CN213646936U

CN213646936U - Dust protected wafer processing tangent plane grinding device

Info

Publication number: CN213646936U
Application number: CN202022495740.0U
Authority: CN
Inventors: 殷泽安; 殷志鹏
Original assignee: Suzhou Yipinxin Semiconductor Co ltd
Current assignee: Suzhou Yipinxin Semiconductor Co ltd
Priority date: 2020-11-02
Filing date: 2020-11-02
Publication date: 2021-07-09
Anticipated expiration: 2030-11-02

Abstract

The utility model belongs to the technical field of the wafer, especially, be a dust protected wafer processing tangent plane grinding device, the on-line screen storage device comprises a base, the top of base is provided with the casing, the one end of base is provided with the water tank, one side of casing is provided with the stoving case. This dust protected wafer processing tangent plane grinding device, collect the mode of receiving the bits box through the air exhauster at the piece that the in-process will produce of polishing, moreover, convenient operation, and because polish and go on in the casing, can effectually prevent that the piece from flying upward, reduce environmental pollution, avoided the piece to cause harm to the staff, polish the effect that the back rethread delivery port sprayed the clear water and played the dust fall on the one hand, on the other hand can wash the workstation, be convenient for use next time, wafer grinding device in the past has been solved and is difficult to the clean problem of piece clearance, can polish two tangent planes of wafer simultaneously through setting up first polishing structure and second polishing structure, can improve machining efficiency.

Description

Dust protected wafer processing tangent plane grinding device

Technical Field

The utility model belongs to the technical field of the wafer, concretely relates to dust protected wafer processing tangent plane grinding device.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, is called a wafer because the shape of the wafer is circular, various circuit element structures can be manufactured on the silicon wafer to form an IC product with a specific electric function, the original material of the wafer is silicon, the surface of the earth crust contains inexhaustible silicon dioxide, silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon, a wafer manufacturing factory melts the polysilicon, seeds are planted in the melting liquid, and then the seeds are slowly pulled out to form a cylindrical monocrystalline silicon rod, as the silicon rod is gradually generated from the molten silicon raw material by the seeds with a crystal plane orientation, the process is called 'crystal growth', the silicon rod is cut, rolled, sliced, chamfered, polished, laser-etched and packaged to form a silicon wafer which is the basic raw material of the integrated circuit factory, this is the "wafer".

Need polish its tangent plane in wafer course of working, current wafer grinding device is difficult to the piece clean processing that produces at the in-process of polishing, not only the polluted environment, still can cause harm to staff's health.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a dust protected wafer processing tangent plane grinding device has solved current wafer grinding device and has been difficult to the piece that will produce at the in-process of polishing and handle totally, and not only the polluted environment still can cause the problem of harm to staff's health.

In order to achieve the above object, the utility model provides a following technical scheme: a dustproof polishing device for a wafer processing section comprises a base, wherein a shell is arranged above the base, a water tank is arranged at one end of the base, a drying box is arranged at one side of the shell, a material containing groove is arranged on the surface of the base, a clamping structure is arranged at one side of the material containing groove, water leakage holes are uniformly formed in one side of the clamping structure, a conical scrap collecting box is arranged below the water leakage holes, an electric slide rail is arranged at one side of the inner wall of the shell, the shell is movably connected with a first polishing structure through the electric slide rail, a second polishing structure is arranged at the other side of the inner wall of the shell, silencing holes are uniformly formed in one side of the electric slide rail, a first electric telescopic rod is arranged at the top of the inner wall of the shell, an arc-shaped clamp is arranged at one end of the first electric telescopic rod, an exhaust fan is arranged on the surface of the inner wall of the shell, and a scrap collecting box is arranged on one side of the exhaust fan.

Preferably, the clamping structure includes a threaded rod, one side of the threaded rod is provided with a slide bar, a first clamping plate is connected between the threaded rod and the slide bar through threads, and one end of the threaded rod is provided with a first motor.

Preferably, the surface of first splint evenly is provided with the spring, the one end of spring is provided with the second splint, the surface of threaded rod is provided with reverse screw.

Preferably, the first polishing structure comprises a second electric telescopic rod, one end of the second electric telescopic rod is provided with a disc, the surface of the disc is provided with an annular electric sliding rail, the disc is movably connected with a second motor through the annular electric sliding rail, an output shaft of the second motor is connected with a grinding disc, and the second polishing structure is completely the same as the first polishing structure in structure.

Preferably, the top of the water tank is provided with a water inlet, the inside of the water tank is provided with a water pump, and one end of the water pump is connected with the water outlet through a water conveying pipe.

Preferably, one side of stoving case is provided with the air intake, the inside of stoving case evenly is provided with the electrical heating silk pipe, one side of electrical heating silk pipe is provided with the fan.

Compared with the prior art, the beneficial effects of the utility model are that:

this dust protected wafer processing tangent plane grinding device, collect the mode of receiving the bits box through the air exhauster at the piece that the in-process will produce of polishing, moreover, convenient operation, and because polish and go on in the casing, can effectually prevent that the piece from flying upward, reduce environmental pollution, avoided the piece to cause harm to the staff, polish the effect that the back rethread delivery port sprayed the clear water and played the dust fall on the one hand, on the other hand can wash the workstation, be convenient for use next time, wafer grinding device in the past has been solved and is difficult to the clean problem of piece clearance, can polish two tangent planes of wafer simultaneously through setting up first polishing structure and second polishing structure, can improve machining efficiency.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a three-dimensional structure of the present invention;

fig. 2 is a cross-sectional view of the present invention;

fig. 3 is a front sectional view of the present invention;

fig. 4 is a side cross-sectional view of the present invention;

FIG. 5 is a cross-sectional view of the water tank of the present invention;

figure 6 is the utility model discloses a stoving case cross-sectional view.

In the figure: 1, a base; 2, a shell; 3, a water tank; 4, a scrap collecting box; 5, drying the box; 6, a material containing groove; 7, a sliding rod; 8, a threaded rod; 9 a first motor; 10 a first splint; 11 a spring; 12 a second splint; 13 silencing holes; 14 water leakage holes; 15 a first electric telescopic rod; 16 electric slide rail; 17 a disk; 18 annular electric slide rail; 19, an arc-shaped clamp; 20 grinding discs; 21 a conical scrap collecting box; 22 a second electric telescopic rod; 23 a second motor; 24 an exhaust fan; 25 water outlet; 26 a water pump; 27 electrically heating the wire tube; 28 blower.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides the following technical solutions: a dust-proof polishing device for a wafer processing section comprises a base 1, a shell 2 is arranged above the base 1, environmental pollution can be effectively reduced by arranging the shell 2, a water tank 3 is arranged at one end of the base 1, a drying box 5 is arranged at one side of the shell 2, a material containing groove 6 is arranged on the surface of the base 1, one end of a wafer is placed in the material containing groove 6 to play a role in fixing, a clamping structure is arranged at one side of the material containing groove 6, water leakage holes 14 are uniformly arranged at one side of the clamping structure, a conical chip collecting box 21 is arranged below the water leakage holes 14, an electric slide rail 16 is arranged at one side of the inner wall of the shell 2, the shell 2 is movably connected with a first polishing structure through the electric slide rail 16, the height position of the first polishing structure can be conveniently adjusted through the electric slide rail 16, a second polishing structure is arranged at the other side of the inner wall of the, noise can be generated in the polishing process, the noise reduction effect can be achieved through the silencing hole 13, a first electric telescopic rod 15 is arranged at the top of the inner wall of the shell 2, an arc-shaped clamp 19 is arranged at one end of the first electric telescopic rod 15, the arc-shaped clamp 19 is pushed by the first electric telescopic rod 15 to clamp and fix the end face of a wafer, the wafer is prevented from deviating in the polishing process, water outlets 25 are uniformly formed in one side of the first electric telescopic rod 15, after polishing is completed, clear water is sprayed through the water outlets 25 to achieve the dust-reducing effect, on the other hand, a workbench can be washed, the next use is facilitated, the problem that the conventional wafer polishing device is difficult to clean up chips is solved, an exhaust fan 24 is arranged on the surface of the inner wall of the shell 2, a chip collecting box 4 is arranged on one side of the exhaust fan 24, and the generated chips are collected into the chip, simple structure, convenient operation can effectually prevent that the piece from flying upward, reduces environmental pollution, has avoided the piece to cause harm to the staff.

Specifically, clamping structure includes threaded rod 8, and one side of threaded rod 8 is provided with slide bar 7, and threaded connection has first splint 10 between threaded rod 8 and the slide bar 7, and the one end of threaded rod 8 is provided with first motor 9, drives threaded rod 8 through first motor 9 and rotates, because threaded rod 8's surface setting is reverse screw, can make two first splint 10 relative movement fix the wafer, is adapted to the wafer of different thickness.

Specifically, the surface of first splint 10 evenly is provided with spring 11, and the one end of spring 11 is provided with second splint 12, and the surface of threaded rod 8 is provided with reverse screw, carries out the centre gripping through second splint 12 and wafer contact to the wafer, and the in-process of polishing can produce the vibration, can play absorbing effect through spring 11.

Specifically, first structure of polishing includes second electric telescopic handle 22, the one end of second electric telescopic handle 22 is provided with disc 17, the surface of disc 17 is provided with annular electric slide rail 18, disc 17 has second motor 23 through annular electric slide rail 18 swing joint, the output shaft of second motor 23 has mill 20, the second structure of polishing is the same completely with the structure of first structure of polishing, promote mill 20 and wafer contact through second electric telescopic handle 22, then according to the size of wafer, adjust the position of mill 20 through annular electric slide rail 18, drive mill 20 through second motor 23 and rotate, it removes to drive mill 20 through annular electric slide rail 18 to rotate the in-process, polish the wafer tangent plane, first structure of polishing and second structure of polishing can polish two tangent planes of wafer simultaneously, can improve machining efficiency.

Specifically, the top of the water tank 3 is provided with a water inlet, the inside of the water tank 3 is provided with a water pump 26, one end of the water pump 26 is connected with the water outlet 25 through a water pipe, clear water is injected into the water tank 3 through the water inlet, and then water is supplied to the water outlet 25 through the water pump 26.

Specifically, one side of stoving case 5 is provided with the air intake, and the inside of stoving case 5 evenly is provided with electrical heating wire pipe 27, and one side of electrical heating wire pipe 27 is provided with fan 28, washes the back that finishes, and the air passes through the air intake and gets into stoving case 5, then heats the air through electrical heating wire pipe 27, then blows hot-air to the workstation through fan 28 again and dries it, prevents to rust.

The utility model discloses a theory of operation and use flow: after the utility model is installed, the device is placed at a proper position, then clear water is injected into the water tank 3 through the water inlet, one end of a wafer is placed in the material containing groove 6, the wafer is clamped and fixed through the clamping structure, then the arc-shaped clamp 19 is pushed by the first electric telescopic rod 15 to clamp and fix the other end surface of the wafer, then the height positions of the first polishing structure and the second polishing structure are adjusted through the electric slide rail 16, then the two sections of the wafer are simultaneously polished through the first polishing structure and the second polishing structure, after polishing, a worker takes out the wafer, produced chips are collected into the chip collecting box 4 through the exhaust fan 24 in the polishing process, the noise reduction effect can be achieved through the sound attenuation hole 13, clear water is sprayed into the shell 2 through the water outlet 25 after polishing is completed, waste water and the chips fall into the conical chip collecting box 21 through the water leakage hole 14, then the air is discharged through a drain pipe, after the washing is finished, the air enters the drying box 5 through the air inlet, then the air is heated through the electric heating wire pipe 27, and then the hot air is blown to the workbench through the fan 28 to be dried, so that the rust is prevented.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a dust protected wafer processing tangent plane grinding device, includes base (1), its characterized in that: a shell (2) is arranged above the base (1), a water tank (3) is arranged at one end of the base (1), a drying box (5) is arranged at one side of the shell (2), a material containing groove (6) is arranged on the surface of the base (1), a clamping structure is arranged at one side of the material containing groove (6), water leakage holes (14) are uniformly formed in one side of the clamping structure, a conical chip collecting box (21) is arranged below the water leakage holes (14), an electric sliding rail (16) is arranged at one side of the inner wall of the shell (2), the shell (2) is movably connected with a first polishing structure through the electric sliding rail (16), a second polishing structure is arranged at the other side of the inner wall of the shell (2), a sound eliminating hole (13) is uniformly formed in one side of the electric sliding rail (16), and a first electric telescopic rod (15) is arranged at the top of the inner wall of, the one end of first electric telescopic handle (15) is provided with arc anchor clamps (19), one side of first electric telescopic handle (15) evenly is provided with delivery port (25), the surface of casing (2) inner wall is provided with air exhauster (24), one side of air exhauster (24) is provided with receipts bits box (4).

2. The apparatus of claim 1, wherein: the clamping structure comprises a threaded rod (8), a sliding rod (7) is arranged on one side of the threaded rod (8), a first clamping plate (10) is connected between the threaded rod (8) and the sliding rod (7) in a threaded mode, and a first motor (9) is arranged at one end of the threaded rod (8).

3. The apparatus of claim 2, wherein: the surface of first splint (10) evenly is provided with spring (11), the one end of spring (11) is provided with second splint (12), the surface of threaded rod (8) is provided with reverse screw.

4. The apparatus of claim 1, wherein: the first polishing structure comprises a second electric telescopic rod (22), a disc (17) is arranged at one end of the second electric telescopic rod (22), an annular electric sliding rail (18) is arranged on the surface of the disc (17), the disc (17) is movably connected with a second motor (23) through the annular electric sliding rail (18), an output shaft of the second motor (23) is connected with a grinding disc (20), and the second polishing structure is completely the same as the first polishing structure in structure.

5. The apparatus of claim 1, wherein: the water tank is characterized in that a water inlet is formed in the top of the water tank (3), a water pump (26) is arranged inside the water tank (3), and one end of the water pump (26) is connected with the water outlet (25) through a water conveying pipe.

6. The apparatus of claim 1, wherein: one side of stoving case (5) is provided with the air intake, the inside of stoving case (5) evenly is provided with electrical heating wire pipe (27), one side of electrical heating wire pipe (27) is provided with fan (28).