CN211867467U - Polishing pad cleaning device - Google Patents
Polishing pad cleaning device Download PDFInfo
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- CN211867467U CN211867467U CN201922496223.2U CN201922496223U CN211867467U CN 211867467 U CN211867467 U CN 211867467U CN 201922496223 U CN201922496223 U CN 201922496223U CN 211867467 U CN211867467 U CN 211867467U
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- disk surface
- rotating shaft
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Abstract
The utility model relates to a polishing pad cleaning device, which comprises a brush structure, wherein the brush structure comprises a disk surface brush capable of rotating circumferentially, and the disk surface brush is used for cleaning a polishing pad by abutting against and rotating; the disc surface hairbrush is arranged on the hairbrush arm, one end of the hairbrush arm is connected with the lifting part, and the lifting part is provided with a rotation driving part which can drive the hairbrush arm to swing in the horizontal direction and can drive the disc surface hairbrush to rotate in the circumferential direction; one side of the disk surface brush is provided with a pressure cleaning structure, and the pressure cleaning structure is used for repairing the polishing pad; the polishing pad cleaning device further comprises a control part, and the control part is used for controlling the disc surface brush rotating state, the brush arm rotating state, the lifting part lifting state and the pressure cleaning structure cleaning state. The device can utilize the quotation brush to wash clean, the polishing pad of moisturizing, utilizes pressure cleaning structure to repair the polishing pad, prevents that dirty and the wearing and tearing of polishing pad from causing the damage of new silicon chip.
Description
Technical Field
The utility model relates to a technical field that the silicon chip ground especially relates to a polishing pad belt cleaning device.
Background
Single crystal silicon, an important semiconductor material, has good electrical properties and thermal stability, and has been discovered and utilized as a substitute for other semiconductor materials soon. The silicon material has better high temperature resistance and radiation resistance, and is particularly suitable for manufacturing high-power devices, so that the silicon material is the most applied semiconductor material, and most silicon materials of integrated circuit semiconductor devices are manufactured. In the method for manufacturing a silicon single crystal having good properties, the Czochralski method for growing a silicon single crystal has relatively simple equipment and process, and is easy to realize automatic control. After being pulled out from a single crystal furnace, the silicon rod of the straight-pull single crystal needs to be subjected to a series of working procedures, wherein the working procedures comprise mechanical processing such as cutting, squaring, fillet grinding and plane grinding at the early stage; in the middle period, the monocrystalline silicon rod is required to be subjected to the processes of barreling, slicing, cleaning, chamfering, grinding, re-cleaning and the like; and in the later stage, the silicon wafer is subjected to the procedures of texturing, diffusion, crystallization, sintering and the like to be manufactured into a semiconductor device or a solar cell for photovoltaic power generation.
Wherein, in the middle stage grinding process, the silicon chip and the grinding disc belong to dry friction, so that the surface of the grinding disc is easy to generate heat and damage, and the silicon chip can be burnt by heat. Foreign matters exist on the polishing pad, and scratch or fall on the silicon wafer during processing, so that the performance of the silicon wafer is influenced. After the silicon wafer is processed, the polishing pad on the disk surface is slightly worn and has small amount of unevenness.
Therefore, the inventor provides a polishing pad cleaning device by virtue of experience and practice of related industries for many years, and cleans and trims the polishing pad in time to avoid damage of silicon wafers caused by the contamination of the polishing pad.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a polishing pad belt cleaning device, the device can utilize the quotation brush to wash clean, the polishing pad of moisturizing, utilize the pressure to wash the structure and maintain the polishing pad, prevent that the dirty and wearing and tearing of polishing pad from causing the damage of new silicon chip.
The utility model aims at realizing the purpose, and discloses a polishing pad cleaning device, which comprises a brush structure, wherein the brush structure comprises a disk surface brush capable of rotating circumferentially, and the disk surface brush is used for cleaning a polishing pad by abutting against and rotating; the disc surface hairbrush is arranged on a hairbrush arm which can move up and down and can swing in the horizontal direction, one end of the hairbrush arm is connected to a lifting part which can drive the hairbrush arm to move up and down, and a rotary driving part which can drive the hairbrush arm to swing in the horizontal direction and can drive the disc surface hairbrush to rotate circumferentially is arranged on the lifting part; a pressure cleaning structure is arranged on one side of the disk surface brush and used for repairing the polishing pad; the polishing pad cleaning device further comprises a control part, and the control part is used for controlling the rotation state of the disk surface brush, the rotation state of the brush arm, the lifting state of the lifting part and the cleaning state of the pressure cleaning structure.
