CN215748559U

CN215748559U - High-precision grinding head for wafer grinding machine

Info

Publication number: CN215748559U
Application number: CN202122035665.4U
Authority: CN
Inventors: 刘虎
Original assignee: Suzhou Superlight Microelectronics Co ltd
Current assignee: Suzhou Superlight Microelectronics Co ltd
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2022-02-08
Anticipated expiration: 2031-08-27

Abstract

The utility model discloses a high-precision grinding head for a wafer grinding machine, relates to the technical field of grinding heads, and aims to solve the problem that the existing grinding head is low in grinding precision. The lower extreme of grinding head is provided with the negative pressure and adsorbs the hole, the inside of grinding head is provided with the negative pressure chamber, the negative pressure exhaust tube is installed to one side of grinding head upper end, piezoelectric sensor is installed to the centre of grinding head upper end, charge amplifier is installed to piezoelectric sensor's upper end, piezoelectric sensor and charge amplifier electric connection, charge amplifier's top is provided with the mount, the internally mounted of mount has driving motor, and the mount passes through the screw connection with driving motor, the transmission shaft is installed to driving motor's lower extreme, and transmission shaft and charge amplifier fixed connection, electronic jar is installed to the upper end of mount, electronic jar includes the actuating lever, and actuating lever and mount fixed connection.

Description

High-precision grinding head for wafer grinding machine

Technical Field

The utility model relates to the technical field of grinding heads, in particular to a high-precision grinding head for a wafer grinding machine.

Background

The original material of the wafer is silicon, which is a silicon wafer used in the fabrication of a silicon semiconductor integrated circuit, and the appearance shape of the wafer is circular, so the wafer is called a wafer, and in order to reduce the thermal resistance of a circuit device and improve the working effect, the silicon wafer needs to be ground, the back surface of the silicon wafer is thinned, and the grinding quality directly determines the working performance of the silicon semiconductor integrated circuit.

However, the conventional polishing head has low polishing precision, and therefore does not satisfy the conventional requirements, and a high-precision polishing head for a wafer polishing machine is proposed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-precision grinding head for a wafer grinding machine, which aims to solve the problem of low grinding precision of the conventional grinding head in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a wafer grinding machine high accuracy grinding head, includes grinding head and grinding platform, the lower extreme of grinding head is provided with negative pressure adsorption hole, the inside of grinding head is provided with the negative pressure chamber, the negative pressure exhaust tube is installed to one side of grinding head upper end, the centre of grinding head upper end is installed piezoelectric sensor, charge amplifier is installed to piezoelectric sensor's upper end, piezoelectric sensor and charge amplifier electric connection.

Preferably, a fixing frame is arranged above the charge amplifier, a driving motor is arranged inside the fixing frame, the fixing frame is connected with the driving motor through screws, and a transmission shaft is arranged at the lower end of the driving motor and fixedly connected with the charge amplifier.

Preferably, an electric cylinder is installed at the upper end of the fixing frame, the electric cylinder comprises a driving rod, and the driving rod is fixedly connected with the fixing frame.

Preferably, the upper end of the grinding platform is provided with a polishing pad, the grinding platform is provided with a circular structure, the polishing pad is fixedly connected with the grinding platform, and the wafer main body is placed at the upper end of the polishing pad.

Preferably, a driving spindle is installed in the middle of the lower end of the grinding platform and is fixedly connected with the grinding platform.

Preferably, twelve negative pressure adsorption holes are provided.

Preferably, the grinding head and the piezoelectric sensor are connected through screws.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the force value of the wafer main body driven by the grinding head is captured in real time through the piezoelectric sensor, the force value data is fed back to the driving motor and the electric cylinder in real time, the power driving mechanism correspondingly adjusts the grinding speed and the grinding position according to the force value data, the stability of the wafer in the grinding process is ensured, the damage of the wafer surface caused by overlarge grinding force is avoided, the overlong grinding time caused by overlong grinding force is also avoided, the refreshing speed in the monitoring process is improved by matching with the use of the charge amplifier, the monitoring accuracy of the grinding force value is ensured, and the grinding precision of the grinding head is improved.

2. The utility model is externally connected with a negative pressure pump, the negative pressure pump pumps a negative pressure cavity inside a grinding head to a vacuum negative pressure state through a negative pressure exhaust tube during working, so that a plurality of negative pressure adsorption holes generate negative pressure adsorption force, the grinding head is contacted with a wafer main body to realize negative pressure adsorption fixation, a driving motor works to drive the grinding head, the wafer main body synchronously rotates along with the grinding head and is contacted with a polishing pad to carry out polishing, the structure is simple, the use is convenient, twelve negative pressure adsorption holes are uniformly distributed, the stress uniformity of the wafer main body during grinding is improved, and the grinding precision of the grinding head is further improved.

Drawings

FIG. 1 is a top three-dimensional view of a high-precision polishing head for a wafer polishing machine according to the present invention;

FIG. 2 is a bottom three-dimensional view of a high-precision polishing head for a wafer polishing machine according to the present invention;

FIG. 3 is a front view of a high precision polishing head and a polishing platen for a wafer polishing machine according to the present invention.

In the figure: 1. a grinding head; 2. a negative pressure adsorption hole; 3. a negative pressure exhaust pipe; 4. a piezoelectric sensor; 5. a charge amplifier; 6. a fixed mount; 7. a drive motor; 8. a drive shaft; 9. an electric cylinder; 10. a drive rod; 11. a grinding platform; 12. a polishing pad; 13. a wafer body; 14. the spindle is driven.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-3, an embodiment of the present invention is shown: a high-precision grinding head for a wafer grinding machine comprises a grinding head 1 and a grinding platform 11, wherein a negative pressure adsorption hole 2 is formed at the lower end of the grinding head 1, a negative pressure cavity is formed in the grinding head 1, a negative pressure exhaust tube 3 is installed at one side of the upper end of the grinding head 1, an external negative pressure pump body works and is used for exhausting air through the negative pressure exhaust tube 3 to enable the negative pressure cavity in the grinding head 1 to generate negative pressure, a plurality of negative pressure adsorption holes 2 generate negative pressure adsorption force, the negative pressure adsorption holes 2 are in contact with a wafer main body 13 to carry out negative pressure adsorption and fixation on the wafer main body 13, a piezoelectric sensor 4 is installed in the middle of the upper end of the grinding head 1, a charge amplifier 5 is installed at the upper end of the piezoelectric sensor 4, the piezoelectric sensor 4 is electrically connected with the charge amplifier 5, the piezoelectric sensor 4 captures the magnitude of a force value when the grinding head 1 drives the wafer main body 13 to grind in real time, and feeds force value data back to a driving motor 7 and an electric cylinder 9 in real time, the power driving mechanism correspondingly adjusts the grinding speed and the grinding position according to the force value data, so that the stability of the wafer main body 13 in the grinding process is ensured, the surface damage of the wafer main body 13 caused by overlarge grinding force is avoided, and the overlong grinding time of the wafer main body 13 caused by the overlong grinding force is also avoided.

Further, the top of charge amplifier 5 is provided with mount 6, and the internally mounted of mount 6 has driving motor 7, and mount 6 passes through the screw connection with driving motor 7, and transmission shaft 8 is installed to driving motor 7's lower extreme, and transmission shaft 8 and charge amplifier 5 fixed connection, improve the refresh speed in the monitoring process, guarantee grinding power value monitoring accuracy.

Further, electronic jar 9 is installed to the upper end of mount 6, and electronic jar 9 includes actuating lever 10, and actuating lever 10 and mount 6 fixed connection, and electronic jar 9 work drive actuating lever 10 can change the grinding height position of grinding head 1.

Further, the upper end of the grinding platform 11 is provided with a polishing pad 12, the grinding platform 11 is provided with a circular structure, the polishing pad 12 is fixedly connected with the grinding platform 11, a wafer body 13 is placed on the upper end of the polishing pad 12, and the wafer body 13 is moved to the upper end of the polishing pad 12 of the grinding platform 11 through a manipulator.

Further, a driving spindle 14 is installed in the middle of the lower end of the polishing platform 11, the driving spindle 14 is fixedly connected with the polishing platform 11, and the driving spindle 14 can drive the polishing platform 11 to rotate.

Furthermore, twelve negative pressure adsorption holes 2 are arranged, twelve negative pressure adsorption holes 2 are uniformly distributed, the stress uniformity of the wafer main body 13 during grinding is improved, and the grinding precision of the grinding head 1 is further improved.

Furthermore, the grinding head 1 is connected with the piezoelectric sensor 4 through screws, so that the connection mode is simple, the mounting and dismounting are convenient, and the maintenance is facilitated.

The working principle is as follows: when the polishing head is used, the wafer main body 13 is moved to the upper end of the polishing pad 12 of the polishing platform 11 through the mechanical arm, an external negative pressure pump body works, air is pumped through the negative pressure air pumping pipe 3, so that a negative pressure cavity inside the polishing head 1 generates negative pressure, the negative pressure adsorption holes 2 generate negative pressure adsorption force, the negative pressure adsorption holes 2 are contacted with the wafer main body 13 to carry out negative pressure adsorption and fixation on the wafer main body 13, the driving motor 7 works to drive the polishing head 1 to rotate through the transmission shaft 8, the wafer main body 13 moves synchronously with the polishing head 1, the lower end of the wafer main body 13 is contacted with the polishing pad 12 to carry out polishing, the piezoelectric sensor 4 captures the magnitude of a force value when the polishing head 1 drives the wafer main body 13 to grind, and feeds the force value data back to the driving motor 7 and the electric cylinder 9 in real time, the power driving mechanism correspondingly adjusts the grinding speed and the grinding position according to the force value data to ensure the stability of the wafer main body 13 in the grinding process, the wafer main body 13 surface damage caused by overlarge grinding force is avoided, the wafer main body 13 grinding time overlong caused by the overlarge grinding force is avoided, the piezoelectric sensor 4 is matched with the charge amplifier 5 for use, the refreshing speed in the monitoring process is improved, the grinding force value monitoring accuracy is guaranteed, and therefore the grinding precision of the grinding head 1 on the wafer main body 13 is improved.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a wafer grinder is with high accuracy grinding head, includes grinding head (1) and grinding platform (11), its characterized in that: the grinding head is characterized in that a negative pressure adsorption hole (2) is formed in the lower end of the grinding head (1), a negative pressure cavity is formed in the grinding head (1), a negative pressure exhaust tube (3) is installed on one side of the upper end of the grinding head (1), a piezoelectric sensor (4) is installed in the middle of the upper end of the grinding head (1), a charge amplifier (5) is installed at the upper end of the piezoelectric sensor (4), and the piezoelectric sensor (4) is electrically connected with the charge amplifier (5).

2. The high-precision grinding head for a wafer grinding machine according to claim 1, wherein: the top of charge amplifier (5) is provided with mount (6), the internally mounted of mount (6) has driving motor (7), and mount (6) and driving motor (7) pass through the screw connection, transmission shaft (8) are installed to the lower extreme of driving motor (7), and transmission shaft (8) and charge amplifier (5) fixed connection.

3. The high-precision grinding head for a wafer grinding machine according to claim 2, wherein: electric cylinder (9) are installed to the upper end of mount (6), electric cylinder (9) include actuating lever (10), and actuating lever (10) and mount (6) fixed connection.

4. The high-precision grinding head for a wafer grinding machine according to claim 1, wherein: the polishing device is characterized in that a polishing pad (12) is arranged at the upper end of the grinding platform (11), the grinding platform (11) is provided with a circular structure, the polishing pad (12) is fixedly connected with the grinding platform (11), and a wafer main body (13) is placed at the upper end of the polishing pad (12).

5. The high-precision grinding head for a wafer grinding machine according to claim 1, wherein: and a driving main shaft (14) is arranged in the middle of the lower end of the grinding platform (11), and the driving main shaft (14) is fixedly connected with the grinding platform (11).

6. The high-precision grinding head for a wafer grinding machine according to claim 1, wherein: twelve negative pressure adsorption holes (2) are arranged.

7. The high-precision grinding head for a wafer grinding machine according to claim 1, wherein: the grinding head (1) is connected with the piezoelectric sensor (4) through screws.