TWM599026U - Consistently automated wafer adhesive remover - Google Patents

Abstract

A consistently automated wafer adhesive removal machine, comprising a machine, a plurality of material storage racks, a center positioning device, at least one separating device, at least one cleaning device and a conveying device. The inside of the machine has a long strip shape. A conveying area and a storage area located on both sides of the conveying area, a positioning area, a separation area and a cleaning area for respectively setting the conveying device, the material storage rack, the center positioning device, the separating device and The cleaning device utilizes the conveying device to go back and forth in the conveying area in a straight line for the conveyance of process materials between the devices in each zone; thereby, the wafers and wafers can be automatically and automatically transferred after the wafer thinning process. Carrier separation and removal of residual adhesive on the wafer to facilitate subsequent processes.

Description

Consistently automated wafer adhesive remover

This creation is a technical field of wafer adhesive removal equipment, especially the process of separating the wafer from the carrier and removing the residual adhesive on the wafer after the wafer thinning process, so as to achieve a significant improvement One of the functions of work efficiency, space saving and cost saving is an automatic wafer adhesive remover.

In the global semiconductor IC wafer manufacturing process, in order to facilitate the smooth progress of the wafer cutting and packaging process in the later process, the thickness of the entire wafer is required to be thinner, which makes the "wafer thinning process" method of importance And visibility is increasing day by day. The "wafer backside grinding process" is also known as the wafer backside grinding process, which helps to reduce the size of IC chips, reduce current on-resistance, speed up current flow, reduce unnecessary electrical waste heat generation, and extend semiconductor life. In the "wafer thinning process", in order to protect the wafer from damage due to the thinning during the polishing process, an adhesive (such as wax) is usually used to temporarily bond the front surface of the wafer together before polishing. On the carrier, the carrier is used as a base for supporting the wafer during polishing. Therefore, after the "wafer thinning process" is completed, it is necessary to separate the wafer from the carrier and remove the adhesive so that the wafer can be subjected to subsequent processes such as cutting and packaging. The current method of performing the process of separating the wafer from the carrier and removing the adhesive is It mainly uses manpower to transport the temporarily bonded wafers and carriers to a separator for separation, and then use manpower to transport the separated wafers to a cleaning machine for cleaning to remove residual adhesive on the wafers . This not only wastes manpower and time and makes work efficiency very poor, but also requires the purchase of a separator and a washing machine, which will take up more space and increase equipment costs.

In view of this, the author developed and designed this creation in response to the above-mentioned problems, and in-depth ideas, and actively researched and improved trials.

The main purpose of this creation is to solve the problems of wasting manpower, poor work efficiency, occupying space and increasing costs during the separation and cleaning operations after the conventional wafer thinning process.

The automatic wafer adhesive removal machine described in this invention includes a machine, a plurality of material storage racks, a center positioning device, at least one separating device, at least one cleaning device and a conveying device. Among them, the machine has a long conveying area and a storage area located on both sides of the conveying area, a positioning area, a separation area and a cleaning area. The plurality of material storage racks are arranged in the storage area, and are respectively provided with a plurality of process materials, the plurality of process materials include a wafer combination, a carrier, a porous silicon carbide disk, and a wafer stack. The plurality of wafers are combined The body is a wafer and a carrier that are temporarily bonded by an adhesive, and the multiple wafer stacking system is a wafer stacking on the upper side of the porous silicon carbide disk. The center positioning device is arranged in the positioning area for center calibration and positioning of the plurality of wafer combined bodies and the plurality of porous silicon carbide disks. The separation device is set in the separation zone, and heat is used to make the After the adhesive is melted, the wafer is separated from the carrier, and the porous silicon carbide disk is combined with the separated wafer to form the wafer laminate. The cleaning device is installed in the cleaning area, and uses the high-speed rotation of the wafer stack to generate centrifugal force and sprays cleaning agent on the top surface of the wafer to remove residual adhesive, and then blows nitrogen to the top surface of the wafer to facilitate subsequent save. The conveying device is arranged in the conveying area and includes at least one conveying guide rail and a robotic arm. The robotic arm can reciprocate linearly in the conveying area along the conveying guide rail for positioning on the plurality of material storage racks and the center The process material is transported between the device, the separating device and the cleaning device.

