JP3524267B2 - Wafer peeling device - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to relates to equipment for stripping each wafer from the wafer column in the state of being bonded via the adhesive on the fixed member.

[0002]

As is well known, semiconductor materials, magnetic materials,
When manufacturing a wafer such as ceramics, these materials are adhered to the fixing member in an ingot state, and then,
Slicing into a row of wafers from a direction perpendicular to the length direction is performed using a wire saw.

Usually, slicing with a wire saw is performed while spraying a slurry-like grinding liquid, and is also performed after the material has been completely cut, to a depth reaching a part of the fixing member. Therefore, the sliced wafer rows are in a state of being bonded to the fixing member via the adhesive.

In order to obtain each wafer from such a wafer row, a plurality of wafers are peeled from the fixing member by hand,
Further, these plural wafers have been manually separated into single wafers.

[0005]

However, in the above-mentioned peeling work, a person peels a plurality of appropriate wafers flexibly according to the bonding state of each wafer and the like, and it is difficult to automate this process. There was a problem that was. That is, a wafer is generally highly brittle, and it has been a technical problem how to peel a wafer with a small force without burdening the wafer from the situation where such a wafer is bonded. . If it is manual, it is possible to delicately adjust the amount of force applied according to the adhesion situation,
Replacing this with mechanical force is difficult and costly. Therefore, there has been a demand for development of a method itself suitable for automation.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a wafer peeling method and apparatus that can achieve automation and can peel a wafer with a small force without burdening the wafer. To do.

[0007]

In the method for peeling a wafer according to the present invention , a method for peeling each wafer from a wafer row in a state of being bonded to a fixing member via an adhesive, A softening step of softening the agent, a first moving step of rotationally moving the wafer in a plane direction with an end point of a bonding portion between the wafer and the fixing member as a fulcrum, and further moving the wafer in a plane direction, A second moving step of moving the wafer out of the region of the wafer row. In the wafer peeling method of the present invention , in the above wafer peeling method,
In order to reduce the surface tension acting between the wafer and a wafer adjacent to the wafer, a step of injecting a gas flow toward the gap between the wafers is included.

The wafer peeling device of the present invention is a device for peeling each wafer from a row of wafers adhered to a fixing member via an adhesive, and dipping the bonded portion by the adhesive. A softening tank for softening the adhesive by doing so, a wafer suction plate that sucks on the surface of the wafer located at the end of the wafer row, the wafer suction plate and the fixing member, the relative wafer First moving means for sliding the wafer in the surface direction and rotating the wafer in the surface direction with the end point of the bonding portion between the wafer and the fixing member as a fulcrum, and further moving the wafer suction plate to move the wafer. A second moving means for moving the wafer out of the region of the wafer row by moving the wafer in the surface direction. In the wafer peeling apparatus of the present invention , in the above wafer peeling apparatus,
A nozzle for injecting a gas flow toward a gap between the wafer to be separated and a wafer adjacent to the wafer is provided in the vicinity of the wafer to be separated. In the wafer peeling apparatus of the present invention , in the above wafer peeling apparatus, a slit that covers the vicinity of the end portion of the wafer row and one wafer at the end portion can be inserted through the slit and the wafer. A pressing member having a notch that allows the suction of the wafer suction plate to move, and between the pressing position of the pressing member near the end of the wafer row and a retracted position separated from the pressing position. It is characterized in that a pressing member drive means for moving the is provided. The separation unit of the wafer of the present invention, the upper
In the wafer peeling apparatus described above, prior to immersing the wafer row in the softening bath, a reversing mechanism for rotating the fixing member and the wafer row around the axis of the wafer row is provided, The reversing mechanism includes a rack arranged perpendicularly to the lengthwise direction of the wafer row, a pinion that rolls in an engaged state with the rack, and a shaft that pivots as the pinion rolls and the axis of the pinion. And a supporting member having an engaging arm that engages with the fixing member in a state where the axis of the wafer row is aligned with each other, and a rotation driving means for rotationally driving the supporting member. It is characterized by that.

[0009] According to the present invention, in the softening step,
After the adhesive is softened, in the first moving step, the wafer is rotated and moved with the end point of the bonded portion as a fulcrum. In this case, in the bonded portion, the adhesive is gradually and continuously peeled off from the other end side of the bonded portion, and most of the adhesive is peeled off with a small force. Then, in the second moving step, the wafer is further moved in the surface direction to move the wafer to the outside of the region of the wafer row. In this case, most of the adhesive has already been peeled off, so a small force is required. According to the present invention, by injecting the gas flow toward the gap between the wafers, the surface tension acting between the wafers is reduced, and the force required for peeling is further reduced.

According to the present invention, the adhesive is softened by immersing the adhesive portion in the softening bath. And the first
The wafer suction plate and the fixing member are slid relative to each other by using the moving means, so that the wafer is rotationally moved in the surface direction with the end point of the bonded portion between the wafer and the fixing member as a fulcrum. Further, the wafer is moved out of the region of the wafer row by using the second moving means. According to the present invention, a nozzle for injecting a gas flow toward the gap between the wafer to be peeled and the wafer adjacent to this wafer is provided in the vicinity of the wafers to be peeled, so that the action between the wafers is reduced. The surface tension is reduced. According to the present invention, when the wafer is moved by the second moving means,
The holding member is arranged at a holding position near the end of the wafer row. Then, the slit allows only one wafer to be inserted, and the adjacent wafers are prevented from being moved together. According to the present invention, since the reversing mechanism is provided, the transfer with the previous process can be smoothly performed.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a wafer peeling method and apparatus of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show an example of a wafer cleaning apparatus equipped with an embodiment of a wafer peeling apparatus of the present invention. The cleaning apparatus includes a cleaning mechanism 10 and a reversing mechanism 2.
0, a peeling device 30 according to an embodiment of the present invention, a single-wafer cleaning mechanism 40, and an accommodating mechanism 50.

The target work W in this embodiment is a wafer row on the fixing member 1, as shown in FIG. In this case, the fixing member 1 includes carbon 2, glass 3,
Each wafer is composed of an iron base 4, and each wafer is adhered to the fixing member 1 in an ingot shape and then sliced into a wafer row from a direction perpendicular to the length direction by a wire saw. Here, the slicing is performed to the depth of the carbon 2, the wafers are completely separated, and the wafers are juxtaposed on the fixing member 1 in a state of being bonded to each other. In the present embodiment, the wafer is an 8-inch silicon wafer, and is intended for the work W in which 200 to 250 wafers are juxtaposed.

[Cleaning Mechanism 10] The cleaning mechanism 10 is for cleaning the wafer row adhered on the fixing member 1 in this form. As shown in FIGS. 4 to 6, the cleaning mechanism 10 includes wafer cleaning tanks 11A, 11B and 11C, an ultrasonic vibrator 12 (vibrating means), a wafer row transfer means 13 and a swing means 14. It is configured.

The ultrasonic vibrator 12 is, as shown in FIG.
Each of the wafer cleaning tanks 11A, 11B and 11C is attached to the side wall and the bottom wall of the wafer cleaning tank 1A.
It functions to give vibration to the cleaning liquid and the work W in 1A, 11B and 11C.

The transfer of the wafer row is performed in the vertical direction and the traveling direction. First, with reference to FIG. 4, the vertical transfer of wafers by the wafer row transfer means 13 will be described. Upward and downward transportation is performed in each wafer cleaning tank 11A, 11A.
In order to immerse the work W in B and 11C, and
Two support arms 15 for holding the work W are formed at both ends in the length direction of the base 4 in order to lift the work W from each of the wafer cleaning tanks 11A, 11B and 11C. The guide member 16 that supports the locking portion 4a from below and supports the first locking portion 15a of the support arm 15 by the step portion 16a is made by moving along the guide rail 16b. .

Next, with reference to FIGS. 5 and 6, the transfer of the wafers by the wafer row transfer means 15 in the traveling direction will be described. In the transport in the traveling direction, the gripping arm 17 for gripping the work W has a groove 4b formed in the side portion of the base 4.
The workpiece W is gripped by inserting the engaging claw 17a into the inside of the wafer cleaning tank 1 along the rail 15a.
This is done by transporting the work W across 1A, 11B, and 11C.

The swinging means 14 is provided for each wafer cleaning tank 11A,
It is for oscillating the work W in 11B and 11C, and includes a motor 14a, a speed reducer 14b, a crank member 14c, a support rod 14d, and a second support arm 15.
It is configured by the locking portion 15b. The oscillating motion is such that after the rotation output of the motor 14a is reduced by the speed reducer 14b,
The crank member 14c is provided to convert the rotary motion into a vertical swing motion, and this swing motion is
It is transmitted to the work W via the support rod 14c that locks the second locking portion 15b. In this case, the first locking portion 15
The engagement between a and the step portion 16a can be released by lowering the guide member 16 from the state where the second locking portion 15b is supported by the support rod 14d. Therefore, the vertical transport and the swing motion can be selectively performed.

