KR20160128115A - Wire saw apparatus - Google Patents

Wire saw apparatus Download PDF

Info

Publication number
KR20160128115A
KR20160128115A KR1020150059946A KR20150059946A KR20160128115A KR 20160128115 A KR20160128115 A KR 20160128115A KR 1020150059946 A KR1020150059946 A KR 1020150059946A KR 20150059946 A KR20150059946 A KR 20150059946A KR 20160128115 A KR20160128115 A KR 20160128115A
Authority
KR
South Korea
Prior art keywords
bath
wire
ingot
cleaning liquid
present
Prior art date
Application number
KR1020150059946A
Other languages
Korean (ko)
Inventor
백성선
우남규
장순호
최효일
김남기
배동우
정승구
Original Assignee
웅진에너지 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 웅진에너지 주식회사 filed Critical 웅진에너지 주식회사
Priority to KR1020150059946A priority Critical patent/KR20160128115A/en
Publication of KR20160128115A publication Critical patent/KR20160128115A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D55/00—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts
    • B23D55/08—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts of devices for guiding or feeding strap saw blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only

Abstract

A wire saw apparatus is provided. The wire saw apparatus includes an ingot moving in a first direction, a wire positioned on a path through which the ingot moves and cutting the ingot, a pair of guide rollers wound around the outer circumferential surface of the wire to move the wire, And a cleaning unit positioned between the guide rollers to clean the ingot that has passed through the wire. Wherein the cleaning part comprises: a first bath filled with a cleaning liquid and having a receiving groove capable of receiving an ingot through which the wire is passed; at least one of the first and second baths is disposed on one side of the first bath, And a second bath surrounding the first bath to receive the cleaning liquid overflowed from the first bath.

Description

[0001] The present invention relates to a wire saw apparatus,

The present invention relates to a wire saw apparatus.

A wafer widely used as a material for manufacturing semiconductor devices refers to a single crystal silicon thin plate. Such wafers include a slicing process for thinly cutting a single crystal silicon ingot into a wafer shape, a lapping process for improving the flatness while polishing the wafer to a desired wafer thickness, an etching process for removing the damaged layer inside the wafer, Polishing is performed to improve etching, surface hardening and flatness, and cleaning to remove contaminants on the surface of the wafer.

Monocrystalline silicon ingots are generally grown and manufactured according to the Czochralski method. This method is a method of melting polycrystalline silicon in a crucible in a chamber, immersing a single crystal seed crystal into molten silicon, and gradually growing the molten silicon into a silicon single crystal ingot having a desired diameter.

After the growth of the ingot is completed, a slicing process for cutting the ingot into wafer units is performed. In this slicing step, there is a wire saw method in which a wire is run at a high speed and a slurry solution is sprayed thereon to cut the slurry by the friction between the slurry and the ingot.

Meanwhile, the conventional wire saw apparatus can not effectively clean particles such as coolant and sludge remaining on the wafer surface because the wafer is dried between the slicing step of cutting the ingot into a wafer form and the cleaning step, which may deteriorate the quality of the wafer .

In addition, the conventional wire saw apparatus takes a long time in the whole process due to the separate cleaning process.

One embodiment of the present invention is to provide a wire saw apparatus capable of effectively removing particles remaining on the surface of a wafer in a slicing step for cutting an ingot to improve the quality of the wafer.

According to one aspect of the present invention, there is provided a method of manufacturing an ingot, comprising: an ingot moving in a first direction; a wire positioned on a path through which the ingot moves and cutting the ingot; a pair of guide rollers wound on an outer circumferential surface of the wire to move the wire; And a cleaning unit positioned between the pair of guide rollers to clean the ingot passed through the wire. Wherein the cleaning part comprises: a first bath filled with a cleaning liquid and having a receiving groove capable of receiving an ingot through which the wire is passed; at least one of the first and second baths is disposed on one side of the first bath, And a second bath surrounding the first bath to receive the cleaning liquid overflowed from the first bath.

At this time, a drain port for discharging the cleaning liquid overflowing from the first bath to the outside of the second bath may be formed at one longitudinal end of the second bath.

At this time, the height h1 of the first bath may be lower than the height h2 of the second bath.

At this time, the length of the pair of guide rollers on which the wire is wound may be shorter than the length of the first bass.

At this time, the wire and the first bath may be spaced apart at a predetermined interval.

At this time, the predetermined interval may be 5 mm to 20 mm.

At this time, the ultrasonic wave generator may be formed on both sides of the first bath.

