CN1603015A - Washing device and method of silicon chip cleaning brush - Google Patents
Washing device and method of silicon chip cleaning brush Download PDFInfo
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- CN1603015A CN1603015A CN 03151422 CN03151422A CN1603015A CN 1603015 A CN1603015 A CN 1603015A CN 03151422 CN03151422 CN 03151422 CN 03151422 A CN03151422 A CN 03151422A CN 1603015 A CN1603015 A CN 1603015A
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Abstract
The silicon chip clear scrub purifier and its cleaning method, this purifier is installed in silicon chip clear scrub, including: A circumference shape spray tube which is wrap seted to the circumference of the stated silicon chip clear scrub on the sidewall of the stated spray tube it equips a plural number exhalant pores.Among:the stated circumference shape spray tube to be located in circumference places of the brush root of the stated silicon chip clear scrub, also does not contact with the clear scrub,the stated water pore is fixed on the outside sidewall of the stated spray tube; The cleaning method is circumference assumes the radiation shape in clear scrubbing by the plural number strip the deionized water class to spray states clear scrubbing, to carry on the clean to the stated clear scrub in different directions, when spraying,it may rotate, also may not rotate the stated clear scrub; The invention increases the clean area of the deionized water, may obviously enhance the clear fineness of the brushe head, reduces the amount used of the deionized water, saves the cost; when flushes once more,it does not need to rotate the clear scrub, both saves the electric power and easy to operate.
Description
Technical field
The present invention relates to the manufacturing technology field of integrated circuit, refer in particular to the cleaning device and the cleaning method thereof that in the wet-chemical cleaning technology, are used for the silicon chip cleaning brush.
Background technology
Because reducing of rapid raising of the integrated level of integrated circuit and components and parts size, requirement for the wafer surface cleaning degree is strict more, each procedure in the wafer manufacture all exists the possibility of pollution, all may cause generation of defects and failure of elements, therefore, in the production of integrated circuit, nearly 20% operation is relevant with the cleaning of silicon chip.
Wet-chemical cleaning technology wherein is in leading position in silicon chip surface cleans, and a kind of technology of in the wet-chemical cleaning technology, comparatively using always, as shown in Figure 1, chemical cleaning solution is put in the cleaning washing trough that is (not shown) on the silicon chip board, insert silicon chip (not shown) to be cleaned then, above this cleaning washing trough, be provided with an electronic cleaning brush 100, the brush holder of cleaning brush 100 is connected with a control device 200, rotation by brush control device 200 control cleaning brush 100, the brush that bristle is made is equipped with in cleaning brush 100 bottoms, brush holder rotates, and the brush that also drives its underpart is scrubbed at silicon chip surface.When the brush of cleaning brush 100 bottoms need clean, then the brush of cleaning brush 100 and its underpart is moved to the top of another washing trough 400, and connect the deionized water of the water pipe 300 be arranged in side, cleaning brush 100 is slowly run on one side, Yi Bian usefulness deionized water washout head.General, clean up a brush 100 and need deionized water 20ml, 5min consuming time.Yet above-mentioned technology with water pipe flushing brush has the following disadvantages:
1, only with a water pipe brush is cleaned, be not easy to make brush clean fully, the absolutely dry clean brush that toos many or too much for use is again scrubbed silicon chip, then can cause the decline of silicon chip yield rate;
2, the consumption of deionized water is too big;
3, must the limit rotate and make the flushing of cleaning brush 100 limits, both increased operational loaded down with trivial details, conservation of power not again.
Summary of the invention
At above-mentioned the deficiencies in the prior art, the present invention proposes a kind of cleaning device and cleaning method thereof of silicon chip cleaning brush, but purpose to improve cleaning efficiency exactly and reduce deionized water consumption, energy efficient also, thereby improve the silicon chip yield rate.
For reaching above purpose, technical scheme of the present invention is as follows:
A kind of cleaning device of silicon chip cleaning brush, be installed on the silicon chip cleaning brush, the bottom of this cleaning brush is provided with a brush that is made by bristle, cleaning device comprises: a circumferential shower that is placed on described silicon chip cleaning brush periphery, be provided with a plurality of apopores on described shower madial wall, described shower also is provided with an inlet opening.Wherein: described circumferential shower is positioned at the periphery of the brush root of described silicon chip cleaning brush, and does not contact with cleaning brush; Described inlet opening is located on the lateral wall of described shower.