The utility model discloses an in a preferred embodiment, lift portion is including being the lift cylinder of vertical setting on first bottom plate, the bottom mounting and the top of lift cylinder can stretch out and draw back the lift, the top of lift cylinder sets up the second bottom plate, set up on the second bottom plate rotation driving portion.
In a preferred embodiment of the present invention, a motor base is erected on the second bottom plate, the rotation driving portion includes a first servo motor hung on the motor base, an output end of the first servo motor is in transmission connection with a vertical first rotating shaft, a bottom end of the first rotating shaft is axially fixed and can be circumferentially arranged on the motor base, a top of the first rotating shaft is fixedly connected to a bottom of a rotating bracket in a C-shaped arrangement, one end of the brush arm extends downward to form a hollow connecting cylinder, a top of the rotating bracket is fixedly connected to a bottom of the connecting cylinder, and the first servo motor drives the brush arm to swing in a horizontal direction through the first rotating shaft, the rotating bracket and the connecting cylinder; the lifting cylinder drives the brush arm to lift through the second bottom plate, the motor base, the first rotating shaft, the rotating bracket and the connecting cylinder; the first servomotor is electrically connected to the control unit.
In a preferred embodiment of the present invention, the brush arm includes a hollow housing, one end of the bottom of the housing is connected to the connecting cylinder, a third rotating shaft is disposed at the rotating center of the disk surface brush, and the third rotating shaft is axially fixed and can be circumferentially rotatably inserted into the other end of the bottom of the housing;
the rotary driving part comprises a second servo motor arranged on the motor base, the output end of the second servo motor is in transmission connection with a vertical second rotating shaft, the second rotating shaft is axially fixed and can be rotatably and hermetically arranged through the connecting cylinder in a penetrating manner, a first transmission belt is arranged in the shell, a first synchronous belt wheel is arranged at the top of the second rotating shaft, a second synchronous belt wheel is arranged at the top of the third rotating shaft, and two ends of the first transmission belt are respectively wound on the first synchronous belt wheel and the second synchronous belt wheel; the second servo motor drives the disk surface hairbrush to rotate circumferentially through the second rotating shaft, the first driving belt and the third rotating shaft; the second servomotor is electrically connected to the control unit.
In a preferred embodiment of the present invention, the polishing pad cleaning device further comprises a pressurizing structure for adjusting the brushing pressure of the disk surface brush; the inlet of the pressurizing structure is communicated with an air pressure device, and the outlet of the pressurizing structure faces to the top of the disk surface hairbrush and can apply air pressure to the disk surface hairbrush; the pressurizing structure is electrically connected with the control part.
In a preferred embodiment of the present invention, a second shaft hole is axially formed through the second rotating shaft, and a third shaft hole is axially formed through the third rotating shaft; the pressurizing structure comprises a first air pressure pipe which is arranged in the second shaft hole in a sealing and penetrating mode, the bottom of the first air pressure pipe is communicated with a first connector in a sealing mode, and the inlet end of the first connector is communicated with an air pressure device; the top of the first air pressure pipe is communicated with a second joint in a sealing mode, the outlet end of the second joint is communicated with a second air pressure pipe located above the first synchronous belt pulley, and the outlet end of the second air pressure pipe is communicated with a third joint; and a third air pressure pipe penetrates through the third axial hole in a sealing manner, the inlet end of the third air pressure pipe is communicated with the outlet end of the third joint, and the outlet of the third air pressure pipe faces the top of the disk surface brush and can apply air pressure to the disk surface brush.
In a preferred embodiment of the present invention, one side of the first transmission belt is abutted against and provided with a first idler and a second idler at a longitudinal interval, and the first idler and the second idler are respectively connected in the housing through an idler frame.
The utility model discloses an in a preferred embodiment, the lateral wall lower part of third pivot sets up outer gear portion, the brush support is established to the bottom cover of third pivot, set up on the brush support with outer gear portion matches the inner gear portion of meshing, the quotation brush pass through flange joint in the bottom of brush support.
In a preferred embodiment of the present invention, a third synchronous pulley is disposed at an output end of the first servo motor, a fourth synchronous pulley is disposed on the first rotating shaft, and a second transmission belt is sleeved on the third synchronous pulley and the fourth synchronous pulley; a position indicating ruler is arranged on the fourth synchronous belt wheel, a sensor frame is arranged on the motor base, a limiting sensor is arranged on the sensor frame and can sense the position of the position indicating ruler, and the limiting sensor is electrically connected with the control part.
In a preferred embodiment of the present invention, the top of the connecting cylinder is fixedly connected to the casing with the opening downward, and the top of the casing is fixedly connected to the bottom of the casing.
From above, the utility model provides a pair of polishing pad belt cleaning device has following beneficial effect:
the polishing pad cleaning device provided by the utility model is used for cleaning and finishing before processing the silicon wafer or after processing the silicon wafer again; in the polishing pad cleaning device of the utility model, the lifting part and the rotary driving part act together to realize the up-and-down movement of the brush arm and the back-and-forth swing in the horizontal direction, so that the disc surface brush arranged on the brush arm is quickly positioned and can sweep and grind the polishing surface in the horizontal direction, and the rotary driving part can also provide power for the spinning of the disc surface brush; the polishing pad cleaning device of the utility model utilizes the rotating disc surface brush to brush and wash away the substances remained on the polishing pad after the silicon wafer is processed, thereby preventing the residual particles from scratching the new silicon wafer during processing; after the silicon wafer is processed, the polishing pad is slightly worn to cause small amount of unevenness, and the pressure cleaning structure is utilized to play a role in trimming the polishing pad through high-pressure flushing.
Drawings
The drawings are only intended to illustrate and explain the present invention and do not limit the scope of the invention. Wherein:
FIG. 1: do the utility model discloses a polishing pad belt cleaning device's front view.
FIG. 2: do the utility model discloses a polishing pad belt cleaning device's top view.
FIG. 3: is a cross-sectional view a-a in fig. 1.
FIG. 4: is a view along direction C in fig. 3.
FIG. 5: is a cross-sectional view B-B in FIG. 1.
FIG. 6: which is a view from the direction D in fig. 5.
FIG. 7: is an enlarged view at I in FIG. 1.
In the figure:
100. a polishing pad cleaning device;
1. a brush structure;
11. a disk surface brush; 12. a brush holder; 13. a flange; 14. a brush holder housing;
2. a brush arm;
20. a housing; 201. a brush arm cover; 21. a connecting cylinder;
3. a lifting part;
30. a lifting cylinder; 31. a first base plate; 32. a second base plate; 33. a motor base; 331. a sensor holder; 34. rotating the bracket; 35. a guide post; 36. a support bar; 37. a limiting fixing rod; 38. a hexagonal pillar;
4. a rotation driving section;
41. a first servo motor; 411. a third synchronous pulley; 42. a second servo motor; 421. a fifth timing pulley;
5. a pressure cleaning structure;
61. a first rotating shaft; 611. a fourth timing pulley; 612. a position indicating ruler; 62. a second rotating shaft; 621. a first timing pulley; 622. a sixth timing pulley; 63. a third rotating shaft; 631. a second timing pulley; 641. a first drive belt; 642. a second belt; 643. a third belt; 651. a first idler pulley; 652. a second idler pulley;
71. a first air compressing tube; 72. a second air compressing tube; 73. a third air compressing tube; 741. a first joint; 742. a second joint; 743. a third joint;
81. a housing; 82. a protective cylinder structure.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings.
The specific embodiments of the present invention described herein are for the purpose of explanation only and should not be construed as limiting the invention in any way. Given the teachings of the present invention, the skilled person can conceive of any possible variants based on the invention, which should all be considered as belonging to the scope of the invention. It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, indirect connections through intermediaries, and the like. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 to 7, the present invention provides a polishing pad cleaning device 100, which includes a brush structure 1, wherein the brush structure 1 includes a disk surface brush 11 capable of rotating circumferentially, and the disk surface brush 11 is used for cleaning a polishing pad by abutting against and rotating; the disk surface hairbrush 11 is arranged on a hairbrush arm 2 which can move up and down and can swing in the horizontal direction, one end of the hairbrush arm 2 is connected to a lifting part 3 which can drive the hairbrush arm 2 to move up and down, and a rotary driving part 4 which can drive the hairbrush arm 2 to swing in the horizontal direction and can drive the disk surface hairbrush 11 to rotate circumferentially is arranged on the lifting part 3; one side of the disk surface brush 11 is provided with a pressure cleaning structure 5 (a high-pressure washing structure which washes the polishing pad by high-pressure water spraying and repairs the surface of the polishing pad by pressure washing), and the pressure cleaning structure 5 is used for repairing the polishing pad; the polishing pad cleaning apparatus 100 further includes a control section for controlling a rotation state of the disk surface brush 11, a rotation state of the brush arm 2, a lifting state of the lifting section 3, and a cleaning state of the pressure cleaning structure 5.
