CN115889267A - Cleaning device, apparatus and method - Google Patents
Cleaning device, apparatus and method Download PDFInfo
- Publication number
- CN115889267A CN115889267A CN202211657789.9A CN202211657789A CN115889267A CN 115889267 A CN115889267 A CN 115889267A CN 202211657789 A CN202211657789 A CN 202211657789A CN 115889267 A CN115889267 A CN 115889267A
- Authority
- CN
- China
- Prior art keywords
- brush
- supporting substrate
- hairbrush
- rotating shaft
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 abstract description 27
- 239000002245 particle Substances 0.000 abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 238000011109 contamination Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Images
Abstract
The invention provides a cleaning device, equipment and a method, and relates to the technical field of silicon wafer polishing. The device includes: a support and a support matrix; the support is fixedly connected with the support matrix; at least one first brush and at least one second brush are arranged on the supporting substrate, and the first brush and the second brush are arranged at intervals; the first hairbrush is connected with the supporting substrate through a rotating shaft, and the second hairbrush is fixedly connected with the supporting substrate; or the second hairbrush is connected with the supporting substrate through a rotating shaft, and the first hairbrush is fixedly connected with the supporting substrate; alternatively, the first brush and the second brush are coupled to the support substrate by a rotating shaft. According to the cleaning device provided by the embodiment of the invention, the first hairbrush and/or the second hairbrush can be driven by the rotating shaft to rotate relative to the supporting substrate, so that stains or particles with different sizes on the surface of the polishing head can be cleaned.
Description
Technical Field
The invention relates to the technical field of silicon wafer polishing, in particular to a cleaning device, equipment and a method.
Background
After the polishing head polishes the wafer, impurities such as contamination or particles exist in adhesives such as epoxy resin adhered to the edge of the polishing head and the surface of the polishing head, and the polishing head needs to be cleaned in order to ensure that new impurities are not brought into the wafer in the polishing process. The existing chuck cleaner brushes and sweeps the polishing head by driving the brush through the rotation of the supporting substrate, and assists the water flow with certain water speed to act between the brush and the polishing head, thereby realizing the cleaning of the polishing head. However, the contamination or particle size of the polishing head is different, and the polishing head cannot be cleaned completely by the conventional chuck cleaner because the height difference between the adhesive and the polishing head surface is caused by the adhesive such as epoxy resin adhered to the polishing head surface, thereby affecting the quality of the wafer.
Disclosure of Invention
In order to solve the technical problems, the invention provides a cleaning device, equipment and a method, which can solve the problem that the quality of a wafer is influenced because a chuck cleaner cannot thoroughly clean a polishing head in the prior art.
In order to solve the technical problem, the invention adopts the following technical scheme:
a cleaning device, comprising:
a support and a support matrix;
the supporting piece is fixedly connected with the supporting substrate;
at least one first brush and at least one second brush are arranged on the supporting substrate, and the first brush and the second brush are arranged at intervals;
the first hairbrush is connected with the supporting substrate through a rotating shaft, and the second hairbrush is fixedly connected with the supporting substrate; or the second brush is connected with the supporting substrate through a rotating shaft, and the first brush is fixedly connected with the supporting substrate; alternatively, the first brush and the second brush are coupled to the support substrate by a rotating shaft.
Further, the rotating shaft is a telescopic rotating shaft;
the first and/or second brushes are distal from the support substrate when the rotating shaft is in an elongated state;
the first and/or second brushes are proximate to the support substrate when the rotating shaft is in a shortened state.
Furthermore, the distance between one end of the bristles on the first brush, which is far away from the supporting substrate, and the supporting substrate is a first distance, and the distance between one end of the bristles on the second brush, which is far away from the supporting substrate, and the supporting substrate is a second distance;
the first distance is different from the second distance.
Further, the bristles on the first brush are different in length from the bristles on the second brush.
Further, the bristle setting densities of the first brush and the second brush are different.