The apparatus may further include a collecting unit connected to the drain port to collect the discharged washing liquid.

At this time, the cleaning liquid supply unit may be located above the first bath and supply the cleaning liquid into the receiving groove.

At this time, the cleaning liquid supply unit may be connected to the collecting unit to supply the cleaning liquid from the collecting unit to the cleaning liquid supply unit.

The wire saw apparatus according to an embodiment of the present invention includes an ultrasonic generator to effectively remove particles such as sludge and coolant present in the ingot, thereby improving the quality of the wafer and reducing the defect rate.

In addition, in the wire saw apparatus according to an embodiment of the present invention, the cleaning unit is positioned between a pair of guide rollers, and the cleaning process is performed at the same time as the slicing process is performed, so that the wafer is not dried, It is possible to effectively remove particles such as particles.

The wire saw apparatus according to an embodiment of the present invention can efficiently clean the wafer by adjusting the frequency magnitude of the ultrasonic vibration according to the size of the particles.

1 is a perspective view showing a wire saw apparatus according to an embodiment of the present invention.
2 is a front view of a wire saw apparatus according to an embodiment of the present invention.
3 is a perspective view illustrating a cleaning unit of the wire saw apparatus according to an embodiment of the present invention.
4 is a perspective view illustrating a cross section of a cleaning unit of a wire saw apparatus according to an embodiment of the present invention.
5 is a schematic view showing an operating state of a wire saw apparatus according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, where a section such as a layer, a film, an area, a plate, or the like is referred to as being "on" another section, it includes not only the case where it is "directly on" another part but also the case where there is another part in between. On the contrary, where a section such as a layer, a film, an area, a plate, etc. is referred to as being "under" another section, this includes not only the case where the section is "directly underneath"

Hereinafter, a wire saw apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.

1 is a perspective view showing a wire saw apparatus according to an embodiment of the present invention. 2 is a front view of a wire saw apparatus according to an embodiment of the present invention.

In the following description, it is assumed that the z-axis direction is the first direction, the x-axis direction is the second direction, and the y-axis direction is the third direction, as shown in Fig.

1 and 2, a wire saw apparatus 1 according to an embodiment of the present invention includes a wire 5, an ingot supporting portion 10, a guide roller 7, a supplying portion 20, a collecting portion 30 A coolant splitter 41, and a cleaning unit 50. [

Accordingly, the wire saw apparatus 1 according to the embodiment of the present invention can improve the quality of wafers by effectively removing the sludge and coolant present in the cut ingot 3 including the cleaning part 50 .

1 and 2, in an embodiment of the present invention, the wire 5 is a type in which cutting particles are fixed on the surface, for example, a diamond particle is fixed to a surface through nickel electrodeposition .

At this time, in the embodiment of the present invention, the wire 5 of the type in which the cutting particles are fixed can cut many wafers 4 in a short time by increasing the cutting ability.

Meanwhile, in one embodiment of the present invention, the ingot 3 is disposed on the upper side of the wire 5, and in the slicing process, the ingot 3 is lowered toward the wire 5 in a first direction, for example, Is cut.

At this time, in the embodiment of the present invention, the ingot that has passed through the wire 5 by descending the ingot 3 is the wafer 4.

Referring to FIG. 1, in one embodiment of the present invention, the ingot support portion 10 may include a work plate 11 and a beam 13 by attaching and supporting the ingot 3 in a slicing process.

On the other hand, the work plate 11 can be attached to one side of the beam 13 using an adhesive member such as an epoxy. At this time, the beam 13 may be made of calcium chloride, glass, quartz, or the like, and the ingot 3 may be mounted on the other side of the beam 13.

That is, as shown in FIG. 1, a work plate 11 may be attached to the top of the beam 13, and an ingot 3 may be attached to the bottom of the beam.

The wire saw apparatus 1 according to the embodiment of the present invention can be manufactured by stably mounting the ingot 3 by the work plate 11 and the beam 13 so that the ingot cut by the wire 5 , It is possible to prevent the wafer 4 from falling downward.

1, in an embodiment of the present invention, the guide rollers 7 may be installed at the bottom of the ingot 3 and may be provided in at least one pair.

At this time, the pair of guide rollers 7 may be spaced apart from each other by a distance larger than the diameter D of the ingot 3 at a predetermined interval, for example, as shown in FIG.

On the other hand, the guide roller 7 has a cylindrical shape and a plurality of guide grooves (not shown) are formed on the outer circumferential surface of the guide roller so that the wire 5 can be wound on the pair of guide rollers 7 at the same time.