The polishing pad cleaning device provided by the utility model is used for cleaning and finishing before processing the silicon wafer or after processing the silicon wafer again; in the polishing pad cleaning device of the utility model, the lifting part and the rotary driving part act together to realize the up-and-down movement of the brush arm and the back-and-forth swing in the horizontal direction, so that the disc surface brush arranged on the brush arm is quickly positioned and can sweep and grind the polishing surface in the horizontal direction, and the rotary driving part can also provide power for the spinning of the disc surface brush; the polishing pad cleaning device of the utility model utilizes the rotating disc surface brush to brush and wash away the substances remained on the polishing pad after the silicon wafer is processed, thereby preventing the residual particles from scratching the new silicon wafer during processing; after the silicon wafer is processed, the polishing pad is slightly worn to cause small amount of unevenness, and the pressure cleaning structure is utilized to play a role in trimming the polishing pad through high-pressure flushing.
Further, as shown in fig. 1, 4, and 6, the lifting unit 3 includes a lifting cylinder 30 vertically disposed on a first bottom plate 31, the bottom end of the lifting cylinder 30 is fixed, and the top end of the lifting cylinder can be lifted in a telescopic manner, a second bottom plate 32 is disposed on the top end of the lifting cylinder 30, and a rotation driving unit 4 is disposed on the second bottom plate 32.
Further, as shown in fig. 1, 4, 5, and 6, a motor base 33 is erected on the second bottom plate 32, a guide post 35, a support rod 36, and a limit fixing rod 37 are disposed between the second bottom plate 32 and the motor base 33, and the second bottom plate 32 and the motor base 33 are connected by a hexagonal pillar 38;
as shown in fig. 1, the rotary driving part 4 includes a first servo motor 41 suspended on the motor base 33, an output end of the first servo motor 41 can rotate in two directions, an output end of the first servo motor 41 is in transmission connection with a vertical first rotating shaft 61, a bottom end of the first rotating shaft 61 is axially fixed and can be circumferentially rotatably disposed on the motor base 33, in the present embodiment, a through first rotating shaft mounting hole is disposed on the motor base 33, a first bearing seat is fixedly disposed on the motor base 33 at the first rotating shaft mounting hole, a first bearing group is disposed in the first bearing seat, a bottom end of the first rotating shaft 61 is axially fixed and rotatably disposed through the first bearing group, so that the bottom end of the first rotating shaft 61 is axially fixed and can be circumferentially rotatably connected with the motor base 33;
the top of the first rotating shaft 61 is fixedly connected with the bottom of the rotating bracket 34 which is arranged in a C shape, one end of the brush arm 2 extends downwards to form a hollow connecting cylinder 21, the top of the rotating bracket 34 is fixedly connected with the bottom of the connecting cylinder 21, and the first servo motor 41 drives the brush arm 2 to swing in the horizontal direction through the first rotating shaft 61, the rotating bracket 34 and the connecting cylinder 21; the lifting cylinder 30 drives the brush arm 2 to lift through the second bottom plate 32, the motor base 33, the first rotating shaft 61, the rotating bracket 34 and the connecting cylinder 21; the first servomotor 41 is electrically connected to the control unit. In this embodiment, the runing rest 34 that the C type set up includes roof, riser and bottom plate, and the top surface and the bottom surface of bottom plate set up the fixed slot of indent, and the top of first pivot 61 supports and leans on in the fixed slot of bottom plate bottom surface, from wearing to establish set screw downwards in the fixed slot of bottom plate top surface, realizes the fixed connection of the top of first pivot 61 and the bottom of runing rest 34.