Furthermore, the number of the first hairbrush and the number of the second hairbrush are three, and the first hairbrush and the second hairbrush are arranged in a sixty-degree mode.
An embodiment of the present invention further provides a cleaning apparatus, including: a flushing device and a cleaning device as described above;
in the working process of the cleaning equipment, the washing device provides cleaning liquid with preset flow speed for the cleaning equipment to clean the object to be cleaned, the first brush and the second brush.
The embodiment of the invention also provides a cleaning method, which is applied to the cleaning device and comprises the following steps:
the rotating shaft drives the first hairbrush and/or the second hairbrush to rotate in a first direction at a first rotating speed, and simultaneously, the supporting substrate and the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate in a second direction at a second rotating speed, and articles to be cleaned are cleaned; alternatively, the first and second electrodes may be,
the rotating shaft drives the first brush and/or the second brush to rotate in a first direction at a first rotating speed, so that the object to be cleaned is cleaned in a first way; the supporting substrate, the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate in a second direction at a second rotating speed, and articles to be cleaned are cleaned in a second mode.
The invention has the beneficial effects that:
according to the cleaning device provided by the embodiment of the invention, the first hairbrush and/or the second hairbrush is/are arranged on the supporting substrate through the rotating shaft, so that the first hairbrush and/or the second hairbrush can rotate relative to the supporting substrate under the driving of the rotating shaft, and the cleaning device can clean stains or particles with different sizes on the surface of the polishing head.
Drawings
Fig. 1 is a schematic structural view of a cleaning device according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help the full understanding of the embodiments of the present invention. Thus, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The invention provides a cleaning device, equipment and a method, aiming at the problem that the quality of a wafer is influenced because a chuck cleaner in the prior art cannot thoroughly clean a polishing head.
As shown in fig. 1, an embodiment of the present invention provides a cleaning apparatus, including:
a support and a support matrix 1;
the supporting piece is fixedly connected with the supporting substrate 1;
at least one first brush 2 and at least one second brush 3 are arranged on the supporting substrate 1, and the first brush 2 and the second brush 3 are arranged at intervals;
the first hairbrush 2 is connected with the supporting substrate 1 through a rotating shaft, and the second hairbrush 3 is fixedly connected with the supporting substrate 1; or, the second brush 3 is connected with the support substrate 1 through a rotating shaft, and the first brush 2 is fixedly connected with the support substrate 1; alternatively, the first and second brushes 2 and 3 are coupled to the support substrate 1 by a rotating shaft.
Optionally, the first brush 2 comprises: a first bristle carrier 21 and first bristles 22;
the first bristles 22 are arranged on the first bristle carrier 21 on the side thereof remote from the support matrix 1;
the first bristles 22 are attached to the support matrix 1 by the first bristle holder 21.
Optionally, the second brush 3 comprises: a second bristle holder 31 and second bristles 32;
the second bristles 32 are arranged on the second bristle carrier 31 on the side thereof remote from the support matrix 1;
the second bristles 32 are attached to the support matrix 1 by the second bristle holder 31.
Alternatively, in the case where the first fur brush 2 and the second fur brush 3 are coupled to the support substrate 1 by means of rotating shafts, the rotating direction of the first rotating shaft coupling the first fur brush 2 to the support substrate 1 is opposite to the rotating direction of the second rotating shaft coupling the second fur brush 3 to the support substrate 1.
According to the cleaning device provided by the embodiment of the invention, the first hairbrush and/or the second hairbrush are/is arranged on the supporting substrate through the rotating shaft, so that the first hairbrush and/or the second hairbrush can rotate relative to the supporting substrate under the driving of the rotating shaft, and stains or particles with different sizes on the surface of the polishing head can be cleaned.
Optionally, the rotating shaft is a telescopic rotating shaft;
the first brush 2 and/or the second brush 3 are/is distanced from the support matrix 1 when the rotation axis is in the elongated state;
the first brush 2 and/or the second brush 3 are/is close to the support substrate 1 when the rotation axis is in a shortened state.