At this time, the guide grooves may be formed at regular intervals along the longitudinal direction of the guide rollers 7.

Meanwhile, the number and thickness of the wafers 4 sliced by the spacing of the wires 5 wound on the guide rollers 7 can be determined in the wire saw 1 according to the embodiment of the present invention.

Referring to FIG. 1, the pair of guide rollers 7 may include a first guide roller 7a and a second guide roller 7b.

1, the first guide roller 7a of the pair of guide rollers 7 is directly connected to the motor 9 so that the first guide roller is rotated by the motor. In addition, the rotational force of the first guide roller 7a can rotate the second guide roller 7b through the wire 5.

On the other hand, the guide roller 7 can be rotated in one direction or in both directions. At this time, as the guide roller 7 is rotated clockwise or counterclockwise, the wire 5 can be driven at a high speed in one direction or in both directions.

In this way, the ingot 3 is cut in the direction perpendicular to the longitudinal direction by the wire 5 which is moved in one direction or both directions so that the wafers 4 can be produced.

However, when the wire saw device 1 according to the embodiment of the present invention moves the wire 5 in both directions to produce a wafer, the thickness deviation of the wafer is reduced rather than the wire moves in one direction to produce the wafer And the quality of the wafer can be improved.

Meanwhile, in one embodiment of the present invention, one side of the first guide roller 7a of the pair of guide rollers 7 may be provided with a supply part 20 for supplying a wire, and the second guide roller 7b And a recovery unit 30 for recovering the wire supplied from the supply unit 20 may be installed at one side.

Referring to Figs. 1 and 2, the supply unit 20 may supply the wire to the guide roller 7, including the supply bobbin 21, the first tension pulley 23, and the supply pulley 25. [

On the other hand, the supply bobbin 21 is disposed on the upper right side of the first guide roller 7a, and the wire 5 is wound to supply the wire.

Referring to FIG. 1, the first tension pulley 23 is installed on the lower side of the supply bobbin 21, and two of them may be installed, but the present invention is not limited thereto. At this time, the first tension pulley 23 can impart tension to the wire 5 and guide the progress of the wire.

On the other hand, the feeding pulley 25 is disposed on the right lower side of the first guide roller 7a and can change the entry position of the wire 5 entering the first guide roller 7a.

However, the feed pulley 25 may be installed on the lower right side of the first guide roller 7a as shown in FIG. 1, but is not limited thereto.

Referring to FIGS. 1 and 2, the recovery unit 30 includes a recovery bobbin 31, a second tension pulley 33, and a recovery pulley 35 to recover the wire from the guide roller 7.

On the other hand, the recovery bobbin 31 is disposed above the left upper side of the second guide roller 7b, and the wire can be wound and recovered.

Referring to FIG. 1, the second tension pulley 33 is installed on the lower side of the recovery bobbin 31 and may be provided with two, but not limited thereto. At this time, the second tension pulley 33 can impart tension to the wire and guide the progress of the wire.

On the other hand, the return pulley 35 can be disposed at the lower left of the second guide roller 7b and can change the position of the wire recovered from the second guide roller 7b. However, as shown in FIG. 1, the return pulley 35 may be installed on the lower left side of the second guide roller 7b, but it is not limited thereto.

Referring to FIG. 1, the coolant splitter 41 may be formed in a pipe shape extending along the longitudinal direction of the guide roller 7, but the present invention is not limited thereto. The coolant splitter 41 may be formed in any form by spraying a coolant.

Referring to FIG. 1, the coolant splitter 41 may be formed with a through hole through which the coolant can be injected. At this time, the coolant splitter 41 is provided on the upper side of the pair of guide rollers 7 to facilitate cutting of the ingot.

On the other hand, when the ingot is cut by the wire 5 wound on the pair of guide rollers 7, the coolant is fed toward the wire 5 positioned between the first guide roller 7a and the second guide roller 7b, Can be sprayed.

At this time, the coolant may include abrasive grains. When the ingot 3 mounted on the ingot support portion 10 moves toward the wire 5 and is pressed, the ingot 3 is pressed by the abrasive grain coated on the wire 5, (3) can be cut.

In this case, in the embodiment of the present invention, the coolant splitter 41 may be connected to the coolant supply unit 43 to supply coolant.

3 is a perspective view illustrating a cleaning unit of the wire saw apparatus according to an embodiment of the present invention. 4 is a perspective view illustrating a cross section of a cleaning unit of a wire saw apparatus according to an embodiment of the present invention.

