CN110773505A - Silicon wafer cleaning device and method - Google Patents
Silicon wafer cleaning device and method Download PDFInfo
- Publication number
- CN110773505A CN110773505A CN201911063219.5A CN201911063219A CN110773505A CN 110773505 A CN110773505 A CN 110773505A CN 201911063219 A CN201911063219 A CN 201911063219A CN 110773505 A CN110773505 A CN 110773505A
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- CN
- China
- Prior art keywords
- cleaning
- silicon wafer
- roller
- cleaned
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 187
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 147
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 146
- 239000010703 silicon Substances 0.000 title claims abstract description 146
- 238000000034 method Methods 0.000 title claims abstract description 24
- 235000012431 wafers Nutrition 0.000 claims abstract description 142
- 239000013078 crystal Substances 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 239000012530 fluid Substances 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 239000012535 impurity Substances 0.000 description 6
- 239000004570 mortar (masonry) Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B08B1/10—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
The invention provides a silicon wafer cleaning device and method, and relates to the field of semiconductor silicon wafers. The device includes: the cleaning tank is used for containing cleaning fluid for cleaning the silicon wafer to be cleaned; the cleaning device comprises a plurality of cleaning lines arranged inside a cleaning tank, wherein a certain distance is formed between every two adjacent cleaning lines, and two ends of each cleaning line are respectively connected with the inner side wall of the cleaning tank or a device arranged on the inner side wall; the clamping structure is arranged above the opening of the cleaning tank and used for fixing a plurality of silicon wafers to be cleaned and driving the silicon wafers to move along the vertical direction, the silicon wafers are formed by cutting crystal bars, and gaps among the silicon wafers correspond to the cleaning lines. The embodiment of the invention effectively solves the problems that the prior art can not effectively clean the opposite surfaces of the adjacent silicon chips and the cleaning quality is low.
Description
Technical Field
The invention relates to the field of semiconductor silicon wafers, in particular to a silicon wafer cleaning device and method.
Background
The surface cleanliness of silicon wafers can affect the quality of semiconductor elements, and therefore, the cleaning process of silicon wafers is an important process in the production of semiconductor elements. After the crystal bar is cut into silicon wafers, mortar liquid used in cutting is adhered to the surfaces of the silicon wafers, and due to the fact that the mortar liquid contains grinding agents and oil, the mortar liquid has certain viscosity and can adhere adjacent silicon wafers together. In the prior art, the cut silicon wafers are put into a cleaning tank for cleaning, the surfaces of the cut silicon wafers which are direct to cleaning liquid can only be cleaned, mortar and chips between adjacent silicon wafers cannot be effectively cleaned, and the cleaning quality is not high.
Disclosure of Invention
In view of this, the invention provides a silicon wafer cleaning device and method, which are used for solving the problems that the prior art cannot effectively clean the opposite surfaces of adjacent silicon wafers and the cleaning quality is low.
In order to solve the above technical problem, the present invention provides a silicon wafer cleaning apparatus, including:
the cleaning tank is used for containing cleaning fluid for cleaning the silicon wafer to be cleaned;
the cleaning device comprises a plurality of cleaning lines arranged in the cleaning tank, wherein a certain distance is formed between every two adjacent cleaning lines, and two ends of each cleaning line are respectively connected with the inner side wall of the cleaning tank or a device arranged on the inner side wall;
and the clamping structure is arranged above the opening of the cleaning tank and used for fixing a plurality of silicon wafers to be cleaned and driving the silicon wafers to move along the vertical direction, the silicon wafers are formed by cutting a crystal bar, and gaps among the silicon wafers correspond to the cleaning lines.
Optionally, the cleaning line is made of resin.
Optionally, the diameter of the washing line is 120 μm to 160 μm.
Optionally, the distance between the cleaning line and the bottom of the cleaning tank is greater than the height of the silicon wafer to be cleaned.
Optionally, a roller structure is arranged on the inner side wall of the cleaning tank, the roller structure comprises a first roller and a second roller which are arranged oppositely, the roller structure is connected with the multiple cleaning lines, the cleaning lines are partially wound on the first roller and the second roller, and the cleaning lines are driven to move horizontally by rotation of the roller structure.
Optionally, a plurality of vent pipes are arranged on the inner wall of the cleaning tank, and a plurality of air outlets are arranged on the side, back to the inner wall of the cleaning tank, of the vent pipes and used for inputting gas into the cleaning solution to make small bubbles.
Optionally, the clamping structure includes: the clamping support is connected with the driving device to control the silicon wafer plate to move, the silicon wafer plate is connected with the silicon wafer to be cleaned through a resin strip and is located on one side, back to the opening of the cleaning tank, of the silicon wafer to be cleaned.
Based on the same invention idea, the invention also provides a silicon wafer cleaning method applied to any one of the silicon wafer cleaning devices, and the method comprises the following steps:
the silicon wafer to be cleaned is controlled to move in the cleaning tank along the vertical direction through the clamping structure, a plurality of cleaning lines are arranged in gaps among the silicon wafers and are in contact with the silicon wafers in the moving process, and the silicon wafer to be cleaned moves in the vertical direction relative to the cleaning lines.
Optionally, if silicon chip belt cleaning device is equipped with the breather pipe, treat through the control of clamping structure and wash the silicon chip and follow vertical direction motion in the washing tank, still include:
and conveying the clean gas into the breather pipe, and conveying the clean gas into the cleaning liquid through the air outlet on the breather pipe.
Optionally, if silicon chip belt cleaning device is equipped with the roller bearing structure, treat through the control of clamping structure and wash the silicon chip and follow vertical direction motion in the washing tank, still include:
controlling a first roller and a second roller in the roller structure to rotate towards a first direction at the same frequency, wherein the first roller and the second roller drive the plurality of cleaning lines to move towards a first horizontal direction relative to the silicon wafer;
and controlling the first roller and the second roller to rotate towards a second direction at the same frequency, wherein the first roller and the second roller drive the plurality of cleaning lines to move towards a second horizontal direction relative to the silicon wafer.
The technical scheme of the invention has the following beneficial effects: the silicon wafer cleaning device is provided with the cleaning lines, in the cleaning process of the silicon wafers, the cleaning lines can separate the silicon wafers which are adhered mutually, cleaning solution can be in contact with the surface of each silicon wafer, meanwhile, relative motion between the silicon wafers and the cleaning lines can enable mortar adhered to the surfaces of the silicon wafers to be separated from the silicon wafers, the silicon wafers are effectively cleaned, the cleaning quality is good, and the efficiency is high.
Drawings
FIG. 1 is a schematic structural diagram of a silicon wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a roller structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a clamping structure according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a silicon wafer cleaning apparatus according to an embodiment of the present invention, the apparatus including:
a cleaning tank 101 for holding a cleaning solution for cleaning the silicon wafer 102 to be cleaned;
a plurality of cleaning lines 103 arranged inside the cleaning tank 101, wherein a certain distance is formed between every two adjacent cleaning lines 103, and two ends of each cleaning line 103 are respectively connected with the inner side wall of the cleaning tank 101 or a device arranged on the inner side wall;
the clamping structure 104 is arranged above the opening of the cleaning tank 101, and is used for fixing the silicon wafers 102 to be cleaned and driving the silicon wafers 102 to move along the vertical direction, the silicon wafers 102 are formed by cutting a crystal bar, and gaps among the silicon wafers 102 correspond to the cleaning lines 103;
wherein, the number of the cleaning lines 103 and the interval between two cleaning lines 103 are determined by the number of the silicon wafers 102 to be cleaned and the interval between two adjacent silicon wafers.
In the embodiment of the invention, the silicon wafer cleaning device provided with the plurality of cleaning lines is provided, in the cleaning process, the cleaning lines can separate the silicon wafers which are adhered to each other, so that the cleaning liquid can fully contact the surface of each silicon wafer, and in addition, the relative movement of the cleaning lines and the silicon wafers in the vertical direction is beneficial to the separation of the surfaces of the silicon wafers and impurities, so that the efficient cleaning effect is achieved, the cleaning time is saved, and the cleaning quality is improved.
In some embodiments of the present invention, optionally, the cleaning line 103 is made of resin.
In the embodiment of the invention, the cleaning line made of the resin material is adopted, so that metal pollution to the silicon wafer in the cleaning process can be avoided, and the cleaning quality is ensured.
In some embodiments of the present invention, optionally, the diameter of the washing line 103 is 120 μm to 160 μm;
illustratively, the diameter of the washing line 103 may be 140 μm.
In the embodiment of the invention, the cleaning line with the diameter of 120-160 μm is adopted to clean the silicon wafers, so that the cleaning line can be ensured to extend into the two silicon wafers without damaging the surfaces of the silicon wafers, and the cleaning line can be contacted with the surfaces of the silicon wafers to assist in stripping impurities on the surfaces of the silicon wafers.
In some embodiments of the present invention, optionally, the distance between the cleaning line 103 and the bottom of the cleaning tank 101 is greater than the height of the silicon wafer 102 to be cleaned.
In the embodiment of the invention, as the silicon wafers can make linear motion in the vertical direction under the control of the clamping structure, when the distance from the cleaning line to the bottom of the cleaning tank is greater than the height of the silicon wafers, the path of relative motion between the silicon wafers and the cleaning line in the vertical direction can be fully distributed on the surface of each silicon wafer, so that the silicon wafers are thoroughly cleaned.