According to the cleaning device provided by the embodiment of the invention, the distance between the first hairbrush and/or the second hairbrush and the polishing head can be adjusted by arranging the telescopic rotating shaft, and the polishing head and the dirt or particles at the height difference formed by the bonding agent bonded on the surface of the polishing head can be cleaned, so that the cleaning effect on the polishing head is improved, and the quality of a wafer is improved.
Optionally, the distance between the end of the bristles of the first brush 2 away from the support substrate 1 and the support substrate 1 is a first distance, and the distance between the end of the bristles of the second brush 3 away from the support substrate 1 and the support substrate 1 is a second distance;
the first distance is different from the second distance.
Optionally, the first distance is different from the second distance, including:
the lengths of the first bristles on the first brush 2 and the second bristles on the second brush 3 are different; alternatively, the first and second electrodes may be,
the first bristles and the second bristles have the same length, and a third distance and a fourth distance are different relative to the support matrix 1;
wherein the third distance is the distance between the end of the first bristle holder remote from the support substrate 1 and the support substrate 1, and the fourth distance is the distance between the end of the second bristle holder remote from the support substrate 1 and the support substrate 1.
According to the cleaning device provided by the embodiment of the invention, the first distance and the second distance are different, and the contamination on each part of the surface of the polishing head can be cleaned, so that the cleaning effect on the polishing head is improved, and the quality of the wafer is improved.
Optionally, the first brush 2 and the second brush 3 have different specifications.
The specification and size of the first brush 2 and the second brush 3 are different, which can be understood as follows: the lengths of the bristles on the first brush 2 and the bristles on the second brush 3 are different; alternatively, the first and second electrodes may be,
the bristle setting densities of the first brush 2 and the second brush 3 are different; alternatively, the first and second electrodes may be,
the first bristle holder is a different size than the second bristle holder.
In an optional embodiment of the present invention, the length of the first bristles on the first brush is greater than the length of the second bristles on the second brush; the density of the first bristles on the first brush is less than that of the second bristles on the second brush; a first projected area of the first bristle holder on the support matrix is greater than a second projected area of the second bristle holder on the support matrix.
According to the cleaning device provided by the embodiment of the invention, the first hairbrush and the second hairbrush with different specifications and sizes are arranged, so that the contamination or particles with different sizes on the surface of the polishing head can be cleaned, and the cleaning efficiency of the surface of the polishing head is improved.
Optionally, the number of the first brushes 2 and the number of the second brushes 3 are three, and the first brushes 2 and the second brushes 3 are arranged at sixty degrees.
In an optional embodiment of the present invention, three first brushes and three second brushes are provided, and the first brushes and the second brushes are spaced apart from each other, and an included angle between each first brush and the second brush is 60 degrees.
In an optional embodiment of the present invention, two first brushes and two second brushes are provided, the first brushes and the second brushes are spaced apart from each other, and an included angle between each first brush and the second brush is 90 degrees.
An embodiment of the present invention further provides a cleaning apparatus, including: a flushing device and a cleaning device as described above;
in the working process of the cleaning equipment, the washing device provides cleaning liquid with preset flow speed for the cleaning equipment to clean the object to be cleaned, the first brush and the second brush.
Optionally, the cleaning liquid flows between the cleaning object and the first and second brushes for cleaning the contamination on the cleaning object and the first and second brushes.
In an optional embodiment of the present invention, the cleaning solution is clean water, and the object to be cleaned, the first brush and the second brush are washed at a preset flow rate.
