CN109201547A - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN109201547A CN109201547A CN201710527208.2A CN201710527208A CN109201547A CN 109201547 A CN109201547 A CN 109201547A CN 201710527208 A CN201710527208 A CN 201710527208A CN 109201547 A CN109201547 A CN 109201547A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- wafer
- roller brush
- cleaning roller
- brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 341
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000013618 particulate matter Substances 0.000 abstract description 13
- 230000007547 defect Effects 0.000 abstract description 8
- 239000013078 crystal Substances 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 11
- 238000009434 installation Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 238000005498 polishing Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000004209 hair Anatomy 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009991 scouring Methods 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007521 mechanical polishing technique Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- B08B1/32—
-
- B08B1/12—
-
- B08B1/50—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
The present invention provides a kind of wafer cleaning devices, and for cleaning to wafer, which includes: main part；Cleaning part, cleaning part are installed in rotation on main part, and cleaning part has cleaning surface, and wafer can at least partly be rotated with cleaning face contact, cleaning part to clean to wafer；Cleaning portion, cleaning portion are arranged on main part, and cleaning portion is connected on the cleaning surface of cleaning part, for clearing up cleaning part.Staff places the wafer in wafer cleaning device of the invention, and is cleaned by the rotation of cleaning part to wafer, specially the cleaning surface rotation of cleaning part, to clean to wafer.At the same time, cleaning part is cleaned in cleaning portion, to clean up the impurity such as particulate matter on the wafer being stained on cleaning part, to effectively prevent adhering to the cleaning surface of particulate matter when continuing cleaning wafer, the generation scratched or the phenomenon that pollution grain defect is generated in crystal column surface.
Description
Technical field
The present invention relates to wafer cleaning equipment technical fields, in particular to a kind of wafer cleaning device.
Background technique
In integrated circuit fabrication process, chemically mechanical polishing (Chemical Mechanical Planarization,
CMP) as shallow trench isolation (STI) and multi-layer metal structure of the technology in realization device that uniquely can be realized global planarizartion
Interconnection etc. be widely applied, become one of mainstream key technology of semiconductors manufacture.Chemical Mechanical Polishing Technique
The main planarization for cooperating to realize material surface by chemistry and mechanism, therefore in chemical mechanical polishing manufacture procedure
A large amount of lapping liquid particle can be introduced to enhance mechanicals efforts, a large amount of residual particles can be also generated during the grinding process, be
These impurity particles are avoided to pollute postchannel process or the defects of crystal column surface generates scuffing, after chemically mechanical polishing
Cleaning becomes very necessary, and rear cleaning device is also important component indispensable in CMP machine platform.With chip features ruler
The very little continuous continuous improvement reduced with chip integration, the control requirement to wafer surface after chemico-mechanical polishing particle defects
Also higher and higher.
Referring to figure 1 and figure 2, the rinse bath configured with double cleaning hairbrush is widely used in chemical-mechanical polishing mathing platform
In, to be cleaned to polished wafer 40.In the process of cleaning, the abrasive grains on wafer may be adhered to cleaning
On hairbrush, the particulate matter on rinse bath is also possible to fall pollution cleaning hairbrush.The cleaning hairbrush for adhering to particulate matter is continuing
When cleaning wafer, is generated in crystal column surface and scratch or pollute grain defect.Such case cleaning compared with flexible film surface when especially
Seriously.
Summary of the invention
The main purpose of the present invention is to provide a kind of wafer cleaning devices, to solve the clear of rinse bath in the prior art
The problem of scouring of wool brush cannot be cleared up in time.
To achieve the goals above, the present invention provides a kind of wafer cleaning devices, for being cleaned to wafer, the crystalline substance
Circle cleaning device includes: main part；Cleaning part, cleaning part are installed in rotation on main part, and cleaning part has cleaning surface, brilliant
Circle can at least partly be rotated with cleaning face contact, cleaning part to clean to wafer；Cleaning portion, cleaning portion are arranged in main body
In portion, cleaning portion is connected on the cleaning surface of cleaning part, for clearing up cleaning part.
Further, cleaning part includes multiple cleaning roller brushes, and the gap between multiple cleaning roller brushes forms cleaning space, often
The cleaning surface of a cleaning roller brush is connected on wafer.
Further, cleaning part further include cleaning driving portion, cleaning driving portion be mounted on main part, cleaning driving portion with
Multiple cleaning roller brushes are drivingly connected, for driving multiple cleaning roller brushes to rotate.
Further, cleaning portion includes cleaning roller brush, and cleaning roller brush is rotatably arranged on main part, cleaning roller brush
Bristle is connected on the cleaning surface of cleaning part, and the axis direction of cleaning roller brush is parallel with the axis direction of cleaning roller brush.
Further, cleaning roller brush is multiple, and multiple cleaning roller brushes and multiple cleaning roller brushes are arranged correspondingly.
Further, the axis of the axis of cleaning roller brush and cleaning roller brush is located in same level.
Further, horizontal plane is higher than horizontal plane where the axis of cleaning roller brush where the axis of cleaning roller brush.
Further, the axis of cleaning roller brush is located at the underface of cleaning roller brush.
Further, cleaning portion includes cleaning erecting brush, and cleaning erecting brush is arranged in the bottom of cleaning roller brush, clears up the brush of erecting brush
Hair is connected on the cleaning surface of cleaning part, and cleaning erecting brush can be moved along the length direction of cleaning roller brush.
Further, cleaning portion further includes guide rail, and cleaning erecting brush is movably disposed on guide rail, the length direction of guide rail
It is identical as the length direction of cleaning roller brush.
It applies the technical scheme of the present invention, staff places the wafer in wafer cleaning device of the invention, and passes through
Wafer is cleaned in the rotation of cleaning part, specially the cleaning surface rotation of cleaning part, to clean to wafer.It is same with this
When, cleaning part is cleaned in cleaning portion, the impurity such as particulate matter on the wafer being stained on cleaning part is cleaned up, to have
Effect avoids the cleaning surface for adhering to particulate matter when continuing cleaning wafer, generates in crystal column surface and scratches or pollute grain defect
The phenomenon that generation.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 shows the structure chart of wafer cleaning equipment in the prior art；
Fig. 2 shows the side views of wafer cleaning equipment in the prior art；
Fig. 3 diagrammatically illustrates the structure chart of one embodiment of wafer cleaning device of the invention；
Fig. 4 diagrammatically illustrates the side view of one embodiment of wafer cleaning device of the invention；
Fig. 5 diagrammatically illustrates the structure chart of second embodiment of wafer cleaning device of the invention；
Fig. 6 diagrammatically illustrates the side view of second embodiment of wafer cleaning device of the invention；
Fig. 7 diagrammatically illustrates the structure chart of the third embodiment of wafer cleaning device of the invention；
Fig. 8 diagrammatically illustrates the side view of the third embodiment of wafer cleaning device of the invention；
Fig. 9 diagrammatically illustrates the structure chart of the 4th embodiment of wafer cleaning device of the invention；And
Figure 10 diagrammatically illustrates the side view of the 4th embodiment of wafer cleaning device of the invention.
Wherein, the above drawings include the following reference numerals:
10, cleaning part；11, cleaning roller brush；20, cleaning portion；21, cleaning roller brush；22, erecting brush is cleared up；30, wafer.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
Just as mentioned in the background, the rinse bath configured with double cleaning hairbrush is widely used in chemically-mechanicapolish polishing
In board, to be cleaned to polished wafer.In the process of cleaning, the abrasive grains on wafer may be adhered to clearly
Scouring of wool paints, and the particulate matter on rinse bath is also possible to fall pollution cleaning hairbrush.Adhere to the cleaning hairbrush of particulate matter after
When continuous cleaning wafer, is generated in crystal column surface and scratch or pollute grain defect.Such case is outstanding when cleaning is compared with flexible film surface
It is serious.
To solve the above-mentioned problems, referring to shown in Fig. 3 to Figure 10, the present invention provides a kind of wafer cleaning device, the crystalline substances
Circle cleaning device includes main part, cleaning part 10 and cleaning portion 20, wherein and cleaning part 10 is installed in rotation on main part,
Cleaning part 10 has cleaning surface, and wafer 30 at least partly can be with cleaning face contact, and the rotation of cleaning part 10 is to carry out wafer 30
Cleaning；Cleaning portion 20 be arranged on main part, cleaning portion 20 is connected on the cleaning surface of cleaning part 10, for cleaning part 10 into
Row cleaning.When installation, the cleaning part 10 in the present invention is first installed in rotation on main part by staff, makes cleaning part
Cleaning surface is at least partly in contact with wafer, and cleaning portion 20 is arranged on main part, and cleaning portion 20 is made to be connected to cleaning
On the cleaning surface in portion 10.When work, staff is placed the wafer in wafer cleaning device of the invention, and passes through cleaning part 10
Rotation wafer is cleaned, specially cleaning part 10 cleaning surface rotation, to be cleaned to wafer.At the same time,
Cleaning part 10 is cleaned in cleaning portion 20, and the impurity such as particulate matter on the wafer being stained on cleaning part 10 are cleaned up, from
And the cleaning surface for effectively preventing adhering to particulate matter generates in crystal column surface when continuing cleaning wafer and scratches or pollute particle
The generation of the phenomenon that defect.