This creation provides an automated wafer adhesive remover, which can use the conveying device to first send a porous silicon carbide disc in one of the material storage racks to the center positioning device for center positioning, and then The porous silicon carbide disc after positioning is sent to the separation device; then a piece of wafer combination in another material storage rack is sent to the center positioning device by the transfer device for center positioning, and then the positioning is completed The wafer combination is sent to the separation device, and the wafer combination is turned over and placed on the porous silicon carbide disk; the carrier in the wafer combination is separated by the separation device, and The wafer and the porous silicon carbide disc are laminated to form a wafer stack; the transport device is used to transport the separated carrier to another material storage rack for storage, and the transport device is then used to separate the device on the The cleaned wafer stack is sent to the cleaning device; the remaining adhesive on the wafer is removed by the cleaning device; and finally the cleaned wafer stack is sent to another material storage rack by the transfer device Storage; in this way, the process of separating the wafer from the carrier and removing the remaining adhesive on the wafer can be automatically completed to save manpower And the purpose of greatly improving work efficiency, and not only can reduce the space occupation, but also reduce the purchase cost of equipment.

10: Machine

11: Transport area

12: Storage area

13: positioning area

14: separation zone

15: Cleaning area

20: Material storage rack

30: Center positioning device

40: Separation device

41: Base

410: Track

42: first stage

420: The first telescopic pole

44: mobile rack

45: Vacuum adsorption module

50: Cleaning device

51: work platform

510: washing tank

511: Cleaning agent recovery tank

52: Adsorption rotating module

53: Shield Module

54: Cleaning agent nozzle group

540: The first nozzle

541: second nozzle

55: Nitrogen nozzle group

550: Gas nozzle

60: Conveyor

61: Conveyor rail

62: mechanical arm

63: Slide

64: Swivel arm group

65: End effector

a: Wafer combination

a1: Wafer

a2: carrier

a3: Adhesive

b: Wafer stack

b1: Porous silicon carbide disk

Figure 1 is a schematic diagram of the three-dimensional appearance of this creation.

Figure 2 is a top view of the internal structure of this creation and a schematic diagram of the transmission action.

Figure 3 is a three-dimensional enlarged schematic diagram of the separation device of this creation.

Figure 4 is a schematic diagram of the action of placing the porous silicon carbide disk and wafer combination on the separation device in this creation.

Figure 5 is a schematic diagram of the adsorption, heating and removal of the separation device of this creation.

Figure 6 is a schematic diagram of the action of the separation device of this creation after the wafer is separated from the carrier.

Figure 7 is a schematic diagram of the separation process of the separation device of this creation.

Figure 8 is a three-dimensional enlarged schematic diagram of the cleaning device of this creation.

Figure 9 is a schematic diagram of the action of placing the wafer stack on the cleaning device in this creation.

Figure 10 is a schematic diagram of the action of spraying cleaning agent in this creation.

Figure 11 is a schematic diagram of the action of blowing nitrogen in this creation.

Please refer to Figures 1 and 2, which shows that the automated wafer adhesive removal machine described in this creation includes a machine 10, a plurality of material storage racks 20, a center positioning device 30, and at least one separation device 40 , At least one cleaning device 50 and one conveying device 60, wherein:

The machine 10 has a long conveying area 11 and a storage area 12 located on both sides of the conveying area 11, a positioning area 13, a separation area 14 and a cleaning area 15 inside.

The plurality of material storage racks 20 are arranged in the storage area 12, and are respectively used for placing a plurality of wafer combinations a, a plurality of carriers a2, a plurality of porous silicon carbide disks b1, and a plurality of wafer laminates b. Materials, wherein the plurality of wafer assembly a is temporarily bonded between a wafer a1 and a carrier a2 using an adhesive a3, and the plurality of wafer laminates b is a laminate of the crystal on the upper side of the porous silicon carbide disc b1 Round a1.

The center positioning device 30 is arranged in the positioning area 13 for centering and positioning the plurality of wafer combinations a and the plurality of porous silicon carbide disks b1 to facilitate the separation and cleaning process.

The separation device 40 is located in the separation zone 14. The adhesive a3 in the wafer assembly a is melted by heating, and the wafer a1 is separated from the carrier a2, and the porous silicon carbide disc b1 and the separation Then the wafer a1 forms the wafer stack b to facilitate the subsequent cleaning process.

The cleaning device 50 is installed in the cleaning zone 15, and uses the high-speed rotation of the wafer stack b to generate centrifugal force and sprays cleaning agent on the top surface of the wafer a1 to remove the residual adhesive a3, and then the wafer a1 Nitrogen gas is blown on the top surface to facilitate subsequent storage. The cleaning device 50 sprays the cleaning agent on the wafer a1 by spraying acetone to remove the adhesive a3, and then spraying ethanol on the wafer a1 to remove the wafer. Residual acetone on a1.