[Reversing Mechanism 20] The reversing mechanism 20 is for rotating the fixing member 1 and the wafer row by 180 ° around the axis of the wafer row, that is, for reversing the top and bottom. The reversing mechanism 20, as shown in FIGS.
It comprises a book support rod 21, two support members 22, and a drive motor (rotational drive means) 23 for rotationally driving these support members 22.

In this case, it should be noted that FIG. 7 is a view of the reversing mechanism 20 as seen from the direction of arrow A in FIG. Further, FIG. 8 shows the reversing mechanism 20 in the direction of arrow B in FIG.
It is the figure seen from the direction.

The support rods 21 are arranged perpendicularly to the lengthwise direction of the wafer row and parallel to each other at both ends in the lengthwise direction of the wafer row. Are formed.

The support member 22 has a claw 2 in the hole of the fixed member 1.
2a has an engaging arm 22b that grips the fixing member 1 from the side of the fixing member 1 by hooking it, and a pinion 22c that rolls in an engaged state with the rack 21a at a position separated from the engaging arm 22b. is there. Here, in the engagement arm 22b, the pinion 22c has the rack 21
When it engages with a and rolls, it swings together. Further, the engagement arm 22b is arranged at a position where the claw 22a is hooked in the hole of the fixing member 1 with the axis of the pinion 22c and the axis of the wafer row aligned.

The drive motor 23 rotates the support member 22 via a belt 23a stretched between the drive motor 23 and the intermediate member 24, and a belt 23b stretched between the intermediate member 24 and the support member 22. Can be made. In this case, the engagement between the rack 21a and the pinion 22c causes the engagement arm 22b and the work W to rotate 180 ° around the axis of the wafer row. In this case, with the reversal, the drive motor 23, the intermediate member 24, and the support member 22 are moved in parallel as a whole by the support rollers 22d and 22d rolling on the support rod 21.

[Peeling Device 30] The peeling device 30 is for peeling one wafer at a time from the end of the cleaned wafer row in the form of a wafer row, and in the present embodiment, one wafer is peeled off. Each peeling is realized by automatic means.

As shown in FIGS. 9 to 11, the peeling device 30 includes a softening tank 31, a wafer suction plate 32, and a swivel arm 32.
a, suction plate rotary actuator (second moving means)
33, air slide table 34, pressing member 35, rotary actuator for pressing member (pressing member driving means)
36, an air nozzle (nozzle) 37, a ball screw 38a,
It has a slide motor 38.

In this case, it should be noted that FIG. 9 is a view of the peeling device 30 as seen from the direction of arrow A in FIG. It should be noted that FIG. 10 is a view of the peeling device 30 as seen from the direction of arrow C in FIG. 9, and shows the state in which the wafer suction plate 32 and the pressing member 35 are at the top position.

The softening tank 31 is used to soften the adhesive agent that adheres each wafer to the fixing member 1.
It is a tank equipped with 1a. In the softening tank 31, in order to fix the fixing member 1 of the work W, the fixing cylinder 31
b, a fixing frame 31c is provided. In the present embodiment, since the adhesive is an epoxy adhesive, the water tank has a temperature of about 90 ° C. The present invention is not limited to this, and the temperature, the solvent, etc. may be appropriately selected according to the adhesive used.

The wafer suction plate 32 is connected to a vacuum suction source (not shown) to suck one wafer located at the end of the wafer row. The wafer suction plate 32 is
It is rotationally driven by a rotary actuator 33 for the suction plate via a swing arm 32a supporting the wafer suction plate 32. As a result, the wafer sucked by the wafer suction plate 32 is moved in the plane direction and largely rotated so as to move to the outside of the region of the wafer row. In this case, a shock absorber 32b for flexibly receiving the engagement arm 32a is provided on the receiving side of the separated wafer.

The air slide table 34 is for rotatably moving the wafer in the surface direction with the end point of the bonded portion between the wafer and the fixing member 1 as a fulcrum, and the shaft of the rotary actuator 33 for the suction disk via the connecting member 34a. Wafer suction plate 32.
Swivel arm 32a / suction plate rotary actuator 3
3 is integrally movable in the lateral direction.