A kind of cleaning method of silicon chip cleaning brush, the bottom of this silicon chip cleaning brush is provided with a brush that is made by bristle, this method is to spray described cleaning brush in the periphery of described silicon chip cleaning brush with the current of a plurality of deionized waters, bristle to described cleaning brush cleans from different directions, the current of these a plurality of deionized waters radially and the space be ejected into equably on the brush that is positioned at circumferential center.Wherein, when the current of a plurality of deionized waters spray described cleaning brush, can rotate, also can not rotate described cleaning brush.
Use silicon chip cleaning device of the present invention and cleaning method, its beneficial effect is: at first because the present invention has installed the shower of circumferential on brush, and bristle is sprayed by a plurality of apopores that are positioned on the circumference, so increased the cleaning area of deionized water, can obviously improve the cleannes of brush, our experiments show that with the impurity particle on the silicon chip after the apparatus and method cleaning of the present invention and can reduce to 20 by original 100; Next has reduced the consumption of deionized water, has saved cost; Nonrotational cleaning brush when washing once more, not only conservation of power but also easy operation.
Description of drawings
Fig. 1 is the schematic diagram of prior art with water pipe flushing brush;
Fig. 2 is that cleaning device of the present invention is placed on the schematic diagram on the brush periphery;
Fig. 3 is that cleaning device of the present invention is placed on the vertical view on the brush periphery.
The specific embodiment
Below by specific embodiment the present invention is described in detail.Principle of the present invention is exactly the periphery that is placed on the cleaning brush 100 among Fig. 1 with a circumferential shower, make deionized water from excircle to the brush spray irrigation that is positioned at the center, form the current of a lot of bar deionized waters, with cleaning area that increases deionized water and the use amount that reduces deionized water.
As shown in Figure 2, for circumferential shower 1100 of the present invention is placed on schematic diagram on brush 100 peripheries, please be simultaneously referring to Fig. 3, for cleaning device of the present invention is placed on vertical view on the brush periphery; Shower 1100 is the circumferential hollow pipeline, be placed on the brush periphery of cleaning brush 100, for the cleaning performance that makes bristle reaches best, circumferential shower 1100 preferably is installed in the periphery of the brush root of described silicon chip cleaning brush 100, shower 1100 does not directly contact with the brush root, so that deionized water at first sprays the bristle root, under the terrestrial gravitation effect, flow to the bristle taper of lower then, the pollutant that makes on the bristle to be infected with is fallen by deionized water rinsing from top to bottom.On the wall of shower 1100 inboards, be provided with many apopores 1101, an inlet opening 1102 that is connected with water pipe 300 is positioned on the wall in shower 1100 outsides, certainly, if the actual needs of production scene, also this inlet opening 1102 can be located at other positions of shower 1100, such as the first-class position of madial wall; These apopores 1101 are uniformly distributed on the inside circumference, and when opening inlet opening 1102, deionized water enters in the circumferential shower 1100, is ejected into the brush that is positioned at circumferential center radially from apopore 1101 then.
So, when the brush that speckles with contaminant particle need clean, just can directly start circumferential shower 1100 of the present invention, make deionized water spray on the brush radially, form the very current of the deionized water of institute's bar, from different directions bristle is washed the consumption that this has just increased the cleaning area of deionized water greatly and has reduced deionized water respectively.And because deionized water is radially brush to be carried out spray Cleaning for High Capacity, so brush itself is not will rotate just, this just makes that operation is easier, power consumption reduces.Certainly, if brush rotates, cleaning performance can be better.
In the present embodiment, circumferential shower 1100 is made by the PVC material, its overall diameter is of a size of 6mm, wall thickness is 1mm, the number of inlet opening 1102 is 1, the aperture of inlet opening 1102 is 6mm, cleans up a brush 100 and needs deionized water 12ml, and the water flow velocity of 3min deionized water consuming time is 4ml/min.Obviously, clean up a brush with same water velocity, the present invention can save the deionized water of 8ml than the method for prior art.
Should be noted that, the vertical view system of Fig. 3 is a most preferred embodiment of the present invention, in other embodiments of the invention, the distribution of apopore 1101 on inside circumference also can be other modes, as inhomogeneous arrangement, be divided into the arrangement of two rows or arrangement mode at random, as long as can on the different directions of circumference, be washed into the bristle of cleaning brush 100.
Relatively can find out mutually by the prior art data in " background technology " of above data and front, use apparatus and method of the present invention, reach same cleaning performance, the consumption of deionized water has reduced, scavenging period has shortened, and do not need electric power to rotate brush, not only simplified the operation but also saves energy.
Although the present invention describes with reference to its specific preferred embodiment, it should be appreciated by those skilled in the art, under the situation that does not break away from the spirit and scope of the present invention that are defined by the following claims, can carry out the various modifications of form and details to it.