In some embodiments of the present invention, as shown in fig. 2, optionally, a roller structure is disposed on an inner side wall of the cleaning tank 101, the roller structure includes a first roller 201 and a second roller 202 that are disposed oppositely, the roller structure is connected to the plurality of cleaning lines 103, the cleaning lines 103 are partially wound around the first roller 201 and the second roller 202, and the rotation of the roller structure drives the cleaning lines 103 to move horizontally.
In the embodiment of the invention, the roller is used for horizontally moving the cleaning line in the cleaning tank, so that the cleaning line and the silicon wafer not only have relative motion in the vertical direction but also have relative motion in the horizontal direction in the process of cleaning the silicon wafer, and the cleaning process is more thoroughly and efficiently completed.
In some embodiments of the present invention, optionally, a plurality of vent pipes are disposed on the inner wall of the cleaning tank, and a plurality of vent holes are disposed on a surface of the vent pipes facing away from the inner wall of the cleaning tank, for introducing gas into the cleaning solution to produce small bubbles.
In the embodiment of the invention, the vent pipe with the air outlet is used for conveying air into the cleaning tank, so that small bubbles are produced in the cleaning liquid, the small bubbles flap the surface of the silicon wafer to assist the separation of the silicon wafer and impurities, and the cleaning quality is improved.
In some embodiments of the present invention, as shown in fig. 3, optionally, the clamping structure 104 comprises: the silicon wafer cleaning device comprises a clamping support 301 and a silicon wafer plate 302 which are connected, wherein the clamping support 301 is connected with a driving device and used for controlling the silicon wafer plate 302 to move, and the silicon wafer plate 302 is connected with a silicon wafer 102 to be cleaned through a resin strip 303 and is positioned on one side, back to the opening of the cleaning tank 101, of the silicon wafer 102 to be cleaned.
In the embodiment of the invention, the silicon wafer plate and the silicon wafer are connected together through the resin strip, so that the silicon wafer is prevented from scattering in the cleaning process, the quality of the silicon wafer is ensured, the clamping support drives the silicon wafer to move, the contact area of the silicon wafer and the cleaning liquid is enlarged, the silicon wafer and the cleaning line can move relatively, and the cleaning quality and the cleaning efficiency are effectively improved.
In addition, an embodiment of the present invention further provides a silicon wafer cleaning method applied to any one of the above silicon wafer cleaning apparatuses, including:
the silicon wafer 102 to be cleaned is controlled by the clamping structure 104 to move in the vertical direction in the cleaning tank 101, during the movement, the plurality of cleaning lines 103 are positioned in gaps among the plurality of silicon wafers 102 and are in contact with the silicon wafers 102, and the silicon wafer 102 to be cleaned moves in the vertical direction relative to the plurality of cleaning lines 103.
In the embodiment of the invention, when the cut silicon wafers are cleaned in the cleaning tank, the relative movement of the cleaning line between the silicon wafer gap and the silicon wafer is utilized, so that the relative surfaces between the adjacent silicon wafers can be contacted with the cleaning liquid, and the separation of the surfaces of the silicon wafers and impurities can be effectively assisted, thereby improving the cleaning quality.
In some embodiments of the present invention, optionally, if the silicon wafer cleaning apparatus is provided with a vent pipe, the silicon wafer to be cleaned is controlled by the clamping structure to move in the vertical direction in the cleaning tank, and the method further includes: and conveying the clean gas into the breather pipe, and conveying the clean gas into the cleaning liquid through the air outlet on the breather pipe.
In the above embodiment of the present invention, the gas is input into the cleaning tank 101 through the vent pipe with the gas outlet, so that small bubbles are formed in the cleaning solution, and the flap of the small bubbles on the surface of the silicon wafer promotes the impurities to fall off from the surface of the silicon wafer, thereby accelerating the cleaning process.
In some embodiments of the present invention, optionally, if the silicon wafer cleaning apparatus is provided with a roller structure, the silicon wafer to be cleaned is controlled by the clamping structure to move in the vertical direction in the cleaning tank, and the method further includes:
controlling a first roller 201 and a second roller 202 in the roller structure to rotate in a first direction at the same frequency, and driving the plurality of cleaning lines 103 to move in a first horizontal direction relative to the silicon wafer 102 by the first roller 201 and the second roller 202;
the first roller 201 and the second roller 202 are controlled to rotate in a second direction at the same frequency, and the first roller 201 and the second roller 202 drive the plurality of cleaning lines 103 to move in a second horizontal direction relative to the silicon wafer 102.
