CN109304318A - A kind of wafer cleaning device and cleaning method - Google Patents
A kind of wafer cleaning device and cleaning method Download PDFInfo
- Publication number
- CN109304318A CN109304318A CN201811458538.1A CN201811458538A CN109304318A CN 109304318 A CN109304318 A CN 109304318A CN 201811458538 A CN201811458538 A CN 201811458538A CN 109304318 A CN109304318 A CN 109304318A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning
- wafer cassette
- rotating disk
- driving device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
Abstract
Wafer cleaning device provided by the present application, comprising: cleaning chamber, rotating mechanism, remover liquid nozzle, at least two wafer cassette driving devices and the dry gas jets of at least two wafer cassettes；The rotating mechanism, setting is intracavitary in the cleaning, and the rotating mechanism includes driver and rotating disk, and the rotating disk is arranged on the driver, and the driver drives the rotation disc spins；The remover liquid nozzle and the wafer cassette driving device are fixed in the rotating disk, and the wafer cassette driving device is for driving wafer cassette rotation；The wafer cassette is fixed in the wafer cassette driving device.By the way that wafer cassette driving device is arranged in the rotating disk, to drive the wafer cassette rotation, to make the wafer cassette is opposite with the remover liquid nozzle to change, in this way, the region that the remover liquid nozzle can be such that wafer to be cleaned contacts with wafer cassette is effectively cleaned, keep wafer cleaning to be cleaned uniform, to improve the cleaning effect of wafer.
Description
Technical field
This application involves ic manufacturing technology fields, and in particular to a kind of wafer cleaning device and cleaning method.
Background technique
The manufacturing process of wafer generally includes all multi-process such as photoetching, ion implanting, etching, vapor deposition.Carrying out phase
After the process of pass, it usually needs cleaned to wafer, to remove the impurity on crystal column surface.If insufficient to wafer cleaning,
So that crystal column surface residual impurity, then in subsequent processing, it is possible to damage wafer, cause to scrap.According to statistics, wafer cleaning work
Skill accounts for about the 20%-30% of whole wafer manufacturing process, and therefore, the process cleaned to wafer seems particularly significant.Mesh
Before, common method for cleaning wafer is mainly: chemical cleaning method, ultrasonic cleaning and vacuum high-temperature facture, these methods and
Technology is widely used in the wafer cleaning in wafer processing and device manufacture.
It is cleaned to wafer, generally uses aerosol type groove profile wet method equipment, set in existing aerosol type groove profile wet process
In standby, as shown in Figure 1, wafer 2 is fixed in rotating disk 4 by the wafer cassette 3 of loading wafer 2, when cleaning, the rotating disk 4 was surrounded
Cleaning chamber (not shown) center 1 is rotated, and cleaning chamber center 1 and cleaning chamber side wall spray misty cleaning agent (such as acid solution)
Wafer 2 is cleaned.In entire cleaning process, the position at wafer 2 and the opposite cleaning chamber center 1 of wafer cassette 3 is constant
, so the position of some contact wafer cassettes 3 is difficult effectively to be cleaned on wafer 2, and wafer 2 is far from cleaning chamber center
1 position and close to clear wash 1 position of chamber center cleaning uniformity it is also different.
Summary of the invention
The application's is designed to provide a kind of wafer cleaning device and cleaning method, is connect with solving wafer in the prior art
The position of touching wafer cassette be not easy to be cleaned to the problem of.
This application provides a kind of wafer cleaning devices, comprising:
Clean chamber；
Rotating mechanism, setting is intracavitary in the cleaning, and the rotating mechanism includes driver and rotating disk, the rotating disk
It is arranged on the driver, the driver drives the rotation disc spins；
Remover liquid nozzle is arranged in the center of the rotating disk, and is connected with a cleaning liquid pipeline, for spraying to wafer
Spill cleaning solution；
At least two wafer cassette driving devices are symmetricly set in the rotating disk centered on the remover liquid nozzle,
For driving wafer cassette rotation；
At least two wafer cassettes are arranged in the wafer cassette driving device.
Optionally, the wafer cassette driving device described in the wafer cleaning device is rotation motor.
Optionally, in the wafer cleaning device, the wafer cleaning device further includes a dry gas jets, described dry
The setting of pathogenic dryness nozzle is intracavitary in the cleaning, for drying wafer.