The embodiment of the invention also provides a cleaning method, which is applied to the cleaning device and comprises the following steps:
the rotating shaft drives the first brush and/or the second brush to rotate in a first direction at a first rotating speed, and simultaneously the supporting substrate and the first brush and the second brush which are arranged on the supporting substrate are driven by the supporting piece to rotate in a second direction at a second rotating speed, and articles to be cleaned are cleaned; alternatively, the first and second electrodes may be,
the rotating shaft drives the first brush and/or the second brush to rotate in a first direction at a first rotating speed, and first cleaning is carried out on an article to be cleaned; the supporting substrate, the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate in a second direction at a second rotating speed, and articles to be cleaned are cleaned in a second mode.
Optionally, the first direction is a clockwise direction, and the second direction is a clockwise direction.
In an optional embodiment of the present invention, while the rotating shaft drives the first brush and/or the second brush to rotate clockwise at a first rotating speed, the supporting member drives the supporting substrate and the first brush and the second brush disposed on the supporting substrate to rotate clockwise at a second rotating speed, and the rotating speed of the first brush and/or the second brush connected by the rotating shaft is the first rotating speed plus the second rotating speed.
In an optional embodiment of the present invention, the rotating shaft drives the first brush and/or the second brush to rotate clockwise at a first rotation speed, so as to perform a first cleaning on the cleaning object, and then the rotating shaft stops rotating;
the supporting substrate, the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate clockwise at a second rotating speed, and articles to be cleaned are cleaned for the second time.
According to the cleaning method provided by the embodiment of the invention, the first hairbrush, the second hairbrush and the supporting substrate are arranged in the same rotating direction, so that the rotating speed of the hairbrush can be adjusted when the to-be-cleaned object is cleaned, and the cleaning efficiency of the to-be-cleaned object is improved.
In an alternative embodiment of the present invention, the rotating shaft is a retractable rotating shaft; the rotating shaft extends to enable the first brush and/or the second brush to be far away from the supporting substrate, and drives the first brush and/or the second brush to rotate clockwise at a first rotating speed to perform first cleaning on the cleaning object, and then the rotating shaft is shortened to enable the first brush and/or the second brush to be far away from the supporting substrate to drive the first brush and/or the second brush;
the supporting substrate, the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate clockwise at a second rotating speed, and articles to be cleaned are cleaned for the second time.
According to the cleaning method provided by the embodiment of the invention, the height of the first hairbrush and/or the second hairbrush is/are adjusted through the rotating shaft, so that the stains on any angle and any corner of the surface of an article to be cleaned can be cleaned.
Optionally, the first direction is a clockwise direction, and the second direction is a counterclockwise direction.
In an optional embodiment of the present invention, the rotating shaft drives the first brush and/or the second brush to rotate clockwise at a first rotation speed, and the support member drives the support substrate and the first brush and the second brush disposed on the support substrate to rotate counterclockwise at a second rotation speed.
In an optional embodiment of the present invention, the rotating shaft drives the first brush and/or the second brush to rotate clockwise at a first rotation speed, so as to perform a first cleaning on the cleaning object, and then the rotating shaft stops rotating;
the supporting substrate, the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate anticlockwise at a second rotating speed, and articles to be cleaned are cleaned for the second time.
According to the cleaning method provided by the embodiment of the invention, the first hairbrush, the second hairbrush and the supporting substrate are arranged in opposite rotating directions, so that the surface of the object to be cleaned can be cleaned from multiple angles, and the cleaning efficiency of the object to be cleaned is improved.
In an alternative embodiment of the present invention, the rotating shaft is a retractable rotating shaft; the rotating shaft extends to enable the first brush and/or the second brush to be far away from the supporting substrate, and drives the first brush and/or the second brush to rotate clockwise at a first rotating speed to perform first cleaning on the cleaning object, and then the rotating shaft is shortened to enable the first brush and/or the second brush to be far away from the supporting substrate to drive the first brush and/or the second brush;
the supporting substrate, the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate anticlockwise at a second rotating speed, and articles to be cleaned are cleaned for the second time.