Specifically, the cleaning part 10 in the present invention includes multiple cleaning roller brushes 11, between multiple cleaning roller brushes 11 between
Gap forms cleaning space, and the cleaning surface of each cleaning roller brush 11 abuts on the wafer 30.When installation, multiple cleaning roller brushes 11 are pacified
In main body, to form cleaning space between multiple cleaning roller brushes 11, when work, multiple cleaning roller brushes rotate jointly with
Wafer is cleaned, the cleaning efficiency of wafer is improved.Meanwhile in order to facilitate the cleaning of wafer, the wafer in the present invention exists
It is rotatable in cleaning space, it is preferable that the wafer cleaning device in the present invention further includes rotating wheel and rotating electric machine, wherein rotating
Wheel is connected on the periphery of wafer, and rotating electric machine and rotating wheel are drivingly connected, and when work, rotating electric machine drives rotating wheel rotation,
Rotating wheel drives wafer by frictional force, to realize the rotation of wafer.Wherein, the rotating wheel in the present invention is preferably rubber wheel,
Certainly, the structure of other functions of can satisfy the rotating wheel in the present invention.In order to further improve in the present invention
Wheel drive wafer rotatably effect is rotated, concaveconvex structure is provided on the outer wall of the rotating wheel in the present invention, to increase rotating wheel
With the frictional force between wafer periphery.
In order to realize the rotation of the cleaning roller brush in the present invention, the cleaning part 10 in the present invention further includes cleaning driving portion,
Cleaning driving portion is mounted on main part, and cleaning driving portion and multiple cleaning roller brushes 11 are drivingly connected, for driving multiple cleanings
Roller brush 11 rotates.When installation, the output end of the cleaning driving portion in the present invention and cleaning roller brush are drivingly connected by staff.Work
When making, staff cleans wafer so that multiple cleaning roller brushes 11 rotate by the work of control cleaning driving portion.
Wherein, the cleaning driving portion in the present invention is driving motor, and when installation, staff is by the driving electricity in the present invention
The output end and cleaning roller brush of machine are drivingly connected.When work, staff passes through the work of control driving motor, so that multiple clear
The rotation of roller brush 11 is washed, wafer is cleaned.
In order to realize the cleaning to cleaning roller brush 11, at the same guarantee the cleaning roller brush 21 in the present invention and cleaning roller brush 11 it
Between cleaning area, the cleaning portion 20 in the present invention includes cleaning roller brush 21, and cleaning roller brush 21 is rotatably arranged in main part
On, the bristle of cleaning roller brush 21 is connected on the cleaning surface of cleaning part 10, the axis direction and cleaning roller brush 11 of cleaning roller brush 21
Axis direction it is parallel.When installation, the cleaning roller brush in the present invention is installed in rotation on main part by staff, and will
The bristle of cleaning roller brush 21 is connected on cleaning part 10, when specially installing, by the axis direction and cleaning roller of cleaning roller brush 21
The contact area that the axis direction of brush 11 is installed in parallel, and then is effectively guaranteed between cleaning roller brush 21 and cleaning roller brush 11,
Keep cleaning roller brush 21 more thorough to the cleaning of cleaning roller brush.
Cleared up in order to the cleaning surface to each cleaning roller brush, the present invention in cleaning roller brush 21 be it is multiple, it is more
A cleaning roller brush 21 and multiple cleaning roller brushes 11 are arranged correspondingly.When installation, staff will be multiple clear in the present invention
Reason roller brush 21 be arranged correspondingly with multiple cleaning roller brushes 11, and the bristle of each cleaning roller brush 21 be connected to it is corresponding
Cleaning roller brush 11 cleaning surface on.When work, staff makes the cleaning driving portion in the present invention work, and then drives this hair
Multiple cleaning roller brushes 11 rotation in bright, cleans wafer, at the same time, multiple cleaning roller brushes 21 are to multiple cleaning roller brushes
11 are cleared up.
Referring to shown in Fig. 3 to Fig. 4, in one embodiment of the invention, the axis of the cleaning roller brush 21 in the present invention
It is located in same level with the axis of cleaning roller brush 11.When installation, staff can be rotated the cleaning roller brush in the present invention
Ground is mounted on main part, and the bristle of cleaning roller brush 21 is connected on cleaning part 10, when specially installing, by cleaning roller brush
21 axis direction is parallel with the axis direction of cleaning roller brush 11 to be installed, and guarantees the axis and cleaning roller brush of cleaning roller brush 21
Axis is located in same level, in the same of the contact area being effectively guaranteed between cleaning roller brush 21 and cleaning roller brush 11
When, meet utilizing for horizontal space and require, and particulate matter can be prevented back to wafer by the effect of blocking of cleaning roller brush 11
On.
Shown in referring to figs. 5 and 6, in a second embodiment of the present invention, the axis of the cleaning roller brush 21 in the present invention
Place horizontal plane is higher than horizontal plane where the axis of cleaning roller brush 11.When installation, staff is by the cleaning roller brush in the present invention
It is installed in rotation on main part, and the bristle of cleaning roller brush 21 is connected on cleaning part 10, it, will be clear when specially installing
The axis direction of reason roller brush 21 is parallel with the axis direction of cleaning roller brush 11 to be installed, and guarantees water where the axis of cleaning roller brush 21
Horizontal plane where plane is higher than the axis of cleaning roller brush 11, is being effectively guaranteed between cleaning roller brush 21 and cleaning roller brush 11
While contact area, meet longitudinal space utilizes requirement.
Shown in referring to figs. 7 and 8, in third embodiment of the invention, the axis of the cleaning roller brush 21 in the present invention
Positioned at the underface of cleaning roller brush 11.When installation, the cleaning roller brush in the present invention is installed in rotation on main body by staff
In portion, and the bristle of cleaning roller brush 21 is connected on cleaning part 10, when specially installing, by the axis direction of cleaning roller brush 21
It is parallel with the axis direction of cleaning roller brush 11 to install, and guarantee that the axis of the cleaning roller brush 21 in the present invention is located at cleaning roller brush 11
Underface, while the contact area being effectively guaranteed between cleaning roller brush 21 and cleaning roller brush 11, reduction can be whole
Horizontal space.
Referring to shown in Fig. 9 and Figure 10, in the 4th embodiment of the invention, the cleaning portion 20 in the present invention includes cleaning
The bottom of cleaning roller brush 11 is arranged in erecting brush 22, cleaning erecting brush 22, and the bristle of cleaning erecting brush 22 is connected to the cleaning of cleaning part 10
On face, cleaning erecting brush 22 can be moved along the length direction of cleaning roller brush 11.When installation, staff stands the cleaning in the present invention
Brush 22 is mounted on the bottom of cleaning roller brush, and the bristle for clearing up erecting brush 22 is connected on cleaning part 10, vertical by control cleaning
Brush 22 is moved along the length direction of cleaning roller brush 11, and realization makes an overall screening cleaning roller brush.
Specifically, the cleaning portion 20 in the present invention further includes guide rail, and cleaning erecting brush 22 is movably disposed on guide rail,
The length direction of guide rail is identical as the length direction of cleaning roller brush 11.When work, staff can be cleared up by mobile manually
Erecting brush 22 moves along the rail, and cleaning erecting brush movement can also be pulled by other power devices, such as passes through hydraulic device, motor
Deng the movement of realization cleaning erecting brush 22.
It can be seen from the above description that the above embodiments of the present invention realized the following chievements:
Staff places the wafer in wafer cleaning device of the invention, and is carried out by the rotation of cleaning part to wafer
Cleaning, specially the cleaning surface rotation of cleaning part, to be cleaned to wafer.At the same time, cleaning portion carries out cleaning part
Cleaning cleans up the impurity such as particulate matter on the wafer being stained on cleaning part, to effectively prevent adhering to particulate matter
Cleaning surface when continuing cleaning wafer, crystal column surface generate scratch or pollution grain defect the phenomenon that generation.
It is noted that above-mentioned detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another
It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Term be interchangeable under appropriate circumstances, so that presently filed embodiment described herein for example can be in addition to herein
Sequence other than those of diagram or description is implemented.
In addition, term " includes " and " having " and their any deformation, it is intended that covering non-exclusive includes example
Such as, the process, method, system, product or equipment for containing a series of steps or units those of are not necessarily limited to be clearly listed
Step or unit, but may include being not clearly listed or intrinsic for these process, methods, product or equipment other
Step or unit.
For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.
For example, being described as " above other devices or construction " or " in other devices if the device in attached drawing is squeezed
On part or construction " device after will be positioned as or " in other devices or constructing it " below other devices or construction "
Under ".Thus, exemplary term " in ... top " may include " in ... top " and " in ... lower section " two kinds of orientation.It should
Device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and opposite to space used herein above
Respective explanations are made in description.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of wafer cleaning device, for being cleaned to wafer (30) characterized by comprising
Main part；
Cleaning part (10), the cleaning part (10) are installed in rotation on the main part, and the cleaning part (10) has clear
It washes one's face, the wafer (30) at least partly can be with the cleaning face contact, and cleaning part (10) rotation is to the wafer
(30) it is cleaned；
Cleaning portion (20), the cleaning portion (20) are arranged on the main part, and the cleaning portion (20) is connected to the cleaning
On the cleaning surface in portion (10), for clearing up the cleaning part (10).
2. wafer cleaning device according to claim 1, which is characterized in that the cleaning part (10) includes multiple cleaning rollers
It brushes (11), the gap between multiple cleaning roller brushes (11) forms cleaning space, the cleaning of each cleaning roller brush (11)
Face is connected on the wafer (30).
3. wafer cleaning device according to claim 2, which is characterized in that the cleaning part (10) further includes cleaning driving
Portion, the cleaning driving portion are mounted on the main part, and the cleaning driving portion and multiple cleaning roller brushes (11) drive
Connection, for driving multiple cleaning roller brush (11) rotations.
4. wafer cleaning device according to claim 2, which is characterized in that the cleaning portion (20) includes cleaning roller brush
(21), the cleaning roller brush (21) is rotatably arranged on the main part, and the bristle of the cleaning roller brush (21) is connected to
On the cleaning surface of the cleaning part (10), the axis side of the axis direction of the cleaning roller brush (21) and the cleaning roller brush (11)
To parallel.
5. wafer cleaning device according to claim 4, which is characterized in that the cleaning roller brush (21) be it is multiple, it is multiple
The cleaning roller brush (21) and multiple cleaning roller brushes (11) are arranged correspondingly.
6. wafer cleaning device according to claim 4, which is characterized in that the axis of the cleaning roller brush (21) with it is described
The axis of cleaning roller brush (11) is located in same level.
7. wafer cleaning device according to claim 4, which is characterized in that water where the axis of the cleaning roller brush (21)
Plane is higher than horizontal plane where the axis of the cleaning roller brush (11).
8. wafer cleaning device according to claim 4, which is characterized in that the axis of the cleaning roller brush (21) is located at institute
State the underface of cleaning roller brush (11).
9. wafer cleaning device according to claim 2, which is characterized in that the cleaning portion (20) includes cleaning erecting brush
(22), cleaning erecting brush (22) setting is abutted in the bottom of the cleaning roller brush (11), the bristle of cleaning erecting brush (22)
On the cleaning surface of the cleaning part (10), cleaning erecting brush (22) can transport along the length direction of the cleaning roller brush (11)
It is dynamic.
10. wafer cleaning device according to claim 9, which is characterized in that the cleaning portion (20) further includes guide rail, institute
It states cleaning erecting brush (22) to be movably disposed on the guide rail, the length direction of the guide rail and the cleaning roller brush (11)
Length direction is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710527208.2A CN109201547A (en) | 2017-06-30 | 2017-06-30 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710527208.2A CN109201547A (en) | 2017-06-30 | 2017-06-30 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109201547A true CN109201547A (en) | 2019-01-15 |
Family
ID=64992031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710527208.2A Pending CN109201547A (en) | 2017-06-30 | 2017-06-30 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109201547A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887865A (en) * | 2019-03-07 | 2019-06-14 | 上海华力微电子有限公司 | A kind of wafer cleaning drying device, method and work-table of chemicomechanical grinding mill |
| CN110893401A (en) * | 2019-12-14 | 2020-03-20 | 孙冬梅 | Road and bridge belt cleaning device |
| CN111185414A (en) * | 2019-12-30 | 2020-05-22 | 重庆市和鑫达电子有限公司 | Integrated circuit copper plate dust collector |
| CN111393010A (en) * | 2020-04-03 | 2020-07-10 | 山东新希望六和集团有限公司 | Duck manure liquid dung supersound mechanical separation system |
| CN113327841A (en) * | 2021-05-28 | 2021-08-31 | 华海清科股份有限公司 | Wafer cleaning system and cleaning method capable of keeping cleaning roller clean |
| CN116408282A (en) * | 2023-06-02 | 2023-07-11 | 光微半导体(吉林)有限公司 | Cleaning device for cleaning brush non-contact magnetic levitation transmission assembly |
| CN116564882A (en) * | 2023-07-10 | 2023-08-08 | 光微半导体(吉林)有限公司 | Electromagnetic induction non-contact transmission wafer cleaning device for cleaning brush |
| CN116765966A (en) * | 2023-08-18 | 2023-09-19 | 浙江求是半导体设备有限公司 | Wafer surface treatment apparatus |
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Application publication date: 20190115 |