KR20210130410A - As Sliced Cleaning process automation apparatus - Google Patents

Abstract

The present invention provides a spray cleaning device that includes a cleaning chamber into which an ingot is put; fixing means for fixing the ingot; a spray nozzle for moving and spraying a cleaning solution toward the ingot; and a transfer rail for movably supporting the spray nozzle. The spray nozzle includes a plurality of spray holes.

Description

Spray cleaning apparatus and ASC process automation apparatus having the same

The present invention relates to a wafer manufacturing apparatus, and more particularly, to an automated ASC process automation apparatus for performing an ASC process.

A single crystal silicon ingot is generally grown and manufactured according to the Czochralski method. In this method, polycrystal silicon is melted in a crucible in a chamber, a single crystal seed crystal is immersed in the molten silicon, and then it is gradually raised to grow into a single crystal silicon ingot (hereinafter, ingot) of a desired diameter. way to do it

The manufacturing process of a single crystal silicon wafer is largely a single crystal growing process to make an ingot, a slicing process to obtain a thin disk-shaped wafer by slicing the ingot, and a slicing process An edge grinding process that processes the outer periphery to prevent cracking and distortion of the wafer obtained by It includes a lapping process, a polishing process of mirror-finishing the wafer, and a cleaning process of removing abrasives or foreign substances adhering to the polished wafer.

On the other hand, the slicing process of cutting the ingot into a wafer is made by a wire sawing apparatus (Wire Sawing apparatus).

1 is a view showing the operation of a general wire sawing device.

As shown in Figure 1, the wire sawing device 1000, the beam (B) for fixing the upper portion of the ingot (IG), and the ingot (IG) for clamping the beam (B) so as to support elevating the ingot (IG). Clamp 1100, a plurality of rollers 1200 and 1300 rotating under the ingot clamp 1100, and a wire W that rotates in a forward and reverse direction while being wound around a plurality of rollers 1200 and 1300, and a wire A slurry spray nozzle (not shown) for spraying the slurry toward (W) is provided.

The wire sawing device 1000 sprays the slurry thereon while driving the wire (W) at a high speed, and the ingot (IG) gradually descends toward the wire (W). At this time, the ingot IG is cut into a plurality of wafers by friction with the slurry attached to the wire W.

When the wire sawing process is completed, as a step before performing the above-described outer circumferential grinding process, foreign substances such as slurry, oil, and cutting powder attached to the wafers are removed, and the beam B fixed on the upper part of the wafers is removed to remove the wafer. An As Sliced Cleaning (ASC) process, which is a series of processes for peeling them, is further performed.

The ASC process is performed through an ASC process device in which various devices are combined. ASC process equipment ASC process such as kerosene cleaning (WN-420), loading, ultra clean, first rinse, second rinse, third rinse, wafer peeling, unloading, etc. Execute the necessary steps sequentially.

However, the devices of each process performing the ASC process and the connection section (progress section) between the devices are made manually because there are many parts that are not automated. This manual process not only causes quality abnormalities in the ASC process (staining on the wafer surface, uneven cleaning, damage to the wafer, etc.) depending on the skill of the operator, but also takes a lot of time and money.

In particular, the cleaning of kerosene (WN-420) in the ASC process apparatus includes a process of forcibly separating foreign substances through a spray nozzle having a point-type spraying method. At this time, as the pressure applied to the wafer through the spray nozzle varies according to the skill level of the operator, the quality of the ASC process is affected, such as non-uniform cleaning and damage to the wafer due to impact.

Therefore, the present invention automates the kerosene cleaning process and the connecting section (progress section) in the ASC process and improves the quality of the ASC process by improving the spray cleaning method, thereby improving the quality of the ASC process and reducing time and cost, and an ASC having the same It is intended to provide a process automation device.

The present invention is a cleaning chamber into which the ingot is put; fixing means for fixing the ingot; a spray nozzle for spraying a cleaning solution toward the ingot while moving; and a transfer rail for movably supporting the spray nozzle, wherein the spray nozzle provides a spray cleaning apparatus including a plurality of spray holes.

a rail unit installed above the cleaning chamber; And it may further include a transfer unit for transferring the ingot along the rail portion.

The fixing means includes a first clamp for fixing one side of the ingot; and a second clamp disposed in parallel with the first clamp and configured to fix the other side of the ingot.

The fixing means may further include a clamp transfer bar for movably supporting the second clamp so as to approach or separate the second clamp toward the first clamp.

The injection nozzle may include a first injection nozzle disposed on one side of the wafers of the ingot; It may include a second injection nozzle disposed on the other side of the wafers of the ingot.

The transfer rail may include: a first vertical rail supporting the first spray nozzle to be vertically movable; and a second vertical rail for vertically movably supporting the second spray nozzle.

a first horizontal rail for horizontally supporting the first spray nozzle; and a second horizontal rail supporting the second spray nozzle to be horizontally movable.

The first horizontal rail and the second horizontal rail may be disposed in parallel along a longitudinal direction of the ingot with the ingot interposed therebetween.

The first horizontal rail may be movably installed on the first vertical rail, and the second horizontal rail may be movably installed along the second vertical rail, respectively.

The injection nozzle may have a first length disposed along a longitudinal direction of the ingot longer than a second length disposed along a vertical direction of the ingot.

The plurality of injection holes may be arranged in a grid pattern.

On the other hand, the present invention is a cleaning chamber in which the ingot is put; fixing means for fixing the ingot; a spray nozzle for spraying a cleaning solution toward the ingot while moving; and a transport rail for movably supporting the spray nozzle from the upper region to both side regions of the ingot, wherein the injection nozzle includes a plurality of injection holes.

The transfer rail supports the injection nozzle to be vertically movable, the first and second vertical rails spaced apart from each other with the ingot interposed therebetween; An upper horizontal rail connecting upper portions of the first and second vertical rails may be included.

The injection nozzle may have a first length disposed along a longitudinal direction of the ingot longer than a second length disposed along a vertical direction of the ingot.

The plurality of injection holes disposed along the first length may be arranged to cover the length of the ingot.

On the other hand, the present invention includes a kerosene cleaning unit comprising a plurality of kerosene baths and cleaning of the wire sawing is completed ingot; And it provides an ASC process automation device including any one of the above-described type of spray cleaning device.

According to the spray cleaning device of the present invention and the ASC process automation device having the same, the quality of the ASC process can be maintained uniformly regardless of the operator by automating the kerosene cleaning process and the connecting section (progress section) and improving the spraying method, It has the effect of saving time and money.

1 is a view showing the operation of a general wire sawing device.
2 is a schematic front configuration diagram of an ASC process automation apparatus according to an embodiment of the present invention.
3 is an enlarged view of the loading unit, the kerosene cleaning unit, and the spray cleaning apparatus of FIG. 2 .
4 is a front view and operation diagram of the spray cleaning apparatus according to an embodiment of the present invention.
5 is a plan view and operation diagram of FIG. 4 .
6 is a perspective view illustrating an embodiment of the spray nozzle of FIG. 5 .
7 is a front view and operation diagram of a spray cleaning apparatus according to another embodiment of the present invention.

Hereinafter, the embodiments will be clearly revealed through the pointed drawings and the description of the embodiments. In the description of an embodiment, each layer (film), region, pattern or structure is “on” or “under” the substrate, each layer (film), region, pad or pattern. In the case of being described as being formed on, "on" and "under" include both "directly" or "indirectly" formed through another layer. do. In addition, the criteria for the upper / upper or lower / lower of each layer will be described with reference to the drawings.

In the drawings, sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not fully reflect the actual size. Also, like reference numerals denote like elements throughout the description of the drawings. Hereinafter, an embodiment will be described with reference to the accompanying drawings.

2 is a schematic front configuration diagram of an ASC process automation apparatus according to an embodiment of the present invention, and FIG. 3 is an enlarged view of the loading unit, kerosene cleaning unit, and spray cleaning apparatus of FIG. 2 .

2 and 3, the ASC process automation apparatus 1 of the embodiment includes a loading unit 10, a kerosene cleaning unit 20, a spray cleaning apparatus 30, a main cleaning unit 40, and wafer peeling. It may be configured to include the unit 50 , the unloading unit 60 , the transfer unit 100 , the rail unit 200 , and the cleaning chamber 300 .

The loading unit 10 may be composed of a mechanism or device that allows the wire sawing ingot (IG, see hereinafter, see FIG. 1) to be put into the kerosene cleaning unit 20 . The ingot IG provided through the loading unit 10 is in a state in which the slicing process (wire sawing process) is finished and cut into a plurality of wafers. A beam B (refer to FIG. 1 below) is still attached to the upper portions of the wafers by an adhesive material such as a bond. Hereinafter, the beam B and the wafers are combined to maintain the shape (cylindrical) of the ingot IG is referred to as the ingot IG, and the sliced individual part attached to the beam B and detachable is a wafer. to call

The loading unit 10 may transfer the above-described ingot (IG) from the wire sawing device unit to the kerosene cleaning unit 20 and put it in. For example, the loading unit 10 may be implemented as a loader including a shelf or a jig on which wheels run on the lower part and the ingot IG on the upper part.

The ingot IG injected into the kerosene washing unit 20 by the loading unit 10 may be subjected to a kerosene washing process by the kerosene washing unit 20 . The kerosene cleaning unit 20 may remove alkali oil contained in the slurry from the wafer surface during the wire sawing process.

As shown in Figure 3, the kerosene cleaning unit 20 may include a plurality of kerosene baths (21, 22, 23, 24) in which the ingot (IG) is sequentially immersed by the transfer unit 100 to be described later. have. For example, a plurality of kerosene baths (21, 22, 23, 24) may consist of four, each of the kerosene baths (21, 22, 23, 24) may contain different concentrations of kerosene. Of course, although it is called a kerosene bath, some of the plurality of kerosene baths (21, 22, 23, 24) may be filled with a cleaning liquid other than kerosene.

Each of the kerosene baths (21, 22, 23, 24) may be sequentially immersed in the ingot (IG) for a predetermined time. To this end, the transfer unit 100 lowers the ingot (IG) toward the kerosene bath (21, 22, 23, 24) to raise it after immersing it in kerosene or moves it to another kerosene bath (21, 22, 23, 24). It can then be raised and lowered.

Conventionally, the operator manually performed the process of immersing the ingot (IG) in the kerosene bath (21, 22, 23, 24), but the present invention is a plurality of kerosene baths (21, 22, 23, 24) can be immersed sequentially, thereby automating the kerosene bath process.

The kerosene cleaning ingot IG may be subjected to a pre-cleaning process by the spray cleaning device 30 .

The spray cleaning apparatus 30 may perform a process for actively removing kerosene and foreign substances adhered to the wafer through a static kerosene cleaning process as a step before performing the main cleaning step. The spray cleaning device 30 can thus be implemented with more forceful and dynamic spray means. This will be described later.

를 이용하여 제3 린스 과정을 수행하는 제4 배스(44)를 포함할 수 있다.The cleaning unit 40 may perform a process of cleaning the ingot IG multiple times (several times). For this purpose, the cleaning unit 40 may include a plurality of baths. For example, the cleaning unit 40 uses a first bath 41 for performing ultra clean, a second bath 42 for performing a first rinse process using DIW, and DIW. A third bath 43 for performing a second rinsing process using hot DIW (eg 80

may include a fourth bath 44 for performing a third rinsing process using

In the first to fourth baths 41 to 44 of the cleaning unit 40 described above, the ingots IG transferred by the transfer unit 100 may be sequentially immersed in the cleaning process.

The wafer peeling unit 50 may peel the ingot IG into a plurality of wafers. To this end, the wafer peeling unit 50 may remove the beam B attached to the ingot IG transferred by the transfer unit 100 .

The unloading unit 60 is installed adjacent to the wafer peeling unit 50 , and may discharge a plurality of wafers to the outside. The unloading unit 60 may be implemented as an unloader including an unloading robot that grips and moves the plurality of wafers from the wafer peeling unit 50 . For example, the unloading robot may take out a plurality of wafers from the wafer peeling unit 50 at once, or may take them out individually. In this case, a cassette such as FOUP may be used together.

The transfer unit 100 linearly and vertically transfers the ingot IG while continuously proceeding the above-described kerosene cleaning unit 20 , spray cleaning device 30 , main cleaning unit 40 , and wafer peeling unit 50 . can do it For example, the transfer unit 100 includes a clamping unit 110 for clamping the ingot IG, a linear transfer unit 120 for moving the ingot IG in the moving direction (x-axis), and It may include an elevating transfer unit 130 for vertically moving (z-axis) the ingot (IG).

The rail unit 200 is installed along the kerosene cleaning unit 20 , the spray cleaning device 30 , the main cleaning unit 40 , and the wafer peeling unit 50 , and the transfer unit 100 may be mounted thereon. For example, the rail unit 200 may be installed long to connect all of the ASC process automation devices along the longitudinal direction (x-axis direction). The rail unit 200 may be implemented as one rail, a plurality of rails, or the like. Accordingly, the transfer unit 100 may continuously move the ASC process along the rail unit 200 .

On the other hand, although the aforementioned spray cleaning device 30 constitutes one part in the ASC process automation device, one spray cleaning device 30 may also be configured individually. Therefore, the spray cleaning device 30 may be referred to as the spray cleaning device 30 .

Since the spray cleaning apparatus 30 has a method of directly spraying a cleaning solution onto the wafer, unlike a static cleaning method immersed in a bath-type cleaning tank, it may be called a dynamic cleaning apparatus, a forced cleaning apparatus, an active cleaning apparatus, and the like.

Hereinafter, the spray cleaning apparatus 30 of the embodiment will be described in detail.

4 is a front configuration diagram and an operation diagram of a spray cleaning apparatus according to an embodiment of the present invention, and FIG. 5 is a plan configuration diagram and operation diagram of FIG. 4 .

4 and 5 , the spray cleaning apparatus 30 may include a cleaning chamber 300 , spray nozzles 310 and 350 , a transfer rail 320 , and a fixing means 330 .

The cleaning chamber 300 forms a space in which the ingot IG is introduced and a cleaning process for the ingot IG is performed. Since the cleaning liquid is sprayed inside the cleaning chamber 300 and foreign substances are separated from the wafer, it needs to be blocked from the outside. The cleaning chamber 300 may be configured in such a way that the inflow of contaminants from the outside is prevented and the cleaning liquid, foreign substances, gas, and the like are discharged. For example, an exhaust port through which the cleaning liquid and foreign substances after cleaning can be discharged is formed in the lower portion of the cleaning chamber 300 , and an exhaust port through which moisture, gas, etc. can be discharged can be formed in the upper portion of the cleaning chamber 300 . .

The rail unit 200 may be installed in the upper portion of the cleaning chamber 300 so that the ingot IG is transported, and the cleaned ingot IG is discharged to the next process. For example, the rail unit 200 may be disposed inside the upper portion of the cleaning chamber 300 to connect the kerosene cleaning unit 20 and the main cleaning unit 40 . The above-described transfer unit 100 may transfer the ingot IG while being movably installed along the rail unit 200 .

The spray nozzles 310 and 350 , the transfer rail 320 , and the fixing means 330 may be installed inside the cleaning chamber 300 .

The spray nozzles 310 and 350 may directly spray the cleaning liquid of an appropriate pressure toward the ingot IG while moving. Here, as the cleaning liquid, DIW, kerosene (WN-420), etc. may be used.

For example, the injection nozzles 310 and 350 include a first injection nozzle 310 disposed on one side of the wafers of the ingot IG, and a second injection nozzle 350 disposed on the other side of the wafers of the ingot IG. ) may be included. That is, the first injection nozzle 310 and the second injection nozzle 350 may be respectively disposed on the left and right sides of the ingot IG in the longitudinal direction.

The transfer rail 320 moves the above-mentioned first spray nozzle 310 and the second spray nozzle 350 vertically and horizontally, respectively, while spraying nozzles 310 and 350 so that the cleaning liquid is sprayed on various areas of the ingot IG. can move them

For example, the transfer rail 320 includes a first vertical rail 321 for vertically movably supporting the first injection nozzle 310 and a second vertical rail for vertically movably supporting the second injection nozzle 350 . (323). As shown in FIG. 4 , the first vertical rail 321 and the second vertical rail 323 may be disposed parallel to the z-axis direction. Accordingly, the first spray nozzle 310 and the second spray nozzle 350 may perform cleaning on the ingot IG while moving along the z-axis.

In addition, the transport rail 320 includes a first horizontal rail 340 for horizontally supporting the first spray nozzle 310 and a second horizontal rail for horizontally supporting the second spray nozzle 350 ( 360) may be included.

As shown in FIG. 5 , the first horizontal rail 340 and the second horizontal rail 360 are disposed in parallel along the longitudinal direction of the ingot IG with the ingot IG interposed therebetween. That is, the first horizontal rail 340 and the second horizontal rail 360 may be disposed parallel to the y-axis direction. Therefore, the first injection nozzle 310 and the second injection nozzle 350 may perform cleaning along the longitudinal direction of the ingot IG while moving along the y-axis.

In addition, the first horizontal rail 340 may be movably installed on the first vertical rail 321 , and the second horizontal rail 360 may be movably installed along the second vertical rail 323 , respectively.

The fixing means 330 may stably hold the ingot IG transported into the cleaning chamber 300 by the transfer unit 100 . That is, the fixing means 330 may take over the ingot IG from the transfer unit 100 and stably fix and support the ingot IG during the cleaning process.

For example, the fixing means 330 may include a first clamp 331 and a second clamp 332 movably installed toward the first clamp 331 .

The first clamp 331 may fix and support one side of the ingot IG. For example, the first clamp 331 may be mounted on the beam B attached to the upper portion of the ingot IG. Of course, the first clamp 331 may be mounted only on one side of the ingot IG (one side of the wafer exposed at the edge) or may be mounted on both the beam B and one side of the ingot IG.

The second clamp 332 may be disposed in parallel with the first clamp 331 and fix the other side of the ingot IG. Similarly, the second clamp 332 may be mounted only on the other side of the ingot IG (one side of the wafer exposed at the edge) or may be mounted on both the beam B and the other side of the ingot IG.

The fixing means 330 described above may further include a clamp transfer bar 333 for movably supporting the second clamp 332 to approach or separate the second clamp 332 toward the first clamp 331 . can That is, the clamp transfer bar 333 may move in the y-axis direction.

Accordingly, as shown in FIG. 5 , the ingot IG transported by the transfer unit 100 (see FIG. 3 ) may be placed so that one side is in contact with the first clamp 331 , and spaced apart from the first clamp 331 . The second clamps 332 arranged side by side in a state where they are in contact with the other side of the ingot IG may be moved by the clamp transfer bar 333 . After the cleaning is completed, the second clamp 332 is moved away from the first clamp 331 by the clamp transfer bar 333 , and the ingot IG is separated and the transfer unit 100 moves to the next process (eg For example, you can move to this cleaning unit).

In the above embodiment, the fixing means 330 fixed the ingot IG during the cleaning process, but during the cleaning process, the ingot IG may be rotated or configured to move toward the spray nozzles 310 and 350 . .

Conventionally, the pre-cleaning process was manually performed by an operator, but the ASC process automation apparatus of the present invention sprays the cleaning solution uniformly and stably by the spray nozzles 310 and 350 for the ingot (IG) transported inside the cleaning chamber 300 . pre-cleaning process can be automated.

Meanwhile, as described above, the spray nozzles 310 and 350 may spray the cleaning liquid at a constant pressure toward one side of the ingot IG fixed to the fixing means 330 .

6 is a perspective view illustrating an embodiment of the spray nozzle of FIG. 5 .

As shown in FIG. 6 , the spray nozzle 310 may include a spray pipe 311 and a spray head 312 connected to the spray pipe 311 .

The cleaning liquid supplied from the injection pipe 311 may be injected through the injection head 312 . To this end, a plurality of injection holes 312b may be formed on the injection surface 312a of the injection head 312 .

The injection nozzles 310 and 350 of the embodiment including a plurality of injection holes 312b improve the conventional point injection method by one injection hole 312b to have a line injection or surface injection form, so that the injection amount of the cleaning liquid is increased. and increase the contact area.

In addition, the plurality of injection holes 312b may be disposed on one surface 312a of the injection nozzle in the form of a grid pattern. When the injection holes 312b are arranged in a grid pattern as described above, the cleaning liquid can be more uniformly distributed and sprayed, so that the cleaning of the ingot IG can be uniformly performed.

In addition, the injection nozzle 310 may have a first length L1 disposed in a longitudinal direction of the ingot IG longer than a second length L2 disposed in a vertical direction of the ingot IG. That is, the length of the spray nozzle 310 in the y-axis direction may be greater than the length in the z-axis direction. As such, when the length of the y-axis direction of the injection nozzle 310 is increased, cleaning performance in the longitudinal direction of the ingot IG may be increased.

Here, the injection holes 312b disposed along the first length L1 may be disposed to cover the length of the ingot IG. As such, when the injection holes 312b of the injection nozzle 310 are sufficiently arranged to cover the length of the ingot IG, the injection nozzle 310 is cleaned in place without moving in the longitudinal direction (y-axis) of the ingot IG. may be able to perform

The first spray nozzle 310 and the second spray nozzle 350 may be implemented in the same shape.

7 is a front view and operation diagram of a spray cleaning apparatus according to another embodiment of the present invention. In this embodiment, in order to avoid overlapping description, parts different from those of the above-described embodiment will be mainly described.

As shown in FIG. 7 , in the spray cleaning apparatus 30a of the present embodiment, the spray nozzles 310a may be formed of one instead of a plurality. Here, the injection nozzle 310a may move from an upper region (x-axis direction) of the ingot IG to both side regions (z-axis direction). To this end, the transfer rail 320 providing the movement direction of the injection nozzle 310a may be disposed on both sides of the upper region of the ingot IG. For example, the transfer rail 320a may include a first vertical rail 321 , a second vertical rail 323 , and an upper horizontal rail 322 .

The first vertical rail 321 and the second vertical rail 323 support the spray nozzle 310a to be vertically movable, and are spaced apart so as to be parallel to the z-axis direction with the ingot IG interposed therebetween. The upper horizontal rail 322 connects the upper portions of the first vertical rail 321 and the second vertical rail 323 and is disposed in the x-axis direction. That is, the first vertical rail 321, the upper horizontal rail 322, the second vertical rail 323 are connected to each other, and the spray nozzle 310a is the first vertical rail 321 and the upper horizontal rail 322, It can move along the second vertical rail 323 .

Accordingly, the spray nozzle 310a may spray the cleaning liquid toward the ingot IG while moving from the upper area to both side areas of the ingot IG.

According to the spray cleaning device of the present invention and the ASC process automation device having the same, the quality of the ASC process can be maintained uniformly regardless of the operator by automating the kerosene cleaning process and the connecting section (progress section) and improving the spray cleaning method and can save time and money.

As described above, according to the ASC process automation apparatus of the present invention, each process performed in the ASC process and a connection section (progress section) between the processes are connected by the rail unit 200 and the transfer unit, and each process is automated and Since it can be performed continuously, it has the effect of improving the quality of the ASC process and reducing time and cost.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by a person skilled in the art to which the embodiments belong. Accordingly, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

1: ASC process automation device 10: loading part
11: Loader 20: Kerosene cleaning unit
21, 22, 23, 24: kerosene bath 30, 30a: spray cleaning device
40: main cleaning part 50: wafer peeling part
60: unloading unit 100: transfer unit
200: rail unit 300: cleaning chamber
310, 310a: first injection nozzle 320: transport rail
321: first vertical rail 322: upper horizontal rail
323: second vertical rail 330: fixing means
331: first clamp 332: second clamp
333: clamp transfer bar 340: first horizontal rail
350: second spray nozzle 360: second horizontal rail
500: wafer peeling unit 600: unloader (Unloader)

Claims (16)

a cleaning chamber into which the ingot is put;
fixing means for fixing the ingot;
a spray nozzle for spraying a cleaning solution toward the ingot while moving;
Containing; a transfer rail for movably supporting the injection nozzle;
The spray nozzle is a spray cleaning device including a plurality of spray holes. According to claim 1,
a rail unit installed above the cleaning chamber; and
Spray cleaning apparatus further comprising a transfer unit for transferring the ingot along the rail portion. According to claim 1,
The fixing means
a first clamp for fixing one side of the ingot; and
and a second clamp disposed in parallel with the first clamp and configured to fix the other side of the ingot. 4. The method of claim 3,
The fixing means further includes a clamp transfer bar for movably supporting the second clamp so as to approach or separate the second clamp toward the first clamp. 5. The method of claim 4,
The spray nozzle is
a first injection nozzle disposed on one side of the wafers of the ingot;
A spray cleaning apparatus including a second spray nozzle disposed on the other side of the wafers of the ingot. 6. The method of claim 5,
The transport rail is
a first vertical rail supporting the first spray nozzle to be vertically movable; and
and a second vertical rail supporting the second spray nozzle to be vertically movable. 7. The method of claim 6,
a first horizontal rail for horizontally supporting the first spray nozzle; and
and a second horizontal rail for horizontally supporting the second spray nozzle. 8. The method of claim 7,
The first horizontal rail and the second horizontal rail are disposed in parallel along the longitudinal direction of the ingot, with the ingot interposed therebetween. 9. The method of claim 8,
The first horizontal rail is movably installed on the first vertical rail,
The second horizontal rail is a spray cleaning device that is installed to be movable along the second vertical rail, respectively. 10. The method according to any one of claims 1 to 9,
The jet nozzle is a jet cleaning apparatus in which a first length disposed along a longitudinal direction of the ingot is longer than a second length disposed along a vertical direction of the ingot. 11. The method according to any one of claims 10 to
The plurality of injection holes are disposed in a lattice pattern. a cleaning chamber into which the ingot is put;
fixing means for fixing the ingot;
a spray nozzle for spraying a cleaning solution toward the ingot while moving;
Containing; and a transfer rail for movably supporting the injection nozzle from the upper region to both side regions of the ingot.
The spray nozzle is a spray cleaning device including a plurality of spray holes. 13. The method of claim 12,
The transport rail is
first and second vertical rails that vertically support the injection nozzle and are spaced apart from each other with the ingot interposed therebetween;
A spray cleaning apparatus including an upper horizontal rail connecting upper portions of the first and second vertical rails. 14. The method of claim 13,
The jet nozzle is a jet cleaning apparatus in which a first length disposed along a longitudinal direction of the ingot is longer than a second length disposed along a vertical direction of the ingot. 15. The method of claim 14,
The plurality of injection holes disposed along the first length are spray cleaning apparatus arranged to cover the length of the ingot. A kerosene cleaning unit including a plurality of kerosene baths and cleaning the wire sawing ingot is completed; and
16. ASC process automation apparatus comprising the spray cleaning apparatus of any one of claims 1 to 9, 12 to 15.

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