Further, as shown in fig. 1, 2, and 7, the brush arm 2 includes a hollow housing 20, one end of the bottom of the housing 20 is connected to the connecting cylinder 21, a third rotating shaft 63 is disposed at the rotating center of the disk surface brush 11, and the third rotating shaft 63 is axially fixed and can be circumferentially rotatably inserted into the other end of the bottom of the housing 20; in the present embodiment, in order to facilitate the structural installation inside the brush arm, a detachable and sealable brush arm cover 201 is provided on the top of the housing 20; the other end of the bottom of the shell 20 is provided with a hairbrush structure mounting hole, a third bearing seat is fixedly arranged at the hairbrush structure mounting hole, a third bearing is arranged in the third bearing seat, and a third rotating shaft 63 axially and fixedly penetrates through the third bearing;
the rotary driving part 4 comprises a second servo motor 42 arranged on the motor base 33, the output end of the second servo motor 42 can rotate in two directions, the output end of the second servo motor 42 is in transmission connection with a vertical second rotating shaft 62, the second rotating shaft 62 is axially fixed and can be rotatably and hermetically arranged through the connecting cylinder 21 in a penetrating manner, in the embodiment, the connecting cylinder 21 forms a second bearing seat, two ends of the inner side of the connecting cylinder 21 are respectively provided with a second bearing set, and the second rotating shaft 62 is axially fixed and rotatably arranged through the two second bearing sets in a penetrating manner;
a first transmission belt 641 is arranged in the housing 20, a first synchronous pulley 621 is arranged at the top of the second rotating shaft 62, a second synchronous pulley 631 is arranged at the top of the third rotating shaft 63, and two ends of the first transmission belt 641 are respectively wound on the first synchronous pulley 621 and the second synchronous pulley 631; the second servo motor 42 drives the disk surface brush 11 to rotate circumferentially through the second rotating shaft 62, the first driving belt 641 and the third rotating shaft 63; the second servomotor 42 is electrically connected to the control unit.
Further, the polishing pad cleaning device 100 further includes a pressurizing structure for adjusting the brushing pressure of the disk surface brush 11; the inlet of the pressurizing structure is communicated with an air pressure device (in the prior art, the air pressure device in a workshop can be controlled by an electric signal of a control part), and the outlet of the pressurizing structure faces to the top of the disk surface brush 11 and can apply air pressure to the disk surface brush 11; the pressurizing structure is electrically connected with the control part.
Further, as shown in fig. 1, 2, and 7, a second shaft hole is axially formed through the second rotating shaft 62, and a third shaft hole is axially formed through the third rotating shaft 63; the pressurizing structure comprises a first air pressure pipe 71 which is arranged in the second shaft hole in a sealing and penetrating mode, the bottom of the first air pressure pipe 71 is communicated with a first connector 741 in a sealing mode, and the inlet end of the first connector 741 is communicated with an air compressing device; the top of the first air compression pipe 71 is communicated with a second joint 742 in a sealing mode, the outlet end of the second joint 742 is communicated with a second air compression pipe 72 located above the first synchronous belt pulley 621, and the outlet end of the second air compression pipe 72 is communicated with a third joint 743; the third shaft hole is internally provided with a third air pressure pipe 73 in a penetrating way in a sealing way, the inlet end of the third air pressure pipe 73 is communicated with the outlet end of the third connector 743, and the outlet of the third air pressure pipe 73 faces the top of the disk surface hairbrush 11 and can apply air pressure to the disk surface hairbrush 11.
In the present embodiment, as shown in fig. 1 and 2, a first idle pulley 651 and a second idle pulley 652 are disposed in contact with one side of the first transmission belt 641 at a predetermined interval in the longitudinal direction, and the first idle pulley 651 and the second idle pulley 652 are connected to the inside of the housing 20 via an idle pulley frame, respectively. The first idle gear 651 and the second idle gear 652 can ensure that the transmission of the first transmission belt 641 is more stable and reliable.
Further, as shown in fig. 7, an outer gear portion is disposed at a lower portion of a side wall of the third rotating shaft 63, the brush holder 12 is sleeved at a bottom of the third rotating shaft 63, an inner gear portion engaged with the outer gear portion is disposed on the brush holder 12, and the disk surface brush 11 is connected to a bottom of the brush holder 12 through a flange 13.
In this embodiment, the other end (i.e., the brush end) of the bottom of the brush arm 2 is further provided with a brush holder housing 14, and the brush holder housing 14 effectively protects the lower portions of the brush holder 12, the inner gear portion, the outer gear portion, and the third rotating shaft 63, and prevents residual particles from being washed away from entering the upper portion of the disk surface brush 11.
Further, as shown in fig. 1, fig. 2, fig. 3, and fig. 4, a third synchronous pulley 411 is disposed at an output end of the first servo motor 41, a fourth synchronous pulley 611 is disposed on the first rotating shaft 61, and a second transmission belt 642 is sleeved on the third synchronous pulley 411 and the fourth synchronous pulley 611; in the present embodiment, the first servomotor 41 is inserted through the motor base 33, the output end thereof is located above the motor base 33, and the middle of the first rotating shaft 61 is provided with the fourth timing pulley 611;
the fourth synchronous pulley 611 is provided with a position indicating ruler 612, the motor base 33 is provided with a sensor holder 331, the sensor holder 331 is provided with a limit sensor, the limit sensor can sense the position of the position indicating ruler 612, and the limit sensor is electrically connected with the control part. When the position indication ruler rotates clockwise or anticlockwise to reach the position limit sensor, the position limit sensor can sense the position indication ruler in real time and send a sensing signal to the control part, so that the control part controls the swinging of the brush arm 2 in the horizontal direction.
Further, as shown in fig. 1, a fifth synchronous pulley 421 is disposed at an output end of the second servo motor 42, a bottom end of the second rotating shaft 62 passes through a top plate of the rotating bracket 34 and is located below the top plate, a sixth synchronous pulley 622 is sleeved at a bottom end of the second rotating shaft 62, and a third transmission belt 643 is sleeved on the fifth synchronous pulley 421 and the sixth synchronous pulley 622.
The control section can control the start and stop of the first servomotor 41 and the second servomotor 42, and can accurately control the rotational speed; the rotation of the first rotating shaft 61, the second rotating shaft 62 and the third rotating shaft 63 is realized through synchronous pulleys and a transmission belt, so that the operation is more stable and reliable; the control part can control the top end of the lifting cylinder 30 to extend or retract, and the plate surface brush 11 is lifted through the lifting of the brush arm 2. The control part realizes the top pressure adjustment of the disk surface brush 11 by controlling the on-off and the output pressure of the air compression device communicated with the pressurization structure, thereby changing the cleaning force of the disk surface brush 11.
Further, as shown in fig. 1, the top of the connecting cylinder 21 is fixedly connected to a casing 81 with a downward opening, the top end of the casing 81 is fixedly connected to the bottom of the housing 20 of the brush arm 2, and the casing 81 can protect the connecting cylinder 21, the second rotating shaft 62 and the bearing set therebetween. In order to further protect the lifting and the rotation of the connecting cylinder 21, a protective cylinder structure 82 is coaxially sleeved on the outer side of the connecting cylinder 21, the protective cylinder structure 82 is fixedly arranged (the bottom of the protective cylinder structure 82 is fixedly connected to the rack, and the rack is in the prior art), and a rotating bearing group is arranged between the outer wall of the connecting cylinder 21 and the inner wall of the protective cylinder structure 82, so that the connecting cylinder 21 can rotate and slide up and down relative to the protective cylinder structure 82.
The utility model discloses a polishing pad belt cleaning device 100's application method as follows:
step a, assembling a device; at this time, the top end (the second bottom plate 32) of the lifting cylinder 30 is at the lowest stroke point, and the brush arm 2 is at the lowest point;
b, the control part controls the lifting cylinder 30 to ascend, the brush arm 2 ascends along with the ascending and pushes the disk surface brush 11 to the working height, and the lifting cylinder 30 stops ascending and keeps at the working position;
step c, the control part controls the first servo motor 41 to start, the third synchronous belt wheel 411 drives the fourth synchronous belt wheel 611 to rotate through the second transmission belt 642, the first rotating shaft 61, the rotating bracket 34 and the connecting cylinder 21 drive the brush arm 2 to swing in the horizontal direction, the limit sensor feeds back the rotating position until the brush arm 2 drives the disk surface brush 11 to rotate to the working position, and the first servo motor 41 is turned off;
d, spraying water to the polishing pad for moisturizing before cleaning the disk surface brush 11;
step e, the control part controls the second servo motor 42 to start, the output end of the second servo motor 42 rotates forwards, the fifth synchronous belt wheel 421 drives the sixth synchronous belt wheel 622 to rotate through the third transmission belt 643, the second rotating shaft 62, the first transmission belt 641 and the third rotating shaft 63 drive the disk surface brush 11 to rotate circumferentially, and the disk surface brush 11 rotates and cleans the polishing pad;
step f, the control part controls the first servo motor 41 to start and carry out back and forth forward and reverse rotation to realize that the brush arm 2 swings back and forth in the horizontal direction, the disk surface brush 11 swings along with the brush arm 2 while rotating, the control part opens the pressurizing structure, high-pressure gas is sprayed to the disk surface brush 11 through the first joint 741, the first air pressure pipe 71, the second joint 742, the second air pressure pipe 72, the third joint 743 and the third air pressure pipe 73 to pressurize the disk surface brush 11 to change the cleaning force of the brush, residual polishing liquid on a polishing pad and residual particles of a processed silicon wafer are washed away, and the new silicon wafer is prevented from being scratched when the residual particles are processed;
step g, after the polishing pad reaches the abrasion limit, the control part controls the pressure cleaning structure 5 to spray water to the polishing pad at high pressure, and the polishing pad is repaired;
and h, after the cleaning is finished, the control part controls each structure to recover the initial state.
From above, the utility model provides a pair of polishing pad belt cleaning device has following beneficial effect:
the polishing pad cleaning device provided by the utility model is used for cleaning and finishing before processing the silicon wafer or after processing the silicon wafer again; in the polishing pad cleaning device of the utility model, the lifting part and the rotary driving part act together to realize the up-and-down movement of the brush arm and the back-and-forth swing in the horizontal direction, so that the disc surface brush arranged on the brush arm is quickly positioned and can sweep and grind the polishing surface in the horizontal direction, and the rotary driving part can also provide power for the spinning of the disc surface brush; the polishing pad cleaning device of the utility model utilizes the rotating disc surface brush to brush and wash away the substances remained on the polishing pad after the silicon wafer is processed, thereby preventing the residual particles from scratching the new silicon wafer during processing; after the silicon wafer is processed, the polishing pad is slightly worn to cause small amount of unevenness, and the pressure cleaning structure is utilized to play a role in trimming the polishing pad through high-pressure flushing.
The above description is only exemplary of the present invention, and is not intended to limit the scope of the present invention. Any person skilled in the art should also realize that such equivalent changes and modifications can be made without departing from the spirit and principles of the present invention.
Claims (10)
1. The polishing pad cleaning device is characterized by comprising a brush structure, wherein the brush structure comprises a disk surface brush capable of rotating circumferentially, and the disk surface brush is used for abutting against and contacting and rotating to clean a polishing pad; the disc surface hairbrush is arranged on a hairbrush arm which can move up and down and can swing in the horizontal direction, one end of the hairbrush arm is connected to a lifting part which can drive the hairbrush arm to move up and down, and a rotary driving part which can drive the hairbrush arm to swing in the horizontal direction and can drive the disc surface hairbrush to rotate circumferentially is arranged on the lifting part; a pressure cleaning structure is arranged on one side of the disk surface brush and used for repairing the polishing pad; the polishing pad cleaning device further comprises a control part, and the control part is used for controlling the rotation state of the disk surface brush, the rotation state of the brush arm, the lifting state of the lifting part and the cleaning state of the pressure cleaning structure.
2. The polishing pad cleaning apparatus as recited in claim 1, wherein the elevating portion comprises an elevating cylinder vertically disposed on a first base plate, a bottom end of the elevating cylinder is fixed and a top end of the elevating cylinder can be telescopically elevated, a second base plate is disposed on a top end of the elevating cylinder, and the rotary driving portion is disposed on the second base plate.
3. The polishing pad cleaning device according to claim 2, wherein a motor base is erected on the second base plate, the rotary driving part comprises a first servomotor suspended on the motor base, an output end of the first servomotor is in transmission connection with a first vertical rotating shaft, a bottom end of the first rotating shaft is axially fixed and can be circumferentially arranged on the motor base, a top of the first rotating shaft is fixedly connected with a bottom of a rotating bracket arranged in a C shape, a hollow connecting cylinder is arranged at one end of the brush arm in a downward extending manner, a top of the rotating bracket is fixedly connected with a bottom of the connecting cylinder, and the first servomotor drives the brush arm to swing in a horizontal direction through the first rotating shaft, the rotating bracket and the connecting cylinder; the lifting cylinder drives the brush arm to lift through the second bottom plate, the motor base, the first rotating shaft, the rotating bracket and the connecting cylinder; the first servomotor is electrically connected to the control unit.
4. The polishing pad cleaning apparatus as recited in claim 3, wherein the brush arm includes a hollow housing, one end of the bottom of the housing is connected to the connecting cylinder, a third shaft is disposed at the rotation center of the disk surface brush, and the third shaft is axially fixed and can be circumferentially rotatably inserted through the other end of the bottom of the housing;
the rotary driving part comprises a second servo motor arranged on the motor base, the output end of the second servo motor is in transmission connection with a vertical second rotating shaft, the second rotating shaft is axially fixed and can be rotatably and hermetically arranged through the connecting cylinder in a penetrating manner, a first transmission belt is arranged in the shell, a first synchronous belt wheel is arranged at the top of the second rotating shaft, a second synchronous belt wheel is arranged at the top of the third rotating shaft, and two ends of the first transmission belt are respectively wound on the first synchronous belt wheel and the second synchronous belt wheel; the second servo motor drives the disk surface hairbrush to rotate circumferentially through the second rotating shaft, the first driving belt and the third rotating shaft; the second servomotor is electrically connected to the control unit.
5. The polishing pad cleaning apparatus according to claim 4, further comprising a pressurizing structure for adjusting a brush brushing pressure of the disk surface; the inlet of the pressurizing structure is communicated with an air pressure device, and the outlet of the pressurizing structure faces to the top of the disk surface hairbrush and can apply air pressure to the disk surface hairbrush; the pressurizing structure is electrically connected with the control part.
6. The polishing pad cleaning apparatus according to claim 5, wherein a second shaft hole is provided axially through the second shaft, and a third shaft hole is provided axially through the third shaft; the pressurizing structure comprises a first air pressure pipe which is arranged in the second shaft hole in a sealing and penetrating mode, the bottom of the first air pressure pipe is communicated with a first connector in a sealing mode, and the inlet end of the first connector is communicated with an air pressure device; the top of the first air pressure pipe is communicated with a second joint in a sealing mode, the outlet end of the second joint is communicated with a second air pressure pipe located above the first synchronous belt pulley, and the outlet end of the second air pressure pipe is communicated with a third joint; and a third air pressure pipe penetrates through the third axial hole in a sealing manner, the inlet end of the third air pressure pipe is communicated with the outlet end of the third joint, and the outlet of the third air pressure pipe faces the top of the disk surface brush and can apply air pressure to the disk surface brush.
7. The polishing pad cleaning apparatus according to claim 4, wherein one side of the first belt abuts against a first idler pulley and a second idler pulley at a longitudinal interval, the first idler pulley and the second idler pulley being connected in the housing through an idler frame, respectively.
8. The polishing pad cleaning apparatus according to claim 4, wherein an outer gear portion is provided at a lower portion of a side wall of the third shaft, a brush holder is provided at a bottom portion of the third shaft, an inner gear portion that is in matching engagement with the outer gear portion is provided on the brush holder, and the disk surface brush is connected to a bottom portion of the brush holder by a flange.
9. The polishing pad cleaning apparatus according to claim 4, wherein a third synchronous pulley is provided at an output end of the first servo motor, a fourth synchronous pulley is provided on the first shaft, and a second transmission belt is provided around the third synchronous pulley and the fourth synchronous pulley; a position indicating ruler is arranged on the fourth synchronous belt wheel, a sensor frame is arranged on the motor base, a limiting sensor is arranged on the sensor frame and can sense the position of the position indicating ruler, and the limiting sensor is electrically connected with the control part.
10. The polishing pad cleaning apparatus according to claim 4, wherein the top of the connecting cylinder is fixedly connected to a casing having a downward opening, and the top end of the casing is fixedly connected to the bottom of the casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922496223.2U CN211867467U (en) | 2019-12-31 | 2019-12-31 | Polishing pad cleaning device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922496223.2U CN211867467U (en) | 2019-12-31 | 2019-12-31 | Polishing pad cleaning device |
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| CN211867467U true CN211867467U (en) | 2020-11-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226317A (en) * | 2021-12-13 | 2022-03-25 | 上海提牛机电设备有限公司 | Wafer cleaning device |
| CN114260217A (en) * | 2021-12-13 | 2022-04-01 | 上海提牛机电设备有限公司 | Wafer cleaning system |
-
2019
- 2019-12-31 CN CN201922496223.2U patent/CN211867467U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226317A (en) * | 2021-12-13 | 2022-03-25 | 上海提牛机电设备有限公司 | Wafer cleaning device |
| CN114260217A (en) * | 2021-12-13 | 2022-04-01 | 上海提牛机电设备有限公司 | Wafer cleaning system |
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