Optionally, in the wafer cleaning device, the quantity of the wafer cassette and the wafer cassette driving device quantity
Identical, a wafer cassette driving device drives a wafer cassette rotation.
Optionally, in the wafer cleaning device, the range of speeds and the rotating disk of the wafer cassette driving device
The range of speeds be 60rpm/min-300rpm/min.
Optionally, in the wafer cleaning device, at least two wafer cassette driving devices are sprayed with the cleaning solution
It is symmetricly set on centered on mouth in the rotating disk.
Optionally, in the wafer cleaning device, the inner wall of the cleaning chamber is equipped with drainpipe, drainpipe and cleaning chamber
Connection, the drainpipe are equipped with solenoid valve, and the solenoid valve is connect with a controller.
Optionally, in the wafer cleaning device, the cleaning is intracavitary to be provided with and examines to cleaning intracavitary water level
The liquid level sensor of survey, the liquid level sensor are connect with the controller.
On the other hand, present invention also provides a kind of cleaning methods, execute following steps with above-mentioned wafer cleaning device:
Wafer to be cleaned is put into the wafer cassette；
The driver drives the rotating disk rotation, meanwhile, the wafer cassette driving device drives the wafer cassette certainly
Turn；
Remover liquid nozzle hydrojet is treated cleaning wafer and is cleaned.
It optionally, further include that dry gas jets handle the drying wafer after over cleaning in the cleaning method
Step.
Optionally, in the cleaning method, the dry gas jets and the remover liquid nozzle are with a preset frequency
It works alternatively.
Compared with the prior art, wafer cleaning device provided by the present application, by the way that wafer cassette is arranged in the rotating disk
Driving device, to drive the wafer cassette rotation, thus make the wafer cassette is opposite with the remover liquid nozzle to change,
In this way, the region that the remover liquid nozzle can be such that wafer to be cleaned contacts with wafer cassette is effectively cleaned, make crystalline substance to be cleaned
Circle cleaning is uniform, to improve the cleaning effect of wafer.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of wafer cleaning device of the prior art；
Fig. 2 is the structural schematic diagram of wafer cleaning device provided by the embodiments of the present application；
Fig. 3 is the top view of the wafer cassette provided by the embodiments of the present application equipped with wafer.
Fig. 4 is a kind of flow chart of cleaning method of the embodiment of the present application；
Fig. 5 is the flow chart of another cleaning method of the embodiment of the present application.
Wherein, the Detailed description of the invention of prior art Fig. 1 is as follows:
1- cleans chamber center；2- wafer；3- wafer cassette；4- rotating disk.
The reference numerals are as follows by attached drawing 2-3:
10- remover liquid nozzle；20- rotating disk；30- wafer cassette driving device；40- wafer cassette；50- wafer.
Specific embodiment
To keep purpose, the advantages and features of the application clearer, the wafer that the application is proposed below in conjunction with attached drawing 2-4
Cleaning device, that is, cleaning method is described in further detail.It should be noted that attached drawing is all made of very simplified form and makes
With non-accurate ratio, the purpose of the embodiment of the present application is only aided in illustrating to convenience, lucidly.
Embodiment one:
Fig. 2 is the structural schematic diagram of wafer cleaning device provided by the embodiments of the present application, and Fig. 3 is that the embodiment of the present application provides
The wafer cassette equipped with wafer top view.
Refering to Fig. 2-3, the present embodiment provides a kind of 50 cleaning devices of wafer, comprising: cleaning chamber (not shown), rotation
Mechanism, remover liquid nozzle 10, at least two wafer cassette driving devices 30, at least two wafer cassettes 40 and dry gas jets are (in figure
It is not shown).The rotating mechanism setting is intracavitary in the cleaning, and the rotating mechanism includes driver (not shown) and rotation
Turntable 20, the rotating disk 20 are arranged on the driver, and the driver is fixed at the cleaning chamber center,
The driver drives the rotating disk 20 to rotate.The remover liquid nozzle 10 is arranged in the center of the rotating disk 20, and with
One cleaning liquid pipeline is connected, to spray cleaning solution to wafer cassette 40 with cleaning wafer 50.At least two wafer cassette drivings
Device 30 is symmetrically fixed in the rotating disk 20 centered on the remover liquid nozzle 10, to guarantee the rotating disk 20
Uniform force, prevent to deflect.When the driver drives the rotating disk 20 rotation, it is fixed in the rotating disk 20
The wafer cassette 40, the remover liquid nozzle 10 and the wafer cassette driving device 30 around the rotating disk 20
Center is rotated；The wafer cassette 40 is fixed in the wafer cassette driving device 30, the wafer cassette driving device
30 driving 40 rotations of wafer cassette.Wherein, the quantity of the wafer cassette 40 is identical as 30 quantity of wafer cassette driving device,
One wafer cassette driving device 30 drives 40 rotation of wafer cassette.
