CN221185836U - Silicon wafer grinding device - Google Patents
Silicon wafer grinding device Download PDFInfo
- Publication number
- CN221185836U CN221185836U CN202323230762.4U CN202323230762U CN221185836U CN 221185836 U CN221185836 U CN 221185836U CN 202323230762 U CN202323230762 U CN 202323230762U CN 221185836 U CN221185836 U CN 221185836U
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- Prior art keywords
- screw
- silicon wafer
- slider
- base
- clamping
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 63
- 239000010703 silicon Substances 0.000 title claims abstract description 63
- 238000000227 grinding Methods 0.000 title claims abstract description 28
- 230000000994 depressogenic effect Effects 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 48
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a silicon wafer grinding device, which comprises a base, a clamping structure used for clamping a silicon wafer, wherein the top wall of the base is fixedly connected with a frame through a supporting rod, a grinding disc is arranged on the side wall of one side, close to the base, of the frame, a driving structure is arranged on one side of the clamping structure, the clamping structure comprises a sliding rail arranged on the top wall of the base, a first sliding block and a second sliding block which are arranged at a concave position of the sliding rail and are in sliding connection, a first threaded hole and a second threaded hole with opposite threaded directions are respectively formed in the side walls of the first sliding block and the second sliding block, a screw is connected to the inner wall of the concave position of the sliding rail through a fixing sleeve in a rotating mode, and a second external thread and a third external thread which are matched with the first threaded hole and the second threaded hole are arranged on the side wall of the screw. According to the utility model, the clamping structure is driven by the driving structure to clamp or loosen the silicon wafer, so that the problem that the clamped and fixed silicon wafer is not easy to take out is solved.
Description
Technical Field
The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer grinding device.
Background
After the silicon wafer is processed into the silicon wafer, the silicon wafer can form an irregular shape, in order not to influence the quality of subsequent processing, irregular edges need to be removed, and then a grinding device is used for grinding the surface of the silicon wafer.
When the silicon wafer is ground, in order to prevent the position of the silicon wafer from moving, the silicon wafer is required to be clamped and fixed by using a clamping device, and the traditional method mainly comprises the steps of placing the silicon wafer in a circular groove matched with the shape of the silicon wafer to limit the fixed position of the silicon wafer, so that the silicon wafer is easy to fix, but the silicon wafer is difficult to move from the circular groove to the silicon wafer after milling because the silicon wafer is positioned in the circular groove; therefore, although the silicon wafer is easily fixed, the silicon wafer is positioned in the circular groove, and the silicon wafer is difficult to remove from the circular groove after grinding.
Disclosure of utility model
The utility model aims at: in order to solve the problem that the clamped and fixed silicon wafer is not easy to take out, the silicon wafer grinding device is provided.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
A silicon wafer grinding apparatus comprising:
The base, the said base roof is fixedly connected with the stander through the bracing piece, the said stander is close to the sidewall of one side of the base to dispose the grinding disc;
the clamping structure is used for clamping a silicon wafer, a driving structure is configured on one side of the clamping structure, the clamping structure comprises a sliding rail arranged on the top wall of a base, a first sliding block and a second sliding block which are arranged at the concave position of the sliding rail in a sliding connection mode, a first threaded hole and a second threaded hole with opposite screw thread directions are respectively formed in the side walls of the first sliding block and the second sliding block, a screw rod is connected to the inner wall of the concave position of the sliding rail in a rotating mode through a fixing sleeve, and second external threads and third external threads which are matched with the first threaded hole and the second threaded hole are arranged on the side walls of the screw rod.
As a further description of the above technical solution:
The first threaded hole and the second threaded hole are the same in size, and the center of the distance between the first sliding block and the second sliding block is intersected with the center shaft of the grinding disc.
As a further description of the above technical solution:
The first slider and the second slider are respectively and fixedly provided with a first clamping disc and a second clamping disc.
As a further description of the above technical solution:
The driving structure comprises an electric telescopic rod fixedly installed on the top wall of the base and an output shaft installed at the output end of the electric telescopic rod.
As a further description of the above technical solution:
the screw thread groove has been seted up to the one end that the output shaft is close to the screw rod, the one end that the screw rod is close to the output shaft is provided with the first external screw thread of cooperation screw thread groove.
As a further description of the above technical solution:
The fixed sleeve is fixedly arranged on the inner wall of the concave position of the sliding rail, a round hole is formed in the side wall of the fixed sleeve, the cross section area of the round hole is smaller than that of the screw, a notch matched with the round hole is formed in the side wall of the screw, and the central axis of the round hole coincides with the central axis of the screw.
