JP6621950B1 - Wafer peeling and cleaning equipment - Google Patents

Abstract

An object of the present invention is to peel off wafers one by one with a small force and to surely transport the peeled wafers to a delivery device or a single wafer cleaning unit. In a wafer peeling and cleaning apparatus, a wafer peeling single wafer unit (100) is installed in a hot water tank (112) and holds a wafer (W). A first peeling suction pad 200 arranged so as to coincide with the central axis of the first, a second peeling suction pad 201 arranged below the first peeling suction pad 200 and expanding and contracting in the axial direction, A first feed motor 148 that moves the first and second peeling suction pads 200 and 201 along the guide rail 136 along the longitudinal direction of the hot water tank 112; and a first and second peeling suction pads 200 and 201. A vertical rotary actuator 204 that moves vertically upward and downward. [Selection diagram] FIG.

Description

  The present invention relates to a wafer peeling and cleaning apparatus, and more particularly to a wafer peeling and cleaning apparatus that peels wafers that have been simultaneously cut into a plurality of pieces with a wire saw into a batch state (bundled) from a slice base into single wafers and cleaned.

  When the ingot is cut with a wire saw, all the wafers are cut out in a state of being bonded to the slice base. For this reason, the wafer needs to be peeled off from the slice base into a single wafer. Further, since the processing liquid or the like is attached to the wafer immediately after being cut by the wire saw, it is necessary to clean the wafer to remove the processing liquid.

  Conventionally, this wafer peeling operation and cleaning operation have been performed by a single wafer peeling and cleaning apparatus. Further, the wafer peeling cleaning apparatus includes a rough cleaning unit, a wafer peeling single wafer unit, a cleaning unit, and a recovery unit. A wafer immediately after cutting is first transported to the rough cleaning unit and roughly cleaned. The roughly cleaned wafers in a batch state are transported to the wafer separation sheet unit, where the wafers are separated one by one from the slice base and separated into sheets. The wafers peeled off from the slice base are transported to the single wafer cleaning unit by the delivery device and single wafer cleaned, and then collected one by one in the recovery unit and stored in the cassette.

  In the wafer peeling single wafer portion, in order to efficiently peel the wafer, a pair of peeling suction pads are arranged at a predetermined interval, and the wafer is vacuum-sucked and held by the pair of peeling suction pads. And it is known that the peeling suction pad is swung in the front-rear direction, moved up and down by a lifting rotary actuator and stopped at a predetermined delivery position, which is described in Patent Document 1.

JP 11-288902 A

  In the thing of patent document 1, since a wafer is vacuum-sucked by a pair of peeling suction pads, it swings in the front-rear direction, and moves up and down, which is desirable in terms of efficiently peeling the wafer, but was peeled off It is not sufficient to reliably deliver the wafer to the delivery suction pad at the delivery position after lifting the wafer. In particular, if the speed of raising / lowering movement is increased to improve efficiency, there is a risk that the wafer may fall along the way, or the posture of the wafer may become unstable and be damaged.

  The object of the present invention is to solve the above-mentioned problems of the prior art, and to easily peel wafers one by one with a small force and to reliably transport the peeled wafers to a delivery device or a single wafer cleaning unit. The object is to obtain a wafer peeling and cleaning apparatus that has a low rate, shortens the time, and improves the efficiency as a whole.

  In order to solve the above-mentioned problems, the present invention provides a wafer separation unit in which a batch of wafers that have been cut simultaneously are separated from a slice base one by one in a wafer separation sheet unit, and the separated wafer is separated into single wafer cleaning units. In the wafer peeling and cleaning apparatus that transports the wafer to a single wafer and recovers the cassette in the cassette after the cleaning, the wafer peeling single wafer portion is formed in a rectangular box shape and a hot water tank in which hot water is stored, A work holding unit that is installed in the hot water tank and holds the wafer, and a first axis arranged so that a central axis coincides with a central axis of the wafer in a state where the wafer is held by the work holding unit. A peeling suction pad, a second peeling suction pad that is disposed below the first peeling suction pad and expands and contracts in the axial direction, and a first guide rail disposed along the longitudinal direction of the hot water tank And before A first feed motor that moves the first and second peeling suction pads along the longitudinal direction of the hot water tank along the first guide rail, and the first and second peeling suction pads vertically moved up and down. And a rotary actuator for moving up and down.

  In the above, it is preferable that the second peeling suction pad is a bellows type vacuum suction pad.

  Further, it is desirable that the first peeling suction pad is a flat vacuum pad having a flat surface and has a stronger suction force than the second peeling suction pad.

  Furthermore, when the wafers are peeled from the wafers in a batch state one by one, the wafers are sucked and held by the second peeling suction pads coming into contact with the end surfaces of the wafers, and then the first It is desirable that the separation be performed by adsorbing the central axis of the wafer with a peeling suction pad.

  Furthermore, it has a detent plate for preventing the wafer from falling forward when the wafers are peeled from the batch wafers one by one, and the second peeling suction pad is used for the batch wafers. It is desirable to pull the wafer toward the end plate side in the vicinity of the vicinity of the bonding portion.

  Further, a swing rotary actuator is provided for swinging the first and second stripping suction pads in a direction along the axis of the wafer, and the swing rotary actuator is driven to drive the first and second stripping suction. It is desirable that the wafer is peeled from the slice base by swinging a pad.

  Furthermore, it is desirable to provide a water supply nozzle vertically above the wafer and supply hot water or water from near the center vertically above the wafer when the wafers are peeled one by one.

  Further, the wafer has air nozzles provided on both side surfaces of the wafer, and the wafer end surfaces set in the hot water tank are sucked and held by the first and second peeling suction pads to peel the wafers one by one. In doing so, it is desirable to blow and supply air to the side surface of the wafer by the air nozzle.

  Further, it is preferable that the air nozzle blows and supplies air from the lower side to the upper side of the wafer.

  Further, it is preferable that the air nozzle blows and supplies air to a plurality of batched sheets when peeling one wafer.

  According to the present invention, in a state where the wafer is held by the workpiece holding unit, the first peeling suction pad arranged so that the central axis coincides with the central axis of the wafer, and the first peeling suction pad below the first peeling suction pad. The second peeling suction pad that is disposed on the side and expands and contracts in the axial direction is provided, so that the wafers can be easily peeled one by one with a small force, and the peeled wafers can be transferred to a delivery device or a single wafer cleaning unit. By transporting reliably, the time can be shortened and the overall efficiency can be improved.