It is intracavitary that the dry gas jets are fixed at the cleaning, for drying a cleaned wafer 50, it is preferred that
The dry gas jets are fixed in the rotating disk 20, and a drying is arranged between wafer cassette 40 described in every two
Gas jets, can be in time by spray drying with the wafer 50 guaranteed in each wafer cassette 40.
After installing wafer 50 to be cleaned in the wafer cassette 40, while starting the driver and driving the rotating disk
20 rotations, the remover liquid nozzle 10 drive the progress jet cleaning liquid to be cleaned and the wafer cassette driving device 30
It moves the wafer cassette 40 to rotate, so that the relative position of the relatively described remover liquid nozzle 10 of the wafer cassette 40 changes.Its
In, the range of speeds of the wafer cassette driving device 30 and the range of speeds of the rotating disk 20 all can be 60rpm/min-
300rpm/min is excessively slow to avoid revolving speed and influence cleaning efficiency or revolving speed too fast the problem of being thrown out of the wafer 50.
In a specific embodiment, the wafer cassette driving device 30 is rotation motor.In other tools of the application
In body embodiment, the wafer cassette driving device 30 is also possible to other driving devices that can drive the wafer cassette 40,
The concrete type for not limiting the wafer cassette driving device 30 in this embodiment, as long as can be realized makes the wafer
The driving device that box 40 carries out rotation is all that the application is claimed.It is driven by the way that wafer cassette is arranged in the rotating disk 20
Device 30, to drive 40 rotation of wafer cassette, to make the wafer 50 opposite generation with the box remover liquid nozzle 10
Change, in this way, the place that the remover liquid nozzle 10 can be such that wafer 50 to be cleaned contacts with wafer cassette 40 effectively cleans to,
Clean wafer 50 to be cleaned uniformly, to improve the quality of wafer 50.
The cleaning chamber is a closed cavity, and the inner wall of the cleaning chamber is equipped with drainpipe (not shown), draining
Pipe is connected to cleaning chamber, and the drainpipe is equipped with solenoid valve (not shown), and the solenoid valve is connect with a controller, institute
It states and cleans the intracavitary liquid level sensor (not shown) for being additionally provided with the water level intracavitary to cleaning and being detected, the liquid level passes
Sensor is connect with the controller.In cleaning wafer 50, wafer 50 to be cleaned is placed in the wafer cassette 40, is opened
Remover liquid nozzle 10, cleaning solution realize that the cleaning to wafer 50 to be cleaned, the liquid level sensor monitoring are described clear through nozzle
Intracavitary liquid level condition is washed, after the intracavitary liquid of the cleaning reaches certain liquid level, the liquid level sensor is by the liquid level
Information is sent to the controller, and the controller controls the solenoid valve and opens, and so that the drainpipe is in communication with the outside, by institute
State cleaning solution discharge；Or, when cleaning to a certain degree after, the controller controls the solenoid valve and opens, and it is intracavitary to drain cleaning
Cleaning solution, then carry out second of cleaning, improve cleaning effect.
Embodiment two:
Fig. 4 is a kind of flow chart of cleaning method of the embodiment of the present application.
Referring to Fig. 4, present embodiments providing a kind of 50 cleaning method of wafer, 50 cleaning device of wafer executes following
Step: wafer 50 to be cleaned is put into the wafer cassette 40, and driver drives the rotation of rotating disk 20, wafer cassette driving dress
30 drivings, 40 rotation of wafer cassette is set, the wafer cassette 40 and the relative position of the remover liquid nozzle 10 is made to change；
10 hydrojet of remover liquid nozzle sprays cleaning solution to the wafer 50 to be cleaned, is cleaned；Wherein it is possible to by the rotating disk 20
And/or the wafer cassette driving device 30 carries out clockwise and/or carries out alternate rotation counterclockwise, cleans to wafer 50,
In this way, the place that the remover liquid nozzle 10 can be such that wafer 50 to be cleaned contacts with wafer cassette 40 effectively cleans to, can have
The removal of effect ground is attached to the residual abrasive sand in each place and impurity on wafer 50, it is ensured that 50 surface cleanness of wafer.
