CN212792030U

CN212792030U - Upper and lower surface cleaning device for single chip

Info

Publication number: CN212792030U
Application number: CN202021749717.3U
Authority: CN
Inventors: 程玉学
Original assignee: Sanhe Zhixin Technology Co ltd
Current assignee: Sanhe Zhixin Technology Co ltd
Priority date: 2020-08-20
Filing date: 2020-08-20
Publication date: 2021-03-26
Anticipated expiration: 2030-08-20

Abstract

The utility model discloses a monolithic upper and lower surface cleaning device, which comprises a base, a central shaft is arranged above the base, a driven rotating ring is sleeved on the central shaft in a transmission way, a transmission turntable is arranged on the upper part of the outer side wall of the driven rotating ring, and 6 wafer bearing tables are arranged on the transmission turntable, the utility model provides a monolithic upper and lower surface cleaning device which has novel structure and reasonable layout, when in work, the transmission turntable is driven to rotate by a driving device, the transmission turntable is provided with 6 wafer bearing tables, when one wafer is scrubbed, the turntable rotates anticlockwise by 60 degrees, the wafer after being scrubbed is transmitted to the lower position, simultaneously, the back brush head is lifted up, the wafer which is not scrubbed and is placed on the wafer bearing table is jacked up to be contacted with the front brush head rotating at a relatively high speed to carry out front rotating scrubbing, and simultaneously, the back brush head also rotates reversely at a relatively lower speed, the back of the wafer is brushed in a rotating mode, and the cleaning efficiency and the comprehensiveness of the device are improved.

Description

Upper and lower surface cleaning device for single chip

Technical Field

The utility model relates to a cleaning equipment technical field specifically is a belt cleaning device about monolithic.

Background

A wafer is a silicon chip used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. Wafers are carriers used in the production of integrated circuits, and in general, wafers are referred to as single crystal silicon wafers. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent. The polysilicon is melted by the wafer fab, a small silicon crystal seed is doped into the solution, and then it is slowly pulled out to form a cylindrical monocrystalline silicon ingot, which is called "grain growth" because the silicon ingot is gradually grown from a small grain in the molten silicon feedstock. The silicon crystal bar is ground, polished and sliced to obtain the basic raw material of integrated circuit factory, i.e. silicon wafer.

With the development of the technology in the semiconductor field, the requirement of a semiconductor manufacturer on the cleanliness of a wafer is higher and higher, the requirement on the cleanliness of a wafer box in direct contact with the wafer is also improved, and the traditional wafer box cleaning equipment cannot meet the requirement on the cleanliness.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a lower belt cleaning device about monolithic to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a lower belt cleaning device about monolithic, includes the base, the base top sets up the center pin, and the transmission cover is equipped with driven change on the center pin, and driven change lateral wall upper portion sets up the transmission carousel, sets up 6 wafer plummer on the transmission carousel, driven change outside lower part sets up drive arrangement, center pin top left side wall sets up the crossbeam, and the crossbeam left side sets up the protection casing, and the protection casing passes through crossbeam fixed connection in the center pin left side, the bottom sets up positive brush head in the protection casing, and the first motor at protection casing top is connected through the top pivot to positive brush head, set up the back brush head under the positive brush head, the back brush head is through bottom pivot connection bottom second motor, and the second motor setting is inside the bottom piston rod, and the piston rod.

When the wafer cleaning device works, the driving device drives the transmission turntable to rotate, the transmission turntable is provided with 6 wafer bearing tables, each wafer is cleaned, the turntable rotates 60 degrees anticlockwise, the cleaned wafer is conveyed to a lower wafer position, meanwhile, the second motor and the back brush head are pushed to lift up through the lower air cylinder and the piston rod, the wafer which is not cleaned and placed on the wafer bearing table is jacked up and is contacted with the front brush head rotating at a relatively high speed to be cleaned in a front rotating mode, meanwhile, the back brush head also rotates in the opposite direction at a relatively low speed to clean the back of the wafer in a rotating mode, and the cleaning efficiency and the comprehensiveness of the wafer cleaning device are improved.

As a further aspect of the present invention: the utility model discloses a wafer cleaning machine, including protection casing, protection casing below mouth, protection casing top correspond the pivot and set up fixed bearing, prevent through the protection casing that the in-process wafer is thrown away by centrifugal force to the mouth portion of protecting casing below sets up the lag, and the lag is blue transparent PVC lag, the protection casing top sets up fixed bearing.

As a further aspect of the present invention: the bottom sets up the spacing ring in the plummer, and the spacing ring top corresponds the wafer and sets up the protection pad, and when the wafer was prevented to place by the spacing ring, the wafer took place to drop, promoted the stability of placeeing of plummer, and the protection pad plays the protection wafer effect, improves the security.

As a further aspect of the present invention: the diameter of the front brush head is matched with the diameter of the bearing table, the diameter of the back brush head is matched with the inner diameter of the limiting ring below the bearing table, the back brush head can push the wafer upwards conveniently, and the cleaning comprehensiveness is improved.

As a further aspect of the present invention: the driving device comprises a driving motor, a driving wheel is arranged on the driving motor, the driving wheel is connected to the driven rotating ring through a driving belt, the driving wheel is driven to rotate through the driving motor, the driven rotating ring is driven to rotate, and therefore the transmission rotating disc moves, and the cleaning work efficiency is improved.

As a further aspect of the present invention: the crossbeam right side is installed at 0~3mm within range reciprocating motion's second cylinder, and second cylinder fixed mounting is at the center pin lateral wall, and under the drive of second cylinder, the front brush head can be to wafer upper surface comprehensive cover, guarantees to scrub the quality.

As a further aspect of the present invention: the front brush head and the back brush head are both milky PVC brush heads, and the cylinder at the bottom of the piston rod is a milky PVC cylinder.

Compared with the prior art, the utility model discloses the beneficial effect of following several aspects has:

1. the utility model provides a lower belt cleaning device about monolithic, novel structure and rationally distributed, in operation, it rotates to drive the transmission carousel through drive arrangement, there are 6 wafer plummer on the transmission carousel, every a slice wafer has been scrubbed, carousel anticlockwise rotation 60 degrees, the wafer that will scrub the completion conveys the lower piece position, and simultaneously, promote the second motor and lift up with the back brush head through below cylinder and piston rod, the wafer jack-up that will put not scrub on the wafer plummer, with the rotatory front brush head contact of relative high speed, carry out the front rotation and scrub, and simultaneously, the back brush head is also rotatory in the opposite direction with relatively lower speed, carry out the rotation to the wafer back and scrub, hoisting device's cleaning efficiency and wholeness.

2. The utility model discloses further protection casing below mouth sets up the lag, and the lag is blue transparent PVC lag, the protection casing top corresponds the pivot and sets up fixing bearing, prevents through the lag to scrub in-process wafer and is thrown away by centrifugal force.

3. The utility model discloses further bottom sets up the spacing ring in the plummer, and the spacing ring top corresponds the wafer and sets up the protection and fills up, and when the wafer was prevented to place by the spacing ring, the wafer took place to drop, promoted putting of plummer stability, and the protection is filled up and is played the protection wafer effect, improves the security.

4. The utility model discloses further design drive arrangement, drive arrangement includes driving motor, and the last drive wheel that sets up of driving motor, drive wheel pass through the drive belt and connect on driven swivel, drive the drive wheel through driving motor and rotate, drive driven swivel and rotate to make the transmission carousel motion, promote cleaning work efficiency.

Drawings

FIG. 1 is a schematic front view of a single-piece top and bottom cleaning apparatus;

FIG. 2 is a schematic top view of a drive disk of a single-wafer top-bottom cleaning apparatus;

FIG. 3 is a schematic side view of a driving apparatus in a single-wafer top-bottom cleaning apparatus;

FIG. 4 is a side view of a front face brush head of a single-piece upper and lower cleaning device;

FIG. 5 is a schematic side view of a cross beam in a single-wafer top and bottom cleaning apparatus;

fig. 6 is a schematic perspective view of a transfer turntable in a single-wafer upper and lower surface cleaning apparatus.

In the figure: 1. a base; 2. a central shaft; 3. a drive device; 4. a bearing table; 5. a transmission turntable; 6. a driven swivel; 7. a cross beam; 8. a first motor; 9. a rotating shaft; 10. a front brush head; 11. a back brush head; 12. a second motor; 13. a piston rod; 14. a cylinder; 15. a limiting ring; 16. a drive wheel; 17. a transmission belt; 18. a drive motor; 19. fixing the bearing; 20. a protective cover; 21. a protective sleeve; 22. a second cylinder.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, a single-chip upper and lower surface cleaning device comprises a base 1, a central shaft 2 is arranged above the base 1, a driven rotating ring 6 is sleeved on the central shaft 2 in a transmission manner, a transmission turntable 5 is arranged on the upper portion of the outer side wall of the driven rotating

ring

6, 6 wafer carrying tables 4 are arranged on the transmission turntable 5, a driving device 3 is arranged on the lower portion of the outer side of the driven rotating ring 6, a cross beam 7 is arranged on the left side wall above the central shaft 2, a protective cover 20 is arranged on the left side of the cross beam 7, the protective cover 20 is fixedly connected to the left side of the central shaft 2 through the cross beam 7, a front brush head 10 is arranged at the bottom portion in the protective cover 20, the front brush head 10 is connected with a first motor 8 at the top portion of the protective cover 20 through an upper rotating shaft 9, a back brush head 11 is arranged under the front, the bottom of the piston rod 13 is provided with a cylinder 14.

A protecting sleeve 21 is arranged on the lower opening of the protecting cover 20, the protecting sleeve 21 is a blue transparent PVC protecting sleeve 21, a fixed bearing 19 is arranged at the top of the protecting cover 20 corresponding to the rotating shaft 9, and the wafer is prevented from being thrown away by centrifugal force in the brushing process through the protecting sleeve 21; the front brush head 10 and the back brush head 11 are both milky PVC brush heads, and the cylinder 14 at the bottom of the piston rod 13 is a milky PVC cylinder 14.

The bottom in the bearing table 4 is provided with a limiting ring 15, a protective pad is arranged above the limiting ring 15 corresponding to the wafer, the limiting ring 15 prevents the wafer from falling off when the wafer is placed, the placing stability of the bearing table 4 is improved, and the protective pad plays a role in protecting the wafer and improving the safety; the diameter of the front brush head 10 is matched with that of the bearing table 4, the diameter of the back brush head 11 is matched with the inner diameter of the limiting ring 15 below the bearing table 4, the back brush head 11 can push the wafer upwards conveniently, and the cleaning comprehensiveness is improved; crossbeam 7 right side is installed at 0~3mm within range reciprocating motion's second cylinder 22, and second cylinder 22 fixed mounting is at 2 lateral walls of center pin, and under the drive of second cylinder 22, front brush head 10 can be to the wafer upper surface comprehensive cover, guarantees to scrub the quality.

Drive arrangement 3 includes driving motor 18, sets up drive wheel 16 on driving motor 18, and drive wheel 16 passes through drive belt 17 to be connected on driven swivel 6, drives drive wheel 16 through driving motor 18 and rotates, drives driven swivel 6 and rotates to make transmission carousel 5 move, promote washing work efficiency.

The utility model discloses a theory of operation is: when the wafer cleaning device works, the driving device 3 drives the transmission turntable 5 to rotate, 6 wafer bearing tables 4 are arranged on the transmission turntable 5, when one wafer is cleaned, the turntable rotates 60 degrees anticlockwise, the cleaned wafer is conveyed to a lower wafer position, meanwhile, the second motor 12 and the back brush head 11 are pushed to lift through the lower air cylinder 14 and the piston rod 13, the wafer which is not cleaned and placed on the wafer bearing table 4 is jacked up and is contacted with the front brush head 10 rotating at a relatively high speed to carry out front rotary cleaning, meanwhile, the back brush head 11 also rotates in the opposite direction at a relatively low speed to carry out rotary cleaning on the back of the wafer, and the cleaning efficiency and the comprehensiveness of the wafer cleaning device are improved.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The utility model provides a monolithic upper and lower face belt cleaning device, includes base (1), its characterized in that, base (1) top sets up center pin (2), and the transmission cover is equipped with driven swivel (6) on center pin (2), and driven swivel (6) lateral wall upper portion sets up transmission carousel (5), sets up 6 wafer plummer (4) on transmission carousel (5), driven swivel (6) outside lower part sets up drive arrangement (3), center pin (2) top left side wall sets up crossbeam (7), and crossbeam (7) left side sets up protection casing (20), and protection casing (20) pass through crossbeam (7) fixed connection in center pin (2) left side, the bottom sets up front brush head (10) in protection casing (20), and front brush head (10) pass through top pivot (9) and connect first motor (8) at protection casing (20) top, front brush head (10) are under set up back brush head (11), the back brush head (11) is connected with a second motor (12) at the bottom through a rotating shaft (9) at the bottom, the second motor (12) is arranged inside a piston rod (13) at the bottom, and an air cylinder (14) is arranged at the bottom of the piston rod (13).

2. A single-piece upper and lower cleaning device according to claim 1, wherein a protecting cover (21) is arranged at the lower opening of the protecting cover (20), the protecting cover (21) is a blue transparent PVC protecting cover (21), and a fixed bearing (19) is arranged at the top of the protecting cover (20) corresponding to the rotating shaft (9).

3. A single-chip upper and lower surface cleaning device according to claim 1, wherein a limiting ring (15) is arranged at the bottom in the bearing table (4), and a protective pad is arranged above the limiting ring (15) corresponding to the chip.

4. A single-piece above-and-below cleaning device according to any of claims 1-3, characterized in that the diameter of the front brush head (10) is adapted to the diameter of the carrier (4) and the diameter of the back brush head (11) is adapted to the inner diameter of the retaining ring (15) below the carrier (4).

5. A single-piece above-below cleaning device according to claim 4, characterized in that the drive means (3) comprise a drive motor (18), the drive motor (18) being provided with a drive wheel (16), the drive wheel (16) being connected to the driven swivel (6) by means of a drive belt (17).

6. A single-piece upper and lower surface cleaning device according to claim 5, characterized in that the right side of the cross beam (7) is provided with a second cylinder (22) which reciprocates within the range of 0-3 mm, and the second cylinder (22) is fixedly arranged on the central shaft (2).

7. A single-piece upper and lower surface cleaning device according to claim 6, wherein the front brush head (10) and the back brush head (11) are both milky PVC brush heads, and the cylinder (14) at the bottom of the piston rod (13) is a milky PVC cylinder (14).