Plan view showing the entire configuration of the wafer peeling cleaning device Plan view showing the configuration of the wafer peeling sheet Plan view showing the configuration of the peeling device Plane partial sectional view showing the configuration of the delivery device Front view showing the configuration of the peeling device Side view showing the configuration of the peeling device Front view showing the configuration of the wafer peeling wafer Front view showing the configuration of the delivery device Side surface partial sectional view showing the configuration of the delivery device Enlarged side view of the main part showing details of the adsorption part for peeling Enlarged front view of the main part showing details of the adsorption part for peeling Explanatory drawing of action of peeling work Side view showing configuration of single wafer cleaning unit Plan view showing the configuration of the transport unit Plan view showing the configuration of the recovery unit

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing a configuration of a wafer peeling cleaning apparatus 1 according to the present invention, and FIG. 2 is a plan view showing a configuration of a wafer peeling single wafer portion 100. As shown in FIG. 1, the wafer peeling and cleaning apparatus 1 according to the present embodiment mainly includes a rough cleaning unit 10, a wafer peeling sheet 100, a transfer unit 310, a sheet cleaning unit 350, a detection unit 400, and a recovery unit 500. It is configured as a part. An outline of each main part will be described.

  The rough cleaning unit 10 performs shower cleaning on the wafer W in a batch state immediately after being cut by the wire saw (wafer W bonded to the slice base S), and removes the slurry adhered at the time of cutting. The rough cleaning unit 10 includes a rough cleaning device 12 that cleans the wafer W. The rough cleaning device 12 has a cleaning step of immersing and cleaning with the mounting plate M facing upward and the slicing groove facing downward. Rinse up and down while washing to create a water flow in the groove. When the cleaning is completed, the wafer carried out from the rough cleaning unit 10 is directly transferred to the next wafer peeling sheet 100 by a lifter.

The wafer peeling single wafer portion 100 peels the wafers W in a batch state from the slice base S one by one to form a single wafer. And the wafer peeling sheet | seat part 100 is comprised by making the hot water tank 112, the peeling apparatus 114, and the delivery apparatus 118 into the main apparatus, as shown in FIG. The delivery device 118 is a device that receives the wafer peeled from the slice base S by the peeling device 114 and delivers it to the shuttle conveyor 312 of the transfer unit 310.

  The transfer unit 310 receives the wafer W peeled and separated by the wafer peeling sheet unit 100 and transfers the wafer W to the next sheet cleaning unit 350. Then, the wafer W is transferred to the single wafer cleaning unit 350 by the shuttle conveyor 312 provided in the transfer unit 310.

  The single wafer cleaning unit 350 cleans the wafers W separated by the wafer separation single wafer unit 100 one by one. The single wafer cleaning unit 350 includes a single sheet brush cleaning unit 352, a single wafer pre-rinse unit 354, and a single wafer rinse unit 356. The single wafer brush cleaning unit 352 performs brush cleaning while applying a cleaning liquid to the back surface of the transferred wafer W. After cleaning, in order not to bring the cleaning liquid into the next process, the compressed air is sprayed to drain the liquid. Then, the wafer W after the brush cleaning is transferred to the single wafer pre-rinsing unit 354 in the next process.

  The single wafer pre-rinsing unit 354 performs brush cleaning with a rotating brush while applying the pre-rinsing liquid from the pre-rinsing liquid nozzle to the back surface of the transferred wafer. After washing, the liquid is discharged by jetting compressed air. And it conveys to the single wafer rinse part 356 of the next process.

  The single wafer rinse section 356 is brush-washed with a rotating brush while applying a rinse liquid from a rinse liquid nozzle to the back surface of the wafer. After the cleaning, the drained wafer W is transferred onto the round belt conveyor 411 of the detection unit 400 and transferred to a predetermined receiving position of the detection unit 400.

  The detection unit 400 detects the presence / absence of cracks, chips, and adhesive remaining for each wafer W that has been cleaned, and measures the thickness of each wafer. Then, the detected wafer W is delivered to the wafer transfer robot 508 of the collection unit 500.

  The wafer transfer robot 508 is an articulated robot, and a swivelable hand unit 520 is provided at the tip, and the wafer W is sucked and held by a suction pad 522 provided at the tip of the hand unit 520. Is done. The recovery unit 500 separates the adhesive remaining wafer and the defective wafer (cracked wafer, chipped wafer, defective thickness wafer, end material) into two wafer recovery units 502A and 502B that recover normal wafers, and the defective wafer. The defective wafer collecting unit 504 for collecting the adhesive remaining wafer and the adhesive remaining wafer collecting unit 506 for collecting the remaining adhesive wafer.

  Then, the wafer transfer robot 508 receives the wafer W from the detection unit 400, and sorts and stores the wafer W in the cassettes of the wafer collection units 502, 504, and 506 based on the detection result.

  Next, details of the wafer separation sheet 100 will be described. 2 is a plan view showing the configuration of the wafer peeling sheet 100, FIG. 3 is a plan view showing the configuration of the peeling device 114, FIG. 4 is a partial plan view of the plane showing the configuration of the delivery device 118, and FIG. FIG. 6 is a side view showing the configuration of the peeling device 114, FIG. 7 is a front view showing the configuration of the wafer peeling sheet 100, and FIG. 8 is a front view showing the configuration of the delivery device 118. 9 is a side partial sectional view showing the configuration of the delivery device 118. The wafer peeling sheet 100 is composed mainly of a hot water tank 112, a peeling device 114, and a delivery device 118.

  The configuration of the hot water tank 112 will be described. The hot water tank 112 is formed in a rectangular box shape, and hot water 120 is stored therein. The wafer W to be peeled from the slice base S is set on a work holding unit 122 provided in the hot water tank 112. Then, by setting the wafer W on the work holding unit 122, the slice base S bonded to the wafer W is immersed in the hot water 120.

  A schematic configuration of the peeling apparatus 114 will be described mainly with reference to FIG. The peeling device 114 is a device that peels the wafers W set in the hot water tank 112 from the slice base S one by one. As shown in FIGS. 2 and 5, a pair of first guide rails 136 and 136 are disposed in the vicinity of the right side of the hot water tank 112 along the longitudinal direction of the hot water tank 112. On the first guide rails 136 and 136, a first slide table (running body) 140 is slidably supported via linear guides 138 and 138 (FIG. 5).

