KR100936191B1 - Ingot cleaning apparatus and ingot cleaning method - Google Patents

Abstract

The present invention provides an ingot cleaning apparatus for cleaning an ingot, comprising: a loading portion for storing an ingot, a cleaning portion provided adjacent to the loading portion, and provided with at least one cleaning tank, and an unloading portion provided adjacent to the cleaning portion. And a transfer robot provided from an upper portion of the loading portion to an upper portion of the unloading portion to transfer an ingot.

The invention as described above has the effect of efficiently separating the carbon beam attached to the silicon ingot, and simultaneously perform the cleaning of the silicon ingot and the separation of the carbon beam, there is an effect that can shorten the work efficiency and processing time. .

Ingot, Carbon Beam, Block Coring, Wire Sawing, Cleaning Tank

Description

Ingot cleaning device and ingot cleaning method {INGOT CLEANING APPARATUS AND INGOT CLEANING METHOD}

The present invention relates to an ingot cleaning device, and more particularly, to an ingot cleaning device and an ingot cleaning method for cleaning a large silicon ingot.

In general, a semiconductor device forms a semiconducting thin film, a conductive thin film, or an insulating thin film on a substrate (that is, a silicon wafer), and fabricates a portion of the semiconductor device by etching. In recent years, plasma efficiency has been increased in forming and etching processes of thin films to increase process efficiency. For example, the etching process supplies a reactive gas to the plasma etching chamber and applies a high frequency power to the chamber to bring the reactive gas into an excited plasma state. By removing the thin film by the physical collision of the reaction gas by plasma-forming the reaction gas it is possible to improve the removal performance of the thin film.

Here, the plasma etching chamber is provided with a wafer, an electrode and a ring, and the wafer, the electrode and the ring are generally manufactured using silicon.

As described above, in the method of manufacturing a silicon wafer and a silicon electrode made of silicon, a cropping process is performed in which a silicon ingot is grown and an unnecessary portion of the ingot is cut to form a cylindrical ingot. Thereafter, a wire sawing process is performed to bond the carbon beam to one side of the cylindrical ingot and to cut according to the thickness of the wafer to be used, and to remove and clean the carbon beam bonded to one side of the ingot. The disc cut according to the thickness of the wafer is made into a silicon wafer and a silicon electrode through a subsequent process.

In addition, the method of manufacturing a silicon ring made of silicon removes the center of the cylindrical ingot after the cropping process to form a through hole to form a silicon cylinder from which the center is removed. Thereafter, a wire sawing process is performed to bond the carbon beam to one side of the silicon cylinder and to cut according to the thickness of the silicon ring to be used, and to remove and clean the carbon beam bonded to one side of the ingot. The disc, with its core cut off according to the thickness of the silicone ring, is made into the silicone ring through a subsequent process.

Here, the cleaning process is performed to remove various foreign matters generated during the cutting of the silicon ingot, for example, slurry, silicon fine particles and oils, which are abrasives.

However, since the cleaning process is performed manually, foreign matter may be resorbed by an operator who performs the cleaning process, and thus the cleaning effect is halved. As a result, foreign matter attached to the silicon ingot in the subsequent process may cause wear and tear of the wheel. Problems such as deep scratches occur.

In addition, after the cleaning is completed, a carbon beam separation process for separating the carbon beam attached to one side of the silicon ingot from the silicon ingot is performed in a high temperature liquid bath, which is performed by a worker's manual work. That is, the operator immerses a large silicon ingot with a carbon beam in a high temperature liquid tank to perform a carbon beam separation process, and the separation process is performed at a high temperature, and a high temperature liquid tank is about 40 degrees to take out the separated silicon ingot. Wait until it is below, then remove the silicon ingot.

However, since the carbon beam separation process is performed by the worker in a high temperature environment, the worker is exposed to a considerable risk, and the silicon ingot from which the carbon beam is separated may be resorbed by the operator. Therefore, after the carbon beam is separated from the silicon ingot, it is necessary to perform cleaning again, which causes a problem of lowering the production efficiency.

In particular, in recent years, since a large diameter 300 mm silicon ingot is used, it is more difficult to manually process the cleaning and carbon beam separation process of the large silicon ingot.

In order to solve the above problems, the present invention provides an ingot cleaning apparatus and an ingot cleaning method for cleaning a large silicon ingot.

The present invention also provides an ingot cleaning apparatus and an ingot cleaning method for efficiently separating a carbon beam attached to a silicon ingot.

The present invention also provides an ingot cleaning apparatus and an ingot cleaning method which can collectively perform wire-sawing large-scale silicon ingot cleaning and carbon beam separation.

The present invention provides an ingot cleaning apparatus for cleaning an ingot, comprising: a loading portion for storing an ingot, a cleaning portion provided adjacent to the loading portion, and provided with at least one cleaning tank, and an unloading portion provided adjacent to the cleaning portion. And, it provides on the ingot cleaning device comprising a transfer robot for transporting the ingot is provided on top of the loading unit to the unloading unit.

The ingot cleaning apparatus and the ingot cleaning method of the present invention have an effect of preventing the risk factors caused by the handling by the operator in advance by fully automating the cleaning process.

In addition, the present invention has the effect of completely removing the foreign matter adhered to the surface and the back of the silicon ingot, to completely block the problems caused by the foreign matter in the subsequent process.

In addition, the present invention has the effect of efficiently separating the carbon beam attached to the silicon ingot.

In addition, the present invention by performing the cleaning of the silicon ingot and carbon beam separation at the same time, there is an effect that can reduce the work efficiency and processing time.

In order to achieve the above object, the present invention provides an ingot cleaning apparatus for cleaning an ingot, comprising: a loading portion for storing an ingot, a cleaning portion provided adjacent to the loading portion, and provided with at least one cleaning tank; And an unloading part provided adjacent to and a transfer robot provided from an upper part of the loading part to an upper part of the unloading part to transfer an ingot.

A heating member is connected to one side of the cleaning tank, and the cleaning member is maintained as a high temperature cleaning liquid by the heating member.

The transfer robot includes a body and a transfer unit for moving the body, wherein the body comprises a seating portion and a support extending in one direction from four edges of the seating portion, and the support unit is connected to the support. .

The seating part may include a first seating part having a plate shape, and a second seating part having stepped portions formed at opposite sides of the first seating part.

The upper portion of the seating portion is characterized in that the fixing portion is formed in a direction perpendicular to the second seating portion facing.

Two fixing parts are formed on an upper part of the seating part, and the two fixing parts may move relative to each other.

The ingot is characterized in that the ingot is a beam attached to one side.

One side of the unloading portion is characterized in that the scrubbing device is further provided.

The scrubbing device comprises two roll brushes facing each other, the roll brush being rotatable.

The scrubbing device further includes a container containing the cleaning liquid, wherein the roll brush is provided in the container.

One side of the scrubbing device is characterized in that the second cleaning portion and the second unloading portion is further provided.

The second cleaning unit is characterized in that it comprises a chemical cleaning tank and a rinse tank.

A second transfer robot may be further provided on the second cleaning part and the second unloading part to move to the upper part of the second cleaning part and the second unloading part.

The second transfer robot is characterized in that for moving the silicon disk from which the beam is removed.

The ingot is characterized in that the wire saw ingot.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to the fullest extent. It is provided to inform you. Like reference numerals in the drawings refer to like elements.

1 is a schematic cross-sectional view showing an ingot cleaning device according to a first embodiment of the present invention, Figure 2 is a perspective view showing the shape of a silicon ingot cleaned in the ingot cleaning device according to a first embodiment of the present invention, Figure 3 Is a perspective view showing a transfer robot of the ingot cleaning apparatus according to the first embodiment of the present invention, FIG. 4 is a front view showing the transfer robot of the ingot cleaning apparatus according to the first embodiment, and FIG. 6 is a side view showing a transfer robot of the ingot cleaning device, and FIG. 6 is a front view showing the operation of the transfer robot of the ingot cleaning device according to the first embodiment of the present invention.

Referring to FIG. 1, the ingot cleaning apparatus includes a loading part 200, a cleaning part 300, an unloading part 800, the loading part 200, and a cleaning part 300 provided adjacent to each other in one direction. And a transfer robot 400 movably installed in a transverse direction from the top of the unloading unit 800. Here, the ultrasonic unit 900 may be further provided on one side of the unloading unit 800.

The loading unit 200 is a place for storing the silicon ingot 100, the large silicon ingot 100 is pre-treated in the loading unit 200 is seated. When the large silicon ingot 100 is seated on the loading unit 200, the transfer robot 400 provided on the loading unit 100 grips and moves the silicon ingot 100 provided in the loading unit 200. To carry out the following process.

As the large silicon ingot 100, an ingot 100 for manufacturing a silicon wafer and a silicon electrode having completed the wire sawing process or an ingot 130 for manufacturing a silicon ring is used. That is, as shown in Figure 2, a portion of the silicon ingot (100, 130) is formed in the slit 110 cut in accordance with the block unit or the desired thickness, one side of the silicon ingot (100, 130) The carbon beam 120 is bonded and attached. Here, the slits 110 are formed from the silicon ingots 100 and 130 to a part of the carbon beams 120, which extend to the carbon beams 120 to completely cut the silicon ingots 100 and 130. Was cut. In this case, the silicon ingot 100, 130, in particular, the slit 110, various foreign substances generated in the block coring and wire sawing process, that is, slurry, silicon fine particles, oils, and the like remain.

The foreign matter remaining in the silicon ingots 100 and 130 is cleaned through the cleaning unit 300 described below, and at the same time or continuously, the carbon beam 120 attached to one side of the silicon ingots 100 and 130. ) Is separated from the silicon ingots 100 and 130. Here, a beam made of ceramic may be used instead of the beam formed of carbon.

Hereinafter, this embodiment will be described using a silicon wafer or a silicon electrode and a silicon ingot 100 for manufacturing a silicon ring.

Returning to FIG. 1, the washing unit 300 is provided adjacent to the loading unit 200 and includes a plurality of washing tanks for storing the washing liquid, and the washing tank includes the slurry washing tank 320 and the SOAP washing tank 330. ) And a high temperature cleaning tank 340. Here, the slurry cleaning tank 320, the SOAP cleaning tank 330 and the high temperature cleaning tank 340 is provided on one shelf 310. Of course, the cleaning unit 300 may be configured as one cleaning tank, three or more cleaning tanks may be provided to increase the cleaning efficiency.

The slurry cleaning tank 320 is formed in a box shape with an open top, is installed on one side on the shelf 310, and serves to remove foreign substances, that is, slurry generated during wire sawing during the pretreatment process. Of course, the slurry cleaning tank 320 may remove the silicon fine particles in addition to the slurry.

The slurry cleaning tank 320 may be formed of stainless steel in which rust is not generated by the cleaning liquid. More preferably, the slurry cleaning tank 320 may be electrically polished. Of course, the material of the slurry cleaning tank 320 is not limited thereto, and any material may be used as long as the material does not generate rust by the cleaning liquid. In addition, a washing liquid supply unit (not shown) for supplying a washing liquid may be connected to the slurry washing tank 320, and time or ultrapure water (DI WATER) may be used as the washing liquid of the slurry washing tank 320. Of course, a cleaning solution to which chemicals are added may be used as the cleaning solution.

Here, in order to further improve the cleaning power of the silicon ingot 100, the ultrasonic generator 322 may be further provided on the inner bottom surface or the inner wall surface of the slurry cleaning tank 320. Of course, the ultrasonic generator 322 may be It may be provided on the outer bottom surface or the outer side surface of the slurry cleaning tank 320. In this embodiment, 28KHZ and 1800W are applied to generate ultrasonic waves. In addition, a cover (not shown) may be further provided on the slurry cleaning tank 320 so that the contaminated cleaning liquid does not leak to the outside during the cleaning in the slurry cleaning tank 320.

In the above, the slurry cleaning tank 320 is formed as a single cleaning tank, but may be formed as a double cleaning tank including an inner tank and an outer tank formed along the outer circumferential surface of the inner tank, whereby the cleaning liquid overflows the silicon ingot 100. Of course, the cleaning power can be further improved.

The SOAP cleaning tank 330 is installed adjacent to the slurry cleaning tank 320 on the shelf 310, and serves to remove foreign substances, that is, oils generated during wire sawing. The SOAP cleaning tank 330 may be formed in a box shape in which an upper portion of a stainless steel material is opened, and an ultrasonic generator 332 may be further installed inside the SOAP cleaning tank 330, and the SOAP cleaning tank 330 may be provided. The upper portion of the cover (not shown) may be further provided so that the contaminated cleaning liquid does not overflow to the outside. In addition, a cleaning solution supply unit (not shown) for supplying a cleaning solution may be connected to the SOAP cleaning bath 330, and a SOAP material is used as the cleaning solution of the SOAP cleaning bath 330.

In order to increase the cleaning power of the silicon ingot 100, one side wall of the SOAP cleaning tank 330 is provided with a heating member 334 for heating the cleaning liquid to increase the temperature, and a heater is used as the heating member 334. Can be. That is, the cleaning liquid heated to a high temperature by the heating member 334 can more effectively clean organic substances such as oil deposited on the silicon ingot 100. Of course, without providing the heating member 334 in the SOAP cleaning tank 330, it is also possible to supply the cleaning liquid heated to a high temperature to perform the cleaning.

Although the foreign matters of oils are removed from the SOAP cleaning tank 330, the foreign matters generated during the slurry cleaning, that is, the slurry and the silicon fine particles remain in the silicon ingot 100, the slurry and the silicon remaining in the silicon ingot 100 Of course, the fine particles can be removed.

The high temperature cleaning tank 340 is installed adjacent to the SOAP cleaning tank 330 on the shelf 310 and separates the carbon beam 120 attached to the silicon ingot 100 and remains in the silicon ingot 100 at the same time. Residual foreign matter, especially the SOAP material.

The high temperature cleaning tank 340 is formed in a box shape in which an upper portion of a stainless steel material is opened, and ultrapure water having a high temperature, that is, a predetermined temperature, is used as the cleaning liquid of the high temperature cleaning tank 340. One side of the high temperature cleaning tank 340 is provided with a heating member 342 for heating the cleaning liquid, for this purpose, the cleaning liquid may maintain a predetermined temperature of a high temperature. The cleaning liquid is preferably heated to a predetermined temperature of 70 degrees or more, and more preferably heated to a predetermined temperature of 90 degrees or more. Here, the predetermined temperature is the most efficient temperature for melting the bonder used when attaching the carbon beam 120 to the silicon ingot 100.

In the above, although the cleaning liquid was heated using the heating member 342 to maintain the predetermined temperature, the heating member 342 was provided outside the high temperature cleaning tank 340, and the cleaning liquid heated by the heating member 342 from the outside. That is, of course, the cleaning liquid having a predetermined temperature of 70 degrees or more, preferably 90 degrees or more can be supplied into the high temperature cleaning tank 340.

The unloading part 800 is provided on one side of the cleaning part 300, and serves to unload the silicon ingot 100 that has been cleaned. Inside the unloading part 800, a heating means 810 such as a heater for heating the inside of the unloading part 800 is provided, and the heating means 810 causes the inside of the unloading part 800 to have a predetermined temperature. Keep it at That is, the unloading part 800 maintaining a predetermined temperature serves to prevent the carbon beam separated from the silicon ingot 100 from being reattached. Here, a spray gun for drying the cleaned silicon ingot may be installed inside the unloading part 800, and the spray gun may dry the cleaning liquid remaining in the silicon ingot 100.

An ultrasonic part 900 may be further provided at one side of the unloading part 800, and the ultrasonic part 900 serves to clean the cut silicon disc from which the carbon beam is removed from the silicon ingot 100. . Here, the ultrasonic unit 900 may store a single sheet or a plurality of silicon discs of the cut silicon disc, whereby one or a plurality of silicon discs are sonicated.

The transfer robot 400 is provided above the loading unit 200, the cleaning unit 300, and the unloading unit 800, and transfers the silicon ingot 100 to the loading unit 200 to the unloading unit 800. It serves to move.

3 to 5, the transfer robot 400 includes a body 410 and a transfer unit 420 connected to an upper portion of the body 410 to move the body 410.

The body 410 is formed of a rectangular boat-type seating portion 412 for seating the silicon ingot 100 to which the carbon beam 120 is attached to one side, and extending upward from four corners of the seating portion 412. Of the first to fourth supports 414a to 414d, the first connecting rods 416a connecting the upper portions of the first and second supports 414a and 414b, and the third and fourth supports 414c and 414d. The second connecting rod 416b connecting the upper portion and the third connecting rod 416c connecting the first and second connecting rods 416a and 416b.

The center of the boat-type seating portion 412 has a rectangular shape corresponding to the lower surface of the carbon beam 120 so that the lower portion of the carbon beam 120 attached to the silicon ingot 100 can be mounted in a horizontal state. A first seating portion 412a that is a groove is formed, and second seating portions 412b having a plurality of stepped portions are formed on opposite sides of the first seating portion 412a. Here, the second mounting portion 412b serves to seat both sides of the silicon ingot 100.

In addition, the upper portion of the seating portion 412 is a circular opposite surface of the silicon ingot 100 seated on the first seating portion 412a, that is, a surface parallel to the slit 110 formed in the silicon ingot 100. Fixing portion 418 is provided to be formed across the first and second seating portion (412a, 412b) for fixing the, the fixing portion 418 is movable to fix according to the thickness of the silicon ingot 100 Is installed. That is, the fixing part 418 moves in a direction facing away or away from each other to fix the opposite surface of the silicon ingot 100, and moves relative to each other.

The transfer unit 420 is connected to the upper portion of the body 410, that is, the third connecting rod 416c of the body 410, and is installed to be movable in the horizontal direction and the vertical direction. That is, the transfer unit 420 moves in the lateral direction to move the body 410 on which the silicon ingot 100 is seated to the cleaning unit 300, that is, the upper portion of each of the cleaning tanks 320, 330, and 340. Subsequently, the body 410 on which the silicon ingot 100 is seated is introduced into each of the cleaning tanks 320, 330, and 340, and as shown in FIG. 6, the silicon ingot 100 is vertically disposed in the cleaning liquid. Shake to up / down. Therefore, the transfer robot 400 may shake the silicon ingot 100 up and down inside the cleaning liquid to more effectively remove foreign substances remaining on the surface of the silicon ingot 100.

Although the transfer unit 420 transfers the silicon ingot 100 to which the carbon beam 120 is attached, the transfer unit 420 may transfer the silicon ingot 100 to which the carbon beam 120 is not attached to perform cleaning. That is, the silicon ingot 100 to which the carbon beam 120 is not attached before the wire sawing process is fixed by the second seating portion 412b and the fixing portion 418 of the transfer unit 420, and is cleaned while transferring it. Can be done. Here, the silicon ingot to which the carbon beam 120 is not attached may be a silicon ingot after the cropping is performed or a silicon ingot from which the center is removed after the block coring is performed.

Hereinafter, the process of removing the foreign matter present on the surface of the silicon ingot 100 and separating the carbon beam 120 from the silicon ingot 100 using the cleaning apparatus according to the first embodiment of the present invention.

First, the silicon ingot 100 that has completed the wire sawing process removes foreign substances generated during wire sawing, that is, silicon fine particles, slurry, and oils, and separates the carbon beam 120 attached to one side of the silicon ingot 100. It is drawn into the loading part 200 of the cleaning apparatus according to the first embodiment of the present invention. Here, the transfer robot 400 is disposed in the loading unit 200, the silicon ingot 100 on the seating portion 412, that is, the first seating portion (412a) formed on the body 410 of the transfer robot 400. The carbon beam 120 attached to one side of the) is seated.

Thereafter, the fixing part 418 provided at the upper portion of the seating part 412 moves toward an opposite surface of the silicon ingot 100, that is, a surface parallel to the surface on which the slit is formed, to fix the silicon ingot 100.

As described above, the silicon ingot 100 seated and fixed to the transfer robot 400 moves to an upper portion of the cleaning unit 300 by the transfer robot 400, and is lowered into the cleaning liquid contained in the slurry cleaning tank 320. Silicon fine particles and slurry are removed. In this case, the transfer robot 400 repeatedly moves the silicon ingot 100 up and down in the cleaning liquid made of water or ultrapure water to perform cleaning. In addition, the 28Khz, 1800W is applied to the ultrasonic generator 322 provided in the slurry cleaning tank 320 to generate ultrasonic waves in the slurry cleaning tank 320 to maximize the cleaning effect of the silicon ingot 100.

After the slurry cleaning as described above, the silicon ingot 100 is moved to the upper part of the SOAP cleaning tank 330 by the transfer robot 400, and foreign substances such as oil present on the surface of the silicon ingot 100 by the method described above. Perform the process to remove it. Here, the washing liquid may be repeatedly washed in the SOAP washing tank 330 to increase the cleaning power of the foreign matters of the oils, and the cleaning liquid may be heated to a predetermined temperature in order to further increase the cleaning power of the oils of the foreign matters. Here, the predetermined temperature may maintain a temperature of 70 degrees or more, preferably 90 degrees or more.

Subsequently, the silicon ingot 100 from which foreign substances have been removed is moved to the high temperature cleaning tank 340 by the transfer robot 400 to immerse the silicon ingot 100. Here, the cleaning liquid of the high temperature cleaning tank 340 is provided with a cleaning liquid heated to 70 degrees or more, preferably 90 degrees or more by the heating member 342, the silicon ingot 100 and the silicon by the high temperature cleaning liquid The bond between the carbon beams 120 attached to one side of the ingot 100 is melted to separate the carbon beams 120 from the silicon ingots 100. In addition, the high temperature cleaning tank 340 separates the carbon beam 120 and can more reliably clean foreign substances remaining on the surface of the silicon ingot 100.

After cleaning the foreign matter attached to the silicon ingot 100 as described above and the carbon beam 120 is separated from the silicon ingot 100, the silicon ingot 100 is a predetermined temperature by the transfer robot 400 Moved to the unloading unit 800 to maintain and finishes the cleaning and separating the carbon beam 120 from the silicon ingot 100.

Although the carbon beam 120 is separated from the silicon ingot 100 in the high temperature cleaning tank 340, the process of separating the carbon beam 120 from the SOAP cleaning tank 330 may be performed. A heating member (not shown) is connected to one side of the 320, and the cleaning liquid in the slurry cleaning tank 320 is heated to 70 degrees, preferably 90 degrees or more to separate the carbon beam 120 from the silicon ingot 100. Of course, the process can be carried out.

In the above, the silicon ingot 100 to which the carbon beam 120 is attached is subjected to the cleaning process and the carbon beam 120 separation process in the slurry cleaning tank 320, the SOAP cleaning tank 330, and the high temperature cleaning tank 340. In addition, a scrubbing device 500 may be further added to clean the silicon disc cut by separating the carbon beam 120 from the cleaning parts 320, 330, and 340.

7 is a schematic cross-sectional view showing a cleaning device according to a second embodiment of the present invention, Figure 8 is a perspective view showing the shape of the silicon ingot used in the cleaning device according to a second embodiment of the present invention, Figure 9 It is a schematic sectional drawing which shows the washing | cleaning operation of the washing | cleaning apparatus which concerns on 2nd Embodiment of this invention.

As shown in FIG. 7, the cleaning apparatus according to the second embodiment of the present invention includes a loading part 200, a cleaning part 300, an unloading part 800, an ultrasonic part 900, and a scrubbing cleaning part 500. ) Is provided in one direction, and the transfer robot 400 is provided on the loading part 200, the cleaning part 300, and the unloading part 800. Here, since the loading unit 200, the cleaning unit 300, the unloading unit 800, the ultrasonic unit 900 and the transfer robot 400 has been described above, a description thereof will be omitted below.

As illustrated in FIG. 8, the cut silicon disc used in the scrubbing cleaning unit 500 may include a silicon disc 100a for manufacturing a silicon wafer and a silicon electrode cut according to a desired thickness by removing a carbon beam on one side. Or a cut silicon ring 130a is used to make a silicon ring. Hereinafter, the description will be made by applying a silicon disc 100a for manufacturing a silicon wafer and a silicon electrode.

Returning to FIG. 7, the scrubbing cleaning unit 500 is disposed so that two stainless steel scrubbing containers 510 are adjacent to each other, and in the scrubbing container 510, two rotatable roll brushes 520 or disks are provided. A brush (not shown) is provided. That is, when one sheet of the silicon original plate 100a cut and separated from the high temperature cleaning unit 340 is inserted into the scrubbing container 510 by an operator, as shown in FIG. The two roll brushes 520 are moved to be disposed on both sides of the silicon disc 100a to rotate on both sides of the silicon disc 100a to remove impurities from the surface of the silicon disc 100a. Here, the scrubbing cleaning unit 500 may be provided with two or more scrubbing containers 510 to increase the productivity, each of the silicon disc (100a) can be performed at the same time scrubbing process. In addition, the scrubbing cleaning unit 500 may be further provided with a cleaning liquid jetting unit (not shown) to spray cleaning agent such as ultrapure water or SOAP in order to increase the cleaning power of the silicon disc 100a. In addition, ultra-pure water may be supplied to the scrubbing container 510 to perform a wet scrubbing process so that the silicon disc 100a is cleaned in ultrapure water.

The cleaning apparatus according to the second embodiment as described above has the effect of simultaneously cleaning the silicon ingot 100 to which the carbon beam 120 is attached and the silicon disc 100a separated from the carbon beam 120.

In the above, although the silicon disc 100a from which the carbon beam 120 is separated is cleaned by the scrubbing cleaner 500, the second cleaner 600 is further cleaned in order to further maximize the cleaning effect of the silicon disc 100a. You can add more.

10 is a schematic cross-sectional view showing a cleaning apparatus according to a third embodiment of the present invention.

Referring to the drawings, the cleaning apparatus according to the third embodiment of the present invention, the loading unit 200, the first cleaning unit 300, the unloading unit 800, the scrubbing cleaning unit 500, the second cleaning unit ( 600 and the second unloading part 700 are provided in one direction, and the transfer robot 400 (hereinafter, the first in the lower part of the loading part 200, the first cleaning part 300, and the unloading part 800) is provided. A transfer robot 430 is provided, and a second transfer robot 430 is provided on the second cleaning unit 600 and the second unloading unit 700. Here, since the loading unit 200, the first cleaning unit 300, the scrubbing cleaning unit 500, the unloading unit 800, and the first transfer robot 400 have been described above, a description thereof will be omitted below. do.

The second cleaning unit 600 includes a chemical cleaning tank 610 and a rinse tank 620. Here, the chemical cleaning tank 610 and the rinsing tank 620 may be provided in plural, and the plurality of chemical cleaning tanks 610 and the rinsing tank 620 may be arranged crosswise. Here, in the second cleaning unit 600, the silicon disc 100a, which has passed through the scrubbing cleaning unit 500, or the silicon ring 130a in which the center is cut, may be used. Hereinafter, the silicon disc 100a may be used. Explain as.

As the cleaning solution of the chemical cleaning tank 610, a mixed cleaning solution (SC1) in which ammonia-hydrogen peroxide-water is mixed may be used. In addition, sulfuric acid-hydrogen peroxide-water (SPM) and hydrochloric acid-hydrogen peroxide-water (SC2) may be used. have. In addition, the chemical cleaning tank 610 is preferably formed of a Teflon material in order to protect from such chemicals. Here, the ultrasonic generator 612 may be provided in the chemical cleaning tank 610 to increase the cleaning power of the silicon disc 100a.

The rinse bath 620 is provided adjacent to the chemical cleaning tank 610, and serves to remove foreign substances such as particles and heavy metal contaminants remaining on the silicon disc 100a after chemical cleaning. Here, it is preferable that ultrapure water is used as the cleaning liquid of the rinse bath 620, and the ultrasonic generator 622 may be provided to increase the cleaning power of the silicon disc 100a.

The second unloading part 700 is provided at one side of the rinse bath 622 and serves to store the silicon original plate 100a which has been cleaned. Here, a dryer (not shown) may be further installed in the second cleaning unit 600 to perform drying of the cleaned silicon disc 100a.

The second transfer robot 430 is installed to move the upper part of the second cleaning part 600 and the second unloading part 700 and is movable in the horizontal direction and the vertical direction. That is, the second transfer robot 430 includes a seating portion 434 on which the silicon disc 100a is seated, and a transfer portion 432 for transferring the seating portion 434. In the lower portion of the seating portion 434, a seating slit 436 for seating the silicon disc 100a is formed, and a transfer part 432 for transferring the seating part 434 in which the silicon disc 100a is seated is the seating part. Connected to the top of 434.

When the silicon disc 100a finishes scrubbing, the second transfer robot 430 mounts the silicon disc 100a that has been scrubbed and immersed in the chemical cleaning unit 610 and the rinse bath 620 to perform cleaning. The cleaned silicon disc 100a is moved to the second unloading part 700 to finish the cleaning operation.

Here, the second transfer robot 430 may be cleaned in an up / down manner in the chemical cleaning tank 610 and the rinse tank 620 to increase the cleaning efficiency, and the chemical cleaning tank 610 and the rinse tank An ultrasonic generator (not shown) may be further added to 620 to maximize cleaning.

Therefore, the cut silicon disc 100a cleaned from the scrubbing cleaner 500 may further enhance the cleaning effect through the second cleaner 600, which may be a problem in a subsequent process of double side grinding and etching. By making the surface of the silicon disc 100a completely cleaned, there is an effect that can prevent in advance the problems that may occur in subsequent processes.

In the above, the scrubbing cleaner 500 and the second cleaner 600 are added to the cleaner 300 to clean the silicon ingot 100 to which the carbon beam 120 is attached, and to separate the carbon beam 120 and the carbon. Although the cleaning process of the silicon disc 100a, in which the beam 120 is separated and cut, has been described, it can be used individually or in combination.

In the above, but shown as cleaning the ingot made of silicon, but is not limited to this, of course it is possible to clean the ingot made of a material other than silicon.

Although described above with reference to the drawings and embodiments, those skilled in the art that the present invention can be variously modified and changed within the scope without departing from the spirit of the invention described in the claims below. I can understand.

1 is a schematic cross-sectional view showing an ingot cleaning device according to a first embodiment of the present invention.

Figure 2 is a perspective view showing the shape of the silicon ingot to be cleaned in the ingot cleaning apparatus according to the first embodiment of the present invention.

3 is a perspective view showing a transfer robot of the ingot cleaning device according to the first embodiment of the present invention.

4 is a front view showing a transfer robot of the ingot cleaning device according to the first embodiment of the present invention.

5 is a side view showing a transfer robot of the ingot cleaning device according to the first embodiment of the present invention.

6 is a front view showing the operation of the transfer robot of the ingot cleaning device according to the first embodiment of the present invention.

7 is a schematic cross-sectional view showing a cleaning apparatus according to a second embodiment of the present invention.

8 is a perspective view showing the shape of the silicon ingot used in the cleaning apparatus according to the second embodiment of the present invention.

9 is a schematic cross-sectional view showing the cleaning operation of the cleaning apparatus according to the second embodiment of the present invention.

10 is a schematic cross-sectional view showing a cleaning apparatus according to a third embodiment of the present invention.

<Description of the code | symbol about the principal part of drawings>

100: ingot 110: slit

120: carbon beam 200: loading portion

300: washing unit 310: shelf

320: slurry washing tank 330: SOAP washing tank

340: high temperature cleaning tank 400: transfer robot

500: scrubbing device 600: second cleaning tank

800: drying part 900: unloading part

Claims (21)

Ingot cleaning device for cleaning the ingot, A loading unit for storing ingots, A cleaning unit provided adjacent to the loading unit and provided with at least one cleaning tank; An unloading part provided adjacent to the cleaning part; A body which is provided from an upper part of the loading part to an upper part of the unloading part and conveys the ingot, a body configured as a support part formed in one direction from a seating part and four edges of the seating part, and a transport connected to the support part to convey the body Ingot cleaning device comprising a transfer robot composed of units. Ingot cleaning device for cleaning the ingot, A loading unit for storing ingots, A cleaning unit provided adjacent to the loading unit and provided with at least one cleaning tank; An unloading part provided adjacent to the cleaning part; A scrubbing device provided at one side of the unloading part; An ingot cleaning device including a transfer robot provided from an upper portion of the loading portion to an upper portion of the unloading portion to transfer the ingot. The ingot cleaning device according to claim 1, wherein a scrubbing device is provided on one side of the unloading part. The ingot cleaning apparatus according to any one of claims 1 to 3, wherein a heating member is connected to one side of the cleaning tank, and the cleaning liquid is maintained as a high temperature cleaning liquid by the heating member. The ingot cleaning device according to claim 1 or 3, wherein the seating portion includes a first seating portion having a plate shape, and a second seating portion having stepped portions on opposite sides of the first seating portion. The ingot cleaning device as set forth in claim 5, wherein a fixing part is formed in a direction perpendicular to an opposite second mounting part. The ingot cleaning apparatus according to claim 6, wherein two fixing parts are formed on an upper part of the seating part, and the two fixing parts move relative to each other. The ingot cleaning apparatus according to any one of claims 1 to 3, wherein the ingot is an ingot having a beam attached to one side thereof. 4. The ingot cleaning apparatus according to claim 2 or 3, wherein the scrubbing device comprises two roll brushes facing each other, and the roll brush is rotatable. The ingot cleaning apparatus according to claim 9, wherein the scrubbing apparatus further includes a container containing a cleaning liquid, and the roll brush is provided in the container. The ingot cleaning device according to claim 2 or 3, wherein a second cleaning part and a second unloading part are further provided at one side of the scrubbing device. The ingot cleaning apparatus according to claim 11, wherein the second cleaning section includes a chemical cleaning tank and a rinse tank. The ingot cleaning apparatus according to claim 12, wherein a second transfer robot is further provided on the second cleaning unit and the second unloading unit to move to the upper portion of the second cleaning unit and the second unloading unit. The ingot cleaning apparatus according to claim 13, wherein the second transfer robot moves the silicon disc from which the beam is removed. The ingot cleaning apparatus according to any one of claims 1 to 3, wherein the ingot is a wire sawed ingot. Loading an ingot with a beam attached to one side; Cleaning the ingot; Immersing the ingot in a hot cleaning solution to separate the carbon beam from the ingot; Cleaning the silicon disc from which the carbon beam is separated And in which each step is carried out continuously. The method of claim 16, further comprising cleaning by applying ultrasonic waves. delete The method of claim 16, wherein the cleaning of the silicon disc comprises scrubbing cleaning. The method of claim 16, wherein the cleaning of the silicon disc is performed by chemical and rinsing. The method of claim 16, 17, 19, 20, wherein the ingot is a wire sawed ingot.

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