The conveying device 60 is located in the conveying area 11 and includes at least one transmission The conveying rail 61 and a mechanical arm 62 can be linearly reciprocated in the conveying area 11 along the conveying rail 61 for the plural material storage rack 20, the center positioning device 30, and the separating device 40 The process material is transferred between the cleaning device 50 and the cleaning device 50.

As can be seen in Figure 2, the robotic arm 62 includes a sliding seat 63, a rotating arm group 64 and an end effector 65. The sliding seat 63 can linearly move back and forth along the conveying guide rail 61. The rotating arm set 64 is rotatably connected to the sliding seat 63 at one end, and is rotatably connected by a plurality of rotating arms, so that the rotating arm set 64 can rotate, extend and contract with it. The end effector 65 is rotatably arranged at the other end of the rotating arm set 64, and can be used for supporting, sucking, translating and turning over the process material.

Please refer to FIG. 3, which shows that the separation device 40 includes a base 41, a first carrier 42, a second carrier 43, a movable frame 44 and a vacuum suction module 45, in which:

The base 41 has two parallel rails 410 on the top surface.

The first stage 42 is set on the base 41 and is located between the two rails 410. A vacuum suction unit (not shown in the figure) and a heating unit (not shown in the figure) are provided inside for facing the top surface. The corresponding process materials generate vacuum suction and heating. The first carrier 42 is provided with a plurality of first telescopic rods 420 capable of supporting the process materials to facilitate material retrieval and placement.

The second carrier 43 is arranged side by side on one side of the first carrier 42 and is located between the two rails 410. A plurality of second carrier materials capable of supporting the process are arranged in the second carrier 43 The telescopic rod 430 is convenient for picking and placing materials.

The movable frame 44 is in the shape of """, and its lower end is slidably connected to the two rails 410.

The vacuum suction module 45 is connected to the movable frame 44 in a liftable manner, can be driven by the movable frame 44 to move above the first and second stages 42, 43, and can be used for corresponding process materials The top surface produces suction.

The above-mentioned moving frame 44 and the vacuum suction module 45 respectively use a driver to drive their displacement, and this driver is still a common and well-known technology in the industry, so it will not be repeated here.

Please refer to Figures 3-7, which shows that the manufacturing process of the separation device 40 is as follows: first place a porous silicon carbide disk b1 on the plurality of first telescopic rods 420 of the first carrier 42, and then Place a wafer combination a upside down on the porous silicon carbide disk b1, so that the back side of the wafer a1 (different from the side of the adhesive a3) abuts against the top surface of the porous silicon carbide disk b1 (such as As shown in Figures 4 and 7); then the plurality of first telescopic rods 420 are retracted into the first stage 42, and the first stage 42 is adsorbed by the porous characteristics of the porous silicon carbide disc b1 Wafer assembly a, and at the same time, the vacuum suction module 45 is moved above the first stage 42 and lowered and sucked onto the carrier a2 of the wafer assembly a, and then heated by the first stage 42 The adhesive a3 in the wafer combination a is melted, and then the vacuum suction module 45 is used to suck the carrier a2 away from the wafer a1 and move it to the top of the second stage 43 (e.g., No. 5, No. 7 As shown in the figure); Finally, the vacuum suction module 45 is used to move down the carrier a2 to place the carrier a2 on the second stage 43, and the vacuum suction module 45 is returned to the original position (as shown in Figure 6); In this way, the wafer a1 and the porous silicon carbide disk b1 are laminated to form a wafer laminate b, and the carrier a2 is transferred from the wafer Separated on a1. Wherein, the wafer stack b can be raised upward from the first stage 42 by the plurality of first telescopic rods 420, and the carrier a2 can be lifted from the second carrier by the plurality of second telescopic rods 430 The platform 43 is raised upward to facilitate the mechanical arm 62 to take and take.

Please refer to Figure 8, which shows that the cleaning device 50 includes a working platform 51, an adsorption rotating module 52, a shield module 53, a cleaning agent nozzle group 54 and a nitrogen nozzle group 55, in which :

The working platform 51 has a cleaning tank 510 and a cleaning agent recovery tank 511.

The adsorption and rotation module 52 is arranged in the cleaning tank 510, and can be used for adsorbing the wafer stack b to be cleaned and driving it to rotate.

The shield module 53 can be raised and lowered in the cleaning tank 510 to prevent the cleaning agent from spraying during cleaning.