  A nut member 142 (FIG. 5) is fixed to the lower surface of the first slide table 140, and the nut member 142 is screwed to a screw rod 144 disposed between the pair of first guide rails 136 and 136. ing. Both end portions of the screw rod 144 are rotatably supported by bearing members 146 and 146, and the first end of the first guide rails 136 and 136 is installed at one end of the screw rod 144. A feed motor 148 (FIG. 6) is connected. The screw rod 144 rotates by driving the first feed motor 148, and as a result, the first slide table 140 moves along the first guide rails 136 and 136.

  On the first slide table 140, a peeling unit 150 for peeling the wafer W from the slice base S is provided. As shown in FIGS. 3, 5, and 6, the peeling unit 150 is provided with a bearing block 152 on the first slide table 140. A spindle 156 provided at the base end of the swing frame 154 is supported on the bearing block 152 so as to be swingable.

  A swing rotary actuator 160 is installed on the first slide table 140 via a bracket 158, and a drive gear 162 is fixed to the output shaft of the swing rotary actuator 160. A driven gear 164 is engaged with the drive gear 162, and the driven gear 164 is fixed to the tip of the rotating shaft 168. The rotating shaft 168 is rotatably supported by a bearing member 170, and the bearing member 170 is supported by a support plate 172 fixed to the swinging rotary actuator 160.

  A rotating plate 174 (FIGS. 5 and 6) formed in a disk shape is coaxially fixed to the driven gear 164, and one end of a connecting rod 176 is connected to the rotating plate 174 by a pin 178. . The other end of the connecting rod 176 is connected to the swing frame 154 by a pin 180.

  With the above configuration, the swing frame 154 swings around the support shaft 156 provided at the base end portion thereof by driving the swing rotary actuator 160. That is, when the swing rotary actuator 160 is driven, the rotary plate 174 reciprocates within a range of 180 °, and the reciprocating rotation is transmitted to the swing frame 154 via the connecting rod 176, so that the swing frame 154 swings.

  A bearing unit 182 is provided at the upper end of the swing frame 154, and two rotating shafts 186 and 188 are rotatably supported on the bearing unit 182. Arms 190 and 192 are fixed to the distal ends of the rotation shafts 186 and 188, respectively, and the distal ends of the arms 190 and 192 are connected to the pad support plate 198 via pins 194 and 196, respectively. A pair of first and second peeling suction pads 200 and 201 are disposed on the pad support plate 198 at a predetermined interval. The first and second peeling suction pads 200 and 201 vacuum-suck the wafer W. And hold.

  A support plate 202 is attached to the back surface of the swing frame 154, and a lifting rotary actuator 204 is installed on the support plate 202. A fan-shaped rotating plate 206 is fixed to the output shaft of the lifting rotary actuator 204, and one end of a connecting rod 208 is connected to the rotating plate 206 by a pin 210. The other end of the connecting rod 208 is connected to one arm 190 by a pin 212.

  With the above configuration, the first and second peeling suction pads 200 and 201 provided on the pad support plate 198 are moved up and down vertically by driving the lifting rotary actuator 204. That is, when the rotary actuator 204 is driven, the rotary plate 206 reciprocates in the range of 180 °, and the reciprocating rotation is transmitted to the arm 190 via the connecting rod 208, and one arm 190 reciprocates in the vertical direction. I do. When the arm 190 reciprocates, the other arm 192 also reciprocates and reciprocates, and as a result, the first and second peeling suction pads 200 and 201 provided on the pad support plate 198. Is lifted vertically upward.

  The first and second peeling suction pads 200 and 201 for sucking and holding the wafer W are moved up and down by driving the lift rotary actuator 204. Further, since the pad support plate 198 provided with the first and second peeling suction pads 200 and 201 is connected to the swing frame 154 via the arms 190 and 192, the swing frame 154 swings. By doing so, it swings back and forth.

  That is, the first and second peeling suction pads 200 and 201 swing in the front-rear direction when the swing rotary actuator 160 is driven, and move up and down when the lift rotary actuator 204 is driven. Then, the wafer W is peeled from the slice base S by the first and second peeling suction pads 200 and 201 as follows.

  The end surface of the wafer W set in the hot water tank 112 is sucked and held by the first and second peeling suction pads 200 and 201. Next, the swing rotary actuator 160 is driven to swing the first and second peeling suction pads 200 and 201 in the front-rear direction (the direction along the axis of the wafer). Here, since the adhesive bonding the wafer W and the slice base S is immersed in the hot water 120, it is sufficiently softened by heat. For this reason, the wafer W is peeled from the slice base S by being swung a plurality of times.

  When the wafer W is peeled from the slice base S, the lifting rotary actuator 204 is driven, and the first and second peeling suction pads 200 and 201 move upward while holding the peeled wafer W. And it stops at a predetermined delivery position. The wafer W transferred to the delivery position is delivered to the delivery device 118, then transferred to the shuttle conveyor 312 by the delivery device 118, and transferred to the next process by the shuttle conveyor 312.

  On the other hand, the first and second peeling suction pads 200 and 201 that have finished transferring the wafer W are driven by the lifting rotary actuator 204 to move downward and return to the original peeling work position. The wafer W is peeled from the slice base S by swinging the end surface thereof by the first and second peeling suction pads 200 and 201, but the first and second peeling suction pads are included in the wafer W. Some have peeled off from the slice base S before being given rocking at 200 and 201.

  In this case, the wafer W may fall forward and become uncollectable. For this reason, an anti-rotation plate 214 for preventing the wafer W from falling forward is disposed at the front position of the wafer W to be peeled. The retaining plate 214 is provided on the support plate 202 on which the lifting rotary actuator 204 is installed, and swings together with the first and second peeling suction pads 200 and 201.

  The first and second peeling suction pads 200 and 201 move up and down through a passage 214a formed in the retaining plate 214. In addition, a two-sheet prevention plate 216 is fixed to the upper portion of the retaining plate 214, and the wafer W peeled from the slice base S passes through a slit 216 a formed in the two-sheet prevention plate 216 and is predetermined. To the delivery position. The slit 216a is formed with a width that allows just one wafer W to pass through (for example, a width that is 1.1 to 1.5 times the thickness of the wafer W). In this case, it is possible to prevent the two wafers from sticking to each other and being simultaneously transferred to the delivery position. Specifically, by making the width of the slit 216a 1.1 to 1.5 times the thickness of the wafer W, it is possible to prevent the simultaneous transfer of two sheets and to prevent the surface from being scratched. it can.

  As a result, even when the two wafers were peeled from the slice base at the same time and adhered to each other, they adhered to the first wafer when passing through the slit 216a of the two-sheet prevention plate 216. Since the second wafer falls without passing through the slit 216a, it can always be transferred to the delivery position one by one. In this case, since the wafer that has fallen without passing through the slit 216a is prevented from falling forward by the retaining plate 214, it can be reliably recovered at the next peeling.

  Next, a schematic configuration of the delivery device 118 will be described. The delivery device 118 is a device that receives the wafer W peeled from the slice base S by the first peeling suction pad 200 of the peeling device 114 from the first peeling suction pad 200 and delivers it to the shuttle conveyor 312. As shown in FIGS. 2, 4 and 7, 8, and 9, the delivery device 118 is provided on the second slide table 240 of the drive unit 222. It moves along the guide rails 236, 236.

  On the second slide table 240 of the drive unit 222, a support column 274 is erected vertically. A support frame 276 is erected vertically on the top of the support column 274, and a turning rotary actuator 278 is horizontally installed on the support frame 276. A drive gear 280 is engaged with the output shaft of the turning rotary actuator 278, and a driven gear 282 fixed to the turning shaft 284 is engaged with the drive gear 280. The turning shaft 284 is rotatably supported by a bearing unit 286 installed on the top of the support frame 276, and rotates within a range of 180 ° by driving the turning rotary actuator 278.

  A turning frame 288 is fixed to a base end portion of the turning shaft 284, and a rotating shaft 290 is rotatably supported by the turning frame 288. An output shaft of a direction changing rotary actuator 292 installed on the revolving frame 288 is fixed to the base end portion of the rotating shaft 290. By rotating the direction changing rotary actuator 292, the output shaft can be rotated within a range of 90 °. Move.

  A turning arm 294 formed in an L shape is fixed to the tip of the rotating shaft 290, and a support plate 296 is fixed to the tip of the turning arm 294. The support plate 296 is provided with a pad advancing / retreating cylinder 298, and a delivery suction pad 300 is provided at the rod tip of the pad advancing / retreating cylinder 298. The wafer W peeled by the first and second peeling suction pads 200 and 201 of the peeling device 114 is transferred to a predetermined delivery position and then delivered to the delivery suction pad 300.

  In the delivery device 118, the wafer W sucked and held by the delivery suction pad 300 is rotated within a range of 180 ° on the vertical plane by driving the turning rotary actuator 278 to drive the direction changing rotary actuator 292. By doing so, the direction is changed from the vertical state to the horizontal state.

  Reception of the wafer W peeled by the peeling device 114 and delivery of the received wafer W onto the shuttle conveyor 312 are performed as follows. The wafer W peeled from the slice base S rises while being sucked and held by the first and second peeling suction pads 200 and 201 and is transferred to a predetermined delivery position. The delivery suction pad 300 is already waiting at the delivery position, and the wafer W is positioned coaxially with the axis of the delivery suction pad 300.

  When the wafer W is transferred to the delivery position, the pad advancing / retreating cylinder 298 is driven to advance the delivery suction pad 300 by a predetermined amount toward the wafer W. As a result, the delivery suction pad 300 comes into close contact with the end surface of the wafer W. Next, the delivery suction pad 300 is driven, and the wafer W is sucked and held by the delivery suction pad 300. The fact that the wafer W is sucked and held on the delivery suction pad 300 is detected by a touch sensor (not shown) provided on the delivery suction pad 300 side. Then, by this detection signal, the vacuum suction of the first peeling suction pad 200 is released, that is, air is introduced. As a result, the wafer W is delivered from the first peeling suction pad 200 to the delivery suction pad 300. The release of the vacuum suction of the second peeling suction pad 201 may be performed simultaneously with the release of the first peeling suction pad 200. However, it may be released before the wafer W rises or before it is transferred to the delivery position, which stabilizes the posture of the wafer W.

  The delivery suction pad 300 that has received the wafer W starts to drive the pad advancing / retreating cylinder 298 in response to a detection signal from the touch sensor, and retreats from the first peeling suction pad 200. Similarly, the first peeling suction pad 200 that has transferred the wafer W starts to descend by a detection signal from the touch sensor and returns to the original peeling work position. When the delivery suction pad 300 moves backward, the turning rotary actuator 278 is then driven, and the turning arm 294 turns 180 °. As a result, the wafer W is transferred to a position above the shuttle conveyor 312.

  Since the wafer W transferred above the shuttle conveyor 312 is in a state orthogonal to the shuttle conveyor 312, after the transfer, the direction changing rotary actuator 292 is driven and the turning arm 294 is centered on the rotation axis 290. Rotate 90 °. As a result, the wafer W is positioned horizontally from the shuttle conveyor 312 at a predetermined height.

  After the direction changing rotary actuator 292 is driven, the pad advancing / retreating cylinder 298 is driven, and the delivery suction pad 300 moves forward by a predetermined amount toward the shuttle conveyor 312. As a result, the wafer W is placed on the shuttle conveyor 312. When the wafer W is placed on the shuttle conveyor 312, the driving of the delivery suction pad 300 is stopped. Then, the pad advancing / retreating cylinder 298 is driven and the delivery suction pad 300 is retracted from the shuttle conveyor 312.

  After completion of the wafer W delivery operation, the delivery suction pad 300 returns to the original delivery position by the reverse operation to that described above. On the other hand, the shuttle conveyor 312 to which the wafer W has been transferred is driven by a driving means (not shown) and transports the transferred wafer W to the next process. The driving of the wafer separation sheet 100 is automatically controlled by a control device (not shown), and each component device operates based on a drive signal output from the control device.

  Next, details of the wafer peeling method in the wafer peeling sheet 100 will be described. In the state before the start, the first slide table 140 on which the peeling unit 150 is installed is located at one end (the lower end in FIG. 2) of the first guide rail 136 (this position is referred to as a peeling work start position). . On the other hand, the second slide table 240 on which the delivery device 118 is installed is located at the other end (the upper end in FIG. 2) of the second guide rail 236.

  The wafer W that has been multi-cut with a wire saw is set in a work holding unit 122 provided in the hot water tank 112. Thereby, the slice base S to which the wafer W is bonded is immersed in the hot water 120 stored in the hot water tank 112. The wafer W may be set manually by an operator, or may be automatically transferred to the workpiece holding unit 122 by a manipulator (not shown) and set automatically.

  When the wafer W is set in the hot water tank 112, the control device first drives the second feed motor 248 to move the second slide table 240 downward in FIG. Next, the second slide table 240 is positioned at a predetermined delivery work start position. Then, when the second slide table 240 is positioned at the start position of the delivery work, the wafer W peeling work is started.

  Next, the control device drives the first feed motor 148 and the second feed motor 248 in synchronization, and advances the first slide table 140 and the second slide table 240 (moves them upward in FIG. 2). The pad support plate 198 of the peeling device 114 provided on the first slide table 140 is provided with a non-contact type position sensor 214S. The position sensor 214S has a predetermined distance from the end surface of the wafer W. Activates when reached.

  The control device stops driving of the first feed motor 148 and the second feed motor 248 by inputting an operation signal of the position sensor 214S, and stops the first slide table 140 and the second slide table 240. As a result, the first and second peeling suction pads 200 and 201 of the peeling device 114 provided on the first slide table 140 come into contact with the end surface of the wafer W. The control device drives the first and second peeling suction pads 200 and 201 that are in contact with the end surface of the wafer W, and causes the first and second peeling suction pads 200 and 201 to hold the wafer W by suction.

  FIG. 10 is an enlarged side view of the main part showing details of the peeling adsorption part, and FIG. 11 is an enlarged front view. The end plate 214 has a reference surface on the end face side of the wafer W, a resin-made pressing plate 214-1 for protecting the surface, and the opposite side for ensuring the flatness of the pressing plate 214-1. -2. Further, the first peeling suction pad 200 is arranged so that the central axis thereof coincides with the central axis of the wafer W, and the second peeling suction pad 201 is arranged below the first peeling suction pad 200. . The first peeling suction pad 200 is a flat vacuum pad suitable for transporting a workpiece having a flat surface, and has a stronger suction force than the second peeling suction pad 201. The second peeling suction pad 201 is a bellows-type vacuum suction pad having a loose shape that expands and contracts in the axial direction.

  The wafer W is bonded to the slice base S with an adhesive and is disposed so as to be on the upper side with respect to the mounting plate M. Then, the wafer W is set on the work holding unit 122 of the hot water tank 112. Here, since the adhesive bonding the wafer W and the slice base S is immersed in the hot water 120, it is sufficiently softened by heat. Next to the slice base S, an air supply mechanism is provided, and air nozzles 80 and 81 are provided on both lower side surfaces of the wafer W. The air nozzles 80 and 81 are installed so as to blow air from the lower side to the upper side of the side surface 2 of the wafer W, that is, blow air vigorously. A water supply nozzle (not shown) is provided in the vicinity of the center of the wafer vertically above the wafer W.

  The suction holding of the wafer W by the first and second peeling suction pads 200 and 201 is performed as follows. First, the second peeling suction pad 201 comes into contact with the end surface of the wafer W. Since the second peeling suction pad 201 is a bellows type vacuum suction pad below the center axis of the wafer W, the base of the wafer W is drawn toward the end plate 214 side around the vicinity of the bonding portion. Thereby, the peeling work is started reliably and efficiently.

  FIG. 12 is an explanatory diagram of the action of the peeling operation. When peeling one wafer W, air nozzles 80 and 81 are used to remove a plurality of wafers on both side surfaces of the wafer W as indicated by arrows F and G. Air is blown from the side toward the upper side.

  Specifically, air is blown and supplied between at least the first and second wafers W, which is the leftmost first wafer W separated in FIG. In addition, it is desirable to blow and supply air between the second and third sheets and between the third and fourth sheets in order to efficiently peel off. However, the adhesive that bonds the wafer W and the slice base S while performing several peeling operations is sufficiently softened because it is immersed in the hot water 120. As the process proceeds, the number of blows supplied may be reduced at the same time.

  On the other hand, by supplying hot water or water from the vicinity of the center in the vertical direction above the wafer W as indicated by an arrow H, water is supplied from the center, and a constant gap can be ensured at the center. Then, by flowing air from both sides of the wafer W, the gaps on both sides can be maintained in a well-balanced manner, and the wafers can be neatly cut.

  That is, the water film is removed by supplying air, the wafer W is prevented from sticking with the surface tension of the water, the edge is cut, and when one wafer W is lifted, the next wafer is lifted together. This can be prevented. In addition, air is blown to a plurality of wafers, and in particular, air is blown between the first and second wafers and between the second and third wafers. The standby wafer W (second wafer) and the next standby wafer W (third wafer) can also be avoided. Thereby, the efficiency can be improved when the peeling operation is successively continued.

  After pulling the wafer W to the end plate 214 side by the second peeling suction pad 201, the central axis of the wafer W is firmly sucked by the first peeling suction pad 200 which is a flat vacuum pad having a flat surface. To do. Therefore, the wafer W can be handled in a state suitable for transporting the wafer W in a short time, and the possibility of dropping or the like during the process can be eliminated.

  Next, the control device drives the swing rotary actuator 160 to swing the swing frame 154 back and forth, and moves the first and second peeling suction pads 200 and 201 back and forth (in the direction along the axis of the wafer). Rocks. Further, the first and second peeling suction pads 200 and 201 swing around the vicinity of the bonding portion between the wafer W and the slice base S. For this reason, the wafer W is given a plurality of swings by the first and second peeling suction pads 200 and 201 and is easily peeled from the slice base S. Further, the wafer W can be peeled off from the base by swinging back and forth during peeling, and can be peeled off efficiently as a whole.

  The control device stops driving the swing rotary actuator 160 when the first and second peeling suction pads 200 and 201 are swung a predetermined number of times. Next, the lifting rotary actuator 204 is driven to turn the arms 190 and 192 upward, and the first and second peeling suction pads 200 and 201 are moved upward. At this time, the central axis of the wafer W is firmly fixed by the first peeling suction pad 200.

  The wafer W sucked and held by the first peeling suction pad 200 is guided by a pressing plate 214-1 made of resin (for example, fluororesin) having good slidability and fixed to the upper portion of the retaining plate 214. Further, it passes through the slit 216a (FIG. 3) of the two-sheet prevention plate 216. This prevents two sheets from being taken.

  That is, even when the wafer W to be peeled next adheres to the wafer W sucked and held mainly by the first peeling suction pad 200, the attached wafer W is slit when passing through the slit 216a. Since it is peeled off when passing through 216a, it is possible to always take out only one wafer W1 sucked by the first peeling suction pad 200.

  In addition, since the wafer that has fallen without passing through the slit 216a is prevented from falling forward by the fall-off plate 214, it is reliably recovered at the next peeling. At this time, the end face side of the wafer W comes into contact with a pressing plate 214-1 made of resin (for example, fluororesin) having a very high surface lubricity, so that damage is prevented.

  The first and second peeling suction pads 200 and 201 that have moved upward stop with the chain line position in FIG. 8 as the delivery position. At the delivery position, the delivery suction pad 300 of the delivery device 118 is waiting, and the wafer W whose end face is attracted and held by the first peeling suction pad 200 that firmly attracts the central axis of the wafer W is used for delivery. It is located on the same axis as the axis of the suction pad 300.

  The delivery position is a position where the delivery suction pad 300 is substantially horizontal (position where the swivel arm 294 is horizontal in FIG. 8) and the wafer W remains in a vertical state. It is a difficult position. In addition, after the delivery, the suction pads 200 and 201 can immediately return to the next wafer W peeling operation, and efficient peeling work can be continued successively.

  When the first and second peeling suction pads 200 and 201 stop at a predetermined delivery position, the control device drives the pad advance / retreat cylinder 298 to advance the delivery suction pad 300 by a predetermined amount toward the wafer W. . As a result, the delivery suction pad 300 is in close contact with the back surface of the wafer W sucked by the first peeling suction pad 200. The wafer W is sucked and held by the delivery suction pad 300 on the back surface as well as the end surface on the first peeling suction pad 200 side.

  The fact that the wafer W is sucked and held on the delivery suction pad 300 is detected by a touch sensor (not shown) provided on the delivery suction pad 300 side. Then, by this detection signal, the vacuum suction of the first and second peeling suction pads 200 and 201 is released, that is, air is introduced. The delivery suction pad 300 is a flat vacuum pad having a flat surface like the first peeling suction pad 200, and firmly sucks the central axis of the wafer W. As a result, the wafer W is transferred from the first peeling suction pad 200 to the delivery suction pad 300, and the central axis of the wafer W is firmly sucked by the delivery suction pad 300. Therefore, handling is possible in a state suitable for transporting the wafer W, and the possibility of dropping or the like during the process can be eliminated.

  Next, the control device drives the pad advancing / retreating cylinder 298 to retract the delivery suction pad 300 from the first peeling suction pad 200. As the delivery suction pad 300 moves backward, the controller drives the lifting rotary actuator 204 to turn the arms 190 and 192 downward, and moves the first and second peeling suction pads 200 and 201 downward. Return to the original peeling work position.

  On the other hand, after driving the pad advancing / retreating cylinder 298, the control device drives the turning rotary actuator 278 to turn the turning arm 294 by 180 °, thereby transferring the wafer W to a position above the shuttle conveyor 312. After the transfer, the direction changing rotary actuator 292 is driven. The swivel arm 294 rotates 90 ° about the rotation shaft 290.

  As a result, both end surfaces of the wafer W are parallel to the shuttle conveyor 312. The control device drives the pad advancing / retreating cylinder 298 to advance the delivery suction pad 300 toward the shuttle conveyor 312. As a result, the wafer W is placed on the shuttle conveyor 312. Next, the controller stops driving the delivery suction pad 300 and delivers the wafer W to the shuttle conveyor 312.

  After stopping the delivery suction pad 300, the controller drives the pad advancing / retreating cylinder 298 to retract the delivery suction pad 300 from the shuttle conveyor 312, and drives the shuttle conveyor 312 to move the wafer W next. Transport to process. Further, the controller drives the pad advance / retreat cylinder 298 and then drives the direction changing rotary actuator 292 and the turning rotary actuator 278 to return the delivery suction pad 300 to the original delivery position.

  Until the delivery suction pad 300 returns to the delivery position, the suction pads 200 and 201 perform the peeling operation of the next wafer W, so that the second wafer W peeling operation is completed. Therefore, efficient stripping work is sequentially continued while reducing wasted time.

  That is, the delivery of the first wafer W is completed in a series of steps, and the suction pads 200 and 201 are returned to the original peeling work position as the delivery suction pad 300 is retracted. Then, the control device drives the first feed motor 148 and the second feed motor 248 in synchronization to advance the first slide table 140 and the second slide table 240 by a predetermined amount. As a result, the first and second peeling suction pads 200 and 201 come into contact with the end face of the wafer W to be peeled second. The control device peels the second wafer W by the same method as described above.

  As described above, the wafers W bonded to the slice base S are sequentially peeled and transferred to the next process, and one cycle of peeling work is completed. Next, the transfer unit 310 receives the wafer W peeled and separated by the wafer peeling sheet unit 100 and transfers it to the next sheet cleaning unit 350. The transfer unit 310 includes a shuttle conveyor 312, and the wafer W is transferred to the single wafer cleaning unit 350 by the shuttle conveyor 312.

  The single wafer cleaning unit 350 cleans the wafers W separated by the wafer separation single wafer unit 100 one by one. The single wafer cleaning unit 350 includes a single sheet brush cleaning unit 352, a single wafer pre-rinse unit 354, and a single wafer rinse unit 356.

  FIG. 13 is a side view showing the configuration of the single wafer cleaning section 350, and the single wafer brush cleaning section 352 has a chamber-structured cleaning tank (not shown). As shown, a pair of rotating brushes 378 and 378, a pair of cleaning liquid nozzles 380 and 380 for flowing a cleaning liquid, two pairs of roller conveyors 382, 382, 382 and 382 for transferring wafers, and a pair of air for cutting liquids Knife nozzles 384 and 384 are provided.

  In the single wafer brush cleaning unit 352, brush cleaning is performed by the rotating brushes 378 and 378 while applying cleaning liquid from the cleaning liquid nozzles 380 and 380 to the back surface of the wafer W transferred by the shuttle conveyor 312 of the transfer unit 310. After cleaning, in order not to bring the cleaning liquid into the next process, compressed air is ejected from the air knife nozzles 384 and 384 to drain the liquid. Then, the wafer W that has been subjected to brush cleaning is transferred to the single wafer pre-rinsing unit 354 of the next process by the roller conveyor 382.

  The single wafer pre-rinse section 354 has the same configuration as the single wafer brush cleaning section 352. In the single wafer pre-rinsing unit 354, brush cleaning is performed with a rotating brush while a pre-rinsing liquid is applied from the pre-rinsing liquid nozzle to the back surface of the wafer conveyed by the roller conveyor 382 of the single wafer brush cleaning unit 352. After washing, the liquid is discharged by jetting compressed air. Then, the wafer W that has been subjected to the brush cleaning is transferred to the single wafer rinse section 356 of the next process by the roller conveyor.

  The single wafer rinse section 356 also has substantially the same configuration as the single wafer brush cleaning section 352. In the single wafer rinse section 356, brush cleaning is performed with a rotating brush while rinsing liquid is applied from the rinse liquid nozzle to the back surface of the wafer conveyed by the roller conveyor of the single wafer rinse cleaning section. After cleaning, the wafer W is transferred to the next detection unit 400 by a roller conveyor.

  The detection unit 400 detects the presence / absence of cracks, chips, and adhesive remaining for each wafer W that has been cleaned, and measures the thickness of each wafer. The detection unit 400 lifts the wafer W, which has been cleaned by the single wafer cleaning unit 350, to the predetermined receiving position and the wafer W transferred to the receiving position to the predetermined detection position. A rotation drive unit that rotates, a thickness measurement unit that measures the thickness of the wafer W rotated by the rotation drive unit, and cracks, chips, and adhesive remaining in the wafer W rotated by the rotation drive unit are detected. A defective wafer detection unit and a delivery unit for delivering the detected wafer W to the wafer transfer robot of the next collection unit 500 are configured.

  FIG. 14 is a plan view showing the configuration of the transport unit 402, and the transport unit 402 includes a round belt conveyor 411. The round belt conveyor 411 is connected to the terminal portion of the single wafer cleaning unit 350. A pair of guide members 411a and 411a are disposed on both side portions of the round belt conveyor 411, and the wafer W is guided by the guide members 411a and 411a so as to advance straight.

  As shown in FIG. 14, five positioning pins 412, 412,... Are arranged in a circular arc at the end position of the round belt conveyor 411, and the round belt conveyor is arranged on the positioning pins 412, 412,. When the wafer W conveyed by 411 contacts, the wafer W is positioned at a predetermined receiving position. Further, when the wafer W comes into contact with the positioning pins 412, 412,..., A sensor (not shown) is activated, and the driving of the round belt conveyor 411 is stopped by actuating this sensor. Then, the detected wafer W is delivered to the wafer transfer robot 508 of the collection unit 500.

  FIG. 15 is a plan view showing the configuration of the collection unit 500. Each of the wafer collection units 502A and 502B is provided with a two-stage cassette holder (not shown). The cassette holder is supported by a cassette positioning mechanism (not shown) so as to be movable up and down. Two wafer collection cassettes 510A and 510B for collecting wafers W are set in the cassette holder.

  Like the wafer collection units 502A and 502B, the defective wafer collection unit 504 and the adhesive remaining wafer collection unit 506 are each provided with a cassette holder (not shown), and the cassette holder is supported by a cassette positioning mechanism (not shown) so as to be movable up and down. ing. Then, the defective wafer collection cassette 512 for collecting the defective wafer W and the adhesive remaining wafer collection cassette 514 for collecting the adhesive remaining wafer W are set in the cassette holder.

  When one wafer W is stored, a cassette positioning mechanism (not shown) is driven to raise the wafer collection cassette 510A by one partition. The wafer peeling and cleaning apparatus 1 of the present embodiment is configured as described above. Note that each device constituting the wafer peeling and cleaning apparatus 1 is driven and controlled by a control device (not shown), and operates based on a drive signal output from the control device.

  The wafer peeling and cleaning apparatus 1 described above is a case where a sliced wafer cut by a normal cutting method (a method of cutting only one ingot for one cutting) is peeled and cleaned. The batch-state wafers W cut by the wire saw are transferred to the wafer peeling and cleaning apparatus 1 by a transfer apparatus (not shown).

  And it mounts in the lifter which the wafer peeling cleaning apparatus 1 was equipped with which is not shown in figure. The wafer W mounted on the lifter is first transported to the rough cleaning unit 10 by the lifter. And it is shower-washed there and the slurry adhering at the time of a cutting | disconnection is removed. The shower cleaning in the rough cleaning unit 10 is performed while being mounted on the lifter. When the shower cleaning is completed, the wafer is transferred to the wafer peeling sheet 100.

  The wafer W transported to the wafer separation sheet 100 is first turned upside down by a reversing mechanism provided in the lifter (the wafer W is placed so as to be on the upper side with respect to the mounting plate M). After that, it is set in the work holding part 122 of the hot water tank 112. The wafers W set on the work holding unit 122 are peeled from the slice base S one by one by the first and second peeling suction pads 200 and 201, and the peeled wafers W are sequentially transferred to the shuttle conveyor of the transfer unit 310. 312 is transferred. Then, it is conveyed to the single wafer cleaning section 350 by the shuttle conveyor 312.

  The above operation is performed for each wafer W separated from the slice base S, and the operation is completed when all the wafers W are stored in the cassette. After completion, each device returns to the state before starting.

  The wafer peeling cleaning apparatus 1 can peel and clean a sliced wafer cut by a multi-cutting method (a method of simultaneously cutting different types of ingots for one cutting). A case where the wafer cut by the multi-cutting method is peeled off and cleaned will be described.

  Since the wafer cut by the multi-cutting method needs to be collected for each type of wafer, it is processed as follows. In addition, the process until it is conveyed to the wafer peeling sheet | seat part 100 is the same as the wafer cut | disconnected by the normal cutting system mentioned above.

  When the multi-cut wafer W is set on the workpiece holding part 122 of the wafer separation sheet 100, a partition plate (not shown) of the partition device is set between the lots of the wafers W. Then, when the partition plate is set, the peeling operation by the first peeling suction pad 200 is started. The peeling operation is first performed from the wafers W of the first lot, and the peeled wafers W are sequentially transferred onto the shuttle conveyor 312 of the transfer unit 310.

  When all the wafers W in the first lot have been peeled off, a first partition plate (not shown) inserted between the first lot and the second lot is detected. When the first partition plate is detected, the control device determines that the wafer to be peeled thereafter is the wafer W of the second lot. Thereby, wafers can be sorted for each lot, and the wafers can be collected without mixing different types of wafers.

  When all the wafers W in the second lot have been peeled off, a second partition plate (not shown) inserted between the second lot and the third lot is detected, and the control device detects the second partition plate. To do. Thereafter, the wafer to be peeled is determined as the wafer W of the third lot.

  According to the above, when the wafer separation sheet 100 is sucked and held by the separation suction pad and separated one by one, air is blown and supplied by the air nozzle. It is possible to secure a good balance and to efficiently lift only one wafer without damaging the wafer. Then, the steps of the transfer unit 310, the single wafer cleaning unit 350, the detection unit 400, and the recovery unit 500 can be smoothly advanced, and the efficient wafer peeling and cleaning apparatus 1 can be provided.

DESCRIPTION OF SYMBOLS 1 ... Wafer peeling cleaning apparatus, 10 ... Rough cleaning part, 12 ... Rough cleaning apparatus, 100 ... Wafer peeling single wafer part, 310 ... Conveyance part, 350 ... Single wafer cleaning part, 400 ... Detection part, 500 ... Recovery part 112 ... Hot water tank, 114 ... peeling device, 118 ... delivery device, 120 hot water,
122 ... Work holding unit, 312 ... Shuttle conveyor, 352 ... Single wafer brush cleaning unit, 354 ... Single wafer pre-rinse unit, 356 ... Single wafer rinse unit, 402 ... Transfer unit, 508 ... Wafer transfer robot,
136: First guide rail, 138: Linear guide, 140: First slide table, 142: Nut member, 144: Screw rod, 148: First feed motor,
DESCRIPTION OF SYMBOLS 150 ... Stripping unit 152 ... Bearing block, 154 ... Swing frame, 160 ... Swing rotary actuator, 162 ... Drive gear, 164 ... Drive gear, 168 ... Rotating shaft, 170 ... Bearing member, 172 ... Support plate, 174 ... Rotation Plate, 176 ... Connecting rod, 178, 180, 194, 196, 210, 212 ... Pin, 182 ... Bearing unit, 186, 188 ... Rotating shaft, 190, 192 ... Arm, 198 ... Pad support plate, 200 ... First peel Suction pad, 201 ... second peeling suction pad, 202 ... support plate, 204 ... rotary lift actuator, 206 ... rotating plate, 208 ... connecting rod, 214 ... stop plate, 214a ... passage, 214S ... position sensor, 214-1 ... Pressing plate, 214-2 ... Down less plate, 80, 81 ... air nozzle, 216 ... two up prevention plate, 216a ... slit,
222 ... Drive unit, 240 ... Second slide table, 248 ... Second feed motor, 236 ... Second guide rail, 274 ... Pole, 276 ... Support frame, 278 ... Rotary rotary actuator, 280 ... Drive gear, 284 ... Swivel Shaft, 282 ... driven gear, 286 ... bearing unit, 288 ... swivel frame, 290 ... rotating shaft, 292 ... direction change rotary actuator, 294 ... swivel arm, 296 ... support plate, 298 ... pad advance / retreat cylinder, 300 ... delivery For suction pad,
378 ... Rotating brush, 380 ... Cleaning liquid nozzle, 382 ... Roller conveyor, 384 ... Air knife nozzle,
402 ... Conveying unit 411 ... Round belt conveyor, 411a ... Guide member, 412 ... Positioning pin,
502, 502A, 502B ... wafer recovery unit, 510A, 510B ... wafer recovery cassette, 504 ... defective wafer recovery unit, 506 ... residual adhesive wafer recovery unit, 514 ... adhesive residual wafer recovery cassette,
M ... Mounting plate, S ... Slice base, W ... Wafer

Claims (9)

Batch-cut wafers that have been cut at the same time are peeled off from the slice base one by one at the wafer peeling single-wafer portion, and separated into single wafers. In the wafer peeling and cleaning device that collects in the cassette at the collection unit,
The wafer peeling single wafer portion is
A hot water tank formed in a rectangular box shape and storing hot water;
A first peeling suction pad, which is a flat vacuum pad with a flat surface, disposed so that a central axis thereof coincides with a central axis of the wafer in a state where the wafer is held vertically in the hot water tank; ,
A second peeling suction pad disposed below the first peeling suction pad and extending and contracting in the axial direction;
A first guide rail disposed along the longitudinal direction of the hot water tank;
A first feed motor for moving the first and second peeling suction pads along the longitudinal direction of the hot water tank along the first guide rail;
A lifting rotary actuator that moves the first and second peeling suction pads vertically up and down;
Equipped with a,
When separating the wafers one by one from the wafer in a batch state, the second peeling suction pad is in contact with the lower end surface of the wafer to attract and draw the wafer, A wafer peeling cleaning apparatus, wherein the central axis of the wafer is sucked by the first peeling suction pad .   The wafer peeling cleaning apparatus according to claim 1, wherein the second peeling suction pad is a bellows vacuum suction pad.   The wafer peeling cleaning apparatus according to claim 1, wherein the first peeling suction pad has a stronger suction force than the second peeling suction pad. A detent plate is provided to prevent the wafer from falling forward when the wafers are separated from the batch wafers one by one, and the second peeling suction pad is attached to the batch wafers. wafer stripping and cleaning device according to any one of the wafers section near the center of claim 1, wherein the pulling into the倒止plate side 3. A swing rotary actuator is provided for swinging the first and second peeling suction pads in a direction along the axis of the wafer, and the swing rotary actuator is driven to move the first and second peel suction pads. by swinging the wafer peeling cleaning apparatus according to any one of claims 1 4, characterized by separating the wafer from the slice base. Vertically upward to provide a water supply nozzle of the wafer, upon the release one by one the wafer, according to claim 1 to 5, characterized in that to supply hot water or water from the vicinity of the center in the vertical above the wafer The wafer peeling cleaning apparatus of any one of Claims. When the wafer is peeled one by one by having air nozzles provided on both side surfaces of the wafer and sucking and holding the end surfaces of the wafer set in the hot water tank with the first and second peeling suction pads the wafer peeling cleaning device according to any one of claims 1 to 6, characterized by blowing supply air to the side surface of the wafer by the air nozzle. The wafer peeling and cleaning apparatus according to claim 7 , wherein the air nozzle blows and supplies air from the lower side to the upper side of the wafer. 8. The wafer peeling cleaning apparatus according to claim 7 , wherein the air nozzle blows and supplies air to a plurality of batched sheets when peeling one wafer.