CN114473814A - Monocrystalline silicon piece surface treatment device - Google Patents

Monocrystalline silicon piece surface treatment device Download PDF

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Publication number
CN114473814A
CN114473814A CN202210123602.0A CN202210123602A CN114473814A CN 114473814 A CN114473814 A CN 114473814A CN 202210123602 A CN202210123602 A CN 202210123602A CN 114473814 A CN114473814 A CN 114473814A
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China
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seat
monocrystalline silicon
polishing
silicon wafer
supporting seat
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CN202210123602.0A
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Chinese (zh)
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武帅帅
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Individual
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Individual
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Priority to CN202210123602.0A priority Critical patent/CN114473814A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a monocrystalline silicon piece surface treatment device, which relates to the technical field of monocrystalline silicon piece processing and comprises a base, a supporting seat and a polishing plate, wherein a rotating assembly is arranged on the outer side of the top of the base, the supporting seat is arranged on the outer side of the top of the rotating assembly, a sucker seat is connected to the outer side of the top of the supporting seat, a threaded seat is connected to the outer end of the supporting seat, and a lead screw is arranged on the inner side of the threaded seat. In the process of rotating the supporting seat, the smooth balls at the bottom of the lifting seat can support the supporting seat, so that the lifting seat can support the supporting seat in the rotating process of the supporting seat, and meanwhile, the smooth balls can greatly reduce the shaking of the supporting seat in the rotating process, so that the polishing stability of the monocrystalline silicon wafer can be improved.

Description

Monocrystalline silicon piece surface treatment device
Technical Field
The invention relates to the technical field of monocrystalline silicon wafer processing, in particular to a monocrystalline silicon wafer surface treatment device.
Background
Monocrystalline silicon is an active non-metallic element, is an important component of a crystal material, is in the front of the development of new materials, is mainly used for manufacturing monocrystalline silicon wafers serving as semiconductor materials and utilizing solar photovoltaic power generation, heat supply and the like, and as solar energy has the advantages of cleanness, environmental protection, convenience and the like, in the last thirty years, solar energy utilization technology has been greatly developed in the aspects of research and development, commercial production and market development, and becomes one of the new industries of rapid and stable development in the world.
The common monocrystalline silicon piece surface treatment device in the market has poor protective performance, and because the monocrystalline silicon piece is integrally thin and the monocrystalline silicon material is brittle, the monocrystalline silicon piece is easy to crack due to uneven grinding stress in the surface treatment process of the monocrystalline silicon piece.
Disclosure of Invention
The present invention is directed to a surface treatment apparatus for a single crystal silicon wafer to solve the above problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a monocrystalline silicon piece surface treatment device comprises a base, a supporting seat and a polishing plate, wherein a rotating assembly is arranged on the outer side of the top of the base, the supporting seat is arranged on the outer side of the top of the rotating assembly, a sucker seat is connected to the outer side of the top of the supporting seat, a threaded seat is connected to the outer end of the supporting seat, a lead screw is arranged on the inner side of the threaded seat, a bearing seat is arranged on the outer end of the lead screw, a steering shaft is connected to the outer side of the bearing seat, an auxiliary sucker is arranged on the outer end of the steering shaft, the base is connected with a top plate through a supporting plate, a second air cylinder is connected to the outer side of the top plate, a lifting frame body is arranged on the outer side of the bottom of the second air cylinder, a second motor is arranged on the inner side of the lifting frame body, a steering seat is arranged on the outer side of the bottom of the lifting frame body, a third motor is arranged on the right end of the steering seat, a positioning shaft is connected with the left end of the steering seat, and the outside surface of positioning shaft is provided with spacing, throw the flitch and settle in spacing inboard, and throw the surperficial polished rod that is connected with of flitch, spacing outer end is provided with the fourth motor, the top outside that turns to the seat is connected with the dead lever, and the bottom outside of dead lever settles and have the detection case, the bottom inboard of detection case is provided with smoothness degree detection subassembly, the bottom outside that turns to the seat is provided with the water jet, the left end of backup pad is connected with the fan.
Further, the rotating assembly comprises a first cylinder, a fixed table, a first motor, a lifting seat and smooth balls, the fixed table is connected to the outer side of the top of the first cylinder, the first motor is arranged at the inner end of the fixed table, the lifting seat is arranged on the outer side of the top of the fixed table, and the smooth balls are connected to the inner side of the top of the lifting seat.
Furthermore, the lifting seat is annularly distributed, the smooth ball rolls on the inner side of the lifting seat, and the outer surface of the smooth ball is attached to the lower surface of the supporting seat.
Further, the supporting seat is rotatably connected with a first motor, and the first motor is connected with the fixed table in a welding mode.
Furthermore, the auxiliary suckers and the sucker seat are at the same height, and the auxiliary suckers are distributed at the outer end of the sucker seat in an annular shape.
Furthermore, the limiting frames are arranged in three numbers, and the limiting frames are distributed on the surface of the positioning shaft at intervals of 120 degrees.
Furthermore, the polishing plate is in an equilateral triangle shape, and the polishing plate is connected with the polishing strip in an adhesion mode.
Further, smoothness degree determine module includes slide groove, roll pearl, joint seat, conduction pole, spring holder and pressure sensor, the inboard surface in slide groove is connected with the roll pearl, and the ball top outside settles and have the joint seat, settle in the top outside of joint seat has the conduction pole, and the top outer end of joint seat is provided with the spring holder, the top inboard in slide groove is connected with pressure sensor.
Furthermore, the outer surface of the pressure sensor is attached to the outer surface of the conducting rod, and the conducting rod and the connecting seat are vertically distributed.
Further, the device and the method for processing the surface of the monocrystalline silicon wafer comprise the following steps:
s1: placing a monocrystalline silicon wafer on the surface of a sucker seat at the top of a supporting seat, adsorbing the monocrystalline silicon wafer by the sucker seat, moving out the screw rod from the inner side of the threaded seat by rotating the screw rod, changing the arrangement site of the auxiliary sucker, and changing the arrangement site of the auxiliary sucker by pulling a steering shaft after the auxiliary sucker extends out, so that the auxiliary sucker is completely attached to the outer contour of the polished monocrystalline silicon wafer according to the shape of the polished monocrystalline silicon wafer;
s2: the second cylinder drives the lifting frame to move downwards, so that the polishing strip at the bottom of the polishing plate is in contact with the monocrystalline silicon wafer, the first motor works to enable the supporting seat to drive the monocrystalline silicon wafer to rotate, the monocrystalline silicon wafer can be repeatedly rubbed on the surface of the polishing strip to be polished, and in the rotating process of the supporting seat, smooth balls at the bottom of the lifting seat support the supporting seat, so that the lifting seat can support the supporting seat in the rotating process of the supporting seat, and meanwhile, the smooth balls greatly reduce the shaking of the supporting seat in the rotating process;
s3: in the polishing process, the fourth motor rotates to drive the polishing plate to rotate, the polishing plate is in an equilateral triangle shape, and by rotating the polishing plate, polishing strips with other meshes on the surface of the polishing plate can rotate to the joint surface with the monocrystalline silicon wafer and polish the monocrystalline silicon wafer;
s4: in the polishing process, clear water is sprayed to the surface of the monocrystalline silicon piece through a water spray nozzle at the bottom of the steering seat, the fan works to enable impurities polished on the surface of the monocrystalline silicon piece to flow with high-speed air and blow off the surface of the monocrystalline silicon piece, the monocrystalline silicon piece is driven to rotate by the supporting seat in the polishing process, and therefore sewage and the impurities on the surface of the monocrystalline silicon piece can be thrown off the surface of the monocrystalline silicon piece through centrifugal force in the rotating process;
s5: the second motor drives the steering seat to rotate, the steering seat can drive the detection box to rotate, the rolling ball can slide on the surface of the monocrystalline silicon piece, if the surface roughness of the monocrystalline silicon piece is higher, the rolling ball can vibrate a little in the rolling process, the rolling ball can slide in the sliding groove due to vibration, the rolling ball can drive the connecting seat at the top to drive the conducting rod to move upwards, the conducting rod can extrude the pressure sensor, and the whole polishing precision of the monocrystalline silicon piece can be accurately judged by judging pressure data received by the pressure sensor.
The invention provides a monocrystalline silicon piece surface treatment device, which has the following beneficial effects: through making supplementary sucking disc adhere to on monocrystalline silicon piece's outline, can guarantee that monocrystalline silicon piece stress at the polishing in-process is even to can very big reduction monocrystalline silicon piece when the polishing because of the cracked that the atress is uneven caused, judge through the pressure data to pressure sensor received, alright carry out accurate judgement to monocrystalline silicon piece's whole polishing precision, this can remove the lower people's eye of precision and camera discernment from, this identification mode can not receive the influence of light and ability light simultaneously.
1. According to the invention, the arrangement position and the placement site of the auxiliary sucker are changed, so that the auxiliary sucker can be completely attached to the outer contour of the polished monocrystalline silicon wafer according to the shape of the polished monocrystalline silicon wafer, the auxiliary sucker is attached to the outer contour of the monocrystalline silicon wafer, the uniform stress of the monocrystalline silicon wafer in the polishing process can be ensured, the fragmentation of the monocrystalline silicon wafer caused by uneven stress during polishing can be greatly reduced, the placing stability of the monocrystalline silicon wafer in the polishing process can be greatly improved by matching the sucker seat with the auxiliary fixing of the auxiliary sucker, and meanwhile, the fixing convenience of the monocrystalline silicon wafer can be improved by adopting the sucker adsorption fixing mode.
2. In the process of rotating the supporting seat, the smooth balls at the bottom of the lifting seat can support the supporting seat, so that the lifting seat can support the supporting seat in the rotating process of the supporting seat, and meanwhile, the smooth balls can greatly reduce the shaking of the supporting seat in the rotating process, so that the polishing stability of the monocrystalline silicon wafer can be improved.
3. The invention can drive the polishing plate to rotate by rotating the fourth motor, the polishing plate is in an equilateral triangle shape, the polishing strips at other positions on the surface of the polishing plate can be rotated to the joint surface with the monocrystalline silicon wafer by rotating the polishing plate, the number of the three polishing strips on the surface of the polishing plate is different, the monocrystalline silicon wafer can be gradually finely ground by replacing the polishing strips, the polishing strips can be quickly replaced by rotating the polishing plate, the polishing efficiency of the equipment can be improved, in addition, the positioning shaft can be rotated by working through the third motor, three groups of polishing plates are arranged on the surface of the positioning shaft, the placing sites of the three groups of polishing plates can be replaced, the three groups of polishing plates can adopt the polishing strips with the same configuration, and when one group of polishing plates is used for polishing, workers can replace the polishing strips on the other polishing plates, thereby realizing the seamless replacement of the polishing plates, in addition, the three groups of polishing plates can adopt polishing strips with different configurations, so that the polishing precision of the monocrystalline silicon wafer can be further improved.
4. The water spray opening at the bottom of the steering seat can spray clear water to the surface of the monocrystalline silicon piece, so that the polishing fineness can be improved, the fan works to enable impurities polished on the surface of the monocrystalline silicon piece to flow with high-speed air and blow off the surface of the monocrystalline silicon piece, the monocrystalline silicon piece can be effectively prevented from being scratched by the impurities, and the monocrystalline silicon piece is driven to rotate by the supporting seat in the polishing process, so that sewage and the impurities on the surface of the monocrystalline silicon piece can be thrown out of the surface of the monocrystalline silicon piece through centrifugal force in the rotating process, and the ground impurities are automatically cleaned, so that the integral polishing effect of the monocrystalline silicon piece can be improved.
5. The second motor drives the steering seat to rotate, the steering seat can drive the detection box to rotate, the rolling balls can slide on the surface of the monocrystalline silicon piece, if the surface roughness of the monocrystalline silicon piece is high, the rolling balls can vibrate slightly in the rolling process, the rolling balls can slide in the sliding groove due to vibration, the rolling balls can enable the connecting seat at the top to drive the conducting rod to move upwards, the conducting rod can extrude the pressure sensor, the overall polishing precision of the monocrystalline silicon piece can be accurately judged by judging pressure data received by the pressure sensor, human eyes and cameras with low precision can be omitted for identification, and meanwhile, the identification mode cannot be influenced by light rays and visible light.
Drawings
FIG. 1 is a schematic front view showing the overall structure of a surface treatment apparatus for a single crystal silicon wafer according to the present invention;
FIG. 2 is a schematic top view of a chuck base of the surface treatment apparatus for monocrystalline silicon wafers according to the present invention;
FIG. 3 is an enlarged schematic view of a portion A of the surface treatment apparatus for a single-crystal silicon wafer according to the present invention;
FIG. 4 is a schematic top view of a rotating assembly of the surface treatment apparatus for monocrystalline silicon wafers according to the present invention;
FIG. 5 is a schematic view of the positioning axis structure of the surface treatment apparatus for monocrystalline silicon wafer according to the present invention;
FIG. 6 is a schematic view of a polishing plate structure of a surface treatment apparatus for monocrystalline silicon wafers according to the present invention;
FIG. 7 is a schematic structural diagram of a smoothness detection assembly of the surface treatment apparatus for single crystal silicon wafer according to the present invention.
In the figure: 1. a base; 2. a rotating assembly; 201. a first cylinder; 202. a fixed table; 203. a first motor; 204. lifting the seat; 205. smoothing the balls; 3. a supporting seat; 4. a sucker seat; 5. a threaded seat; 6. a lead screw; 7. a bearing seat; 8. a steering shaft; 9. an auxiliary suction cup; 10. a support plate; 11. a top plate; 12. a second cylinder; 13. a lifting frame body; 14. a second motor; 15. a steering seat; 16. a third motor; 17. a positioning shaft; 18. a limiting frame; 19. polishing the plate; 20. polishing the strip; 21. a fourth motor; 22. fixing the rod; 23. a detection box; 24. a smoothness detection component; 2401. a slide groove; 2402. rolling the beads; 2403. a linking seat; 2404. a conductive rod; 2405. a spring seat; 2406. a pressure sensor; 25. a water jet; 26. a fan.
Detailed Description
Referring to fig. 1-7, the present invention provides a technical solution: a monocrystalline silicon wafer surface treatment device comprises a base 1, a supporting seat 3 and a polishing plate 19, wherein a rotating assembly 2 is arranged on the outer side of the top of the base 1, the supporting seat 3 is arranged on the outer side of the top of the rotating assembly 2, a sucker seat 4 is connected to the outer side of the top of the supporting seat 3, a threaded seat 5 is connected to the outer end of the supporting seat 3, a lead screw 6 is arranged on the inner side of the threaded seat 5, a bearing seat 7 is arranged at the outer end of the lead screw 6, a steering shaft 8 is connected to the outer side of the bearing seat 7, an auxiliary sucker 9 is arranged at the outer end of the steering shaft 8, the base 1 is connected with a top plate 11 through a supporting plate 10, a second air cylinder 12 is connected to the outer side of the top plate 11, a lifting frame body 13 is arranged on the outer side of the bottom of the second air cylinder 12, a second motor 14 is arranged on the inner side of the lifting frame body 13, a steering seat 15 is arranged on the outer side of the bottom of the lifting frame body 13, and a third motor 16 is arranged on the right side of the steering seat, the left end that turns to seat 15 is connected with positioning shaft 17, and positioning shaft 17's outside surface is provided with spacing 18, polishing plate 19 settles in spacing 18's inboard, and polishing plate 19's surface is connected with polishing strip 20, spacing 18's outer end is provided with fourth motor 21, the top outside that turns to seat 15 is connected with dead lever 22, and the bottom outside of dead lever 22 settles there is detection case 23, the bottom inboard of detection case 23 is provided with smoothness degree detection subassembly 24, the bottom outside that turns to seat 15 is provided with the water jet 25, the left end of backup pad 10 is connected with fan 26.
Referring to fig. 1-4, the rotating assembly 2 includes a first cylinder 201, a fixed table 202, a first motor 203, a lifting seat 204 and a smooth ball 205, the fixed table 202 is connected to the outside of the top of the first cylinder 201, the first motor 203 is disposed at the inner end of the fixed table 202, the lifting seat 204 is disposed at the outside of the top of the fixed table 202, the smooth ball 205 is connected to the inside of the top of the lifting seat 204, the lifting seat 204 is annularly distributed, the smooth ball 205 rolls inside the lifting seat 204, the outer surface of the smooth ball 205 is attached to the lower surface of the supporting seat 3, the supporting seat 3 is rotatably connected to the first motor 203, the first motor 203 is welded to the fixed table 202, the auxiliary suction cup 9 is at the same height as the suction cup seat 4, and the auxiliary suction cup 9 is annularly distributed at the outer end of the suction cup seat 4;
the operation is as follows, after the monocrystalline silicon piece to be polished is placed on the surface of the sucker seat 4 at the top of the supporting seat 3, the sucker seat 4 can stably adsorb the monocrystalline silicon piece, the screw rod 6 can be moved out from the inner side of the threaded seat 5 by rotating the screw rod 6, so that the placing site of the auxiliary sucker 9 can be changed, in the process of rotating the screw rod 6, the bearing seat 7 can ensure that the auxiliary sucker 9 always faces one side of the monocrystalline silicon piece, after the auxiliary sucker 9 extends out, the placing site of the auxiliary sucker 9 can be changed by pulling the steering shaft 8, the placing position and the placing site of the auxiliary sucker 9 can be changed, the auxiliary sucker 9 can be completely attached to the outer contour of the polished monocrystalline silicon piece according to the shape of the polished monocrystalline silicon piece, and the auxiliary sucker 9 is attached to the outer contour of the monocrystalline silicon piece, so that the stress of the monocrystalline silicon piece in the polishing process can be ensured to be uniform, therefore, the fragmentation of the monocrystalline silicon wafer caused by uneven stress during polishing can be greatly reduced, the placing stability of the monocrystalline silicon wafer during polishing can be greatly improved by matching the sucker seat 4 with the auxiliary sucker 9 for auxiliary fixing, meanwhile, the fixing convenience of the monocrystalline silicon wafer can be improved by adopting a sucker adsorption fixing mode, after the monocrystalline silicon wafer is fixed, the lifting frame body 13 is driven by the second air cylinder 12 to move downwards, the polishing strip 20 at the bottom of the polishing plate 19 can be contacted with the monocrystalline silicon wafer, after the polishing strip 20 is contacted with the monocrystalline silicon wafer, the monocrystalline silicon wafer is driven by the support seat 3 to rotate by the first motor 203 to work, so that the monocrystalline silicon wafer can be repeatedly rubbed on the surface of the polishing strip 20 for polishing, in addition, in the rotating process of the support seat 3, the smooth ball 205 at the bottom of the lifting seat 204 can support the support seat 3, so that the lifting seat 204 can support the support seat 3 in the rotating process of the support seat 3, simultaneously, smooth ball 205 can be very big reduce the rocking of supporting seat 3 in the rotation process, this makes monocrystalline silicon piece's polishing stability can obtain promoting, polish through the mode that adopts the rotation of messenger's monocrystalline silicon piece and polished rod 20 to stand in addition, it is in monocrystalline silicon piece one side to enable to exert the power point, this makes monocrystalline silicon piece can further reduce at the damaged probability of polishing in-process, in addition carry out work through first cylinder 201, the position height that enables supporting seat 3 finely tunes, this makes monocrystalline silicon piece still can stably laminate with polished rod 20 after producing thickness variation because of the polishing.
Referring to fig. 1, 5 and 6, three limiting frames 18 are provided, and the limiting frames 18 are distributed on the surface of the positioning shaft 17 at intervals of 120 °, the polishing plate 19 is an equilateral triangle, and the polishing plate 19 is bonded with the polishing strip 20;
the specific operation is as follows, in the polishing process, the polishing plate 19 can be driven to rotate by rotating the fourth motor 21, the polishing plate 19 is an equilateral triangle, the polishing strips 20 at other positions on the surface of the polishing plate 19 can be rotated to the joint surface with the monocrystalline silicon wafer by rotating the polishing plate 19, the three polishing strips 20 on the surface of the polishing plate 19 have different meshes, the monocrystalline silicon wafer can be gradually finely ground by replacing the polishing strips 20, the polishing strips 20 can be quickly replaced by rotating the polishing plate 19, the polishing efficiency of the equipment can be improved, in addition, the positioning shaft 17 can be rotated by operating the third motor 16, the three groups of polishing plates 19 are arranged on the surface of the positioning shaft 17, the placing positions of the three groups of polishing plates 19 can be replaced, the three groups of polishing plates 19 can adopt the polishing strips 20 with the same configuration, and when one group of polishing plates 19 is used for polishing, the staff can replace the polishing strips 20 on other polishing plates 19, which can realize seamless replacement of the polishing plates 19, and in addition, the three groups of polishing plates 19 can adopt polishing strips 20 with different configurations, which can further improve the polishing precision of the monocrystalline silicon wafer.
Referring to fig. 1 and 7, the smoothness detection assembly 24 includes a slide groove 2401, a rolling ball 2402, a connection seat 2403, a conductive rod 2404, a spring seat 2405 and a pressure sensor 2406, the rolling ball 2402 is connected to the inner side surface of the slide groove 2401, the connection seat 2403 is disposed on the outer side of the top of the rolling ball 2402, the conductive rod 2404 is disposed on the outer side of the top of the connection seat 2403, the spring seat 2405 is disposed on the outer end of the top of the connection seat 2403, the pressure sensor 2406 is connected to the inner side of the top of the slide groove 2401, the outer surface of the pressure sensor 2406 is attached to the outer surface of the conductive rod 2404, and the conductive rod 2404 and the connection seat 2403 are vertically distributed;
the operation is as follows, in the polishing process, the water jet 25 at the bottom of the steering seat 15 can spray clear water to the surface of the monocrystalline silicon piece, which can improve the polishing fineness, and the fan 26 can work, so that the impurities polished on the surface of the monocrystalline silicon piece can be blown out of the surface of the monocrystalline silicon piece along with the flow of high-speed air, which can effectively prevent the monocrystalline silicon piece from being scraped by the impurities, because the monocrystalline silicon piece is driven to rotate by the supporting seat 3 in the polishing process, the sewage and the impurities on the surface of the monocrystalline silicon piece can be blown out of the surface by the centrifugal force in the rotating process, and the polished impurities are automatically cleaned, which can improve the overall polishing effect of the monocrystalline silicon piece, after the polishing is completed, the polishing plate 19 is moved away, the second cylinder 12 continues to work, the detection box 23 can be moved down, so that the rolling beads 2402 at the bottom of the detection box 23 can be attached to the monocrystalline silicon piece, the steering seat 15 is driven to rotate by the second motor 14, the steering seat 15 can drive the detection box 23 to rotate, so that the rolling beads 2402 can slide on the surface of the monocrystalline silicon piece, if the surface roughness of the monocrystalline silicon piece is higher, the rolling beads 2402 can generate a little vibration in the rolling process, the vibration can enable the rolling beads 2402 to slide in the slide groove 2401, this allows the rolling bead 2402 to move the engagement seat 2403 on the top up, which moves the conductive rod 2404, and allows the conductive rod 2404 to squeeze the pressure sensor 2406, the overall polishing precision of the monocrystalline silicon wafer can be accurately judged by judging the pressure data received by the pressure sensor 2406, the identification by human eyes and a camera with lower precision can be avoided, meanwhile, the identification mode is not influenced by light rays and visible light, thereby ensuring that the polishing precision of the monocrystalline silicon piece can reach the standard, and after the rolling ball 2402 moves to a stable surface, the spring can be rebounded through the spring seat 2405, so that the rolling bead 2402 can continuously detect the smoothness of the monocrystalline silicon wafer.
A surface treatment device and a treatment method of a monocrystalline silicon wafer comprise the following steps:
s1: placing a monocrystalline silicon wafer on the surface of a sucker seat 4 at the top of a supporting seat 3, adsorbing the monocrystalline silicon wafer by the sucker seat 4, moving a lead screw 6 out of the inner side of a threaded seat 5 by rotating the lead screw 6, changing the arrangement site of an auxiliary sucker 9, and changing the arrangement site of the auxiliary sucker 9 by pulling a steering shaft 8 after the auxiliary sucker 9 extends out, so that the auxiliary sucker 9 is completely attached to the outer contour of the polished monocrystalline silicon wafer according to the shape of the polished monocrystalline silicon wafer;
s2: the second cylinder 12 drives the lifting frame body 13 to move downwards, so that the polishing strips 20 at the bottom of the polishing plate 19 are in contact with the monocrystalline silicon wafers, the first motor 203 works to enable the supporting seat 3 to drive the monocrystalline silicon wafers to rotate, the monocrystalline silicon wafers can be repeatedly rubbed on the surfaces of the polishing strips 20 to be polished, in the rotating process of the supporting seat 3, the smooth balls 205 at the bottom of the lifting seat 204 support the supporting seat 3, the lifting seat 204 can support the supporting seat 3 in the rotating process of the supporting seat 3, and meanwhile, the smooth balls 205 greatly reduce the shaking of the supporting seat 3 in the rotating process;
s3: in the polishing process, the fourth motor 21 rotates to drive the polishing plate 19 to rotate, the polishing plate 19 is in an equilateral triangle shape, and by rotating the polishing plate 19, polishing strips 20 with other meshes on the surface of the polishing plate 19 can rotate to the joint surface with the monocrystalline silicon wafer, and the monocrystalline silicon wafer is polished;
s4: in the polishing process, a water spray port 25 at the bottom of the steering seat 15 sprays clean water to the surface of the monocrystalline silicon piece, the fan 26 works to enable impurities polished on the surface of the monocrystalline silicon piece to flow with high-speed air and blow out of the surface of the monocrystalline silicon piece, the monocrystalline silicon piece is driven to rotate by the supporting seat 3 in the polishing process, and sewage and impurities on the surface of the monocrystalline silicon piece can be thrown out of the surface of the monocrystalline silicon piece through centrifugal force in the rotating process;
s5: the second motor 14 drives the steering seat 15 to rotate, the steering seat 15 can drive the detection box 23 to rotate, the rolling beads 2402 can slide on the surface of the monocrystalline silicon piece, if the surface roughness of the monocrystalline silicon piece is high, the rolling beads 2402 can vibrate a little in the rolling process, the rolling beads 2402 can slide in the slide groove 2401 due to vibration, the rolling beads 2402 can enable the connecting seats 2403 at the top to drive the conducting rods 2404 to move upwards, the conducting rods 2404 can extrude the pressure sensors 2406, and the overall polishing precision of the monocrystalline silicon piece can be accurately judged by judging pressure data received by the pressure sensors 2406.
To sum up, the monocrystalline silicon piece surface treatment device is used, firstly, after the monocrystalline silicon piece to be polished is placed on the surface of the sucker seat 4 at the top of the supporting seat 3, the sucker seat 4 can stably adsorb the monocrystalline silicon piece, the screw rod 6 can be moved out from the inner side of the threaded seat 5 by rotating the screw rod 6, so that the placing point of the auxiliary sucker 9 can be changed, in the rotating process of the screw rod 6, the bearing seat 7 can ensure that the auxiliary sucker 9 always faces one side of the monocrystalline silicon piece, after the auxiliary sucker 9 extends out, the placing point of the auxiliary sucker 9 can be changed by pulling the steering shaft 8, the placing position and the placing point of the auxiliary sucker 9 can be changed, the auxiliary sucker 9 can be completely attached to the outer contour of the polished monocrystalline silicon piece according to the shape of the polished monocrystalline silicon piece, and the auxiliary sucker 9 can be attached to the outer contour of the monocrystalline silicon piece, so that the stress of the monocrystalline silicon piece can be ensured to be uniform in the polishing process, therefore, the fragmentation of the monocrystalline silicon wafer caused by uneven stress during polishing can be greatly reduced, the placing stability of the monocrystalline silicon wafer during the polishing process can be greatly improved by the auxiliary fixation of the sucker seat 4 and the auxiliary sucker 9, and meanwhile, the fixation convenience of the monocrystalline silicon wafer can be improved by adopting a sucker adsorption fixation mode;
then after the monocrystalline silicon wafer is fixed, the second cylinder 12 drives the lifting frame 13 to move downwards, the polishing strip 20 at the bottom of the polishing plate 19 is enabled to be in contact with the monocrystalline silicon wafer, after the polishing strip 20 is in contact with the monocrystalline silicon wafer, the first motor 203 works to enable the supporting seat 3 to drive the monocrystalline silicon wafer to rotate, so that the monocrystalline silicon wafer can be repeatedly rubbed on the surface of the polishing strip 20 and polished, in addition, in the rotating process of the supporting seat 3, the smooth ball 205 at the bottom of the lifting seat 204 can support the supporting seat 3, so that the lifting seat 204 can support the supporting seat 3 in the rotating process of the supporting seat 3, meanwhile, the smooth ball 205 can greatly reduce the shaking of the supporting seat 3 in the rotating process, so that the polishing stability of the monocrystalline silicon wafer can be improved, in addition, the polishing is carried out by adopting the mode that the monocrystalline silicon wafer rotates and the polishing strip 20 stands still, the force applying point can be positioned on one side of the monocrystalline silicon piece, so that the probability of damage of the monocrystalline silicon piece in the polishing process can be further reduced, and the first cylinder 201 works to finely adjust the position height of the supporting seat 3, so that the monocrystalline silicon piece can be still stably attached to the polishing strip 20 after the thickness of the monocrystalline silicon piece is changed due to polishing;
then, in the polishing process, the fourth motor 21 rotates to drive the polishing plate 19 to rotate, the polishing plate 19 is in an equilateral triangle shape, the polishing strips 20 at other positions on the surface of the polishing plate 19 can rotate to the joint surface with the monocrystalline silicon wafer by rotating the polishing plate 19, the three polishing strips 20 on the surface of the polishing plate 19 have different meshes, the monocrystalline silicon wafer can be gradually finely ground by replacing the polishing strips 20, the polishing strips 20 can be quickly replaced by rotating the polishing plate 19, the polishing efficiency of the equipment can be improved, in addition, the positioning shaft 17 can rotate by operating through the third motor 16, three groups of polishing plates 19 are arranged on the surface of the positioning shaft 17, the placing positions of the three groups of polishing plates 19 can be replaced, the three groups of polishing plates 19 can adopt the same configuration of polishing strips 20, and when one group of polishing plates 19 performs polishing operation, an operator can replace the polishing strips 20 on the other polishing plates 19, the seamless replacement of the polishing plates 19 can be realized, and in addition, the three groups of polishing plates 19 can adopt polishing strips 20 with different configurations, so that the polishing precision of the monocrystalline silicon wafer can be further improved;
then, in the polishing process, the water spray port 25 at the bottom of the steering seat 15 can spray clear water to the surface of the monocrystalline silicon piece, so that the polishing fineness can be improved, the fan 26 works to enable the impurities polished on the surface of the monocrystalline silicon piece to flow along with high-speed air and blow off the surface of the monocrystalline silicon piece, the monocrystalline silicon piece can be effectively prevented from being scraped by the impurities, and the monocrystalline silicon piece is driven to rotate by the supporting seat 3 in the polishing process, so that sewage and the impurities on the surface of the monocrystalline silicon piece can be thrown off the surface of the silicon piece through centrifugal force in the rotating process, and the polished impurities are automatically cleaned, so that the integral polishing effect of the monocrystalline silicon piece can be improved;
finally, after polishing is completed, the polishing plate 19 is moved away, the second cylinder 12 continues to work, the detection box 23 can be moved downwards, the rolling beads 2402 at the bottom of the detection box 23 can be attached to the monocrystalline silicon wafer, the second motor 14 drives the steering seat 15 to rotate, the steering seat 15 drives the detection box 23 to rotate, the rolling beads 2402 can slide on the surface of the monocrystalline silicon wafer, if the surface roughness of the monocrystalline silicon wafer is high, the rolling beads 2402 can generate a little vibration in the rolling process, the rolling beads 2402 can slide in the sliding groove 2401 due to the vibration, the rolling beads 2402 can enable the connecting seats 2403 at the top to drive the conducting rods 2404 to move upwards, the conducting rods 2404 can extrude the pressure sensors 2406, the overall polishing precision of the monocrystalline silicon wafer can be accurately judged by judging the pressure data received by the pressure sensors 2406, and the identification by people and cameras with low precision can be avoided, meanwhile, the recognition mode cannot be influenced by light rays and visible light, so that the polishing precision of the monocrystalline silicon wafer can reach the standard, and after the rolling bead 2402 moves to a stable surface, the rolling bead 2402 can rebound through the spring seat 2405, so that the rolling bead 2402 can continuously detect the smoothness of the monocrystalline silicon wafer.

Claims (10)

1. A monocrystalline silicon piece surface treatment device is characterized by comprising a base (1), a supporting seat (3) and a polishing plate (19), wherein a rotating assembly (2) is arranged on the outer side of the top of the base (1), the supporting seat (3) is arranged on the outer side of the top of the rotating assembly (2), a sucker seat (4) is connected to the outer side of the top of the supporting seat (3), a threaded seat (5) is connected to the outer end of the supporting seat (3), a lead screw (6) is arranged on the inner side of the threaded seat (5), a bearing seat (7) is arranged on the outer end of the lead screw (6), a steering shaft (8) is connected to the outer side of the bearing seat (7), an auxiliary sucker (9) is arranged on the outer end of the steering shaft (8), the base (1) is connected with a top plate (11) through a supporting plate (10), and a second air cylinder (12) is connected to the outer side of the top plate (11), a lifting frame body (13) is arranged on the outer side of the bottom of the second air cylinder (12), a second motor (14) is arranged on the inner side of the lifting frame body (13), a steering seat (15) is arranged on the outer side of the bottom of the lifting frame body (13), a third motor (16) is arranged on the right side of the steering seat (15), the left end of the steering seat (15) is connected with a positioning shaft (17), a limiting frame (18) is arranged on the surface of the outer side of the positioning shaft (17), the polishing plate (19) is arranged on the inner side of the limiting frame (18), a polishing strip (20) is connected to the surface of the polishing plate (19), a fourth motor (21) is arranged on the outer end of the limiting frame (18), a fixing rod (22) is connected to the outer side of the top of the steering seat (15), a detection box (23) is arranged on the outer side of the bottom of the fixing rod (22), and a smoothness detection assembly (24) is arranged on the inner side of the bottom of the detection box (23), a water spray opening (25) is formed in the outer side of the bottom of the steering seat (15), and a fan (26) is connected to the left end of the supporting plate (10).
2. The surface treatment device for the monocrystalline silicon wafer according to claim 1, wherein the rotating assembly (2) comprises a first air cylinder (201), a fixed table (202), a first motor (203), a lifting seat (204) and a smooth ball (205), the fixed table (202) is connected to the outer side of the top of the first air cylinder (201), the first motor (203) is arranged at the inner end of the fixed table (202), the lifting seat (204) is arranged on the outer side of the top of the fixed table (202), and the smooth ball (205) is connected to the inner side of the top of the lifting seat (204).
3. The surface treatment device for the monocrystalline silicon wafer according to claim 2, wherein the lifting seat (204) is annularly distributed, the smooth balls (205) roll inside the lifting seat (204), and the outer surfaces of the smooth balls (205) are attached to the lower surface of the supporting seat (3).
4. The surface treatment device for the monocrystalline silicon wafer according to claim 2, wherein the support base (3) is rotatably connected with a first motor (203), and the first motor (203) is connected with the fixed table (202) in a welding manner.
5. The surface treatment device for the monocrystalline silicon wafer according to claim 1, wherein the auxiliary suction cups (9) are at the same height as the suction cup holder (4), and the auxiliary suction cups (9) are annularly arranged at the outer end of the suction cup holder (4).
6. The surface treatment device for the monocrystalline silicon wafer according to claim 1, wherein the number of the limiting frames (18) is three, and the limiting frames (18) are distributed on the surface of the positioning shaft (17) at intervals of 120 degrees.
7. The surface treatment device for the monocrystalline silicon wafer according to claim 1, wherein the polishing plate (19) is an equilateral triangle, and the polishing plate (19) is adhesively connected to the polishing strip (20).
8. The device for surface treatment of the monocrystalline silicon wafer according to claim 1, wherein the smoothness detection assembly (24) comprises a slide groove (2401), rolling beads (2402), a joint seat (2403), a conducting rod (2404), a spring seat (2405) and a pressure sensor (2406), the rolling beads (2402) are connected to the inner side surface of the slide groove (2401), the joint seat (2403) is arranged on the outer side of the top of the rolling beads (2402), the conducting rod (2404) is arranged on the outer side of the top of the joint seat (2403), the spring seat (2405) is arranged on the outer end of the top of the joint seat (2403), and the pressure sensor (2406) is connected to the inner side of the top of the slide groove (2401).
9. The device for processing the surface of the monocrystalline silicon wafer according to claim 8, wherein the outer surface of the pressure sensor (2406) is attached to the outer surface of the conducting rod (2404), and the conducting rod (2404) and the connecting seat (2403) are vertically distributed.
10. The apparatus for surface treatment of a single crystal silicon wafer and the method for surface treatment thereof according to any one of claims 1 to 9, wherein the apparatus for surface treatment of a single crystal silicon wafer and the method for surface treatment thereof comprise the steps of:
s1: placing a monocrystalline silicon wafer on the surface of a sucker seat (4) at the top of a supporting seat (3), adsorbing the monocrystalline silicon wafer by the sucker seat 4, moving a lead screw (6) out of the inner side of a threaded seat (5) by rotating the lead screw (6), changing the arrangement site of an auxiliary sucker (9), and changing the arrangement site of the auxiliary sucker (9) by pulling a steering shaft (8) after the auxiliary sucker (9) extends out, so that the auxiliary sucker (9) is completely attached to the outer contour of the polished monocrystalline silicon wafer according to the shape of the polished monocrystalline silicon wafer;
s2: the second cylinder (12) drives the lifting frame body (13) to move downwards, so that the polishing strip (20) at the bottom of the polishing plate (19) is in contact with the monocrystalline silicon piece, the first motor (203) works to enable the supporting seat (3) to drive the monocrystalline silicon piece to rotate, the monocrystalline silicon piece can repeatedly rub on the surface of the polishing strip (20) to be polished, the smooth ball 205 at the bottom of the lifting seat (204) supports the supporting seat (3) in the rotating process of the supporting seat (3), the lifting seat (204) can support the supporting seat (3) in the rotating process of the supporting seat (3), and meanwhile, the smooth ball (205) greatly reduces the shaking of the supporting seat (3) in the rotating process;
s3: in the polishing process, the fourth motor (21) rotates to drive the polishing plate (19) to rotate, the polishing plate (19) is in an equilateral triangle shape, and the polishing strips (20) with other meshes on the surface of the polishing plate (19) can rotate to the joint surface with the monocrystalline silicon wafer and polish the monocrystalline silicon wafer by rotating the polishing plate (19);
s4: in the polishing process, clear water is sprayed to the surface of the monocrystalline silicon piece through a water spray port (25) at the bottom of the steering seat (15), a fan (26) works to enable impurities polished on the surface of the monocrystalline silicon piece to flow with high-speed air and blow off the surface of the monocrystalline silicon piece, the monocrystalline silicon piece is driven to rotate by the supporting seat (3) in the polishing process, and sewage and impurities on the surface of the monocrystalline silicon piece can be thrown off the surface of the monocrystalline silicon piece through centrifugal force in the rotating process;
s5: the second motor (14) drives the steering seat (15) to rotate, the steering seat (15) can drive the detection box (23) to rotate, the rolling beads (2402) can slide on the surface of the monocrystalline silicon piece, if the surface roughness of the monocrystalline silicon piece is high, the rolling beads (2402) can generate a little vibration in the rolling process, the vibration can enable the rolling beads (2402) to slide in the slide groove (2401), the rolling beads (2402) can enable the connecting seat (2403) at the top to drive the conducting rod (2404) to move upwards, the conducting rod (2404) extrudes the pressure sensor (2406), and the overall polishing precision of the monocrystalline silicon piece can be accurately judged by judging pressure data received by the pressure sensor (2406).
CN202210123602.0A 2022-02-10 2022-02-10 Monocrystalline silicon piece surface treatment device Withdrawn CN114473814A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116117619A (en) * 2022-12-30 2023-05-16 江苏福旭科技有限公司 Solar-grade monocrystalline silicon piece surface treatment equipment
CN117340711A (en) * 2023-12-04 2024-01-05 内蒙古兴固科技有限公司 Monocrystalline silicon piece grinding device and grinding method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116117619A (en) * 2022-12-30 2023-05-16 江苏福旭科技有限公司 Solar-grade monocrystalline silicon piece surface treatment equipment
CN116117619B (en) * 2022-12-30 2023-10-13 江苏福旭科技有限公司 Solar-grade monocrystalline silicon piece surface treatment equipment
CN117340711A (en) * 2023-12-04 2024-01-05 内蒙古兴固科技有限公司 Monocrystalline silicon piece grinding device and grinding method thereof
CN117340711B (en) * 2023-12-04 2024-02-20 内蒙古兴固科技有限公司 Monocrystalline silicon piece grinding device and grinding method thereof

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Application publication date: 20220513