Wherein, 10 hydrojet of remover liquid nozzle is cleaned multiple times to described more than 50 spray cleaning solutions of wafer to be cleaned, and
The cleaning solution sprayed every time cleans the difference of the property of impurity and different as needed, for example, in prerinse, the cleaning solution
Nozzle 10 sprays clear water and washes away the dust, the solid impurity that contact on 50 surface of wafer, when on 50 surface of wafer
On dust, after solid impurity has been flushed away, control the remover liquid nozzle 10 spray dissolubility solution will be sticky in it is described to
Pollutant softening, separation, dissolution on the wafer 50 of cleaning.
Fig. 5 is the flow chart of another cleaning method of the embodiment of the present application.
Referring to Fig. 5, preferred, the dry gas jets and remover liquid nozzle 10 are done with preset frequency alternation
The wafer 50 that the process remover liquid nozzle 10 cleaned every time is dried in pathogenic dryness nozzle.It can make the crystalline substance in this way
50 surfaces of circle are rapidly achieved drying regime after primary cleaning, after the remover liquid nozzle 10 described in this way can be sprayed immediately
Cleaning solution, not only can improve the cleaning efficiency, can also prevent different cleaning solutions from contacting hair on 50 surface of wafer
Raw reaction generates new pollutant or destroys wafer 50, to guarantee the quality of wafer 50.
Foregoing description is only the description to the application preferred embodiment, not to any restriction of the application range, this Shen
Please field those of ordinary skill any change, the modification done according to the disclosure above content, belong to the protection of claims
Range.
Claims (11)
1. a kind of wafer cleaning device characterized by comprising
Clean chamber；
Rotating mechanism, setting is intracavitary in the cleaning, and the rotating mechanism includes driver and rotating disk, the rotating disk setting
On the driver, the driver drives the rotation disc spins；
Remover liquid nozzle is arranged in the center of the rotating disk, and is connected with a cleaning liquid pipeline, for clear to wafer sprinkling
Washing lotion；
At least two wafer cassette driving devices are symmetricly set in the rotating disk, are used for centered on the remover liquid nozzle
Drive wafer cassette rotation；
At least two wafer cassettes are arranged in the wafer cassette driving device.
2. wafer cleaning device according to claim 1, which is characterized in that the wafer cassette driving device is rotation horse
It reaches.
3. wafer cleaning device according to claim 1, which is characterized in that the wafer cleaning device further includes one dry
Gas jets, the dry gas jets setting is intracavitary in the cleaning, for drying wafer.
4. wafer cleaning device according to claim 1, which is characterized in that the quantity of the wafer cassette and the wafer cassette
Driving device quantity is identical, and a wafer cassette driving device drives a wafer cassette rotation.
5. wafer cleaning device according to claim 1, which is characterized in that the range of speeds of the wafer cassette driving device
The range of speeds with the rotating disk is 60rpm/min-300rpm/min.
6. wafer cleaning device according to claim 1, which is characterized in that at least two wafer cassette driving devices with
It is symmetricly set on centered on the remover liquid nozzle in the rotating disk.
7. wafer cleaning device according to claim 1, which is characterized in that the inner wall of the cleaning chamber is equipped with drainpipe,
Drainpipe is connected to cleaning chamber, and the drainpipe is equipped with solenoid valve, and the solenoid valve is connect with a controller.
8. wafer cleaning device according to claim 7, which is characterized in that it is described cleaning it is intracavitary be provided with to clean it is intracavitary
The liquid level sensor that is detected of water level, the liquid level sensor connect with the controller.
9. a kind of method for cleaning wafer, which is characterized in that executed with such as the described in any item wafer cleaning devices of claim 1-8
Following steps:
Wafer to be cleaned is put into the wafer cassette；
The driver drives the rotating disk rotation, meanwhile, wafer cassette driving device drives the wafer cassette rotation；
Remover liquid nozzle hydrojet is treated cleaning wafer and is cleaned.
10. method for cleaning wafer according to claim 9, which is characterized in that dry gas jets are to the crystalline substance after over cleaning
Circle is dried.