In this case, instead of the air slide table 34 or in addition to the air slide table 34,
It is also possible to use a combination of the cylinder 34b and the hook 34c attached to the pressing member 35 described later. The hook 34c functions as a locking claw, and is driven by the cylinder 34b to lock only one wafer located at the end through a slit 35a described later, and to horizontally move only this wafer. It can be shifted in the direction.

The pressing member 35 covers the vicinity of the end of the wafer row so that only one wafer located at the end of the wafer row is inserted and the adjacent wafers are not moved. For this purpose, a slit 35a is formed so as to allow only one wafer to be inserted when the vicinity of the end of the wafer row is covered. Also,
The pressing member 35 is formed with a notch 35b that allows the wafer suction plate 32 to move or pass. Holding member 35
Is connected to the rotary actuator 36 for the pressing member, and is rotationally driven between the pressing position 35A and the retracted position 35B.

The air nozzle 37 is arranged in the vicinity of the wafer to be peeled, and in order to reduce the surface tension acting between the wafer to be peeled and the wafer adjacent to this wafer, It is for injecting an air flow toward the gap between the wafers.

The slide motor 38 is arranged along the ball screw 38a every time the wafer is peeled off, along the ball screw 38a, the wafer suction plate 32, the swing arm 32a, the suction plate rotary actuator 33, the air slide table 34, and the pressing member 3.
5, an assembly of the pressing member rotary actuator 36, the air nozzle 37, and a receiving member 44 described later is shown in FIG.
Is moved in the direction indicated by arrow D by a predetermined length.

[Single Wafer Cleaning Mechanism 40] Single Wafer Cleaning Mechanism 40
Is for cleaning each of the separated wafers one by one, and as shown in FIGS.
1, a single-wafer cleaning means 42, and a drying means 43.

The delivery means 41 comprises a receiving member 44 and a conveyor 45. The receiving member 44 receives the wafer separated by the wafer suction plate 32 in the accommodation portion 44a formed slightly thicker than the thickness of the wafer at the center in the thickness direction. As shown in FIG. 11, the receiving member 44 receives the wafer in an upright state. Then, after the suction by the wafer suction disk 32 is released, the wafer is rotated around the shaft body provided at the bottom edge portion and tilted to the horizontal state as shown by the two-dot chain line in the figure.

Two belts 45a are provided at the fallen position.
A conveyor 45 is provided which is driven so as to convey in the direction of arrow D. Further, the receiving member 44 is formed with a cutout portion 44b (FIGS. 9 and 11) extending over the entire length in alignment with the two belts 45a of the conveyor 45. From the cutout portion 44b, If the wafer is exposed downwards,
The belts 45a can be brought into contact with each other.

Therefore, the wafer peeled by the wafer suction plate 32 is once housed in the receiving member 44, and when the receiving member 44 is tilted, the wafer comes into contact with each belt 45a of the conveyor 45 through the notch 44b, and each belt. The conveyor 45 separates from the receiving member 44 due to the frictional force with the 45a.
Thus, it is delivered to the single-wafer cleaning means 42 which is the next step.

The single-wafer cleaning means 42 is a brush roller (brush) 42a for cleaning, a spray nozzle (spray means) 42b for spraying cleaning water (cleaning liquid) toward a cleaning location by the brush roller 42a, and a wafer. Roller 42c for transporting and absorbing water, and drive motor 42 for brush roller 42a and water absorption roller 42c
It is configured with d.

In this case, the spray nozzles 42b are provided on both upper and lower sides of the brush roller 42a so as to effectively clean the front and back surfaces of the wafer, as shown in FIG.

The drying means 43 comprises a stainless steel roller 43b and a roller 43b to which a plurality of O-rings 43a are attached.
Drive motor 43c and a hot air blowing means (not shown).

[Accommodating Mechanism 50] As shown in FIG. 1, the accommodating mechanism 50 has a rear stage of the single-wafer cleaning mechanism 40 for accommodating the wafers cleaned and dried in a cassette (accommodation container) 51. And is provided with a robot (single wafer transfer means) 52.

Next, a peeling method using the wafer peeling apparatus of the present invention configured as described above will be described along with a method of using the wafer cleaning apparatus.

[Cleaning Step] The work W shown in FIG. 3 is sliced by a wire saw and then transferred to the wafer row transfer means 13 of the cleaning mechanism 10 by an appropriate transfer means. In this cleaning process, the wafer row of the work W is
Wash in this form.

First, in the first wafer cleaning tank 11A, cleaning is performed by using the clean-through KS1000 (trade name, manufactured by Kao Corporation) as a cleaning liquid while applying ultrasonic vibration by the ultrasonic vibrator 12. Ultrasonic vibration causes cavitation and the cleaning solution is likely to enter the 28 kHz band where the cleaning effect is large and / or a narrow gap.
Perform in the kHz band. During the cleaning, the swinging means 14 swings the work W to enhance the cleaning effect. Then, from time to time, the work W is once pulled out of the cleaning liquid, the cleaning liquid is caused to flow, and the work W is immersed again in the cleaning liquid to further enhance the cleaning effect.

Next, in the second wafer cleaning tank 11B, cleaning is performed using the 5% aqueous solution of the clean-through KS1000 as a cleaning liquid. The cleaning conditions such as the addition of ultrasonic vibration, the addition of oscillation, and the temporary lifting of the work W are the same as above.

Then, in the third wafer cleaning tank 11C, cleaning is performed with water. The cleaning conditions such as the addition of ultrasonic vibration, the addition of oscillation, the temporary lifting of the work W, etc.
The same as above.

In this cleaning step, the type of cleaning liquid,
The cleaning conditions such as the addition of ultrasonic vibration, the addition of oscillation, and the temporary lifting of the work W should be appropriately performed according to the work W, and are not limited to the above.

[Inversion Step] Next, prior to delivering the cleaned wafer row to the peeling step, that is, prior to immersing the wafer row in the softening bath 31, the fixing member 1 is positioned below. By this reversing step, the fixing member 1 and the wafer row are turned upside down. In this reversing operation, the drive motor 23 is driven to engage the rack 21a and the pinion 22c with each other, and the engagement arm 22b and the work W are
It is performed by rotating 180 degrees around the axis of the wafer row.

[Peeling Step] 1. Softening Step In this step, as indicated by arrow E in FIG.
The inverted wafer row is lowered by an elevating means (not shown), and the adhesive portion between each wafer and the fixing member 1 is
It is immersed in the softening bath 31 maintained at about 90 ° C. by the heater 31a, and fixed by the fixing cylinder 31b and the fixing frame 31c. This softens the adhesive,
Easy peeling.

2. First moving step Next, the holding member 3 set as the retracted position 35B (FIG. 9).
5 is moved to the pressing position 35A. Then, the wafer suction plate 32 sucks one wafer located at the end of the wafer row.

After that, the air slide table 34 is driven to laterally slide the axis of the suction plate rotary actuator 33 through the connecting member 34a, so that the wafer is sucked onto the wafer suction plate 32, The wafer is moved in the in-plane direction together with the wafer suction plate 32 as shown by an arrow F in FIGS. 7 and 9. in this case,
The jet of the air flow from the air nozzle 37 is performed in parallel.

As a result, the adhesive points 30a to 30
b (FIG. 9), of the bonded portion between the wafer and the fixing member 1, the wafer rotates with respect to the fixing member 1 with the end point 30b of the bonded portion as a fulcrum, and gradually and continuously from the other end point 30a side. , The softened adhesive part will come off.

3. Second moving step Next, in a state where the air flow from the air nozzle 37 is jetted in parallel, the wafer is attracted to the wafer suction plate 32 as shown by an arrow G in FIGS. 7 and 9 together with the wafer suction plate 32. The slit 35a of the holding member 35 is inserted, and the rotary actuator 33 for the suction disk drives it to rotate largely. In this case, the pressing member 35 remains covering the end portion of the wafer row, and the movement of the wafer suction plate 32 is
It is allowed by the notch 35b of the pressing member 35. As a result, only one wafer is separated from the fixing member 1.

[Single Wafer Cleaning Step] Then, the wafer suction plate 3
The wafer separated by 2 is once housed in the receiving member 44. Further, by tilting the receiving member 44, the wafer is passed through the notches 44b and the belts 45a of the conveyor 45 are conveyed.
And is separated from the receiving member 44 by the frictional force with each belt 45a and is transferred by the conveyor 45 to the single-wafer cleaning means 42 which is the next step. After the transfer, the slide motor 38 is driven to move the wafer suction plate 3
2, swivel arm 32a, rotary actuator 33 for suction plate, air slide table 34, pressing member 35, rotary actuator 36 for pressing member, air nozzle 3
The assembly of 7 and the receiving member 44 is moved by a predetermined length in the direction indicated by arrow D in FIG.

Next, the single-wafer cleaning means 42 performs cleaning by the brush roller 42a while water is being injected from above and below by the spray nozzle 42b, and wafer conveyance and water absorption by the water absorbing roller 42c. Further, the drying means 4
The wafer is dried according to 3.

[Accommodation Step] Finally, the robot 52 uses the cassette 52 to clean each wafer that has been washed and dried.
House inside.

In the present embodiment, after the adhesive is softened in the softening step, the wafer is rotationally moved in the first moving step with the end point of the bonding point as a fulcrum, so that the wafer is moved from the other end side of the bonding point. The adhesive can be gradually and continuously peeled off, and most of the adhesive can be peeled off with a small force. Therefore, peeling can be achieved without imposing a burden on the wafer, and the wafer is not cracked or chipped. In addition, in the second moving step, the wafer is further moved in the surface direction to move the wafer out of the region of the wafer row. In this case, since most of the adhesive has already been peeled off, peeling can be achieved with a small force.

Further, by injecting the air flow toward the gap between the wafers, the surface tension acting between the wafers can be reduced, and the force required for peeling can be further reduced.

Moreover, when the wafer is moved to the outside of the area of the wafer row, the holding member 35 is arranged at the holding position 35A near the end portion of the wafer row, so that the slit 35a of the holding member 35 causes the end of the holding member 35 to move. It is possible to allow only one wafer located in the part to be inserted, and it is possible to prevent adjacent wafers from moving along with each other.

Since the reversing mechanism 20 is provided, the transfer with the previous process can be smoothly achieved.

The present invention is not limited to the above-mentioned embodiment, but may have the following forms. a) Targeting a wafer of any semiconductor material, magnetic material, ceramics, etc., instead of a silicon wafer. b) Targeting a wafer of any size, instead of a wafer having a diameter of 8 inches. c) In the peeling process, in addition to using the air slide table 34 to shift the wafer at the end of the wafer row in the surface direction, use the cylinder 34b and the hook 34c to shift the wafer at the end of the wafer row in the surface direction. thing. Alternatively,
Use additional stripping equipment. d) Injecting an inert gas such as nitrogen or argon, or any other gas, instead of injecting air between the wafers. Alternatively, injecting an arbitrary mixed gas. e) In the stripping step, instead of stripping the wafers one by one from one end in the lengthwise direction of the wafer row, stripping the wafers one by one from both ends in the lengthwise direction of the wafer row. . Alternatively, peel off from any position.

[0062]

According to the wafer peeling method and apparatus of the present invention, the following effects can be obtained. According to the above wafer peeling method, after the adhesive is softened in the softening step, the wafer is rotationally moved in the first moving step with the end point of the bonding point as a fulcrum, so that the other end point side of the bonding point is moved. The adhesive can be gradually and continuously peeled off, and most of the adhesive can be peeled off with a small force. In addition, in the second moving step, the wafer is further moved in the surface direction to move the wafer out of the region of the wafer row. In this case, since most of the adhesive has already been peeled off, peeling can be achieved with a small force. According to the above method for separating wafers, by injecting the gas flow toward the gap between the wafers, the surface tension acting between the wafers can be reduced, and the force required for separation can be reduced. , Can be made smaller.

According to the above wafer peeling apparatus, the adhesive is softened by immersing the bonded portion in the softening bath,
Then, by using the first moving means to relatively slide the wafer suction plate and the fixing member, the wafer is rotationally moved in the plane direction with the end point of the bonded portion between the wafer and the fixing member as a fulcrum. Therefore, the adhesive can be gradually and continuously peeled off from the other end point side of the bonded portion, and most of the adhesive can be peeled off with a small force. Further, the second moving means is used to move the wafer out of the region of the wafer row. In this case, since most of the adhesive has already been peeled off, peeling can be achieved with a small force. Up
According to the peeling apparatus of serial wafer, in the vicinity of the wafer is peeled off, since the nozzle for injecting a gas flow toward the gap between the wafer is peeled off the wafer adjacent to the wafer are provided The surface tension acting between the wafers can be reduced, and the force required for peeling can be further reduced. According to the above wafer peeling apparatus,
When the wafer is moved by the second moving means, since the holding member is arranged at the holding position near the end of the wafer row, the slit of the holding member allows only one wafer to be inserted, and It is possible to prevent the moving wafer from moving. According to the above wafer peeling apparatus, since the reversing mechanism is provided, the delivery to the previous step can be smoothly achieved.