In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:
1. According to the utility model, the output shaft is moved by the electric telescopic rod to rotate the screw rod, so that the first sliding block and the second sliding block move along the direction of approaching each other, and the silicon wafer between the first clamping disk and the second clamping disk is enabled to achieve the effect of fixing the silicon wafer; when a user needs to take out the silicon wafer fixed between the first clamping disc and the second clamping disc, the output shaft is moved along the opposite direction by the electric telescopic rod to rotate the screw rod, so that the first sliding block and the second sliding block move along the direction away from each other, the first clamping disc and the second clamping disc are not used for fixing the silicon wafer, the user can simply and conveniently take out the silicon wafer, and the problem that the silicon wafer after clamping and fixing is not easy to take out is solved.
Drawings
FIG. 1 illustrates a schematic diagram of a front structure provided in accordance with an embodiment of the present utility model;
FIG. 2 shows a schematic structural view of a clamping structure and a driving structure provided according to an embodiment of the present utility model;
Fig. 3 shows a schematic structural view of a clamping structure according to an embodiment of the present utility model after being unfolded;
fig. 4 shows a schematic view of a clamping structure and an output shaft in cross section, provided according to an embodiment of the utility model.
Legend description:
10. A base; 11. a support rod; 12. a frame; 13. a grinding disc; 14. an electric telescopic rod; 21. an output shaft; 211. a thread groove; 22. a screw; 221. a first external thread; 222. a notch; 223. a second external thread; 224. a third external thread; 23. a first slider; 231. a first threaded hole; 24. a second slider; 241. a second threaded hole; 25. a first clamping plate; 26. a second clamping plate; 31. a slide rail; 32. a fixed sleeve; 33. and a round hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a silicon chip grinder, includes base 10, is used for the clamping structure of centre gripping silicon chip, and installs in the drive structure of one side of clamping structure, and base 10 roof is through bracing piece 11 fixedly connected with frame 12, is provided with grinding disc 13 on the lateral wall that frame 12 is close to base 10 one side, is provided with the structure that drives grinding disc 13 and push down and take place the rotation in the frame 12, and grinding disc 13 grinds the silicon chip of below through pushing down and rotation.
The clamping structure comprises a sliding rail 31 arranged on the top wall of the base 10, and a first sliding block 23 and a second sliding block 24 arranged at the concave positions of the sliding rail 31, wherein the sliding rail 31 is respectively in sliding connection with the first sliding block 23 and the second sliding block 24, so that the first sliding block 23 and the second sliding block 24 cannot shake in the sliding process, and the stability of the clamping structure is improved; the first slider 23 and the second slider 24 are respectively fixedly provided with a first clamping disk 25 and a second clamping disk 26 for clamping silicon wafers, and the first clamping disk 25 and the second clamping disk 26 are respectively provided with two arc grooves which are symmetrical to each other and are used for clamping round silicon wafers.
The side walls of the first sliding block 23 and the second sliding block 24 are respectively provided with a first threaded hole 231 and a second threaded hole 241 with opposite thread directions, the inner wall of the concave position of the sliding rail 31 is rotationally connected with a screw 22 through a fixed sleeve 32, and the side walls of the screw 22 are provided with a second external thread 223 and a third external thread 224 which are matched with the first threaded hole 231 and the second threaded hole 241; thus, the first slider 23 and the second slider 24 can be moved in a direction away from or toward each other by rotating the screw 22; the user can rotate the screw 22 to move the first clamping disk 25 and the second clamping disk 26 in the direction approaching to each other until the silicon wafer between the first clamping disk 25 and the second clamping disk 26 is fixed, thereby achieving the effect of fixing the silicon wafer.
The silicon wafer grinding device is a device for grinding and polishing the silicon wafer; conventionally, the conventional method mainly places the silicon wafer in a circular groove conforming to the shape of the silicon wafer, and limits the fixing position of the silicon wafer, so that although the silicon wafer is easy to mount, because the silicon wafer is in the circular groove and is difficult to take out from the circular groove after polishing, a clamping structure is designed to solve the problem, when a user needs to take out the silicon wafer fixed between the first clamping disk 25 and the second clamping disk 26, the first sliding block 23 and the second sliding block 24 can move in the directions away from each other by rotating the screw 22, at this time, the first clamping disk 25 and the second clamping disk 26 do not fix the silicon wafer any more, and the user can simply and conveniently take out the silicon wafer, thereby solving the problem that the silicon wafer after clamping and fixing is difficult to take out.
Specifically, as shown in fig. 1 to 3, in order to determine the fixed position of the silicon wafer, the first threaded hole 231 and the second threaded hole 241 are the same in size, so that in the process of rotating the screw 22 to slide the first slider 23 and the second slider 24, the center of the distance between the first slider 23 and the second slider 24 is always unchanged, and in order to enable the silicon wafer to be aligned for grinding when the grinding disc 13 moves down, the center of the distance between the first slider 23 and the second slider 24 intersects with the center axis of the grinding disc 13, so that each silicon wafer clamped in the clamping structure can be ground by the grinding disc 13.
Specifically, as shown in fig. 2-3, the driving structure includes an electric telescopic rod 14 fixedly installed on the top wall of the base 10 and an output shaft 21 installed at the output end of the electric telescopic rod 14, a threaded groove 211 is formed at one end of the output shaft 21 close to the screw 22, and a first external thread 221 matching with the threaded groove 211 is formed at one end of the screw 22 close to the output shaft 21, so that the electric telescopic rod 14 is driven to move the output shaft 21 and drive the screw 22 to rotate, and the first slider 23 and the second slider 24 are controlled to move along the direction away from or close to each other.
Specifically, as shown in fig. 3-4, in order to prevent the output shaft 21 from driving the screw 22 to slide in the sliding process, the slide rail 31 is fixed on the base 10, the inner wall of the recess of the slide rail 31 is fixedly provided with the fixing sleeve 32, the side wall of the fixing sleeve 32 is provided with the round hole 33, the cross section area of the round hole 33 is smaller than that of the screw 22, the side wall of the screw 22 is provided with the notch 222 matched with the round hole 33, and the central axis of the round hole 33 coincides with the central axis of the screw 22, so that the screw 22 can rotate on the base 10, but cannot slide, and the stability of the structure is improved.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a silicon chip grinder, includes base (10), base (10) roof is through bracing piece (11) fixedly connected with frame (12), be provided with abrasive disc (13) on the lateral wall that frame (12) are close to base (10) one side, its characterized in that includes:
A clamping structure for centre gripping silicon chip, one side of clamping structure disposes drive structure, clamping structure is including installing slide rail (31) on base (10) roof, and install first slider (23) and second slider (24) in slide rail (31) depressed part sliding connection, first screw hole (231) and second screw hole (241) that screw thread opposite direction have been seted up respectively on the lateral wall of first slider (23) and second slider (24), slide rail (31) depressed part inner wall is connected with screw rod (22) through fixed cover (32) rotation, be provided with second external screw thread (223) and third external screw thread (224) of cooperation first screw hole (231) and second screw hole (241) on screw rod (22) lateral wall.
2. A silicon wafer grinding device according to claim 1, wherein the first threaded hole (231) and the second threaded hole (241) are the same size, and the center of the distance between the first slider (23) and the second slider (24) intersects with the center axis of the grinding disk (13).
3. A silicon wafer grinding device according to claim 2, wherein the first slider (23) and the second slider (24) are fixedly provided with a first clamping disk (25) and a second clamping disk (26), respectively.
4. A silicon wafer grinding device according to claim 1, wherein the driving structure comprises an electric telescopic rod (14) fixedly mounted on the top wall of the base (10) and an output shaft (21) mounted on the output end of the electric telescopic rod (14).
5. The silicon wafer grinding device according to claim 4, wherein a thread groove (211) is formed in one end of the output shaft (21) close to the screw (22), and a first external thread (221) matched with the thread groove (211) is formed in one end of the screw (22) close to the output shaft (21).
6. The silicon wafer grinding device according to claim 1, wherein a fixing sleeve (32) is fixedly arranged on the inner wall of the concave position of the sliding rail (31), a round hole (33) is formed in the side wall of the fixing sleeve (32), the cross section area of the round hole (33) is smaller than that of the screw (22), a notch (222) matched with the round hole (33) is formed in the side wall of the screw (22), and the central axis of the round hole (33) coincides with the central axis of the screw (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323230762.4U CN221185836U (en) | 2023-11-29 | 2023-11-29 | Silicon wafer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323230762.4U CN221185836U (en) | 2023-11-29 | 2023-11-29 | Silicon wafer grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221185836U true CN221185836U (en) | 2024-06-21 |
Family
ID=91491020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323230762.4U Active CN221185836U (en) | 2023-11-29 | 2023-11-29 | Silicon wafer grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221185836U (en) |
-
2023
- 2023-11-29 CN CN202323230762.4U patent/CN221185836U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |