CN111070098A - Polishing head cleaning device - Google Patents
Polishing head cleaning device Download PDFInfo
- Publication number
- CN111070098A CN111070098A CN201911404893.5A CN201911404893A CN111070098A CN 111070098 A CN111070098 A CN 111070098A CN 201911404893 A CN201911404893 A CN 201911404893A CN 111070098 A CN111070098 A CN 111070098A
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- China
- Prior art keywords
- brush
- rotating shaft
- base
- cylinder
- polishing head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 title claims abstract description 75
- 238000004140 cleaning Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000005507 spraying Methods 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 15
- 230000001680 brushing effect Effects 0.000 claims abstract description 8
- 230000001360 synchronised effect Effects 0.000 claims description 37
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 34
- 229910052710 silicon Inorganic materials 0.000 abstract description 34
- 239000010703 silicon Substances 0.000 abstract description 34
- 239000007921 spray Substances 0.000 abstract description 5
- 241000251468 Actinopterygii Species 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 238000000227 grinding Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a polishing head cleaning device, which comprises a substrate, a cleaning head and a cleaning head, wherein the substrate can be fixedly connected to a machine body; the polishing head comprises a base plate, a brush structure and a polishing head, wherein the brush structure comprises a first brush part and a second brush part which are detachably arranged above the base plate, the first brush part and the second brush part can lift and rotate, the first brush part is used for brushing the side surface of the polishing head, and the second brush part is used for brushing the processing end surface of the polishing head; a rotation driving structure including a first rotation part and a second rotation part; the lifting structure is connected to the bottom of the base plate and extends downwards, and the lifting structure is used for driving the brush structure and the rotary driving structure to lift along the vertical direction; the water spraying structure is used for spraying water to wash the polishing head; the control part, rotary driving structure, elevation structure and water spray structure all are connected with the control part electricity. The device can effectively clean the polishing head, prevents that foreign matter from causing the fish tail to the silicon chip or the foreign matter drops on the silicon chip when absorbing the silicon chip on the polishing head, guarantees the performance of silicon chip.
Description
Technical Field
The invention relates to the technical field of silicon wafer grinding, in particular to a polishing head cleaning device.
Background
Single crystal silicon, an important semiconductor material, has good electrical properties and thermal stability, and has been discovered and utilized as a substitute for other semiconductor materials soon. The silicon material has good high temperature resistance and radiation resistance, and is particularly suitable for manufacturing high-power devices, so that the silicon material is the most applied semiconductor material, and most integrated circuit semiconductor devices are made of the silicon material. In the method for manufacturing a silicon single crystal having good properties, the Czochralski method for growing a silicon single crystal has relatively simple equipment and process, and is easy to realize automatic control. After being pulled out from a single crystal furnace, the silicon rod of the straight-pull single crystal needs to be subjected to a series of working procedures, wherein the working procedures comprise mechanical processing such as cutting, squaring, fillet grinding and plane grinding at the early stage; in the middle period, the monocrystalline silicon rod is required to be subjected to the processes of barreling, slicing, cleaning, chamfering, grinding, re-cleaning and the like; and in the later stage, the silicon wafer is subjected to the procedures of texturing, diffusion, crystallization, sintering and the like to be manufactured into a semiconductor device or a solar cell for photovoltaic power generation.
In the middle-stage grinding process, the silicon wafer and the grinding disc are in dry friction, the surface of the grinding disc is easy to generate heat and damage, and the silicon wafer can be burnt by heat. Foreign matters are arranged on the polishing head and the adsorption pad, so that the silicon wafer is scratched or falls on the silicon wafer during processing, and the performance of the silicon wafer is influenced.
Therefore, the inventor provides a polishing head cleaning device by virtue of experience and practice of related industries for many years so as to overcome the defects in the prior art.
Disclosure of Invention
The invention aims to provide a polishing head cleaning device, which can be used for solving the problems of silicon wafer damage, silicon wafer performance influence and the like caused by the abrasion of foreign matters on a polishing head in the prior art.