[Brief description of drawings]

FIG. 1 is a front view showing a wafer cleaning apparatus including an embodiment of a wafer peeling apparatus of the present invention.

FIG. 2 is a side view showing a cleaning apparatus for the wafer shown in FIG.

FIG. 3 is a perspective view showing a work targeted by the wafer peeling apparatus of the present invention.

FIG. 4 is a side view showing a cleaning mechanism in the wafer cleaning apparatus shown in FIG.

5 is a front view showing a wafer row transfer means in the cleaning mechanism shown in FIG.

FIG. 6 is an enlarged side view showing a part of the wafer row transfer means shown in FIG.

FIG. 7 is a left side view of the reversing mechanism in the wafer peeling apparatus of the present invention as seen from the direction of arrow A in FIG.

8 is a front view of the reversing mechanism shown in FIG. 7 viewed from the direction of arrow B in FIG.

FIG. 9 is a left side view of an embodiment of the peeling device of the present invention as viewed in the direction of arrow A in FIG.

10 is a front view of the peeling device shown in FIG. 9 as seen from the direction of arrow C in FIG.

11 is a plan view showing the peeling device shown in FIG. 9. FIG.

12 is a plan view showing a single-wafer cleaning mechanism in the wafer cleaning apparatus shown in FIG.

13 is a front view showing the single-wafer cleaning mechanism shown in FIG. 12 in detail.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Fixing member 20 Inversion mechanism 21a Rack 22 Supporting member 22b Engaging arm 22c Pinion 23 Drive motor (rotary driving means) 30 Stripping device 30b End point (fulcrum) 31 Softening tank 32 Wafer suction plate 33 Rotary actuator for suction plate (2nd movement) 34) Air slide table (first moving means) 37 Air nozzle (nozzle) 35a Slit 35b Notch 35 Holding member 35A Holding position 35B Retracting position 36 Holding member rotary actuator (holding member driving means)

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-9-237770 (JP, A) JP-A-6-208979 (JP, A) JP-A-7-106287 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 21/304

Claims (4)

(57) [Claims] 1. An apparatus for separating each wafer from a wafer row in a state of being adhered to a fixing member via an adhesive, wherein the adhesive is softened by immersing the bonded portion by the adhesive. A softening bath for allowing the wafer to be sucked onto the surface of the wafer located at the end of the wafer row, and the wafer suction plate and the fixing member are slid relative to each other in the plane direction of the wafer. A first moving means for rotationally moving the wafer in the surface direction with an end point of a bonding portion between the fixing member and the fixing member as a fulcrum, and further, moving the wafer suction plate to move the wafer in the surface direction. And a second moving means for moving the wafer out of the area of the wafer row. 2. The wafer peeling apparatus according to claim 1 , wherein a gas flow is injected in the vicinity of the wafer to be peeled toward a gap between the wafer to be peeled and a wafer adjacent to the wafer. 1. A wafer peeling apparatus, characterized in that the nozzle of (1) is provided. 3. The wafer peeling apparatus according to claim 1 or 2 , wherein a slit that covers the vicinity of the end of the wafer row and allows a single wafer located at the end to pass through, and the wafer. A pressing member having a notch that allows the suction of the wafer suction plate to move, and between the pressing position of the pressing member near the end of the wafer row and a retracted position separated from the pressing position. A wafer peeling apparatus, characterized in that a pressing member driving means for moving the wafer is provided. 4. The wafer stripping apparatus according to claim 1, 2 or 3 , wherein the fixing member and the wafer row are rotated around an axis of the wafer row before the wafer row is immersed in the softening bath. A reversing mechanism for rotating is provided, and the reversing mechanism includes a rack arranged perpendicularly to the length direction of the wafer row, a pinion rolling in engagement with the rack, and the pinion. For rotating and driving the support member, which has an engaging arm that engages with the fixing member in a state of turning along with the rolling of the pinion and aligning the axis of the pinion with the axis of the wafer row. And a rotation driving means for the wafer peeling device.