According to the cleaning method provided by the embodiment of the invention, the first hairbrush and/or the second hairbrush are/is arranged on the supporting substrate through the rotating shaft, so that the first hairbrush and/or the second hairbrush can rotate relative to the supporting substrate under the driving of the rotating shaft, and stains or particles with different sizes on the surface of the polishing head can be cleaned.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and reference may be made to the partial description of the product embodiments for relevant points.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive the changes within the technical scope of the present disclosureOr alternatives, are intended to be within the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims 。
Claims (8)
1. A cleaning device, comprising:
a support and a support matrix;
the support is fixedly connected with the support matrix;
at least one first brush and at least one second brush are arranged on the supporting substrate, and the first brush and the second brush are arranged at intervals;
the first hairbrush is connected with the supporting substrate through a rotating shaft, and the second hairbrush is fixedly connected with the supporting substrate; or the second hairbrush is connected with the supporting substrate through a rotating shaft, and the first hairbrush is fixedly connected with the supporting substrate; alternatively, the first brush and the second brush are coupled to the support substrate by a rotating shaft.
2. The cleaning apparatus as claimed in claim 1, wherein the rotating shaft is a retractable rotating shaft;
the first and/or second brushes are distal from the support substrate when the rotating shaft is in an elongated state;
the first and/or second brushes are proximate to the support substrate when the rotating shaft is in a shortened state.
3. The cleaning device of claim 1, wherein the bristles on the first brush are spaced a first distance from the supporting substrate at an end of the first brush distal from the supporting substrate, and the bristles on the second brush are spaced a second distance from the supporting substrate at an end of the second brush distal from the supporting substrate;
the first distance is different from the second distance.
4. The cleaning device of claim 1, wherein the bristles on the first brush are of different lengths than the bristles on the second brush.
5. The cleaning device as claimed in claim 1 or 4, wherein the first brush and the second brush have bristles arranged at different densities.
6. The cleaning apparatus as claimed in claim 1, wherein the number of the first brush and the second brush is three, and the first brush and the second brush are disposed at sixty degrees.
7. A cleaning apparatus, comprising: a rinsing device and a cleaning device as claimed in any one of claims 1 to 6;
in the working process of the cleaning equipment, the washing device provides cleaning liquid with preset flow speed for the cleaning equipment to clean the object to be cleaned, the first brush and the second brush.
8. A cleaning method applied to the cleaning device according to any one of claims 1 to 6, comprising:
the rotating shaft drives the first brush and/or the second brush to rotate in a first direction at a first rotating speed, and simultaneously the supporting substrate and the first brush and the second brush which are arranged on the supporting substrate are driven by the supporting piece to rotate in a second direction at a second rotating speed, and articles to be cleaned are cleaned; alternatively, the first and second electrodes may be,
the rotating shaft drives the first brush and/or the second brush to rotate in a first direction at a first rotating speed, and first cleaning is carried out on an article to be cleaned; the supporting substrate, the first hairbrush and the second hairbrush which are arranged on the supporting substrate are driven by the supporting piece to rotate in a second direction at a second rotating speed, and articles to be cleaned are cleaned in a second mode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211657789.9A CN115889267A (en) | 2022-12-22 | 2022-12-22 | Cleaning device, apparatus and method |
| TW112105725A TW202330113A (en) | 2022-12-22 | 2023-02-17 | Cleaning device, apparatus, and method that includes a first brush and a second brush, a least one of which is connected by a rotating axle to a support substrate to be rotatable relative to the support substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211657789.9A CN115889267A (en) | 2022-12-22 | 2022-12-22 | Cleaning device, apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115889267A true CN115889267A (en) | 2023-04-04 |
Family
ID=86476112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211657789.9A Pending CN115889267A (en) | 2022-12-22 | 2022-12-22 | Cleaning device, apparatus and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115889267A (en) |
| TW (1) | TW202330113A (en) |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020004964A1 (en) * | 1999-12-15 | 2002-01-17 | Luchino Thomas Patrick | Toothbrush with individually embedded bristles |
| CN1603015A (en) * | 2003-09-29 | 2005-04-06 | 中芯国际集成电路制造(上海)有限公司 | Washing device and method of silicon chip cleaning brush |
| US20090065607A1 (en) * | 2007-09-10 | 2009-03-12 | Gardner Michael R | Pressure washer system |
| WO2016043152A1 (en) * | 2014-09-17 | 2016-03-24 | コニカミノルタ株式会社 | Brush for sunlight-reflection mirror, and method and device for cleaning sunlight-reflection mirror |
| KR20160052986A (en) * | 2014-10-30 | 2016-05-13 | 삼성중공업 주식회사 | Underwater cleaning robot |
| US20160338811A1 (en) * | 2013-12-19 | 2016-11-24 | Colgate-Palmolive Company | Powered toothbrush head having a tuft block with a combination of oscillating motions |
| US20170092481A1 (en) * | 2015-09-30 | 2017-03-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP Cleaning and Apparatus |
| US20180009419A1 (en) * | 2016-07-05 | 2018-01-11 | Favagrossa Edoardo S.R.L. | Brush construction for motor vehicle washing systems |
| CN108435616A (en) * | 2018-06-01 | 2018-08-24 | 四川益泽丰信息科技有限公司 | A kind of outdoor LED screen auto dust cleaning machine |
| JP2019096657A (en) * | 2017-11-20 | 2019-06-20 | 三菱電機株式会社 | Cleaning apparatus |
| CN111070098A (en) * | 2019-12-31 | 2020-04-28 | 浙江芯晖装备技术有限公司 | Polishing head cleaning device |
| CN211865947U (en) * | 2020-03-19 | 2020-11-06 | 赵建坤 | Cleaning device for heating and ventilating air conditioner |
| CN215745000U (en) * | 2021-03-29 | 2022-02-08 | 江苏隆基乐叶光伏科技有限公司 | Glass cleaning device and glass feeding equipment |
| WO2022098603A1 (en) * | 2020-11-03 | 2022-05-12 | Corning Incorporated | Glass sheet cleaning apparatus |
| CN216875407U (en) * | 2021-12-10 | 2022-07-05 | 天津市长龙宏业燃气设备有限公司 | Steel bottle cleaning brush |
| CN217137869U (en) * | 2022-03-08 | 2022-08-09 | 无锡美湖环境设计工程有限公司 | Intelligent cleaning equipment based on glass curtain wall external cleaning |
| CN217261117U (en) * | 2022-01-21 | 2022-08-23 | 重庆金锂新能源汽车零部件制造有限公司 | Motor shaft packaging hardware |
-
2022
- 2022-12-22 CN CN202211657789.9A patent/CN115889267A/en active Pending
-
2023
- 2023-02-17 TW TW112105725A patent/TW202330113A/en unknown
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020004964A1 (en) * | 1999-12-15 | 2002-01-17 | Luchino Thomas Patrick | Toothbrush with individually embedded bristles |
| CN1603015A (en) * | 2003-09-29 | 2005-04-06 | 中芯国际集成电路制造(上海)有限公司 | Washing device and method of silicon chip cleaning brush |
| US20090065607A1 (en) * | 2007-09-10 | 2009-03-12 | Gardner Michael R | Pressure washer system |
| US20160338811A1 (en) * | 2013-12-19 | 2016-11-24 | Colgate-Palmolive Company | Powered toothbrush head having a tuft block with a combination of oscillating motions |
| WO2016043152A1 (en) * | 2014-09-17 | 2016-03-24 | コニカミノルタ株式会社 | Brush for sunlight-reflection mirror, and method and device for cleaning sunlight-reflection mirror |
| KR20160052986A (en) * | 2014-10-30 | 2016-05-13 | 삼성중공업 주식회사 | Underwater cleaning robot |
| US20170092481A1 (en) * | 2015-09-30 | 2017-03-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP Cleaning and Apparatus |
| CN107571847A (en) * | 2016-07-05 | 2018-01-12 | 法瓦格罗萨爱德华多有限公司 | Brush for motor vehicles purging system constructs |
| US20180009419A1 (en) * | 2016-07-05 | 2018-01-11 | Favagrossa Edoardo S.R.L. | Brush construction for motor vehicle washing systems |
| JP2019096657A (en) * | 2017-11-20 | 2019-06-20 | 三菱電機株式会社 | Cleaning apparatus |
| CN108435616A (en) * | 2018-06-01 | 2018-08-24 | 四川益泽丰信息科技有限公司 | A kind of outdoor LED screen auto dust cleaning machine |
| CN111070098A (en) * | 2019-12-31 | 2020-04-28 | 浙江芯晖装备技术有限公司 | Polishing head cleaning device |
| CN211865947U (en) * | 2020-03-19 | 2020-11-06 | 赵建坤 | Cleaning device for heating and ventilating air conditioner |
| WO2022098603A1 (en) * | 2020-11-03 | 2022-05-12 | Corning Incorporated | Glass sheet cleaning apparatus |
| CN215745000U (en) * | 2021-03-29 | 2022-02-08 | 江苏隆基乐叶光伏科技有限公司 | Glass cleaning device and glass feeding equipment |
| CN216875407U (en) * | 2021-12-10 | 2022-07-05 | 天津市长龙宏业燃气设备有限公司 | Steel bottle cleaning brush |
| CN217261117U (en) * | 2022-01-21 | 2022-08-23 | 重庆金锂新能源汽车零部件制造有限公司 | Motor shaft packaging hardware |
| CN217137869U (en) * | 2022-03-08 | 2022-08-09 | 无锡美湖环境设计工程有限公司 | Intelligent cleaning equipment based on glass curtain wall external cleaning |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202330113A (en) | 2023-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI680834B (en) | Wafer edge grinding device and method | |
| CN1165971C (en) | Washing method and device | |
| CN104167351A (en) | Chemical mechanical cleaning method of SiC epitaxial wafer and special-purpose tools | |
| CN102479669B (en) | Wafer brush cleaning device and wafer brush cleaning method | |
| CN214418499U (en) | Double-side polishing equipment with cleaning and anti-scaling device | |
| CN108903849A (en) | A kind of dedicated disc brush of floor-cleaning machine | |
| CN109201547A (en) | Wafer cleaning device | |
| CN205599595U (en) | Optical lens piece self - cleaning device | |
| CN102485358A (en) | Wafer cleaning device and method | |
| WO2022184066A1 (en) | Cleaning robot | |
| CN115889267A (en) | Cleaning device, apparatus and method | |
| TW201246318A (en) | Method for cleaning a semiconductor wafer | |
| CN211299826U (en) | Wall surface cleaning machine for decoration | |
| JP2002124504A (en) | Substrate cleaner and substrate cleaning method | |
| TW202300286A (en) | Cleaning device, system and method for grooves of lower fixed disc in double-sided grinding | |
| CN213887491U (en) | Cleaning mechanism for optical polishing machine | |
| CN214817691U (en) | Polishing carrier disc cleaning and storing device | |
| TWI576078B (en) | With dust and dust removal function of the dust removal device | |
| CN211243183U (en) | Corner dust cleaning component of floor wiping brush | |
| CN210546501U (en) | High efficiency two-sided brush dish washs frock | |
| JPH05134398A (en) | Photomask cleaner, production for photomask and for semiconductor device | |
| CN205083405U (en) | Clean - steel brush in ground | |
| CN206464977U (en) | CMP tool internal spray system | |
| CN110340798A (en) | A kind of grinding pad cleaning device and twin grinder | |
| CN218427339U (en) | Terrace grinding robot with floor brushing assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |