CN115157049A - Polishing equipment for semiconductor material production - Google Patents

Polishing equipment for semiconductor material production Download PDF

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Publication number
CN115157049A
CN115157049A CN202210918302.1A CN202210918302A CN115157049A CN 115157049 A CN115157049 A CN 115157049A CN 202210918302 A CN202210918302 A CN 202210918302A CN 115157049 A CN115157049 A CN 115157049A
Authority
CN
China
Prior art keywords
wall
plate
rod
polishing
semiconductor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202210918302.1A
Other languages
Chinese (zh)
Inventor
赵瑞昆
高小良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xuzhou Liangmeng Semiconductor Technology Co ltd
Original Assignee
Xuzhou Liangmeng Semiconductor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xuzhou Liangmeng Semiconductor Technology Co ltd filed Critical Xuzhou Liangmeng Semiconductor Technology Co ltd
Priority to CN202210918302.1A priority Critical patent/CN115157049A/en
Publication of CN115157049A publication Critical patent/CN115157049A/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention relates to the technical field of semiconductor material processing, in particular to polishing equipment for semiconductor material production, which comprises an installation seat, wherein a vertical plate is arranged on the outer wall of the installation seat, an electric slide rail is arranged on the outer wall of one side of the vertical plate, a slide block is arranged in the electric slide rail in a sliding manner, a moving frame is arranged on the outer wall of the slide block, an upright post is arranged on the inner wall of the moving frame, a supporting plate is arranged at the end part of the upright post in a rotating manner, a fixed plate is also arranged on the outer wall of the installation seat, a lead screw is arranged in the fixed plate in a rotating manner, an adjusting wheel is arranged at the end part of the lead screw, a moving plate is sleeved on the outer wall of the lead screw, the moving plate is attached to the installation seat, a first telescopic part is arranged on the outer wall of the moving plate, and a lifting plate is arranged at the telescopic end of the first telescopic part. The invention can accurately adjust the polishing angle and the polishing thickness of the semiconductor material chamfer, effectively utilize different positions of the polishing block and has better use effect.