In the embodiment of the invention, the roller drives the cleaning line to move in the horizontal direction, so that the cleaning line and the silicon wafer move relatively in the horizontal direction, impurities can be stripped from the surface of the silicon wafer by the cleaning line, and the cleaning efficiency is improved.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A silicon wafer cleaning apparatus, comprising:
the cleaning tank is used for containing cleaning fluid for cleaning the silicon wafer to be cleaned;
the cleaning device comprises a plurality of cleaning lines arranged in the cleaning tank, wherein a certain distance is formed between every two adjacent cleaning lines, and two ends of each cleaning line are respectively connected with the inner side wall of the cleaning tank or a device arranged on the inner side wall;
and the clamping structure is arranged above the opening of the cleaning tank and used for fixing a plurality of silicon wafers to be cleaned and driving the silicon wafers to move along the vertical direction, the silicon wafers are formed by cutting a crystal bar, and gaps among the silicon wafers correspond to the cleaning lines.
2. The silicon wafer cleaning apparatus according to claim 1, wherein the cleaning line is made of a resin material.
3. The silicon wafer cleaning apparatus according to claim 1, wherein the diameter of the cleaning wire is 120 μm to 160 μm.
4. The silicon wafer cleaning apparatus as claimed in claim 1, wherein the distance between the cleaning line and the bottom of the cleaning tank is greater than the height of the silicon wafer to be cleaned.
5. The silicon wafer cleaning device according to claim 1, wherein a roller structure is disposed on an inner side wall of the cleaning tank, the roller structure comprises a first roller and a second roller which are oppositely disposed, the roller structure is connected with the plurality of cleaning lines, the cleaning lines are partially wound on the first roller and the second roller, and the cleaning lines are driven to horizontally move by rotation of the roller structure.
6. The silicon wafer cleaning apparatus as claimed in claim 1, wherein a plurality of vent pipes are disposed on the inner wall of the cleaning tank, and a plurality of gas outlets are disposed on a surface of the vent pipes facing away from the inner wall of the cleaning tank for introducing gas into the cleaning liquid to produce small bubbles.
7. The wafer cleaning apparatus according to claim 1, wherein the clamping structure comprises: the clamping support is connected with the driving device to control the silicon wafer plate to move, the silicon wafer plate is connected with the silicon wafer to be cleaned through a resin strip and is located on one side, back to the opening of the cleaning tank, of the silicon wafer to be cleaned.
8. A silicon wafer cleaning method applied to the silicon wafer cleaning apparatus according to any one of claims 1 to 7, characterized by comprising:
the silicon wafer to be cleaned is controlled to move in the cleaning tank along the vertical direction through the clamping structure, a plurality of cleaning lines are arranged in gaps among the silicon wafers and are in contact with the silicon wafers in the moving process, and the silicon wafer to be cleaned moves in the vertical direction relative to the cleaning lines.
9. The silicon wafer cleaning method according to claim 8, wherein if the silicon wafer cleaning apparatus is provided with a vent pipe, the silicon wafer to be cleaned is controlled by the holding structure to move in the vertical direction in the cleaning tank, further comprising:
and conveying the clean gas into the breather pipe, and conveying the clean gas into the cleaning liquid through the air outlet on the breather pipe.
10. The silicon wafer cleaning method according to claim 8, wherein if the silicon wafer cleaning apparatus is provided with a roller structure, the silicon wafer to be cleaned is controlled by the clamping structure to move in the vertical direction in the cleaning tank, further comprising:
controlling a first roller and a second roller in the roller structure to rotate towards a first direction at the same frequency, wherein the first roller and the second roller drive the plurality of cleaning lines to move towards a first horizontal direction relative to the silicon wafer;
and controlling the first roller and the second roller to rotate towards a second direction at the same frequency, wherein the first roller and the second roller drive the plurality of cleaning lines to move towards a second horizontal direction relative to the silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911063219.5A CN110773505B (en) | 2019-10-31 | 2019-10-31 | Silicon wafer cleaning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911063219.5A CN110773505B (en) | 2019-10-31 | 2019-10-31 | Silicon wafer cleaning device and method |
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| Publication Number | Publication Date |
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| CN110773505A true CN110773505A (en) | 2020-02-11 |
| CN110773505B CN110773505B (en) | 2022-06-28 |
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| CN201911063219.5A Active CN110773505B (en) | 2019-10-31 | 2019-10-31 | Silicon wafer cleaning device and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226294A (en) * | 2020-09-09 | 2022-03-25 | 中国科学院微电子研究所 | Wafer cleaning device and wafer cleaning method |
| CN114361078A (en) * | 2022-01-06 | 2022-04-15 | 淮安永捷电子有限公司 | Wafer cleaning equipment and method for electronic product manufacturing |
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| EP1058300A2 (en) * | 1999-03-30 | 2000-12-06 | Applied Materials, Inc. | Wafer edge cleaning method and apparatus |
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| CN114361078A (en) * | 2022-01-06 | 2022-04-15 | 淮安永捷电子有限公司 | Wafer cleaning equipment and method for electronic product manufacturing |
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| Publication number | Publication date |
|---|---|
| CN110773505B (en) | 2022-06-28 |
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Effective date of registration: 20211022 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |