JP2000169296A - Device for peeling ingot - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ingot-peeling device capable of automatically peeling an ingot from a work plate. SOLUTION: An ingot-adhered work plate IW carried in a delivery selection 12 is carried to a peeling section 14 by the use of the first carrying device 70 and then immersed in hot water to naturally peel the ingot, etc. The peeled ingot I and a slice space S are carried to a washing section 16 by the use of the second carrying device 100, washed, dried, and then recovered into an ingot- recovering section 20 and a slice space-recovering section 22, respectively. The separated work plate W is carried to the washing section, washed, dried, and then recovered into the ingot-recovering section 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ingot peeling apparatus, and more particularly to an ingot peeling apparatus for peeling an ingot and a slice base from a work plate having an ingot bonded thereto.

[0002]

2. Description of the Related Art When a single crystal ingot of silicon or the like is cut with a wire saw, the crystal orientation is adjusted so that the wafer is cut in a desired crystal orientation. In some cases, the crystal orientation is adjusted by a tilting mechanism provided in a wire saw.
As disclosed in Japanese Patent Publication No. 20, a method is adopted in which a crystal orientation is adjusted when an ingot is mounted on a work plate. However, when the ingot is attached to the work plate in this way, if it is found that the crystal orientation was wrong after installation or if the attachment failed, the ingot must be peeled off the work plate and the installation work must be restarted from the beginning. Did not. Conventionally, an operator manually performs this ingot peeling operation.

[0003]

However, since the diameter of the ingot is increasing year by year, the conventional peeling method in which the operator peels off the ingot by hand is extremely difficult and involves a great risk. Was. The present invention has been made in view of such circumstances, and an object of the present invention is to provide an ingot peeling device capable of automatically peeling an ingot.

[0004]

According to the present invention, there is provided an ingot separating apparatus for separating an ingot and a slice base from a work plate to which an ingot has been bonded. A peeling unit that thermally softens the adhesive of the work plate to which the ingot has been bonded to peel the slice base and the ingot, a collecting unit that collects the ingot, the slice base, and the work plate peeled by the peeling unit; and the loading unit. A first transport unit that transports the ingot-bonded work plate carried into the peeling unit to the peeling unit, and transports the work plate peeled at the peeling unit to the collection unit, and transports the ingot peeled at the peeling unit to the While transporting to the collection unit, the slice base peeled at the peeling unit A second conveying unit for conveying the serial recovery unit,
It is characterized by consisting of.

According to the present invention, the ingot-bonded work plate carried into the carry-in section is carried by the first carrying section to the peeling section. Then, the adhesive is thermally softened at the peeling portion, and the slice base and the ingot are peeled. The peeled ingot and slice base are each
The work part is collected by the collection part by the conveyance part, and the work plate is collected by the collection part by the first conveyance part. This allows the ingot to be peeled off safely without manual intervention.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an ingot peeling device according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view showing a configuration of an embodiment of an ingot peeling device according to the present invention.

As shown in FIG. 1, an ingot separating apparatus 10 according to the present embodiment includes a carry-in section 12, a peeling section 14, a cleaning section 16, a work plate collecting section 18, and an ingot collecting section 2.
0, a slice base recovery unit 22, a first transport unit 24, and a second transport unit 26. The loading unit 12 receives the work plate IW having the ingots bonded thereto.
The loading section 12 has a loading stage 32. The work plate holder 90 of the first transfer device 70, which will be described later,
The work plate IW on which the ingot is bonded is received on the carry-in stage 32.

[0008] The peeling section 14 peels the slice base S and the ingot I from the work plate IW to which the ingot has been bonded. The peeling part 14 is a hot water tank 3 in which hot water is stored.
Four. Ingot bonded work plate I
W is immersed in the hot water of the hot water tank 34 while being held by the work plate holder 90 of the first transfer device 70 described later. When the ingot-bonded work plate IW is immersed in hot water, the adhesive bonding the slice base S and the ingot I is thermally softened, and the slice base S and the ingot I are peeled off.

The cleaning unit 16 cleans the ingot I, the slice base S, and the work plate W peeled by the peeling unit 14. The cleaning unit 16 has a pair of nozzles 36,36. As shown in FIGS. 1 and 2, the nozzles 36, 36 are disposed at symmetrical positions with respect to the transport path of the second transport section 26, and the support brackets 38, 3 at both ends.
8 rotatably supported. Nozzle swing motors 40, 40 are provided at the base ends of the support brackets 38, 38.
Are installed on the output shaft, and drive pulleys 44, 4
4 is fixed. On the other hand, driven pulleys 46, 46 are fixed to one end of the nozzles 36, 36, and belts 48, 48 are wound around the driven pulleys 46, 46 and the driving pulleys 44, 44. Therefore, when the nozzle swing motors 42, 42 are driven, the rotation thereof is transmitted to the driven pulleys 46, 46 via the belts 48, 48, and as a result, the nozzles 36, 36 rotate. At the time of cleaning, the cleaning liquid is sprayed toward the ingot I and the like conveyed by the second conveyance device 100 while the nozzles 36 and 36 are being swung at a predetermined swing angle to clean the ingot I and the like. After cleaning, the nozzle 36
The compressed air is sprayed and dried while swinging 36 at a fixed swing angle. In addition, the nozzles 36, 36 are configured to be able to selectively jet the compressed air and the cleaning liquid.

The work plate collecting section 18 has a work plate receiving table 50.
The work plate W that has been washed and dried is placed on the work plate W.
The ingot collecting section 20 has an ingot receiving stand 52, and the ingot I that has been washed and dried is placed on the ingot receiving stand 52. A pair of guide rods 54, 54 are fixed to a lower portion of the ingot receiving table 52,
The guide rods 54 are supported by bushes 56 fixed to the gantry 28 so as to be slidable in the vertical direction. A pedestal elevating cylinder 58 is provided on the gantry 28, and the rod tip of the pedestal elevating cylinder 58 is connected to the center of the lower surface of the ingot pedestal 52. Therefore, when the pedestal elevating cylinder 58 is driven, the ingot pedestal 52 is
Move up and down along.

The slice base collecting section 22 has a slice base receiving table 60, and this slice base receiving table 6
A slice base S that has been washed and dried is placed on the slice base S.
A rod of a cradle elevating cylinder 64 is fixed to a lower portion of the slice base pedestal 60, and the pedestal elevating cylinder 64 is provided on the top of a column 66 erected on the gantry 28. The slice base receiving table 60 moves up and down by driving the receiving table lifting / lowering cylinder 64.

The first transport section 24 receives the ingot-attached work plate IW carried into the carry-in section 12 and transports it to the peeling section 14. Then, the work plate W from which the ingot I has been peeled by the peeling unit 14 is transported to the cleaning unit 16, and the work plate W washed and dried by the cleaning is transported to the work plate collecting unit 18. This first
The transport section 24 has a first transport device 70 that travels on a pair of first guide rails 68.

The pair of first guide rails 68, 68
Are laid along a support plate 72 erected on the gantry 28 as shown in FIG. A screw rod 74 is provided between the pair of first guide rails 68, 68, and both ends of the screw rod 74 are rotatably supported by bearing members 75, 75. And this screw rod 74
The output shaft of the first servomotor 76 is connected to one end of the first servomotor 76. The screw rod 74 rotates by driving the first servomotor 76.

On the other hand, the first transfer device 70 has a traveling frame 80, and the traveling frame 80 is connected to the first guide rail 68 via linear guides 82, 82,... As shown in FIG. , 68 are slidably supported. A nut member 80A is fixed to the rear surface of the traveling frame 80, and the nut member 80A is screwed to the screw rod 74. Accordingly, when the first servomotor 76 is driven to rotate the screw rod 74, the traveling frame 80 travels along the first guide rails 68, 68 in the lateral direction.

As shown in FIGS. 3 and 4, a pair of support arms 82 are fixed to the front portion of the traveling frame 80. A pair of bushes 84, 84 are provided at the distal ends of the support arms 82, 82, respectively. The bushes 84, 84 have guide rods 86, 8, respectively.
6 are slidably supported. The upper ends of the pair of guide rods 86 are connected to the connecting plate 8 respectively.
8 and a lower end thereof is connected to an upper surface of the work plate holder 90, respectively. The work plate W is mounted on the work plate holder 9.
0, the work plate holder 9
It is kept at 0.

A first cylinder 92 is disposed on the front of the traveling frame 80. On the other hand, a second cylinder 94 is disposed above the connection plate 88. The rods of the first cylinder 92 and the second cylinder 94 are connected to each other via a joint 96. When the first cylinder 92 or the second cylinder 94 is driven, the work plate holder 90 moves up and down. . The stroke of the second cylinder 94 is set shorter than the stroke of the first cylinder 92. The second cylinder 94 transfers the ingot I after peeling to the second cylinder 94.
It is used when transferring to the transport device 100.

In the first transport unit 24 configured as described above, the work plate holder 90 is
Alternatively, it moves in the vertical direction by driving the second cylinder 94, and moves in the horizontal direction by driving the first servomotor 76. The second transport unit 26 cleans the ingot I or the slice base S peeled by the peeling unit 14 from the cleaning unit 16.
And the ingot I or the slice base S washed and dried by the washing is transferred to the ingot collecting section 20 or the slice base collecting section 22, respectively. The second transport section 26 has a second transport device 100 that travels on a pair of second guide rails 98, 98.

The pair of second guide rails 98, 98
1 is arranged along a ceiling frame 102 as shown in FIG. 1, and both ends of the ceiling frame 102 are supported by columns 104, 104 erected on the gantry 28. A screw rod 106 is provided between the pair of second guide rails 98, 98, and both ends of the screw rod 106 are rotatably supported by bearing members 108, 108. An output shaft of a second servomotor 110 is connected to one end of the screw rod 106, and the screw rod 106 is rotated by driving the second servomotor 110.

On the other hand, the second transporting device 100 has a pair of slide frames 112, 112. As shown in FIGS. 3 and 5, the slide frames 112, 112 have linear guides 114, 114, respectively. Are slidably supported on the second guide rails 98, 98 via. Connecting members 116, 116 are fixed to the upper surfaces of the slide frames 112, 112, respectively, and rod end portions of arm opening / closing cylinders 118, 118 are connected to the connecting members 116, 116, respectively. . This arm opening / closing cylinder 118, 118
Are fixed to the traveling frame 120, respectively, and by driving the arm opening / closing cylinders 118, 118, the slide frame 1
12 and 112 slide on the second guide rails 98 and 98.

A nut member 120A is fixed to the upper surface of the running frame 120.
A is screwed to the screw rod 106. Therefore,
When the screw rod 106 is rotated by driving the second servo motor 110, the traveling frame 120 travels along the second guide rails 98, 98 along with the slide frames 112, 112 in the lateral direction.

Transfer arms 122, 122 are provided on the lower surfaces of the slide frames 112, 112, respectively.
Each of the pair of claws 124 is fixed. The ingot I is transported while being placed on the claws 124, 124 of the pair of transport arms 122, 122, and the slice base S is transported by the pair of transport arms 12
The sheet is conveyed while being sandwiched between 2, 122.

In the second transfer section 26 configured as described above, the transfer arms 122, 122 are opened and closed by driving the arm opening / closing cylinders 118, 118, and are driven in the horizontal direction by driving the second servomotor 110. Go to The operation of the ingot peeling device 10 according to the present embodiment configured as described above is as follows.

In the initial state, the first transfer device 70 is located at the loading section 12, and its work plate holder 90 is located on the loading stage 32 of the loading section 12. Further, the second transfer device 100 is located in the washing unit 16, and the ingot receiving table 52 and the slice base receiving table 60 are disposed.
Are located at the lowest positions (the positions indicated by solid lines in FIG. 1).

First, the work plate IW to which the ingot has been adhered is carried into the carry-in section 12, and is set on the work plate holder 90 located on the carry-in stage 32. Thus, the ingot-bonded work plate IW is set in the ingot peeling device 10. Hereinafter, the peeling operation is automatically performed when the apparatus is operated. First, the first cylinder 92 of the first transfer device 70 is driven, and the work plate holder 90 is raised by a predetermined amount. As a result, the work plate IW to which the ingot is bonded is lifted to a position at a predetermined height. Next, the first servomotor 76 is driven,
The first transfer device 70 moves to the left in FIG. And
It stops at a position above the hot water tank 34.

Next, the first cylinder 92 is driven to lower the work plate holder 90 by a predetermined amount. As a result, the ingot-bonded work plate IW held by the work plate holder 90 is immersed in the hot water stored in the hot water tank. The immersion is continuously performed for a predetermined time, and as a result, the adhesive bonding the ingot I and the slice base S and the adhesive bonding the slice base S and the work plate W are thermally softened, and the ingot I and the slice base S are separated. .

When a predetermined time has passed since the ingot-bonded work plate IW was immersed in the hot water tank 34,
When the second servomotor 110 is driven, the second transfer device 10
0 moves to a position above the hot water tank 34. At this time, the second
The transfer arms 122 and 122 of the transfer device 100 are in a diameter-expanded state (a state where the interval is the longest). Next, the first cylinder 92 is driven, and the work plate holder 90 is raised by a predetermined amount. As a result, the ingot-bonded work plate IW is pulled up from the hot water to a position at a predetermined height.
Next, the arm opening / closing cylinders 118 are driven, and the transfer arms 122, 122 of the second transfer device 100 move in directions approaching each other. As a result, the claws 124, 124 of the transfer arms 122, 122 are located below the ingot I lifted by the work plate holder 90.
Is located. Next, the second cylinder 94 is driven, and the work plate holder 90 is lowered by a predetermined amount. As a result, the ingot I peeled from the slice base S is transferred to the claws 124 of the transfer arms 122.

The ingots I are transport arms 122, 122
Of the first cylinder 9
2 is driven to lower the work plate holder 90 by a predetermined amount. As a result, the work plate W and the slice base S held by the work plate holder 90 are immersed again in hot water. At the same time, the second cylinder 94 is driven, and the work plate holder 90 returns to the original height position.

On the other hand, the second transporting device 100 that has received the ingot I moves leftward in FIG. 1 and stops at a position above the cleaning unit 16. Then, the second transfer device 100
Is stopped at a position above the washing section 16, washing is started. That is, the cleaning liquid is sprayed from the nozzles 36 toward the ingot held by the transfer arms 122, 122, whereby the ingot I is cleaned. At this time, the nozzles 36 and 36 spray the cleaning liquid toward the ingot I while swinging at a fixed angle.

The injection of the cleaning liquid is performed continuously for a predetermined time. After a lapse of a predetermined time, the injection of the cleaning liquid is stopped,
Subsequently, compressed air is injected toward ingot I. The ingot I is dried by the injected compressed air. In addition, when this compressed air is injected, the nozzle 3
6, 36 inject compressed air toward the ingot I while swinging at a fixed angle. As with the cleaning liquid injection, the compressed air injection is also continued for a predetermined time, and after the predetermined time has elapsed, the injection is stopped.

When washing and drying of the ingot I are completed,
The second transporting device 100 moves leftward in FIG. 1 and stops above the ingot collecting unit 20. And this second
When the transport device 100 stops above the ingot collecting section 20, the cylinder 58 for raising and lowering the cradle is driven, and the cradle 52 is raised by a predetermined amount. As a result, the transfer arm 12
The ingot I held by the claws 124, 124 is placed on the ingot receiving table 52. Next, the arm opening / closing cylinders 118, 118 are driven, and the transfer arms 122, 122 move in directions away from each other. As a result, the claws 124, 124 of the transfer arms 122, 122
The ingot I is delivered to the ingot receiving table 52 from the. Next, the cradle elevating cylinder 58 is driven, and the ingot cradle 52 is lowered by a predetermined amount. As a result, the ingot I is collected by the ingot collecting unit 20.

On the other hand, when the ingot receiving table 52 is lowered, the second transfer device 100 moves rightward in FIG. 1 and stops above the hot water tank 34. At this time, the transfer arm 12
2, 122 move open. Next, the first cylinder 92 is driven, and the work plate holder 90 is raised by a predetermined amount. As a result, the slice base S and the work plate W are raised from the hot water to a position at a predetermined height. Next, the arm opening / closing cylinders 118 are driven,
The transfer arms 122 of the second transfer device 100 move in directions approaching each other. As a result, the slice base S lifted by the work plate holder 90 is held by the transfer arms 122. Next, the second cylinder 94 is driven, and the work plate holder 90 is moved.
Decreases by a predetermined amount. As a result, the slice bases S separated from the work plate W are transported by the transfer arms 122, 122.
Passed to.