The cleaning agent nozzle group 54 is set on the working platform 51 and has a first nozzle 540 and a second nozzle 541 that can spray different cleaning agents (such as acetone and ethanol) respectively. The cleaning agent sprays The tube group 54 can be rotated to move the nozzles of the first and second nozzles 540 and 541 to above the wafer stack b or the cleaning agent recovery tank 511.

The nitrogen nozzle group 55 is set on the working platform 51 and has at least one gas nozzle 550 capable of ejecting nitrogen. The nitrogen nozzle group 55 can be rotated to move the nozzle of the gas nozzle 550 To the top of the wafer stack b or move away from the cleaning tank 510.

Please refer to Figs. 8-9, which shows that the process of the cleaning device 50 is: placing a wafer stack b to be cleaned on the adsorption rotating module 52, and using the adsorption rotating module 52 to The wafer stack b sucks and drives it to rotate (as shown in Figure 9); then the shield module 53 is raised, and the cleaning agent nozzle group 54 is a first nozzle 540 and a first nozzle 540 The nozzle of the second nozzle 541 is transferred to the upper side of the wafer stack b, and the first nozzle 540 is first to spray acetone on the top surface of the wafer stack b to rinse the remaining adhesive a3 on the wafer a1 , And the adhesive a3 is shaken off by rotating centrifugal force, and then the first nozzle 540 is stopped spraying and the second nozzle 541 is sprayed with ethanol on the top surface of the wafer a1 to wash away residual acetone (such as Figure 10); then stop the second nozzle 541 from spraying, and then make the nozzles of the first nozzle 540 and the second nozzle 541 of the cleaning agent nozzle group 54 transfer to the cleaning agent Above the recovery tank 511, the cleaning agent recovery tank 511 is used to recover the dripping cleaning agent, and at the same time, the nozzle of the gas nozzle 550 of the nitrogen nozzle group 55 is transferred to the upper side of the wafer stack b, and the wafer Nitrogen is sprayed on the top surface of the circle a1 to prevent the wafer a1 from being oxidized and helps storage; finally, the gas nozzle 550 is stopped and the nitrogen nozzle group 55 is turned back to the original position and the shield module 53 is lowered To the original position, the cleaning process is completed.

This creation provides an automated wafer adhesive remover, which can first send a porous silicon carbide disk b1 in one of the material storage racks 20 to the center positioning device 30 through the transfer device 60 Position, and then send the positioned porous silicon carbide disc b1 to the separation device 40; then by the transfer device 60, send a wafer combination a in another material storage rack 20 to the center positioning device 30 Carry out center positioning, and then send the positioned wafer assembly a To the separation device 40, and turn the wafer assembly a on the porous silicon carbide disk b1; the separation device 40 separates the carrier a2 in the wafer assembly a, and makes The wafer a1 and the porous silicon carbide disk b1 are laminated to form a wafer stack b; the transport device 60 is used to transport the separated carrier a2 to another material storage rack 20 for storage, and the transport device 60 is reused The wafer stack b to be cleaned on the separating device 40 is sent to the cleaning device 50; the remaining adhesive a3 on the wafer a1 is removed by the cleaning device 50; finally, the cleaning device 60 is used to complete the cleaning The wafer stack b is sent to another material storage rack 20 for storage; in this way, the process of separating the wafer a1 from the carrier a2 and removing the residual adhesive a3 on the wafer a1 can be automatically completed to save manpower and The purpose of greatly improving efficiency, and not only can reduce the space occupation, but also reduce the purchase cost of equipment.

To sum up, since this creation has the above-mentioned advantages and practical value, and no similar products have been published in similar products, it has met the requirements for application for new patents, and an application is submitted in accordance with the law.

10‧‧‧machine

11‧‧‧Transportation area

12‧‧‧Storage area

13‧‧‧Locating area

14‧‧‧Separated Area

15‧‧‧Cleaning area

20‧‧‧material storage rack

30‧‧‧Centering device

40‧‧‧Separation device

50‧‧‧Cleaning device

60‧‧‧Transport Device

61‧‧‧Transfer rail

62‧‧‧Robot

63‧‧‧Slide

64‧‧‧Swivel arm group

65‧‧‧End Effector

a‧‧‧Wafer combination

a2‧‧‧Carrier

b‧‧‧Wafer stack

b1‧‧‧Porous Silicon Carbide Disk

Claims (10)