The object of the present invention is achieved by a polishing head cleaning apparatus comprising,
the base plate can be fixedly connected to the machine body;
the polishing head comprises a base plate, a brush structure and a polishing head, wherein the brush structure comprises a first brush part and a second brush part which are arranged above the base plate in parallel at intervals and can be detachably arranged, the first brush part and the second brush part can lift and rotate, the first brush part is used for brushing the side surface of the polishing head, and the second brush part is used for brushing the processing end surface of the polishing head;
the rotary driving structure comprises a first rotating part and a second rotating part which can respectively drive the first brush part and the second brush part to rotate;
the lifting structure is connected to the bottom of the substrate and extends downwards, and the lifting structure is used for driving the brush structure and the rotary driving structure to lift along the vertical direction;
the water spraying structure is used for spraying water to wash the polishing head;
and the control part is electrically connected with the rotary driving structure, the lifting structure and the water spraying structure.
In a preferred embodiment of the present invention, the brush structure includes the first brush portion and two second brush portions, the first brush portion is disposed between the two second brush portions, and the brush structure can clean two polishing heads simultaneously.
In a preferred embodiment of the present invention, the first rotating portion includes a first rotating shaft penetrating through the substrate, the first brush portion is detachably connected to a top end of the first rotating shaft, a first servo motor is connected to one end of the first rotating shaft located below the substrate, the first servo motor is configured to drive the first rotating shaft and the first brush portion to rotate circumferentially, a first synchronous pulley is disposed at a bottom end of the first rotating shaft, a second synchronous pulley is disposed at an output end of the first servo motor, and a first synchronous belt is sleeved on the first synchronous pulley and the second synchronous pulley; the first servo motor is erected on the first motor base, and the lifting structure comprises a first cylinder capable of driving the first motor base, the first servo motor, the first rotating shaft and the first brush part to lift;
the second rotating part comprises a second rotating shaft penetrating through the base plate, the second hairbrush part is detachably connected to the top end of the second rotating shaft, one end, located below the base plate, of the second rotating shaft is connected with a second servo motor, the second servo motor is used for driving the second rotating shaft and the second hairbrush part to rotate circumferentially, a third synchronous belt pulley is arranged at the bottom end of the second rotating shaft, a fourth synchronous belt pulley is arranged at the output end of the second servo motor, and a second synchronous belt is sleeved on the third synchronous belt pulley and the fourth synchronous belt pulley; the second servo motor is erected on a second motor base, and the lifting structure comprises a second cylinder capable of driving the second motor base, the second servo motor, the second rotating shaft and the second brush part to lift;
the first servo motor, the first cylinder, the second servo motor and the second cylinder are all electrically connected with the control part.
In a preferred embodiment of the present invention, the first cylinder includes a first cylinder tube fixedly connected to the bottom of the base plate and extending downward, a first cylinder rod is sealingly and slidably disposed at a lower end of the first cylinder tube, the lower end of the first cylinder rod is connected to the bottom of the first cylinder base, and the first motor base is disposed at the top of the first cylinder base; a first housing base is arranged above the top of the first cylinder base, and the bottom end of the first rotating shaft penetrates through the first housing base in a rotating mode;
the second cylinder comprises a second cylinder barrel fixedly connected to the bottom of the base plate and arranged in a downward extending mode, the lower end of the second cylinder barrel penetrates through a second cylinder rod in a sealing and sliding mode, the lower end of the second cylinder rod is connected with the bottom of a second cylinder base, and a second motor base is arranged at the top of the second cylinder base; and a second shell base is arranged above the top of the second cylinder base, and the bottom end of the second rotating shaft rotates to penetrate through the second shell base.
In a preferred embodiment of the present invention, the bottom of the substrate is further connected to a first guide shaft extending downward, a first linear bearing is disposed on the first motor base in a penetrating manner, and the first linear bearing can slide up and down along the first guide shaft along with the first motor base;
the bottom of base plate still is connected with the second guiding axle that downwardly extending set up, wear to establish second linear bearing on the second motor base, second linear bearing can follow the second motor base is followed the second guiding axle slides from top to bottom.
In a preferred embodiment of the present invention, a first housing is coaxially sleeved outside the first rotating shaft, the first housing penetrates through the substrate, a bottom end of the first housing is fixedly supported on the first housing base, two ends of an inner wall of the first housing are respectively provided with a first bearing set, the first rotating shaft rotatably penetrates through the first bearing set, and the first housing can be lifted along with the first housing base and the first rotating shaft;
the second casing is established to the coaxial cover in the outside of second rotation axis, the second casing is worn to establish and is passed through the base plate, the bottom mounting of second casing props and locates on the second casing base, the inner wall both ends of second casing set up second bearing group respectively, the second rotation axis rotates and wears to establish through second bearing group, the second casing can be followed second casing base with the second rotation axis goes up and down.