Claims (10)
1. the cleaning device of a silicon chip cleaning brush, be installed on the silicon chip cleaning brush, the bottom of this cleaning brush is provided with a brush that is made by bristle, it is characterized in that: described cleaning device comprises: a circumferential shower that is placed on described silicon chip cleaning brush periphery, be provided with a plurality of apopores on described shower madial wall, described shower also is provided with an inlet opening.
2. cleaning device as claimed in claim 1 is characterized in that: described circumferential shower is positioned at the periphery of the brush root of described silicon chip cleaning brush, and does not contact with cleaning brush.
3. cleaning device as claimed in claim 1 is characterized in that: described inlet opening is located on the lateral wall of described shower.
4. cleaning device as claimed in claim 1 is characterized in that: described a plurality of apopores are uniformly distributed on the circumference of madial wall.
5. cleaning device as claimed in claim 1 is characterized in that: described circumferential shower is made by the PVC material.
6. the cleaning method of a silicon chip cleaning brush, the bottom of this silicon chip cleaning brush is provided with a brush that is made by bristle, it is characterized in that: spray described cleaning brush in the periphery of described silicon chip cleaning brush with the current of a plurality of deionized waters, the bristle to described cleaning brush cleans from different directions.
7. cleaning method as claimed in claim 6 is characterized in that: the current of described a plurality of deionized waters radially and the space be ejected into equably on the brush that is positioned at circumferential center.
8. cleaning method as claimed in claim 6 is characterized in that: when the current of a plurality of deionized waters spray described cleaning brush, do not rotate described cleaning brush.
9. cleaning method as claimed in claim 6 is characterized in that: when the current of a plurality of deionized waters spray described cleaning brush, rotate described cleaning brush.
10. cleaning method as claimed in claim 6 is characterized in that: the water flow velocity of described a plurality of deionized waters is 4ml/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03151422 CN1603015A (en) | 2003-09-29 | 2003-09-29 | Washing device and method of silicon chip cleaning brush |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03151422 CN1603015A (en) | 2003-09-29 | 2003-09-29 | Washing device and method of silicon chip cleaning brush |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1603015A true CN1603015A (en) | 2005-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03151422 Pending CN1603015A (en) | 2003-09-29 | 2003-09-29 | Washing device and method of silicon chip cleaning brush |
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| CN (1) | CN1603015A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385632C (en) * | 2005-06-01 | 2008-04-30 | 联华电子股份有限公司 | Chemical machanical grinding method, and equipment for preventing rudimental grinding pulp |
| CN101362313B (en) * | 2007-08-09 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical grinding device and chemical-mechanical grinding method |
| CN102437014A (en) * | 2011-11-29 | 2012-05-02 | 上海宏力半导体制造有限公司 | Wet etching cleaning device |
| CN102078869B (en) * | 2009-11-26 | 2013-04-17 | 中芯国际集成电路制造(上海)有限公司 | Photomask cleaning method |
| CN104167351A (en) * | 2014-07-23 | 2014-11-26 | 东莞市天域半导体科技有限公司 | Chemical mechanical cleaning method of SiC epitaxial wafer and special-purpose tools |
| CN115672801A (en) * | 2022-06-10 | 2023-02-03 | 智程半导体设备科技(昆山)有限公司 | Single wafer brushing device capable of automatically replacing brush head |
| CN115889267A (en) * | 2022-12-22 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Cleaning device, apparatus and method |
-
2003
- 2003-09-29 CN CN 03151422 patent/CN1603015A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385632C (en) * | 2005-06-01 | 2008-04-30 | 联华电子股份有限公司 | Chemical machanical grinding method, and equipment for preventing rudimental grinding pulp |
| CN101362313B (en) * | 2007-08-09 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical grinding device and chemical-mechanical grinding method |
| CN102078869B (en) * | 2009-11-26 | 2013-04-17 | 中芯国际集成电路制造(上海)有限公司 | Photomask cleaning method |
| CN102437014A (en) * | 2011-11-29 | 2012-05-02 | 上海宏力半导体制造有限公司 | Wet etching cleaning device |
| CN104167351A (en) * | 2014-07-23 | 2014-11-26 | 东莞市天域半导体科技有限公司 | Chemical mechanical cleaning method of SiC epitaxial wafer and special-purpose tools |
| CN115672801A (en) * | 2022-06-10 | 2023-02-03 | 智程半导体设备科技(昆山)有限公司 | Single wafer brushing device capable of automatically replacing brush head |
| CN115889267A (en) * | 2022-12-22 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Cleaning device, apparatus and method |
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