A consistently automated wafer adhesive remover, including: A machine with a transfer area and a storage area located on the periphery of the transfer area, a positioning area, a separation area and a cleaning area; A plurality of material storage racks are arranged in the storage area and are respectively provided for storing a plurality of process materials. The plurality of process materials include a wafer combination, a carrier, a porous silicon carbide disk, and a wafer stack. The multiple wafers are combined The body is a wafer and a carrier that are temporarily bonded with an adhesive, and the multiple wafer stacking system is a wafer stacking on the upper side of the porous silicon carbide disk; A center positioning device is provided in the positioning area for centering and positioning the plurality of wafer combinations and the plurality of porous silicon carbide disks; At least one separation device is arranged in the separation zone, and the adhesive in the wafer combination is melted by heating to separate the wafer from the carrier, and cooperate with the porous silicon carbide disk and the separated wafer to form the Wafer stack At least one cleaning device is arranged in the cleaning zone, which utilizes the high-speed rotation of the wafer stack to generate centrifugal force and sprays cleaning agent on the top surface of the wafer to remove residual adhesive, and then blows nitrogen gas to the top surface of the wafer Facilitate subsequent preservation; and A conveying device is installed in the conveying area, and includes at least one conveying guide rail and a robotic arm. The robotic arm can move in the conveying area along the conveying guide rail for positioning on the plurality of material storage racks and the center The process material is transported between the device, the separating device and the cleaning device. An automated wafer adhesive remover as described in claim 1, wherein the transfer area is a long strip, and the storage area, the positioning area, the separation area and the cleaning area are Located on both sides of the conveying area, the conveying device can go straight back and forth in the conveying area. An automated wafer adhesive remover as described in claim 2, wherein the robotic arm includes a sliding seat, a rotary arm group and an end effector, the sliding seat can move linearly and back and forth along the conveying rail, the One end of the rotating arm assembly is rotatably connected to the sliding seat, and is connected by a plurality of rotating arms, so that the rotating arm assembly can rotate, extend and contract with it. The end effector is rotatably arranged at The other end of the rotating arm set can be used for supporting, sucking, translating and turning over the process material. According to claim 2, an automated wafer adhesive remover, wherein the separating device includes: A base with two parallel rails on the top surface; A first stage is set on the base and located between the two rails. A vacuum suction unit and a heating unit are provided inside the base to generate vacuum suction and heat for the corresponding process materials on the top surface; A second carrier is arranged side by side on one side of the first carrier and located between the two rails; A movable frame which is slidably coupled to the two rails; and A vacuum suction module is combined with the movable frame in a liftable manner, and can be driven by the movable frame to move above the first and second stages, and can adsorb corresponding process materials. According to claim 4, an automated wafer adhesive remover, wherein the movable frame is in the shape of a letter. According to claim 4, an automated wafer adhesive remover, wherein the first A carrier is provided with a plurality of first telescopic rods capable of supporting process materials, and the second carrier is provided with a plurality of second telescopic rods capable of supporting process materials, so as to facilitate the robot arm to take and unload materials. . According to claim 2, an automated wafer adhesive remover, wherein the cleaning device includes: A working platform with a cleaning tank; An adsorption and rotation module, which is installed in the cleaning tank, can be used to adsorb and drive the wafer stack to be cleaned to rotate; A shield module can be raised and lowered in the cleaning tank to prevent the cleaning agent from splashing during cleaning; A cleaning agent nozzle group is set on the work platform, and can spray cleaning agent on the top surface of the wafer stack; and A nitrogen nozzle group is set on the work platform, and can blow nitrogen gas to the top surface of the wafer stack. According to claim 7, an automated wafer adhesive remover, wherein the working platform has a cleaning agent recovery tank, and the cleaning agent nozzle group is rotatably arranged on the working platform, and has separate Spraying a first nozzle and a second nozzle of different cleaning agents, the cleaning agent nozzle group can be rotated to move the nozzles of the first and second nozzles to the wafer stack or the cleaning agent Above the recovery tank, the cleaning agent recovery tank can recover the dripping cleaning agent. According to claim 8, an automated wafer adhesive remover, wherein the first nozzle is for spraying acetone, and the second nozzle is for spraying ethanol. According to claim 7, an automated wafer adhesive removal machine, wherein the nitrogen nozzle group is rotatably arranged on the work platform and has at least one gas nozzle capable of spraying nitrogen, the nitrogen nozzle The assembly system can be rotated to move the nozzle of the gas nozzle to the top of the wafer stack or to move away from the cleaning tank.

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