In a preferred embodiment of the present invention, a substrate cover plate is disposed above the substrate, a first protection tube with an open top is radially sleeved at an interval outside the first casing, and a bottom of the first protection tube is fixedly connected to the substrate cover plate through a first fixing seat; a second protection barrel is sleeved on the outer side of the first protection barrel, the bottom of the second protection barrel is provided with an opening, the top of the second protection barrel is fixedly connected with the top of the first rotating shaft, and the second protection barrel can lift and rotate along with the first rotating shaft;
a third protection cylinder with an opening at the top is radially sleeved at intervals on the outer side of the second machine shell, and the bottom of the third protection cylinder is fixedly connected to the substrate cover plate through a second fixed seat; a fourth protection cylinder is sleeved on the outer side of the third protection cylinder, the bottom of the fourth protection cylinder is open, the top of the fourth protection cylinder is fixedly connected with the top of the second rotating shaft, and the fourth protection cylinder can lift and rotate along with the second rotating shaft.
In a preferred embodiment of the present invention, the first brush part includes a first brush plate detachably connected to a top end of the first rotating shaft, and bristles are horizontally disposed on a side wall of the first brush plate.
In a preferred embodiment of the present invention, the second brush part includes a second brush plate detachably connected to a top end of the second rotating shaft, and bristles are annularly arranged on a top surface of the second brush plate in a vertical direction.
In a preferred embodiment of the present invention, the first brush plate is connected to a top end of the first rotating shaft by a connection screw; the second brush plate is connected to the top end of the second rotating shaft through a connecting screw.
From the foregoing, the polishing head cleaning device provided by the invention has the following beneficial effects:
in the polishing head cleaning device provided by the invention, the first brush part and the second brush part which can clean and scrub the side surface of the polishing head and the processing end surface of the polishing head respectively are arranged, and structurally, the first brush part and the second brush part adopt a detachable connection mode, so that the replacement and maintenance of the brush parts are convenient; functionally, after the silicon wafer is unloaded, the water spraying structure is automatically opened to flush the polishing head, the first brush part and the second brush part can automatically rise, and the processing surface and the side surface of the polishing head are cleaned simultaneously, so that the polishing head can be effectively cleaned, the silicon wafer is prevented from being scratched by foreign matters on the polishing head or the foreign matters fall on the silicon wafer when the silicon wafer is sucked, and the performance of the silicon wafer is ensured; in the polishing head cleaning device provided by the invention, the brush structure comprises the first brush part and the two second brush parts, so that the two polishing heads can be cleaned simultaneously, and the working efficiency is high.
Drawings
The drawings are only for purposes of illustrating and explaining the present invention and are not to be construed as limiting the scope of the present invention.
Wherein:
FIG. 1: is a plan view of the polishing head cleaning apparatus of the present invention.
FIG. 2: is a cross-sectional view taken at a-a in fig. 1.
FIG. 3: is a side view at the first cylinder of the present invention.
FIG. 4: is a side view at the first rotary part of the present invention.
In the figure:
100. a polishing head cleaning device;
1. a substrate; 11. a substrate cover plate;
2. a brush structure; 21. a first brush part; 22. a second brush part;
3. a rotation driving structure;
31. a first rotating section; 311. a first rotating shaft; 312. a first servo motor; 313. a first timing pulley; 314. a second timing pulley; 315. a first synchronization belt; 316. a first motor base; 317. a first housing base;
32. a second rotating section; 321. a second rotation shaft; 322. a second servo motor; 323. a third synchronous pulley; 324. a fourth timing pulley; 325. a second synchronous belt; 326. a second housing base;
4. a lifting structure;
41. a first cylinder; 411. a first cylinder; 412. a first cylinder rod; 413. a first cylinder base; 414. a first guide shaft; 415. a first linear bearing;
42. a second cylinder;
51. a first housing; 52. a second housing; 53. a first bearing set; 54. a second bearing set; 55. a first protective cylinder; 56. a second protective cylinder.
Detailed Description
In order to more clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will now be described with reference to the accompanying drawings.
The specific embodiments of the present invention described herein are for the purpose of illustration only and are not to be construed as limiting the invention in any way. Any possible variations based on the present invention may be conceived by the skilled person in the light of the teachings of the present invention, and these should be considered to fall within the scope of the present invention. It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, indirect connections through intermediaries, and the like. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 to 4, the present invention provides a polishing head cleaning apparatus 100, which is disposed at a silicon wafer unloading position, including,
a base plate 1, which can be fixedly arranged on a machine body (the machine body is fixedly arranged on the ground and is used for covering a power structure of a device, such as a lifting structure, a rotating driving structure and the like, which are not shown in the figure); in an embodiment of the present invention, the substrate 1 is rectangular;
a brush structure 2, including a first brush portion 21 and a second brush portion 22, which are arranged above the substrate in parallel and at intervals and detachably, wherein the first brush portion 21 and the second brush portion 22 can be lifted and rotated, the first brush portion 21 is used for brushing the side surface of the polishing head (prior art), and the second brush portion 22 is used for brushing the processing end surface of the polishing head (the end surface of the polishing head is provided with an adsorption pad to form the processing end surface, which is not shown in the prior art);
a rotation driving structure 3 including a first rotation part 31 and a second rotation part 32 which can drive the first brush part 21 and the second brush part 22 to rotate, respectively;
the lifting structure 4 is connected to the bottom of the substrate 1 and extends downwards, and the lifting structure 4 is used for driving the brush structure 2 and the rotary driving structure 3 to lift along the vertical direction;
the water spraying structure is used for spraying water to wash the polishing head; in the embodiment, the water spraying structure is a water spraying head (only a washing spray head in the prior art is used) communicated with the water supply equipment;
the control part, rotary driving structure, elevation structure and water spray structure all are connected with the control part electricity.
In the polishing head cleaning device provided by the invention, the first brush part and the second brush part which can clean and scrub the side surface of the polishing head and the processing end surface of the polishing head respectively are arranged, and structurally, the first brush part and the second brush part adopt a detachable connection mode, so that the replacement and maintenance of the brush parts are convenient; from the function, after the silicon chip is uninstalled, the water spray structure is automatically opened, washes the rubbing head, and first brush portion and second brush portion can rise automatically, and to the machined surface and the side washing of rubbing head, can effectively wash the rubbing head simultaneously, prevent to have the foreign matter to cause the fish tail or the foreign matter drops on the silicon chip on the rubbing head when absorbing the silicon chip, influence the performance of silicon chip.
Further, as shown in fig. 1 and 2, the brush structure 2 includes a first brush portion 21 and two second brush portions 22, the first brush portion 21 is disposed between the two second brush portions 22 for two polishing heads to share, and the brush structure 2 can clean the two polishing heads simultaneously. A first brush portion 21 and two second brush portions 22 are parallel interval arrangement, and the interval between the three satisfies that first brush portion 21 can clean the processing terminal surface of burnishing head while second brush portion 22 can clean the burnishing head when the side of burnishing head. When a silicon wafer is ground, a group of polishing heads is used for processing, and generally comprises two polishing heads.
Further, as shown in fig. 2 and 4, the first rotating portion 31 includes a first rotating shaft 311 disposed through the substrate 1, the first brush portion 21 is detachably connected to a top end of the first rotating shaft 311, one end of the first rotating shaft 311 located below the substrate 1 is connected to a first servomotor 312, the first servomotor 312 is used for driving the first rotating shaft 311 and the first brush portion 21 to rotate circumferentially, a first synchronous pulley 313 is disposed at a bottom end of the first rotating shaft 311, a second synchronous pulley 314 is disposed at an output end of the first servomotor 312, and the first synchronous pulley 313 and the second synchronous pulley 314 are sleeved with a first synchronous belt 315; the first servo motor 312 is mounted on the first motor base 316, and the lifting structure includes a first cylinder 41 capable of driving the first motor base 316, the first servo motor 312, the first rotating shaft 311 and the first brush part 21 to lift;
the second rotating part 32 includes a second rotating shaft 321 passing through the substrate 1, the second brush part 22 is detachably connected to the top end of the second rotating shaft 321, one end of the second rotating shaft 321 below the substrate 1 is connected with a second servomotor 322, the second servomotor 322 is used for driving the second rotating shaft 321 and the second brush part 22 to rotate circumferentially, the bottom end of the second rotating shaft 321 is provided with a third synchronous pulley 323, the output end of the second servomotor 322 is provided with a fourth synchronous pulley 324, and the third synchronous pulley 323 and the fourth synchronous pulley 324 are sleeved with a second synchronous belt 325; the second servo motor 322 is erected on the second motor base, and the lifting structure comprises a second cylinder 42 which can drive the second motor base, the second servo motor 322, a second rotating shaft 321 and the second brush part 22 to lift;
the first servomotor 312, the first cylinder 41, the second servomotor 322, and the second cylinder 42 are electrically connected to the control unit.
The first servo motor 312 and the second servo motor 322 are driven by servo motors, the control part can control the starting and the closing of the servo motors, and the servo motors can accurately control the rotating speed; synchronous belt transmission is adopted between the first servo motor 312 and the first rotating shaft 311 and between the second servo motor 322 and the second rotating shaft 321, and the operation is more stable.
Further, as shown in fig. 2 and fig. 3, the first cylinder 41 includes a first cylinder 411 fixedly connected to the bottom of the base plate 1 and extending downward, a lower end of the first cylinder 411 is slidably and hermetically inserted into the first cylinder rod 412, a lower end of the first cylinder rod 412 is connected to the bottom of the first cylinder base 413, the top of the first cylinder base 413 is provided with the first motor base 316, in this embodiment, the first cylinder base 413 includes a first base bottom plate, the first base bottom plate is connected to the first base top plate through a vertically arranged cylinder frame, and the first motor base 316 is arranged on the first base top plate;
the first housing base 317 is disposed above the top of the first cylinder base 413 (i.e., above the first base top plate), which is connected to the first housing base 317 by a hexagonal pillar disposed vertically in the present embodiment; the bottom end of the first rotating shaft 311 rotates through the first housing base 317; in this embodiment, a first fixing nut is sleeved on the first rotating shaft 311 at a position below the first housing base 317, and the first fixing nut axially fixes the first rotating shaft 311; the first rotating shaft 311 is positioned below the first fixing nut and sleeved with a first synchronous belt pulley 313;
the second cylinder 42 comprises a second cylinder tube fixedly connected to the bottom of the substrate 1 and extending downwards, the lower end of the second cylinder tube is hermetically and slidably arranged to penetrate through a second cylinder rod, the lower end of the second cylinder rod is connected with the bottom of a second cylinder base, and a second motor base is arranged at the top of the second cylinder base; in the embodiment, the second cylinder base comprises a second base bottom plate, the second base bottom plate is connected with a second base top plate through a vertically arranged cylinder frame, and a second motor base is arranged on the second base top plate;
a second shell base is arranged above the top of the second cylinder base (namely, above a second base top plate), and in the embodiment, the second base top plate is connected with the second shell base through a vertically arranged hexagonal pillar; the bottom end of the second rotating shaft 321 rotates through the second housing base 326; in this embodiment, a second fixing nut is sleeved on the second rotating shaft 321 at a position below the second housing base 326, and the second fixing nut axially fixes the second rotating shaft 321; the second rotation shaft 321 is disposed below the second fixing nut and is sleeved with a second timing belt 325.
Further, as shown in fig. 2 and 4, the bottom of the base plate 1 is further connected with a first guide shaft 414 extending downward, a first linear bearing 415 is arranged on the first motor base 316 in a penetrating manner, and the first linear bearing 415 can slide up and down along the first guide shaft 414 along with the first motor base 316; the bottom of base plate still is connected with the second guiding axle that downwardly extending set up, wears to establish second linear bearing on the second motor base, and second linear bearing can slide from top to bottom along the second guiding axle along the second motor base. The cooperation of the first guide shaft 414 and the first linear bearing 415, and the second guide shaft and the second linear bearing makes the lifting of the first rotating shaft 311 and the second rotating shaft 321 more stable.
Further, as shown in fig. 2, the first housing 51 is coaxially sleeved outside the first rotating shaft 311, the first housing 51 penetrates through the substrate 1, the bottom end of the first housing 51 is fixedly supported on the first housing base 317, the first bearing sets 53 are respectively disposed at two ends of the inner wall of the first housing 51, the first rotating shaft 311 rotatably penetrates through the first bearing sets 53, and the first housing 51 can be lifted and lowered along with the first housing base 317 and the first rotating shaft 311;
the second housing 52 is coaxially sleeved outside the second rotating shaft 321, the second housing 52 penetrates through the substrate 1, the bottom end of the second housing 52 is fixedly supported on the second housing base 326, the two ends of the inner wall of the second housing 52 are respectively provided with the second bearing sets 54, the second rotating shaft 321 rotates to penetrate through the second bearing sets 54, and the second housing 52 can ascend and descend along with the second housing base 326 and the second rotating shaft 321.
Further, as shown in fig. 2, a substrate cover plate 11 is disposed above the substrate 1, a first protection tube 55 with an open top is radially sleeved at intervals on the outer side of the first housing 51, and the bottom of the first protection tube 55 is fixedly connected to the substrate cover plate 11 through a first fixing seat; a second protection cylinder 56 is sleeved on the outer side of the first protection cylinder 55, the bottom of the second protection cylinder 56 is open, the top of the second protection cylinder 56 is fixedly connected with the top of the first rotating shaft 311, and the second protection cylinder 56 can lift and rotate along with the first rotating shaft 311;
a third protection cylinder with an opening at the top is radially sleeved at intervals on the outer side of the second casing 52, and the bottom of the third protection cylinder is fixedly connected to the substrate cover plate through a second fixed seat; a fourth protection cylinder is sleeved on the outer side of the third protection cylinder, the bottom of the fourth protection cylinder is open, the top of the fourth protection cylinder is fixedly connected with the top of the second rotating shaft, and the fourth protection cylinder can lift and rotate along with the second rotating shaft.
Further, the first brush part 21 includes a first brush plate detachably connected to a top end of the first rotating shaft 311, and bristles are horizontally disposed on a side wall of the first brush plate.
Further, the second brush part includes a second brush plate detachably coupled to a top end of the second rotating shaft 321, and bristles are annularly arranged on a top surface of the second brush plate in a vertical direction.
In the present embodiment, the first brush plate is connected to the tip end of the first rotating shaft 311 by a connection screw; the second brush plate is coupled to the top end of the second rotating shaft 321 by a coupling screw.
In an embodiment of the present invention, the method of using the polishing head cleaning apparatus 100 is as follows:
unloading the silicon wafer after the silicon wafer is ground, and automatically rotating the unloading conveying unit to an unloading position;
the control part controls the first air cylinder 41 and the two second air cylinders 42 to be started simultaneously, the first cylinder rod 412 and the second cylinder rod are both recovered to move upwards, the first cylinder rod 412 drives the first brush part 21 to move upwards through the first air cylinder base 413, the first motor base 316 and the first rotating shaft 311, the second cylinder rod drives the second brush part 22 to move upwards through the second air cylinder base, the second motor base and the second rotating shaft 321, the first brush part 21 and the second brush part 22 are integrally pulled to working positions, and the first air cylinder 41 and the two second air cylinders 42 stop working; the water spraying structure (water spraying head) starts to spray water;
the control part controls the first servo motor 312 and the second servo motor 322 to rotate forward, the servo motor drives the first rotating shaft 311 and the second rotating shaft 321 to rotate through the synchronous belts (the first synchronous belt 315 and the second synchronous belt 325), the first brush part 21 and the second brush part 22 rotate synchronously therewith, the first brush part 21 brushes the side surface of the polishing head, and the second brush part 22 brushes the processing end surface (mainly an adsorption pad) of the polishing head;
after the cleaning is finished, the control unit controls the first servomotor 312 and the second servomotor 322 to stop rotating, controls the first cylinder 41 and the two second cylinders 42 to start simultaneously, controls both the first cylinder rod 412 and the second cylinder rod to extend and move downward, and returns the first brush unit 21 and the second brush unit 22 to the original state.
From the foregoing, the polishing head cleaning device provided by the invention has the following beneficial effects:
in the polishing head cleaning device provided by the invention, the first brush part and the second brush part which can clean and scrub the side surface of the polishing head and the processing end surface of the polishing head respectively are arranged, and structurally, the first brush part and the second brush part adopt a detachable connection mode, so that the replacement and maintenance of the brush parts are convenient; functionally, after the silicon wafer is unloaded, the water spraying structure is automatically opened to flush the polishing head, the first brush part and the second brush part can automatically rise, and the processing surface and the side surface of the polishing head are cleaned simultaneously, so that the polishing head can be effectively cleaned, and the phenomenon that the silicon wafer is scratched by foreign matters on the polishing head or the foreign matters fall on the silicon wafer when the silicon wafer is sucked is prevented, and the performance of the silicon wafer is influenced; in the polishing head cleaning device provided by the invention, the brush structure comprises the first brush part and the two second brush parts, so that the two polishing heads can be cleaned simultaneously, and the working efficiency is high.
The above description is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. Any equivalent changes and modifications that can be made by one skilled in the art without departing from the spirit and principles of the invention should fall within the protection scope of the invention.
Claims (10)
1. A cleaning device for a polishing head is characterized by comprising,
the base plate can be fixedly connected to the machine body;
the polishing head comprises a base plate, a brush structure and a polishing head, wherein the brush structure comprises a first brush part and a second brush part which are arranged above the base plate in parallel at intervals and can be detachably arranged, the first brush part and the second brush part can lift and rotate, the first brush part is used for brushing the side surface of the polishing head, and the second brush part is used for brushing the processing end surface of the polishing head;
the rotary driving structure comprises a first rotating part and a second rotating part which can respectively drive the first brush part and the second brush part to rotate;
the lifting structure is connected to the bottom of the substrate and extends downwards, and the lifting structure is used for driving the brush structure and the rotary driving structure to lift along the vertical direction;
the water spraying structure is used for spraying water to wash the polishing head;
and the control part is electrically connected with the rotary driving structure, the lifting structure and the water spraying structure.
2. A polishing head cleaning apparatus according to claim 1, wherein said brush structure includes one of said first brush portion and two of said second brush portions, said first brush portion being disposed between said two of said second brush portions, said brush structure being capable of cleaning both polishing heads simultaneously.
3. A polishing head cleaning device according to claim 2, wherein the first rotating part comprises a first rotating shaft disposed through the base plate, the first brush part is detachably connected to a top end of the first rotating shaft, a first servo motor is connected to an end of the first rotating shaft located below the base plate, the first servo motor is configured to drive the first rotating shaft and the first brush part to rotate circumferentially, a first synchronous pulley is disposed at a bottom end of the first rotating shaft, a second synchronous pulley is disposed at an output end of the first servo motor, and a first synchronous belt is sleeved on the first synchronous pulley and the second synchronous pulley; the first servo motor is erected on the first motor base, and the lifting structure comprises a first cylinder capable of driving the first motor base, the first servo motor, the first rotating shaft and the first brush part to lift;
the second rotating part comprises a second rotating shaft penetrating through the base plate, the second hairbrush part is detachably connected to the top end of the second rotating shaft, one end, located below the base plate, of the second rotating shaft is connected with a second servo motor, the second servo motor is used for driving the second rotating shaft and the second hairbrush part to rotate circumferentially, a third synchronous belt pulley is arranged at the bottom end of the second rotating shaft, a fourth synchronous belt pulley is arranged at the output end of the second servo motor, and a second synchronous belt is sleeved on the third synchronous belt pulley and the fourth synchronous belt pulley; the second servo motor is erected on a second motor base, and the lifting structure comprises a second cylinder capable of driving the second motor base, the second servo motor, the second rotating shaft and the second brush part to lift;
the first servo motor, the first cylinder, the second servo motor and the second cylinder are all electrically connected with the control part.
4. A polishing head cleaning device according to claim 3, wherein the first cylinder comprises a first cylinder tube fixedly connected to the bottom of the base plate and extending downward, a lower end of the first cylinder tube sealingly and slidably penetrates a first cylinder rod, a lower end of the first cylinder rod is connected to the bottom of the first cylinder base, and the first motor base is disposed on the top of the first cylinder base; a first housing base is arranged above the top of the first cylinder base, and the bottom end of the first rotating shaft penetrates through the first housing base in a rotating mode;
the second cylinder comprises a second cylinder barrel fixedly connected to the bottom of the base plate and arranged in a downward extending mode, the lower end of the second cylinder barrel penetrates through a second cylinder rod in a sealing and sliding mode, the lower end of the second cylinder rod is connected with the bottom of a second cylinder base, and a second motor base is arranged at the top of the second cylinder base; and a second shell base is arranged above the top of the second cylinder base, and the bottom end of the second rotating shaft rotates to penetrate through the second shell base.
5. A polishing head cleaning apparatus according to claim 4, wherein a first guide shaft is further connected to a bottom of the base plate and extends downward, and a first linear bearing is disposed through the first motor base and is capable of sliding up and down along the first guide shaft with the first motor base;
the bottom of base plate still is connected with the second guiding axle that downwardly extending set up, wear to establish second linear bearing on the second motor base, second linear bearing can follow the second motor base is followed the second guiding axle slides from top to bottom.
6. A polishing head cleaning device according to claim 4, wherein a first housing is coaxially sleeved outside the first rotating shaft, the first housing is disposed through the substrate, a bottom end of the first housing is fixedly supported on the first housing base, two ends of an inner wall of the first housing are respectively provided with a first bearing set, the first rotating shaft rotatably penetrates through the first bearing set, and the first housing can be lifted and lowered along with the first housing base and the first rotating shaft;
the second casing is established to the coaxial cover in the outside of second rotation axis, the second casing is worn to establish and is passed through the base plate, the bottom mounting of second casing props and locates on the second casing base, the inner wall both ends of second casing set up second bearing group respectively, the second rotation axis rotates and wears to establish through second bearing group, the second casing can be followed second casing base with the second rotation axis goes up and down.
7. A polishing head cleaning apparatus according to claim 6, wherein a substrate cover plate is disposed above the substrate, a first protection barrel with an open top is radially and intermittently sleeved outside the first casing, and a bottom of the first protection barrel is fixedly connected to the substrate cover plate through a first fixing seat; a second protection barrel is sleeved on the outer side of the first protection barrel, the bottom of the second protection barrel is provided with an opening, the top of the second protection barrel is fixedly connected with the top of the first rotating shaft, and the second protection barrel can lift and rotate along with the first rotating shaft;
a third protection cylinder with an opening at the top is radially sleeved at intervals on the outer side of the second machine shell, and the bottom of the third protection cylinder is fixedly connected to the substrate cover plate through a second fixed seat; a fourth protection cylinder is sleeved on the outer side of the third protection cylinder, the bottom of the fourth protection cylinder is open, the top of the fourth protection cylinder is fixedly connected with the top of the second rotating shaft, and the fourth protection cylinder can lift and rotate along with the second rotating shaft.
8. A polishing head cleaning device according to claim 3, wherein said first brush section comprises a first brush plate detachably attached to a tip end of said first rotating shaft, and bristles are arranged in a horizontal direction on a side wall of said first brush plate.
9. A polishing head cleaning device according to claim 8, wherein the second brush section comprises a second brush plate detachably attached to a tip end of the second rotating shaft, and a top surface of the second brush plate is provided with bristles arranged in a vertical direction.
10. A polishing head cleaning apparatus according to claim 9, wherein said first brush plate is attached to a tip end of said first rotating shaft by a coupling screw; the second brush plate is connected to the top end of the second rotating shaft through a connecting screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911404893.5A CN111070098A (en) | 2019-12-31 | 2019-12-31 | Polishing head cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911404893.5A CN111070098A (en) | 2019-12-31 | 2019-12-31 | Polishing head cleaning device |
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| Publication Number | Publication Date |
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| CN111070098A true CN111070098A (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911404893.5A Pending CN111070098A (en) | 2019-12-31 | 2019-12-31 | Polishing head cleaning device |
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| CN (1) | CN111070098A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111482901A (en) * | 2020-04-30 | 2020-08-04 | 杨圣 | Cleaning device of chemical mechanical polishing equipment |
| CN111604781A (en) * | 2020-06-03 | 2020-09-01 | 南通理工学院 | A napping device that is used for steel construction application to have a dust removal function |
| CN115889267A (en) * | 2022-12-22 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Cleaning device, apparatus and method |
| CN117160984A (en) * | 2023-09-08 | 2023-12-05 | 无锡中环应用材料有限公司 | Monocrystalline silicon wafer washing degumming system and degumming process thereof |
-
2019
- 2019-12-31 CN CN201911404893.5A patent/CN111070098A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111482901A (en) * | 2020-04-30 | 2020-08-04 | 杨圣 | Cleaning device of chemical mechanical polishing equipment |
| CN111482901B (en) * | 2020-04-30 | 2022-08-26 | 青岛华芯晶电科技有限公司 | Cleaning device of chemical mechanical polishing equipment |
| CN111604781A (en) * | 2020-06-03 | 2020-09-01 | 南通理工学院 | A napping device that is used for steel construction application to have a dust removal function |
| CN111604781B (en) * | 2020-06-03 | 2021-06-01 | 南通理工学院 | A napping device that is used for steel construction application to have a dust removal function |
| CN115889267A (en) * | 2022-12-22 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Cleaning device, apparatus and method |
| CN117160984A (en) * | 2023-09-08 | 2023-12-05 | 无锡中环应用材料有限公司 | Monocrystalline silicon wafer washing degumming system and degumming process thereof |
| CN117160984B (en) * | 2023-09-08 | 2024-04-12 | 无锡中环应用材料有限公司 | Monocrystalline silicon wafer washing system of coming unstuck |
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