Description

Polishing equipment for semiconductor material production
Technical Field
The invention relates to the technical field of semiconductor material processing, in particular to polishing equipment for semiconductor material production.
Background
Semiconductor materials are a class of electronic materials having semiconductor properties that can be used to fabricate semiconductor devices and integrated circuits, and in the course of processing semiconductor materials, in order to facilitate mounting of the semiconductor materials, grinding and chamfering operations are typically performed on the side edges of the semiconductor materials.
At present, the existing polishing equipment still has certain disadvantages, in the using process, the polishing angle and the polishing thickness cannot be accurately adjusted, and the polishing block is usually used only by a small part and cannot be fully used, so that a polishing equipment for producing semiconductor materials is urgently needed to be designed to solve the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides polishing equipment for semiconductor material production.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a semiconductor materials production is with equipment of polishing, includes the mount pad, the outer wall of mount pad is provided with the riser, and one side outer wall of riser is provided with electronic slide rail, and slides in the electronic slide rail and be provided with the slider, the outer wall of slider is provided with the removal frame, and the inner wall of removing the frame is provided with the stand, the tip of stand rotates and is provided with the layer board, the outer wall of mount pad still is provided with the fixed plate, it is provided with the lead screw to rotate in the fixed plate, and the tip of lead screw is provided with the regulating wheel, the outer wall of lead screw has cup jointed the movable plate, and laminates mutually between movable plate and the mount pad, the outer wall of movable plate is provided with a extensible member one, and the flexible end of extensible member one is provided with the lifter, the outer wall of lifter runs through the rotation and is provided with the pivot, and the shape of pivot is the U-shaped, the tip of pivot is provided with the mount pad, be provided with the polishing block in the mount pad, and the outer wall of polishing block is provided with the movable rod, the pole runs through the mount pad, and the outer wall of movable rod cup joints flexible one, the one side outer wall of movable rod has seted up a fixed port, the outer wall of mount pad is close to the one side outer wall of polishing block, the outer wall of mount pad, the outer wall of mount pad is provided with the arc pole, the arc pole is provided with the arc pole, the arc pole is still includes:
the clamping mechanism is arranged on the moving frame and used for clamping the semiconductor material on the supporting plate;
the limiting mechanism is arranged on the inner wall of the moving frame and used for limiting the position of the supporting plate;
and the fixing mechanism is arranged on one side of the lifting plate and used for limiting the position of the arc-shaped rod.
As a still further scheme of the invention: the clamping mechanism comprises a screw rod penetrating through threads and arranged on the outer wall of the top of the movable frame, a rotary disc is arranged at one end of the screw rod, an installation cylinder is arranged at the other end of the screw rod in a rotating mode, the inner wall of the installation cylinder is connected with a telescopic rod through a second elastic piece, the end portion of the telescopic rod is provided with a supporting plate, and the outer wall of the supporting plate are provided with a plurality of rubber balls.
As a still further scheme of the invention: stop gear is including setting up in the upright section of thick bamboo that removes the frame inner wall, the inner wall of founding a section of thick bamboo is connected with the inserted bar through elastic component three, and the outer wall of inserted bar is provided with the separation blade, the bottom outer wall of layer board is seted up the equidistance and is the slot that the annular distributes, and the tip of inserted bar agrees with mutually with the inner wall of slot.
As a still further scheme of the invention: the fixing mechanism comprises a second telescopic piece, the second telescopic piece is arranged in a groove formed in one side of the lifting plate, a movable plate is arranged at the telescopic end of the second telescopic piece, a supporting rod is arranged on the outer wall of the movable plate, a supporting block is arranged at the end part of the supporting rod, and the outer wall of the supporting block is attached to the outer wall of the arc-shaped rod.
As a still further scheme of the invention: the electric slide rail, the first telescopic piece and the second telescopic piece are all connected with a switch through wires, and the switch is electrically connected with a controller.
As a still further scheme of the invention: the outer wall of mount pad is provided with the fixed block, and the top of fixed block and both sides outer wall all are provided with the gyro wheel that the equidistance distributes, the fixed slot has been seted up to the outer wall of removal frame, and the outer wall of gyro wheel and the inner wall of fixed slot contact.
As a still further scheme of the invention: the mounting hole has been seted up to one side outer wall of installing frame, one side outer wall of sanding block is provided with the pointer, and the pointer runs through the mounting hole, the lateral wall of installing frame still is provided with the scale, and the tip and the scale of pointer laminate mutually.
Compared with the prior art, the invention has the beneficial effects that:
according to the polishing equipment for producing the semiconductor material, the semiconductor material to be polished can be placed on the supporting plate, then the semiconductor material is fixed through the clamping mechanism, meanwhile, the position of the supporting plate is limited through the limiting mechanism, the supporting plate is prevented from rotating, then the arc-shaped rod on the lifting plate can be rotated, the inclination angle of the polishing block in the mounting frame can be conveniently adjusted, and further the purpose of adjusting the inclination angle of chamfer polishing is achieved.
Drawings
Fig. 1 is a schematic cross-sectional structural view of a polishing apparatus for semiconductor material production according to an embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
FIG. 3 is an enlarged view of the structure at B in FIG. 2;
fig. 4 is a schematic structural view of a clamping mechanism of a polishing apparatus for semiconductor material production according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a limiting mechanism of a polishing device for semiconductor material production according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a moving frame of a polishing apparatus for semiconductor material production according to an embodiment of the present invention;
fig. 7 is an enlarged schematic view of the structure at C in fig. 1.
In the figure: 1-mounting seat, 2-upright post, 3-supporting plate, 4-rubber ball, 5-upright plate, 6-electric sliding rail, 7-sliding block, 8-moving frame, 9-clamping mechanism, 10-first telescopic member, 11-adjusting wheel, 12-screw rod, 13-moving plate, 14-fixed plate, 15-limiting mechanism, 16-lifting plate, 17-rotating shaft, 18-mounting frame, 19-moving rod, 20-first elastic member, 21-grinding block, 22-fixed port, 23-arc rod, 24-fixed mechanism, 25-second telescopic member, 26-movable plate, 27-abutting rod, 28-abutting block, 29-mounting port, 30-pointer, 31-scale, 32-screw rod, 33-rotating disc, 34-mounting barrel, 35-second elastic member, 36-telescopic rod, 37-abutting plate, 38-upright barrel, 39-third elastic member, 40-inserting rod, 41-inserting slot, 42-blocking piece, 43-fixed block, 44-fixed slot, 45-roller.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, 2 and 6, a polishing apparatus for producing a semiconductor material according to an embodiment of the present invention includes a mounting base 1, a vertical plate 5 is disposed on an outer wall of the mounting base 1, an electric slide rail 6 is disposed on an outer wall of one side of the vertical plate 5, a slider 7 is slidably disposed in the electric slide rail 6, a moving frame 8 is disposed on an outer wall of the slider 7, an upright column 2 is disposed on an inner wall of the moving frame 8, a support plate 3 is rotatably disposed at an end of the upright column 2, a fixed plate 14 is further disposed on an outer wall of the mounting base 1, a screw 12 is rotatably disposed in the fixed plate 14, an adjusting wheel 11 is disposed at an end of the screw 12, a moving plate 13 is sleeved on an outer wall of the screw 12, the moving plate 13 and the mounting base 1 are attached to each other, a first extensible member 10 is disposed on an outer wall of the moving plate 13, and a specific structure of the first extensible member 10 is not limited, in this embodiment, it is preferable, a 10 telescopic part adopts the pneumatic cylinder, and the flexible end of a 10 telescopic part is provided with lifter plate 16, the outer wall of lifter plate 16 runs through to rotate and is provided with pivot 17, and the shape of pivot 17 is the U-shaped, the tip of pivot 17 is provided with installing frame 18, be provided with sanding block 21 in the installing frame 18, and sanding block 21's outer wall is provided with movable rod 19, movable rod 19 runs through installing frame 18, and movable rod 19's outer wall has cup jointed a elastic component 20, the concrete structure of an elastic component 20 does not restrict, in this embodiment, it is preferable, an elastic component 20 adopts the spring, one side outer wall that installing frame 18 is close to sanding block 21 has seted up fixed mouthful 22, the outer wall of installing frame 18 still is provided with arc pole 23, and arc pole 23 runs through lifter plate 16, still include:
the clamping mechanism 9 is arranged on the moving frame 8, and is used for clamping the semiconductor material on the supporting plate 3;
the limiting mechanism 15 is arranged on the inner wall of the movable frame 8, and is used for limiting the position of the supporting plate 3;
and a fixing mechanism 24, wherein the fixing mechanism 24 is arranged on one side of the lifting plate 16 and used for limiting the position of the arc-shaped rod 23.
Semiconductor material that needs to polish can place on layer board 3, then it is fixed with semiconductor material through fixture 9, the position of layer board 3 is injectd through stop gear 15 simultaneously, prevent that layer board 3 from taking place to rotate, then arc 23 on can rotating the lifter plate 16, the convenient inclination to the piece 21 of polishing in the installing frame 18 is adjusted, and then reach the inclination purpose of adjusting the chamfer and polish, can rotate regulating wheel 11 and drive lead screw 12 and rotate thereupon, make movable plate 13 remove, and then make semiconductor material's side pass through fixed mouthful 22 and get into in the installing frame 18, and promote the piece 21 that polishes and remove, make elastic component 20 on the movable rod 19 compressed, the distance that the piece 21 removed is the thickness of polishing of semiconductor material side, then can drive removal frame 8 round trip movement through electronic slide rail 6, make semiconductor material in the piece 21 surface round trip movement of polishing, realize polishing to semiconductor material, when polishing to the regulation size, the piece 21 can be under the elastic effect of elastic component 20 can the inner wall of installing frame 18, can not further polish to semiconductor material again, can make the size constantly be polished, make more accurate the piece 21 that polishes and can be used as the piece 21, it can all can drive a section more effectively to reach a flexible effect after the use, 16.
As an embodiment of the present invention, please refer to fig. 4 and 6, the clamping mechanism 9 includes a screw rod 32 disposed on the outer wall of the top of the moving frame 8 through a thread, one end of the screw rod 32 is provided with a rotating disc 33, and the other end of the screw rod 32 is rotatably provided with a mounting cylinder 34, the inner wall of the mounting cylinder 34 is connected to a telescopic rod 36 through a second elastic member 35, and the specific structure of the second elastic member 35 is not limited.
As an embodiment of the present invention, please refer to fig. 5 and 6, the limiting mechanism 15 includes a vertical cylinder 38 disposed on the inner wall of the moving frame 8, the inner wall of the vertical cylinder 38 is connected with an insertion rod 40 through a third elastic member 39, the specific structure of the third elastic member 39 is not limited, in this embodiment, preferably, the third elastic member 39 is a spring, the outer wall of the insertion rod 40 is provided with a blocking piece 42, the outer wall of the bottom of the supporting plate 3 is provided with slots 41 distributed annularly at equal intervals, and the end of the insertion rod 40 is engaged with the inner wall of the slot 41, under the elastic force of the third elastic member 39, the insertion rod 40 can be inserted into the slot 41 to limit the position of the supporting plate 3, because the screw 32 is rotatably connected with the mounting cylinder 34, the supporting plate 3 is rotatably connected with the upright column 2, when the other side of the semiconductor material needs to be polished to open a chamfer, the blocking piece 42 is only required to be pressed to move the insertion rod 40 out of the slot 41, the supporting plate 3 is rotated, and the insertion rod 40 is inserted into the slot 41 again after the position is adjusted, so that the clamping of the semiconductor material is not required to be changed, and the operation is convenient.
As an embodiment of the present invention, please refer to fig. 2, the fixing mechanism 24 includes a second telescopic member 25, a specific structure of the second telescopic member 25 is not limited, in this embodiment, preferably, the second telescopic member 25 employs an electric telescopic rod 36, the second telescopic member 25 is disposed in a groove formed on one side of the lifting plate 16, a movable plate 26 is disposed at a telescopic end of the second telescopic member 25, an abutting rod 27 is disposed on an outer wall of the movable plate 26, an abutting block 28 is disposed at an end of the abutting rod 27, and a specific structure of the abutting block 28 is not limited.
As an embodiment of the present invention, the electric sliding rail 6, the first extensible member 10 and the second extensible member 25 are all connected to a switch through a wire, and the switch is electrically connected to a controller.
Referring to fig. 6 and 7, as an embodiment of the present invention, a fixing block 43 is disposed on an outer wall of the mounting base 1, rollers 45 are disposed on top and outer walls of two sides of the fixing block 43, the fixing groove 44 is disposed on an outer wall of the moving frame 8, and an outer wall of the roller 45 contacts an inner wall of the fixing groove 44, and the roller 45 on the fixing block 43 can assist the moving frame 8 to move, so that the moving process is smoother, and the using effect is better.
As an embodiment of the present invention, referring to fig. 3, an installation opening 29 is formed in an outer wall of one side of the installation frame 18, a pointer 30 is disposed on an outer wall of one side of the polishing block 21, the pointer 30 penetrates through the installation opening 29, a graduated scale 31 is further disposed on a side wall of the installation frame 18, an end of the pointer 30 is attached to the graduated scale 31, when the polishing block 21 moves, the pointer 30 moves along with the installation opening, and the polishing thickness of the chamfer can be obtained by observing a moving distance of the pointer 30 on the graduated scale 31, which is very convenient to use.
During the use, the semiconductor material that needs to polish can place on layer board 3, then it is fixed with semiconductor material through fixture 9, the position of layer board 3 is injectd through stop gear 15 simultaneously, prevent that layer board 3 from taking place to rotate, then can rotate arc pole 23 on the lifter plate 16, the convenient inclination to the piece 21 of polishing in the installing frame 18 is adjusted, and then reach the inclination purpose of adjusting the chamfer and polish, can rotate regulating wheel 11 and drive lead screw 12 and rotate along with it, make movable plate 13 remove, and then make the side of semiconductor material get into in the installing frame 18 through fixed port 22, and promote the piece 21 that polishes and remove, make one 20 of the elastic component on the movable rod 19 compressed, the distance that the piece 21 removed is the thickness of polishing of semiconductor material side, then can drive removal frame 8 round trip movement through electronic slide rail 6, make semiconductor material in the piece 21 surface round trip movement of polishing, realize the polishing to semiconductor material, when polishing to the regulation size, the piece 21 can support the installing frame 18 inner wall under the elastic effect of elastic component 20, further can not further polish, make the piece 21 that the polishing can be more accurate and get the back and reach the effective use of a certain flexible piece that utilizes, make more good use, 16.
It should be noted that, although the present specification describes embodiments, not every embodiment includes only a single technical solution, and such description of the specification is only for clarity, and those skilled in the art should make the specification as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments understood by those skilled in the art.

Claims (7)

1. The utility model provides a semiconductor materials production is with equipment of polishing, includes the mount pad, its characterized in that, the outer wall of mount pad is provided with the riser, and one side outer wall of riser is provided with electronic slide rail, and slides in the electronic slide rail and be provided with the slider, the outer wall of slider is provided with the carriage, and the inner wall of carriage is provided with the stand, the tip of stand rotates and is provided with the layer board, the outer wall of mount pad still is provided with the fixed plate, it is provided with the lead screw to rotate in the fixed plate, and the tip of lead screw is provided with the regulating wheel, the outer wall of lead screw has cup jointed the movable plate, and laminates between movable plate and the mount pad mutually, the outer wall of movable plate is provided with a extensible member one, and the flexible end of extensible member one is provided with the lifter plate, the outer wall of lifter plate runs through and rotates and is provided with the pivot, and the shape of pivot is the U-shaped, the tip of pivot is provided with the mount pad, be provided with the polishing block in the mount pad, and the outer wall of polishing block is provided with the movable rod, the movable rod runs through the mount pad, and the outer wall of movable rod cup joints elastic component one, the one side of mount pad is close to one, the outer wall of polishing block has seted up fixed mouth, the outer wall of mount pad, the arc still is provided with the arc pole, and the arc pole, and still runs through the arc pole, the arc is including the lifter plate:
the clamping mechanism is arranged on the moving frame and used for clamping the semiconductor material on the supporting plate;
the limiting mechanism is arranged on the inner wall of the moving frame and used for limiting the position of the supporting plate;
and the fixing mechanism is arranged on one side of the lifting plate and used for limiting the position of the arc-shaped rod.
2. The polishing device for producing semiconductor materials as claimed in claim 1, wherein the clamping mechanism comprises a screw rod which is threaded through the outer wall of the top of the movable frame, a rotary table is arranged at one end of the screw rod, an installation cylinder is rotatably arranged at the other end of the screw rod, an inner wall of the installation cylinder is connected with a telescopic rod through a second elastic piece, a resisting plate is arranged at the end of the telescopic rod, and a plurality of rubber balls are arranged on the outer walls of the resisting plate and the supporting plate.
3. The polishing device for producing the semiconductor material as claimed in claim 2, wherein the limiting mechanism comprises a vertical cylinder arranged on the inner wall of the moving frame, the inner wall of the vertical cylinder is connected with an inserting rod through a third elastic element, a blocking piece is arranged on the outer wall of the inserting rod, slots distributed in an annular shape at equal intervals are formed in the outer wall of the bottom of the supporting plate, and the end portions of the inserting rod are matched with the inner walls of the slots.
4. The polishing device for producing the semiconductor material as claimed in claim 1, wherein the fixing mechanism comprises a second expansion piece, the second expansion piece is arranged in a groove formed in one side of the lifting plate, a movable plate is arranged at a telescopic end of the second expansion piece, a resisting rod is arranged on the outer wall of the movable plate, a resisting block is arranged at an end of the resisting rod, and the outer wall of the resisting block is attached to the outer wall of the arc-shaped rod.
5. The polishing equipment for producing semiconductor materials as claimed in claim 4, wherein the electric slide rail, the first extensible member and the second extensible member are all connected with a switch through wires, and the switch is electrically connected with a controller.
6. The polishing device for producing semiconductor materials as claimed in claim 1, wherein the outer wall of the mounting seat is provided with a fixed block, the top end and the outer walls at two sides of the fixed block are provided with rollers distributed equidistantly, the outer wall of the movable frame is provided with a fixed groove, and the outer wall of the roller is in contact with the inner wall of the fixed groove.
7. The polishing device for producing the semiconductor material as claimed in claim 1, wherein a mounting opening is formed in an outer wall of one side of the mounting frame, a pointer is arranged on an outer wall of one side of the polishing block and penetrates through the mounting opening, a graduated scale is further arranged on a side wall of the mounting frame, and an end portion of the pointer is attached to the graduated scale.
CN202210918302.1A 2022-08-01 2022-08-01 Polishing equipment for semiconductor material production Withdrawn CN115157049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210918302.1A CN115157049A (en) 2022-08-01 2022-08-01 Polishing equipment for semiconductor material production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210918302.1A CN115157049A (en) 2022-08-01 2022-08-01 Polishing equipment for semiconductor material production

Publications (1)

Publication Number Publication Date
CN115157049A true CN115157049A (en) 2022-10-11

Family

ID=83476934

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210918302.1A Withdrawn CN115157049A (en) 2022-08-01 2022-08-01 Polishing equipment for semiconductor material production

Country Status (1)

Country Link
CN (1) CN115157049A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117067077A (en) * 2023-09-27 2023-11-17 晟高新能源(江苏)有限公司 Edge trimming device of photovoltaic module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117067077A (en) * 2023-09-27 2023-11-17 晟高新能源(江苏)有限公司 Edge trimming device of photovoltaic module
CN117067077B (en) * 2023-09-27 2024-04-02 晟高新能源(江苏)有限公司 Edge trimming device of photovoltaic module

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Application publication date: 20221011