3, in one embodiment of the present invention, the cleaning section 50 may include a first bath 60, a second bath 70, an ultrasonic generator 63, and a collector 80 .

The wire saw apparatus 1 according to an embodiment of the present invention includes the cleaning part 50 to effectively remove particles such as sludge and coolant present on the surface of the wafer 4 to improve the quality of the wafer, .

Meanwhile, in an embodiment of the present invention, the first bath 60 has a rectangular cross-section and is provided with a first receiving groove 61 (see FIG. 3) But the present invention is not limited thereto.

At this time, the vertical length w and the height h1 of the first bath 60 are larger than the diameter D of the ingot 3 and the transverse length L2 of the first bath is larger than the length L1 of the ingot, Can be accommodated in the first bath 60.

In addition, several tens of wafers 4, typically 50 wafers, having passed through the wire 5 can be introduced into the first receiving groove 61 of the first bath 60.

Referring to FIG. 1, in an embodiment of the present invention, the first bath 60 is positioned between a pair of guide rollers 7, that is, a first guide roller 7a and a second guide roller 7b.

Further, it can be positioned between the wire 5 wound around the upper outer peripheral surface of the pair of guide rollers 7 and the wire wound around the lower outer peripheral surface.

5, the wire 5 cutting the ingot 3 and the first bath 60 are spaced apart from each other by a predetermined distance S, so that the washing process can be performed simultaneously with the slicing process .

At this time, the predetermined distance S between the wire 5 and the first bath 60 may be 5 mm to 20 mm. Accordingly, the wire saw apparatus 1 according to the embodiment of the present invention can prevent the ingot 3, which is cut through the wire 5, from drying before flowing into the first bath 60, Can be prevented from entering the pair of guide rollers (7).

However, in the embodiment of the present invention, the wire 5 may be formed in a downward direction when cutting the ingot 3, but the distance between the wire and the first bath 60 can be adjusted in consideration of this.

Accordingly, the wire saw apparatus 1 according to an embodiment of the present invention can perform a cleaning process in a state where the wafer is not dried, thereby effectively removing particles such as sludge and coolant remaining on the wafer surface.

1, the wire 5 is wound around the pair of guide rollers 7 while maintaining a constant distance in the longitudinal direction, and the length L2 of the guide rollers around which the wire is wound is larger than the length And may be shorter than the transverse length L3.

Thus, the wire saw 1 according to the embodiment of the present invention is configured such that all the particles, such as coolant and sludge generated when the ingot 3 passes through the wire 5, are attracted to the pair of guide rollers 7 So that it can be introduced into the first bath 60.

Meanwhile, in an embodiment of the present invention, a cleaning liquid supply unit 51 may be installed on the upper portion of the first bath 60 so that the cleaning liquid can be introduced into the first bath. At this time, the cleaning liquid may be supplied from the cleaning liquid supply tank (not shown) to the inside of the first bath 60 through the cleaning liquid supply unit 51.

Meanwhile, in one embodiment of the present invention, the cleaning liquid may be deionized water (H 2 O), but it is not limited thereto and any liquid may be used as long as it is for removing particles present on the surface of the wafer 4 have.

3 and 4, in one embodiment of the present invention, at least one ultrasonic wave generator 63 is installed on one side of the first bath 60, for example, on the left side or the right side of the first bath . Accordingly, the ultrasonic wave generators 63 may be installed on both sides of the first bath 60 in pairs.

The wire saw apparatus 1 according to an embodiment of the present invention includes the ultrasonic wave generator 63 to effectively remove particles of various sizes such as sludge and coolant present on the surface of the wafer 4, Can be improved and the defect rate can be reduced.

3 and 4, in an embodiment of the present invention, the ultrasonic wave generator 63 may have a long rod shape, but the present invention is not limited thereto.

At this time, the cleaning section 50 fills the first bath 60 with the cleaning liquid, and then vibrates the cleaning liquid finely by the ultrasonic waves generated in the ultrasonic wave generating section 63 and vibrates the surface of the wafer 4 by the vibrating cleaning liquid. Particles such as attached coolant and sludge can be removed.

Meanwhile, in an embodiment of the present invention, the ultrasonic wave generator 63 can control the frequency band of the ultrasonic vibration generated in the ultrasonic wave generator through the controller (not shown) according to the size of particles to be removed.

Further, in the embodiment of the present invention, the ultrasonic wave generator 63 can select low frequency vibration or high frequency vibration according to the particles to be removed.

In other words, a particle of a small size generates low frequency vibration, and a particle of larger size can be removed by generating a high frequency vibration, but it is also possible to efficiently clean particles of various sizes by sending low frequency vibration and high frequency vibration at the same time.

Meanwhile, the wire saw apparatus 1 according to an embodiment of the present invention may include a second bath 70 disposed to surround the outer surface of the first bath 60. At this time, the second bath 70 may be disposed to surround the first bath 60 to receive the washing liquid overflowed from the side of the first bath.

3 and 4, the second bass 70 is similar to the first bass 60 and has a rectangular cross-section. The first bass 60 can be accommodated in the first bass 60, 3, a second receiving groove 71 having an open upper side can be formed.

4, the height h2 of the second bath 70 is higher than the height h1 of the first bath 60 so that all the washing liquid overflowing from the first bath can flow to the second bath .

4, a drain port 73 may be formed at both ends of the second bath 70 in the longitudinal direction. At this time, the drain port 73 may be formed on the lower surface of the second bath 70, but is not limited thereto.

This is because, in one embodiment of the present invention, the drain hole 73 is formed at both ends of the second bath 70 in the longitudinal direction so that the wire 5 and the pair of guide rollers 7, when discharging the cleaning liquid mixed with the particles, .

Meanwhile, in an embodiment of the present invention, the drain port 73 may discharge the washer fluid overflowed from the first bath 60 to the collecting section 80 through a discharge pipe (not shown). At this time, the discharged cleaning liquid may be purified through a filter (not shown) and collected in the collecting unit 80.

Referring to FIG. 1, the collecting portion 80 may be installed on the lower side of the pair of guide rollers 7, and the third receiving groove 81 opened to the upper side may be formed to collect the washing liquid.

At this time, a part of the coolant injected by the pair of guide rollers 7 in the coolant splitter 41 may be collected in the third receiving groove 81 of the collecting part 80 and collected.

In addition, the coolant purified through the filter among the cleaning liquid collected in the collecting unit 80 can be moved to the coolant supply unit 43 again, and the cleaning liquid flows into the cleaning liquid supply tank, (Not shown).

The operation of the wire saw apparatus 1 according to one embodiment of the present invention will be described below.

5, a wire wound around the supply bobbin 21 is wound around a first tension pulley 23, a supply pulley 25, a first guide roller 7a The ingot 3 is cut into the wafer 4 having a desired number and thickness while moving to the second guide roller 7b, the recovery pulley 35, the second tension pulley 33 and the recovery bobbin 31 .

At this time, the wire advances from the supply bobbin 21 toward the recovery bobbin 31 and is wound, and can be recovered while reciprocally rotating on the outer circumferential surface of a pair of facing guide rollers 7.

At the same time, the work plate 11 on which the ingot 3 is mounted is moved downward, and only the part of the whole ingot 3 to be cut is brought into contact with the wire 5 rotating reciprocatingly, so that a desired number of the wafers 4 are cut .

At this time, the wafer 4 flows into the first bath 60 filled with the cleaning liquid, and the ultrasonic wave generator 63 installed on both sides of the first bath is operated to vibrate the cleaning liquid to remove particles present on the wafer surface .

Thereafter, the cleaning liquid mixed with the particles overflowing from the first bath 60 is received in the second bath 70 and discharged to the collecting unit 80 through the drain port 73 formed in the second bath.

In the collecting unit 80, the cleaning liquid is filtered and classified into a coolant, a clean cleaning liquid, and the like, which are sent to the coolant supply unit 43 and the cleaning liquid supply tank, respectively, for reuse.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: wire saw device 3: ingot
5: wire 7: guide roller
7a: first guide roller 7b: second guide roller
9: motor 10: ingot support
11: work plate 13: beam
20: supply part 21: supply bobbin
23: first tension pulley 25: feed pulley
30: recovery unit 31: recovery bobbin
33: second tension pulley 35: return pulley
41: Coolant distributor 43: Coolant supplier
50: washing unit 51: cleaning liquid supply unit
60: first bath 61: first receiving groove
63: ultrasonic wave generator 70: second bath
71: second receiving groove 73: drain hole
80: collecting section 81: third receiving groove

Claims (10)

An ingot moving in a first direction;
A wire positioned on a path through which the ingot moves and cutting the ingot;
A pair of guide rollers wound on the outer circumferential surface of the wire to move the wire; And
And a cleaner positioned between the pair of guide rollers to clean the ingot that has passed through the wire.
The taxing authority
A first bath having a receiving groove filled with a cleaning liquid therein and capable of receiving an ingot passing through the wire;
At least one or more ultrasonic generators disposed on one side of the first bath to generate ultrasonic waves for vibrating the cleaning liquid; And
And a second bath surrounding the first bath to receive the rinse solution overflowed from the first bath. The method according to claim 1,
And a drain port for discharging the cleaning liquid overflowing from the first bath to the outside of the second bath is formed at one longitudinal end of the second bath. The method according to claim 1,
Wherein the height (h1) of the first bath is less than the height (h2) of the second bath. The method according to claim 1,
Wherein the length of the pair of guide rollers wound with the wire is shorter than the length of the first bass. The method according to claim 1,
Wherein the wire and the first bath are spaced apart at a predetermined interval. The method according to claim 1,
Wherein the predetermined interval is 5 mm to 20 mm. The method according to claim 1,
Wherein the ultrasonic wave generators are formed in pairs on both sides of the first bath. 3. The method of claim 2,
And a collecting unit connected to the drain port to collect the discharged washing liquid. 9. The method of claim 8,
And a cleaning liquid supply unit located above the first bath and supplying the cleaning liquid into the receiving groove. 10. The method of claim 9,
And the cleaning liquid supply unit is connected to the collecting unit to supply the cleaning liquid from the collecting unit to the cleaning liquid supply unit.
KR1020150059946A 2015-04-28 2015-04-28 Wire saw apparatus KR20160128115A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150059946A KR20160128115A (en) 2015-04-28 2015-04-28 Wire saw apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150059946A KR20160128115A (en) 2015-04-28 2015-04-28 Wire saw apparatus

Publications (1)

Publication Number Publication Date
KR20160128115A true KR20160128115A (en) 2016-11-07

Family

ID=57529987

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150059946A KR20160128115A (en) 2015-04-28 2015-04-28 Wire saw apparatus

Country Status (1)

Country Link
KR (1) KR20160128115A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108612531A (en) * 2018-03-19 2018-10-02 深圳市海浦蒙特科技有限公司 Saw control method of restricting and system
KR20200086458A (en) * 2019-01-09 2020-07-17 에스케이실트론 주식회사 Constant temperature baths for wire sawing apparatus and wire sawing apparatus including the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108612531A (en) * 2018-03-19 2018-10-02 深圳市海浦蒙特科技有限公司 Saw control method of restricting and system
KR20200086458A (en) * 2019-01-09 2020-07-17 에스케이실트론 주식회사 Constant temperature baths for wire sawing apparatus and wire sawing apparatus including the same

Similar Documents

Publication Publication Date Title
KR100350657B1 (en) Method and device for cutting a multiplicity of disks off a hard brittle workpiece
US9073235B2 (en) Method for cutting workpiece with wire saw
US9314942B2 (en) Ingot cutting apparatus and ingot cutting method
JP6704714B2 (en) Cutting equipment
KR20120086873A (en) Apparatus and method for removing wafer from ingot
JP2004106360A (en) Slit wafer supporting component and wafer cleaning apparatus
KR20160128115A (en) Wire saw apparatus
CN207952128U (en) A kind of multi-wire cutting silicon wafer stripping ultrasonic cleaning equipment
US20130206163A1 (en) Methods and Systems For Removing Contaminants From A Wire Of A Saw
CN110773505B (en) Silicon wafer cleaning device and method
JPH04240749A (en) Dicing device
KR102435925B1 (en) As Sliced Cleaning process automation apparatus
KR20120003699A (en) Wafer cleaning appratus
KR101672706B1 (en) Wire saw apparatus
KR101967192B1 (en) Wire saw apparatus
JP2011124578A (en) Method of producing semiconductor wafer
JP2003318134A (en) Dicing device and method thereof
KR101951736B1 (en) Wire Sawing Apparatus For Cutting Single Crystal Ingot
JP4909575B2 (en) Cleaning method and cleaning equipment
JP2016101611A (en) Manufacturing method of substrate
KR20100059549A (en) Substrate supporting member, substrate processing apparatus having the same and method of processing substrate using the same
JP2011031387A (en) Crystal slicing method
KR20130074192A (en) Wire cleaning unit and wire saw apparatus including the same
KR102160169B1 (en) Ingot Clamp and Wire sawing apparatus having the same
JP2883844B2 (en) High frequency cleaning method

Legal Events

Date Code Title Description
A201 Request for examination