The slice base S is composed of the transfer arms 122, 1
When the work plate holder 90 is transferred, the first cylinder 92 is driven and the work plate holder 90 is lowered by a predetermined amount. As a result, the work plate W held by the work plate holder 90 is immersed again in hot water. At the same time, the second cylinder 94 is driven, and the work plate holder 9 is moved.
0 returns to the original height position.

On the other hand, the second receiving the slice base S
The transport device 100 moves to the left in FIG.
6. Stop at the position above 6. Then, the second transfer device 1
When 00 stops at a position above the cleaning unit 16, cleaning is started. That is, the cleaning liquid is sprayed from the nozzles 36 toward the slice base S held by the transfer arms 122, 122, and thereby the slice base S is cleaned. In this case as well, the nozzles 36 and 36 eject the cleaning liquid toward the slice base S while swinging at a fixed angle.

The injection of the cleaning liquid is performed continuously for a predetermined time. After a lapse of a predetermined time, the ejection of the cleaning liquid is stopped, and then the compressed air is ejected toward the slice base S. The slice base S is dried by the injected compressed air. Also in the case of injecting the compressed air, the nozzles 36, 36 also inject the compressed air toward the slice base S while swinging at a fixed angle. The injection of the compressed air is continuously performed for a predetermined time, and after the predetermined time has elapsed, the injection of the compressed air is stopped.

When the washing and drying of the slice base S are completed, the second transport device 100 moves to the left in FIG.
It stops above the slice base collection unit 22. And
When the second transporting device 100 stops above the slice base collecting section 22, the cradle lifting cylinder 64 is driven, and the slice base cradle 60 is raised by a predetermined amount. As a result, the slice base S held by the transfer arms 122, 122 is placed on the slice base receiving table 60.
Next, the arm opening / closing cylinders 118, 118 are driven, and the transfer arms 122, 122 move in directions away from each other. As a result, the slice base S is transferred from the transfer arms 122 to the slice base receiving table 60. Next, the cradle lifting cylinder 64 is driven, and the slice base cradle 60 is lowered by a predetermined amount. As a result, the slice base S is collected by the slice base collection unit 22.

On the other hand, when the slice base receiving table 60 is lowered, the first cylinder 92 is driven, and the work plate holder 90 is raised by a predetermined amount. As a result, the work plate W is pulled up from the hot water to a position at a predetermined height.
Next, the first servomotor 76 is driven, and the first transfer device 70 moves leftward in FIG. 1 and stops at a position above the cleaning unit 16. Then, the work plate W held by the work plate holder 90 is cleaned.
That is, the cleaning liquid is sprayed from the nozzles 36 toward the work plate W held by the transfer arms 122, 122, whereby the work plate W is cleaned. In this case as well, the nozzles 36 and 36 spray the cleaning liquid toward the work plate W while swinging at a fixed angle.

The injection of the cleaning liquid is performed continuously for a predetermined time.
After a lapse of a predetermined time, the injection of the cleaning liquid is stopped, and then the compressed air is injected toward the work plate W. The work plate W is dried by the injected compressed air. In addition, when this compressed air is injected, the nozzle 3
6, 36 inject compressed air toward the work plate W while swinging at a fixed angle. The injection of the compressed air is continuously performed for a predetermined time, and after the predetermined time has elapsed, the injection of the compressed air is stopped.

When the washing and drying of the work plate W are completed, the first transfer device 70 moves to the left in FIG. 1 and stops above the work plate collection unit 18. When the first transfer device 70 stops at this position, the first cylinder 92 is driven, and the work plate holder 90 is lowered by a predetermined amount. As a result, the work plate W held by the work plate holder 90 is placed on the work plate receiving table 50 and collected.

With the above steps, the ingot I stripping operation is completed. The operator unloads the collected ingot I, slice base S, and work plate W to the respective collecting sections. As described above, according to the ingot peeling apparatus 10 of the present embodiment, the ingot I and the slice base S are automatically obtained from the ingot-bonded work plate IW.
Can be removed, washed and dried to collect. Therefore, the ingot peeling operation can be performed safely, and the labor of the operator is reduced.

The present apparatus is combined with an ingot mounting apparatus (an apparatus for bonding the ingot I to the work plate W via the slice base S) and an X-ray crystal orientation measuring apparatus (an apparatus for measuring the crystal orientation of the ingot). A system for automating the bonding of the ingot to the work plate can be constructed. That is, the respective devices are connected by an automatic transport device, and the ingots and the like can be transported to each other. Then, first, the ingot is bonded to the work plate by the ingot mounting device. Next, the crystal orientation of the ingot bonded to the work plate is measured by an X-ray crystal orientation measurement device. Then, as a result of the measurement, if it is bonded in a desired crystal orientation, it is carried out to the next step (cutting step using a wire saw) as it is, and if it is not bonded in the desired crystal orientation, the ingot or the like is removed by an ingot peeling device. Peel off. Then, the peeled ingot or the like is transported again to the ingot mounting device, and bonding is performed again. By constructing such a system, it is possible to prevent the crystal orientation from being shifted and being cut, and to efficiently manufacture a wafer.

In the ingot peeling apparatus 10 of the present embodiment, the ingot I and the like are collected after being washed and dried. May be configured. That is, the installation of the cleaning unit 16 is optional. Further, in the ingot peeling device 10 of the present embodiment, the peeled ingot I and the like are configured to be collected in the receiving tray, but a configuration may be adopted in which a conveyor or the like is installed so that the ingot can be automatically carried out. Further, a configuration may be employed in which a plurality of unloaded ingots or the like can be stocked.

Further, in the ingot peeling apparatus 10 of the present embodiment, the peeled ingot I, slice base S, and work plate W are individually recovered, but are recovered at one place without being separated. You may do so. In addition, in the ingot peeling apparatus 10 of the present embodiment, the work piece W having the ingot bonded thereto is immersed in hot water, so that the adhesive bonding the ingot I and the slice base S is thermally softened to thereby remove the ingot I. Although the slice base S is peeled off, the adhesive may be softened by heating with a heater.

[0043]

As described above, according to the present invention,
The ingot that has failed to adhere can be safely separated from the work plate without human intervention and collected.

[Brief description of the drawings]

FIG. 1 is a front view showing the configuration of an ingot peeling device.

FIG. 2 is a side view showing a configuration of a cleaning unit.

FIG. 3 is a side view showing a configuration of a first transport device and a second transport device.

FIG. 4 is a front view showing the configuration of a first transfer device.

FIG. 5 is a front view showing the configuration of a second transfer device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Ingot peeling apparatus 12 ... Carry-in part 14 ... Peeling part 16 ... Cleaning part 18 ... Work plate collection part 20 ... Ingot collection part 22 ... Slice base collection part 34 ... Hot water tank 36 ... Nozzle 50 ... Work plate receiving stand 52 ... Ingot Receiving stand 60 ... Slice base receiving stand 70 ... First transfer device 90 ... Work plate holder 100 ... Second transfer device 122 ... Transfer arm I ... Ingot S ... Slice base W ... Work plate IW ... Ingot bonded work plate

Claims (3)

[Claims] 1. An ingot peeling device for peeling an ingot and a slice base from a work plate on which an ingot is bonded, wherein a loading section into which the work plate on which the ingot is bonded is loaded, and an adhesive of the work plate on which the ingot is bonded is thermally softened and sliced. A separating unit for separating the base and the ingot; a collecting unit for collecting the ingot, the slice base, and the work plate separated by the separating unit; and a transfer of the ingot-bonded work plate carried into the carry-in unit to the peeling unit. A first transport unit that transports the work plate peeled off by the peeling unit to the collecting unit; and a transport unit that transports the ingot peeled off by the peeling unit to the collecting unit, and the slice that is peeled off by the peeling unit. A second transport unit that transports the base to the collection unit. Ingot peeling apparatus characterized. 2. The cleaning device according to claim 1, further comprising a cleaning unit for cleaning the ingot, the slice base, and the work plate peeled off by the peeling unit, wherein the cleaning unit recovers the ingot, the slice base, and the work plate. Ingot peeling device. 3. An ingot collecting section for collecting a peeled ingot, a slice base collecting section for collecting a peeled slice base, and a work plate collecting for collecting a peeled work plate. The ingot peeling device according to claim 1 or 2, wherein the device is separated and collected.