CN102658273A - Cleaning device - Google Patents

Cleaning device Download PDF

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Publication number
CN102658273A
CN102658273A CN2012101429443A CN201210142944A CN102658273A CN 102658273 A CN102658273 A CN 102658273A CN 2012101429443 A CN2012101429443 A CN 2012101429443A CN 201210142944 A CN201210142944 A CN 201210142944A CN 102658273 A CN102658273 A CN 102658273A
Authority
CN
China
Prior art keywords
belt
cylinder
cleaning device
wafer
brush unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101429443A
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Chinese (zh)
Inventor
董呈龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Huahong Grace Semiconductor Manufacturing Corp
Original Assignee
Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Huahong Grace Semiconductor Manufacturing Corp filed Critical Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority to CN2012101429443A priority Critical patent/CN102658273A/en
Publication of CN102658273A publication Critical patent/CN102658273A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a cleaning device, which comprises a cleaning tank for cleaning wafers, and also comprises a brush device for clamping and brushing the wafers, a spray system positioned above the brush device, a roller positioned below the brush device, supports and rotates the wafers and is driven by a belt, and a detection device for detecting whether the belt is broken, which are arranged in the cleaning tank. The detection device is adopted to detect the working sate of the belt driving the roller to rotate so as to timely discover a phenomenon that the roller does not rotate due to breakage of the belt, so that the wafers cannot stop rotating in the brushing process, and the brush can uniformly brush the surfaces of the wafers to avoid the surface defects of the wafers. Therefore, the product quality is improved and the loss is reduced.

Description

Cleaning device
Technical field
The present invention relates to semiconductor applications, particularly a kind of cleaning device.
Background technology
Prior art is carried out cmp after making copper-connection on the wafer, generally will carry out chemicals and impurity that cleaning and removing is removed crystal column surface after the grinding; The device of cleaning wafer comprises the cylinder of the shower that washes wafer, support and rotation wafer and scrubs and the brush unit of clamping wafer, and said cylinder drives belt by motor and rotates and drive, when motor failure or cylinder get stuck; When causing situation that motor do not rotate, the feedback signal of motor self can detect uneven rotating speed and report to the police automatically, thereby detects motor failure in real time or cylinder gets stuck; Cleaning device is reported to the police automatically; So that in time find handling failure, but the belt that connects motor ruptures underload; Motor does not have feedback signal, and cleaning device detects less than the belt fracture can not produce warning yet.Yet drive the easy loss of belt, breakage, fracture that cylinder rotates in the device of said cleaning wafer, can not drive cylinder after the belt fracture and rotate, cylinder stops operating; Because wafer to be cleaned is supported by cylinder and is clamped in the middle of the brush unit, therefore can not rotate, and then make crystal column surface to be cleaned in cleaning process, can not be scrubbed equably; Such as; Some zone of crystal column surface is not through scrubbing, and some zone is too scrubbed, and can produce defective at crystal column surface and scrub unevenly.
Summary of the invention
The purpose of this invention is to provide a kind of cleaning device, in cleaning process, produce defective, improve the quality of products to avoid wafer.
Technical solution of the present invention is a kind of cleaning device, comprises the rinse bath that is used for cleaning wafer, also comprises placing in the rinse bath:
Brush unit is used for clamping and scrubs wafer;
Spray equipment is positioned at the top of brush unit;
Cylinder is positioned at the below of brush unit, supports also rotation wafer, and said cylinder is driven by belt;
Whether checkout gear is used to detect said belt and ruptures.
As preferably: said checkout gear comprises sensor, and said sensor comprises a transmitting terminal and a receiving terminal, and the transmitting terminal of said sensor and receiving terminal are positioned at the tow sides of a side belt and are provided with in opposite directions.
As preferably: said cylinder is a plurality of and is positioned on the same plane that plane, said cylinder place is positioned in the middle of the brush unit.
As preferably: said cylinder is three.
As preferably: said spray equipment comprises shower and is connected the nozzle on the shower that said shower is installed on the rinse bath inwall through geometrical clamp.
As preferably: said brush unit also comprises the tumbler that drives the hairbrush rotation.
Compared with prior art; The present invention adopts a checkout gear to detect the duty of the belt of drive cylinder rotation; The cylinder of in time finding the belt fracture and causing is rotation phenomenon not, avoids wafer in scrubbing process, not rotate not rotating of bringing because of cylinder, and then avoids hairbrush to scrub the inhomogeneous crystal column surface defective of bringing of crystal column surface; Thereby improve the quality of products, reduce the loss.
Description of drawings
Fig. 1 is the front view of the cleaning device of the specific embodiment of the invention;
Fig. 2 is the profile of the cleaning device of the specific embodiment of the invention;
Fig. 3 is the detection belt work status detection device sketch map of the specific embodiment of the invention.
The specific embodiment
The present invention below will combine accompanying drawing to do further to detail:
A lot of details have been set forth in the following description so that make much of the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention does not receive the restriction of following disclosed practical implementation.
Secondly, the present invention utilizes sketch map to be described in detail, when the embodiment of the invention is detailed; For ease of explanation; The profile of expression device architecture can be disobeyed general ratio and done local the amplification, and said sketch map is instance, and it should not limit the scope of the present invention's protection at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
See also Fig. 1, shown in Figure 2, the present invention provides a kind of cleaning device, comprises the rinse bath (not shown) that is used for cleaning wafer 1, also comprises the brush unit, spray equipment 4, cylinder 2 and the checkout gear 22 that place in the rinse bath.
Brush unit is by its switch of pneumatic operated valve control; Said brush unit comprises two hairbrush 3 that keep at a certain distance away, and the switch of controlling two hairbrush 3 through pneumatic operated valve comes clamping or decontrols said wafer 1, is penetrated with axle 31 in each hairbrush 3, and axle 31 two ends are connected on the rinse bath through joint.Also be provided with a shower 32 in the axle 31, be used for the spray of pure water or chemicals.Said brush unit also comprises the tumbler (not shown) that drives hairbrush 3 rotations.
Spray equipment 4 is positioned at the top of brush unit, comprises shower 41 and is connected the nozzle 42 on the shower 41, and said shower 41 is installed on the rinse bath inwall through the geometrical clamp (not shown).
Cylinder 2 is positioned at the below of brush unit, supports and rotation wafer 1.In present embodiment, said cylinder 2 is three, and is positioned on the same plane.Can supporting wafer 1 rotate between two hairbrush 3 between two hairbrush 3 just on plane, three cylinder 2 places.As shown in Figure 3, said cylinder 2 is driven by belt 21, and said belt 21 can also can be many for one, mutual transmission in the time of many.
Please continue with reference to shown in Figure 3; Said cleaning device also is provided with one and detects belt work status detection device 22, and said checkout gear comprises sensor, and said sensor comprises a transmitting terminal 221 and a receiving terminal 222; The transmitting terminal 221 and the receiving terminal 222 of said sensor is positioned at the tow sides of a side belt 21 and is provided with in opposite directions; When belt 21 was many, every belt 21 was provided with a sensor accordingly, and belt 21 passes from the centre of transmitting terminal 221 and receiving terminal 222 in driving cylinder 2 rotation processes; Monitor the duty of belt 21 in real time so that transmitting terminal 221 cooperatively interacts with receiving terminal 222, come down to detect belt 21 and whether rupture.The receiving terminal 222 of said sensor connects the alarm device of cleaning devices, if when detecting belt 21 fractures, the receiving terminal 222 of said sensor receives the signal of transmitting terminal 221 emissions, and machine produces warning automatically.
The course of work of said cleaning device is following:
At first, pass wafer to be cleaned 1 between two hairbrush 3 and to be placed on the cylinder 2, open cylinder 2 and drive wafers 1 rotation;
Then, starting spray equipment 4 makes the chemical cleaning solution spray on wafer 1 to be cleaned;
Then, state wafer 1, start the hairbrush tumbler after the hairbrush closure and make its rotation, to scrub wafer 1 through pneumatic operated valve control hairbrush 3 closed clamping residences;
Then, after said wafer 1 passes through scrubbing of 3 a period of times of hairbrush, control said hairbrush 3 through pneumatic operated valve and open, and close spray equipment 4;
Then, give showers 32 logical pure water or chemicals in the axle 31 so that wafer 1 is done hydro-peening, and hydro-peening is accomplished back taking-up wafer 1.
The operation principle of said checkout gear is following: drive in wafer 1 rotary course at cylinder 2; Signal of transmitting terminal 221 emissions of said sensor; When belt 21 normal rotation, not fracture, the receiving terminal 222 of said sensor does not receive the signal of transmitting terminal 221 emissions; And after belt 21 wear and rupture; The receiving terminal 222 of said sensor receives the signal of transmitting terminal 221 emissions; Machine produces warning automatically, notifies the staff to safeguard replacing, thereby avoids supporting and after the cylinder 2 that rotates wafer 1 stops operating; Wafer does not rotate, and hairbrush is scrubbed the inhomogeneous crystal column surface defective of bringing of crystal column surface.
In sum; The present invention adopts a checkout gear to detect the duty of the belt of drive cylinder rotation; In time find because of the belt fracture causes not rotation phenomenon of cylinder, avoid wafer in scrubbing process because of cylinder does not rotate not rotating of bringing, and then avoid scrubbing the inhomogeneous crystal column surface defective of bringing of crystal column surface; Thereby improve the quality of products, reduce the loss.
The above is merely preferred embodiment of the present invention, and all equalizations of being done according to claim scope of the present invention change and modify, and all should belong to the covering scope of claim of the present invention.

Claims (6)

1. a cleaning device comprises the rinse bath that is used for cleaning wafer, it is characterized in that, also comprises placing in the rinse bath:
Brush unit is used for clamping and scrubs wafer;
Spray equipment is positioned at the top of brush unit;
Cylinder is positioned at the below of brush unit, supports also rotation wafer, and said cylinder is driven by belt;
Whether checkout gear is used to detect said belt and ruptures.
2. cleaning device according to claim 1 is characterized in that: said checkout gear comprises sensor, and said sensor comprises a transmitting terminal and a receiving terminal, and the transmitting terminal of said sensor and receiving terminal are positioned at the tow sides of a side belt and are provided with in opposite directions.
3. cleaning device according to claim 1 is characterized in that: said cylinder is a plurality of and is positioned on the same plane that plane, said cylinder place is positioned in the middle of the brush unit.
4. cleaning device according to claim 3 is characterized in that: said cylinder is 3.
5. cleaning device according to claim 1 is characterized in that: said spray equipment comprises shower and is connected the nozzle on the shower that said shower is installed on the rinse bath inwall through geometrical clamp.
6. cleaning device according to claim 1 is characterized in that: said brush unit also comprises the tumbler that drives the hairbrush rotation.
CN2012101429443A 2012-05-09 2012-05-09 Cleaning device Pending CN102658273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101429443A CN102658273A (en) 2012-05-09 2012-05-09 Cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101429443A CN102658273A (en) 2012-05-09 2012-05-09 Cleaning device

Publications (1)

Publication Number Publication Date
CN102658273A true CN102658273A (en) 2012-09-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101429443A Pending CN102658273A (en) 2012-05-09 2012-05-09 Cleaning device

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CN (1) CN102658273A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103386406A (en) * 2013-08-08 2013-11-13 常州市科沛达超声工程设备有限公司 Double-side scrubbing equipment between wafer production processes
CN103962319A (en) * 2014-04-03 2014-08-06 华为技术有限公司 Wiping mechanism and automatic cleaning device provided with same
CN104867810A (en) * 2014-02-26 2015-08-26 盛美半导体设备(上海)有限公司 Wafer cleaning device
CN105609448A (en) * 2016-01-15 2016-05-25 上海华虹宏力半导体制造有限公司 Brush sheet cleaning machine
CN107999457A (en) * 2017-11-29 2018-05-08 德淮半导体有限公司 Rotary-cleaning equipment, detection device and detection method for rotary-cleaning equipment
CN108722984A (en) * 2018-04-13 2018-11-02 合肥恩锐科技有限公司 A kind of industrial and mineral ore wash mill and its working method
CN109201547A (en) * 2017-06-30 2019-01-15 中电海康集团有限公司 Wafer cleaning device
CN109490313A (en) * 2018-11-09 2019-03-19 中国科学院光电技术研究所 Automatic detection device and method for surface defects of large-caliber curved surface optical element
CN110773505A (en) * 2019-10-31 2020-02-11 西安奕斯伟硅片技术有限公司 Silicon wafer cleaning device and method
CN111146116A (en) * 2019-11-28 2020-05-12 华海清科股份有限公司 Wafer cleaning method and wafer post-processing device
CN114226294A (en) * 2020-09-09 2022-03-25 中国科学院微电子研究所 Wafer cleaning device and wafer cleaning method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035624A1 (en) * 2004-09-28 2006-04-06 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
CN201898118U (en) * 2010-12-06 2011-07-13 中芯国际集成电路制造(上海)有限公司 Wafer cleaning device
CN201898119U (en) * 2010-12-06 2011-07-13 中芯国际集成电路制造(上海)有限公司 Wafer cleaning device
CN201946573U (en) * 2010-09-03 2011-08-24 清华大学 Brushing device for wafer
CN202094103U (en) * 2011-06-14 2011-12-28 中芯国际集成电路制造(上海)有限公司 Rack division type wafer cleaning device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035624A1 (en) * 2004-09-28 2006-04-06 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
CN201946573U (en) * 2010-09-03 2011-08-24 清华大学 Brushing device for wafer
CN201898118U (en) * 2010-12-06 2011-07-13 中芯国际集成电路制造(上海)有限公司 Wafer cleaning device
CN201898119U (en) * 2010-12-06 2011-07-13 中芯国际集成电路制造(上海)有限公司 Wafer cleaning device
CN202094103U (en) * 2011-06-14 2011-12-28 中芯国际集成电路制造(上海)有限公司 Rack division type wafer cleaning device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103386406B (en) * 2013-08-08 2015-04-01 常州市科沛达超声工程设备有限公司 Double-side scrubbing equipment between wafer production processes
CN103386406A (en) * 2013-08-08 2013-11-13 常州市科沛达超声工程设备有限公司 Double-side scrubbing equipment between wafer production processes
CN104867810A (en) * 2014-02-26 2015-08-26 盛美半导体设备(上海)有限公司 Wafer cleaning device
CN103962319A (en) * 2014-04-03 2014-08-06 华为技术有限公司 Wiping mechanism and automatic cleaning device provided with same
CN103962319B (en) * 2014-04-03 2016-08-17 华为技术有限公司 Wiping mechanism and there is the automatic flushing device of Wiping mechanism
CN105609448A (en) * 2016-01-15 2016-05-25 上海华虹宏力半导体制造有限公司 Brush sheet cleaning machine
CN109201547A (en) * 2017-06-30 2019-01-15 中电海康集团有限公司 Wafer cleaning device
CN107999457A (en) * 2017-11-29 2018-05-08 德淮半导体有限公司 Rotary-cleaning equipment, detection device and detection method for rotary-cleaning equipment
CN108722984A (en) * 2018-04-13 2018-11-02 合肥恩锐科技有限公司 A kind of industrial and mineral ore wash mill and its working method
CN108722984B (en) * 2018-04-13 2021-07-23 合肥恩锐科技有限公司 Ore washing device for industrial and mining and working method thereof
CN109490313A (en) * 2018-11-09 2019-03-19 中国科学院光电技术研究所 Automatic detection device and method for surface defects of large-caliber curved surface optical element
CN110773505A (en) * 2019-10-31 2020-02-11 西安奕斯伟硅片技术有限公司 Silicon wafer cleaning device and method
CN111146116A (en) * 2019-11-28 2020-05-12 华海清科股份有限公司 Wafer cleaning method and wafer post-processing device
CN114226294A (en) * 2020-09-09 2022-03-25 中国科学院微电子研究所 Wafer cleaning device and wafer cleaning method

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Legal Events

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C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING

Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI

Effective date: 20140504

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20140504

Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399

Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation

Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818

Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120912

WD01 Invention patent application deemed withdrawn after publication