11. method for cleaning wafer according to claim 10, which is characterized in that the dry gas jets and the cleaning solution
Nozzle is worked alternatively with a preset frequency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458538.1A CN109304318A (en) | 2018-11-30 | 2018-11-30 | A kind of wafer cleaning device and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458538.1A CN109304318A (en) | 2018-11-30 | 2018-11-30 | A kind of wafer cleaning device and cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109304318A true CN109304318A (en) | 2019-02-05 |
Family
ID=65223548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811458538.1A Pending CN109304318A (en) | 2018-11-30 | 2018-11-30 | A kind of wafer cleaning device and cleaning method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110335839A (en) * | 2019-07-05 | 2019-10-15 | 西安奕斯伟硅片技术有限公司 | A kind of film magazine cleaning device and method |
| CN111293060A (en) * | 2020-02-21 | 2020-06-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning and fixing device and wafer cleaning equipment |
| CN111842380A (en) * | 2020-06-22 | 2020-10-30 | 徐州鑫晶半导体科技有限公司 | Wafer cassette cleaning apparatus and control method of wafer cassette cleaning apparatus |
| CN112235926A (en) * | 2020-09-26 | 2021-01-15 | 江苏亚电科技有限公司 | Wafer static electricity removing and cleaning method |
| CN112509969A (en) * | 2020-11-30 | 2021-03-16 | 联合微电子中心有限责任公司 | Wafer processing apparatus and wafer processing method |
| CN113843235A (en) * | 2021-08-06 | 2021-12-28 | 徐州鑫晶半导体科技有限公司 | Wafer cassette cleaning device and control method thereof |
| TWI772893B (en) * | 2020-05-29 | 2022-08-01 | 台灣積體電路製造股份有限公司 | Cleaning apparatus for cleaning wafer carrier, cleaning method, and dry chamber |
| CN114988407A (en) * | 2022-07-20 | 2022-09-02 | 天津晟元远卓科技有限公司 | Water flow surrounding impact type flexible rinsing equipment for activated carbon |
| CN117066238A (en) * | 2023-10-17 | 2023-11-17 | 北京青禾晶元半导体科技有限责任公司 | Wafer box cleaning equipment and wafer box cleaning method |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110335839A (en) * | 2019-07-05 | 2019-10-15 | 西安奕斯伟硅片技术有限公司 | A kind of film magazine cleaning device and method |
| CN110335839B (en) * | 2019-07-05 | 2022-02-22 | 西安奕斯伟材料科技有限公司 | Wafer box cleaning device and method |
| CN111293060A (en) * | 2020-02-21 | 2020-06-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning and fixing device and wafer cleaning equipment |
| CN111293060B (en) * | 2020-02-21 | 2023-03-10 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning and fixing device and wafer cleaning equipment |
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| TWI772893B (en) * | 2020-05-29 | 2022-08-01 | 台灣積體電路製造股份有限公司 | Cleaning apparatus for cleaning wafer carrier, cleaning method, and dry chamber |
| US11813649B2 (en) | 2020-05-29 | 2023-11-14 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and method for making |
| CN111842380A (en) * | 2020-06-22 | 2020-10-30 | 徐州鑫晶半导体科技有限公司 | Wafer cassette cleaning apparatus and control method of wafer cassette cleaning apparatus |
| CN112235926A (en) * | 2020-09-26 | 2021-01-15 | 江苏亚电科技有限公司 | Wafer static electricity removing and cleaning method |
| CN112235926B (en) * | 2020-09-26 | 2021-05-07 | 江苏亚电科技有限公司 | Wafer static electricity removing and cleaning method |
| CN112509969A (en) * | 2020-11-30 | 2021-03-16 | 联合微电子中心有限责任公司 | Wafer processing apparatus and wafer processing method |
| CN113843235A (en) * | 2021-08-06 | 2021-12-28 | 徐州鑫晶半导体科技有限公司 | Wafer cassette cleaning device and control method thereof |
| CN114988407A (en) * | 2022-07-20 | 2022-09-02 | 天津晟元远卓科技有限公司 | Water flow surrounding impact type flexible rinsing equipment for activated carbon |
| CN117066238A (en) * | 2023-10-17 | 2023-11-17 | 北京青禾晶元半导体科技有限责任公司 | Wafer box cleaning equipment and wafer box cleaning method |
| CN117066238B (en) * | 2023-10-17 | 2023-12-15 | 北京青禾晶元半导体科技有限责任公司 | Wafer box cleaning equipment and wafer box cleaning method |
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