JP2546631Y2 - Transfer apparatus for semiconductor substrate and automatic processing apparatus having the same - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor substrate transfer apparatus for automatically transferring a plurality of semiconductor substrates such as silicon wafers and glass substrates along a desired path, and a semiconductor substrate transfer apparatus. The present invention relates to an automatic processing apparatus for sequentially immersing a semiconductor substrate in a processing liquid in each processing tank and performing a cleaning process or the like.

[0002]

2. Description of the Related Art Conventionally, there has been a semiconductor substrate transfer apparatus and an automatic processing apparatus of this type shown in FIG. As shown in FIG. 26, in this apparatus, a semiconductor substrate 101 such as a silicon wafer or a glass substrate is handled in a state where a plurality of semiconductor substrates 101 are accommodated in a dedicated carrier 102 for processing. Note that in the carrier 102, each semiconductor substrate 101 has its main surface overlapped with each other.
Moreover, each is arranged in an upright state. Also,
The carrier 102 has a handle 102a.

On the other hand, the apparatus has a gantry 103, and a receiving frame 105 and an unloading frame 106 are provided on the front end and the rear end of the gantry 103, respectively. And between the receiving frame 105 and the unloading frame 106, three processing tanks 108 to 110 are arranged in order. A pre-cleaning liquid is stored in the processing tank 108, and an etching liquid and a post-cleaning liquid are stored in the subsequent processing tanks 109 and 110, respectively.

An opening 111 is formed at one side of the gantry 103 so as to extend along the direction in which the processing tanks are arranged. A movable pole 112 is arranged in the opening 111. . At the upper end of the movable pole 112, a holding means 114 for holding the carrier 102 described above is provided. The movable pole 112 is provided with the holding means 11.
4, thus constituting a part of a transporting means (not shown except for the movable pole 112) for transporting the carrier 102 along a predetermined route described later.

The holding means 114 is provided with the movable pole 112
A rectangular parallelepiped base portion 115 fixed to the upper end of the base portion, and a base portion 1 attached to one side of the base portion 115 at one end.
The arm member 116 has a pair of hanger members 117 which are fixed to the other end of the arm member 116 in a hanging state and which suspend the handle 102a of the carrier 102. .

Next, the operation of the above-described conventional device will be described. First, a carrier 102 containing a plurality of semiconductor substrates 101 is placed on a receiving frame 105, and
It is suspended by a hanger member 117. From this state, the movable pole 112 is moved along the path Z ₁ → X ₁ → Z ₂ , and each semiconductor substrate 101 is immersed in the pre-cleaning liquid in the processing tank 108 together with the carrier 102 to perform pre-cleaning. . Subsequently, the movable pole 112 moves along the path Z ₁ → X ₂
→ The semiconductor substrate 101 is moved along Z ₂ , and each semiconductor substrate 101 is drawn out of the processing tank 108 and immersed in the etching liquid stored in the adjacent processing tank 109. Then, etching is performed. Next, the movable pole 112 moves along the route Z ₁ → X ₃
→ The semiconductor substrates 101 are moved along the Z ₂ to move the semiconductor substrates 101 from the processing bath 109 into the processing bath 110,
It is immersed in the post-cleaning liquid inside to perform post-cleaning. After this, when the washing is completed, the movable pole 112 moves along the path Z ₁ → X.
₄ → moves along Z ₂ , and the carrier 102
0 and is placed on the unloading frame 106.
Here, each semiconductor substrate 101 is collected from the carrier 102 and sent to the next step.

On the other hand, the empty carrier 102 is returned to the receiving frame 105 by moving the movable pole 112 along the path Z ₁ → X ₅ → Z ₂ . Then, a new semiconductor substrate supplied from the previous process is stored in the carrier 102. Thereafter, the above-described series of operations is repeated.

In the above-described conventional device, the semiconductor substrate 101 is handled in a state of being accommodated in the carrier 102, and thus has the following problems. (1) The processing liquid becomes turbid due to dust adhering to the carrier 102, thereby contaminating the semiconductor substrate. (2) Since a relatively large amount of the processing liquid adheres to the surface of the carrier 102, the processing liquid stored in the processing tank consumes a large amount and mixes with another type of processing liquid in an adjacent processing tank. (3) Since the space occupied by the carrier 102 is large, it is difficult to reduce the size of the entire apparatus including the volume of each processing tank.

In order to solve such a problem, an apparatus shown in FIGS. 27 and 28 has been proposed. This apparatus is disclosed, for example, in Japanese Patent Laid-Open No. 57-52138. Since this device is configured similarly to the device shown in FIG. 26 except for the main parts of the device shown in the figure, the description of the configuration and operation of the entire device will be omitted. In the following description, the same members as those of the apparatus shown in FIG. 26 are denoted by the same reference numerals.

As shown in FIG. 27, in the apparatus, a holding means 12 for holding a plurality of semiconductor substrates 101 is provided.
1 is configured as follows. Each semiconductor substrate 1
Numerals 01 are arranged and held by the holding means 121 in such a manner that their respective main surfaces are overlapped and each is upright.

That is, the holding means 121 is provided with the arm member 11.
A hanger member 122 having four hanging parts 122a attached to the end of the base member 6; and a pair of substrates supported by two of these hanging parts 122a and relatively swingably via pins 123. It has a holding member 125 and driving means for driving the two substrate holding members 125. The driving means comprises a pneumatic cylinder 126 provided on the hanger member 122, two links 127a and three pins 127b, and transmits the output of the output shaft 126a of the pneumatic cylinder 126 to the two board holding members 125. And a link mechanism 127 that performs the operation.

A large number of, in this case, five retaining grooves 125a, in each of which the semiconductor substrate 101 can be engaged, are provided in the two substrate holding members 125 in parallel.

On the other hand, the processing tank 108
A receiving frame 130 is provided adjacent to the front of the board. A substrate container 131 containing a plurality of semiconductor substrates 101 is placed on the receiving frame 130. Substrate container 131
Are provided with five storage grooves 131a, each of which can store the semiconductor substrate 101. The substrate container 13
Reference numeral 1 denotes a case where each semiconductor substrate 101 is carried on a receiving frame 130 by a container transport device (not shown) in a state of being accommodated.

The substrate container 1 is located below the receiving frame 130.
The holding means 121 described above holds each semiconductor substrate 101 in
Substrate supply means for supplying the substrate to a position that can be held. The substrate supply means includes a substrate support member 133 in which five support grooves 133a capable of engaging with and supporting the semiconductor substrate 101 are arranged in parallel, and a substrate support member mounted on the pedestal 103 and having its output shaft 134a mounted on the output shaft 134a. And a pneumatic cylinder 134 to which a member 133 is fixed. The pneumatic cylinder 134 is for raising and lowering the substrate supporting member 133. The substrate supporting member 133 is raised by the projecting operation of the output shaft 134a, and each semiconductor substrate 101 carried by the substrate supporting member 133 is pushed upward. Holding means 1
21 is reached. In addition, receiving underframe 1
The openings 30 a and 131 a through which the substrate holding member 133 passes are formed in the substrate 30 and the substrate container 131.

Next, the operation of the above-described device will be described with reference to FIGS. First, as shown in FIG. 27, a substrate container 13 containing five semiconductor substrates 101 is provided.
1 is placed on the receiving frame 130. Then, FIG. 29
As shown in FIG. 7, the pneumatic cylinder 134 operates to project its output shaft 134a, and each semiconductor substrate 101 is carried by the substrate carrying member 133 and pushed out above the substrate container 131, and is positioned at a position where it can be held by the holding means 121. Is done. Following this, the upper pneumatic cylinder 126 operates and its output shaft 126a projects. Therefore, FIG.
As shown in FIG. 9, the link mechanism 127 operates, and the semiconductor substrates 101 are clamped by the pair of substrate clamping members 125. Thereafter, the movable pole 112 moves along a predetermined path in the same manner as in the conventional apparatus shown in FIG. 26, and accordingly, pre-cleaning, etching, and post-cleaning of each semiconductor substrate 101 are performed. The semiconductor substrates 101 that have been completed up to the subsequent cleaning are conveyed to a position immediately above an unloading frame (not shown) disposed behind each of the processing tanks 108 to 110 (see FIG. 26). . A collection substrate container (not shown) capable of accommodating each semiconductor substrate is placed on the unloading frame, and each semiconductor substrate 101 is lowered from the position immediately above and stored in this substrate container. Is done. After that,
These semiconductor substrates 101 are conveyed toward a subsequent process while being stored in the substrate container. The substrate container for collecting the substrate has the same shape as the substrate container 131 for supplying the substrate shown in FIGS. 27 and 29, and has five rows of receiving grooves into which the semiconductor substrates 101 can be fitted one by one. Has been established.

As described above, in the second prior art device shown in FIGS. 27 to 29, the carrier 102 required in the first prior art device shown in FIG. 26 is used.
Is no longer required. Therefore, the above-mentioned problem of the first conventional device is solved.

[0017]

However, in the second conventional device, the arm member 116 attached to the base portion 115 on the movable pole 112 in a cantilever manner is relatively long. This long arm member 116
A pneumatic cylinder 126 serving as a driving source is mounted together with the hanger member 117 at the tip of the cylinder. Accordingly, the weight of the semiconductor substrate 101 to be held is added, so that the load becomes large, and the arm member 116 is largely inclined, and is transferred from the substrate holding member 125 to the substrate container (not shown) for collecting the substrate. In this case, the outer peripheral edge of the semiconductor substrate may come into contact with the edge of the accommodating groove formed in the substrate container for accommodating the substrate. In addition, when the arm member 116 is greatly inclined in this way, when performing some processing on the semiconductor substrate 101 following the above-described cleaning step, the semiconductor substrate 101 is moved to a processing position by the processing apparatus. There is also a disadvantage that it is difficult to accurately convey and position.

In view of the above, the present invention has been made in view of the above-mentioned disadvantages of the related art, and enables the semiconductor substrate to be smoothly and smoothly transported without any trouble, and to be transported and positioned at a desired position with high precision. It is an object of the present invention to provide a semiconductor substrate transfer apparatus which can increase the number of semiconductor substrates which can be transferred and which can be transferred, and an automatic processing apparatus in which a liquid processing function is added to the transfer apparatus.

[0019]

SUMMARY OF THE INVENTION According to the present invention, there is provided a holding means capable of holding a plurality of semiconductor substrates arranged in an upright state such that their main surfaces are overlapped with each other, and the holding means is provided with a plurality of semiconductor substrates. Transport means for transporting along the route,
The holding means is provided with a base portion conveyed by the conveyance means and a plurality of holding grooves with which the semiconductor substrate can be engaged, and is provided relatively movably on the base portion to cooperate with each other. A semiconductor substrate transfer device comprising: at least a pair of substrate holding members for holding the semiconductor substrate; and driving means for driving each of the substrate holding members.
The holding means is attached to the base portion at one end so as to be rotatable around an axial center, extends toward the side of the base portion, and has the other end to which the substrate holding member is attached. An arm member, wherein the driving means is provided with a torque applying means attached to the base portion to apply a torque to each of the arm members, and a plurality of the substrate holding members are provided for each of the arm members. It is intended to be attached. Further, the present invention provides a processing tank capable of storing a processing liquid, and a holding means capable of holding a plurality of semiconductor substrates arranged and held in an upright state such that their main surfaces overlap with each other, and Transport means for transporting the holding means together with the held semiconductor substrate along a predetermined path extending from the processing solution in the processing tank through the immersion position to the outside of the processing tank, and the holding means includes And a plurality of holding grooves, each of which can be engaged with the semiconductor substrate, are provided side by side, and are relatively movably provided on the base portion to cooperate with each other to clamp the semiconductor substrate. In an automatic processing apparatus comprising at least a pair of substrate holding members and driving means for driving each of the substrate holding members, the holding means is attached to the base portion at one end so as to be rotatable about an axis. A plurality of arm members extending laterally of the base portion and having the substrate holding member attached to the other end, wherein the driving means applies a torque to each of the arm members. Means, and a plurality of said substrate holding members are attached to each of said arm members.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of a semiconductor substrate transfer apparatus according to the present invention and an automatic processing apparatus including the transfer apparatus will be described.

As shown in FIGS. 1 and 2, the automatic processing apparatus includes a frame 1 made of a shaped steel or the like, and a panel (not denoted by reference numerals) covered on the frame 1.
A housing 3 formed in a rectangular parallelepiped shape as a whole is provided.
The use of stainless steel as a material for the frame 1 and the panel prevents rust of the housing. Further, as shown in the figure, a number of casters 4 to be used when transporting the automatic processing apparatus are provided at a lower portion of the housing 3. A large number of legs 5 are provided in the vicinity of the casters 4 and the like, and the automatic processing device transported to a predetermined position is fixed on the floor 6 with these legs 5.

As shown in FIG. 1, a substrate supply means 8, four processing tanks 9 to 12, a substrate drier 13
Are arranged in order.

In the processing tank 9, a processing liquid 9a formed by mixing aqueous ammonia, hydrogen peroxide and pure water and heated to a predetermined temperature is stored. In addition, processing tanks 10 and 12
Hot deionized water (hot deionized water) 10a and 12a, which are heated pure waters, are stored therein as processing liquids, respectively. The processing tank 11 is formed by mixing sulfuric acid and hydrogen peroxide water. Treatment liquid 11
a is stored. Further, vibrators 15 and 16 are attached to the bottoms of the processing tanks 9 and 10, respectively. Each of the vibrators 15 and 16 is driven by an ultrasonic oscillator (not shown) disposed at a predetermined position in the housing 3 to excite both the processing tanks 9 and 10.

As shown in FIG. 1, a drainage means 18 is provided below the processing tank 10 for rapidly discharging the processing liquid 10a in the processing tank 10. This drainage means 18
Is similar to that disclosed in Japanese Utility Model Laid-Open No. 3-38628, and will not be described in detail here. The drainage from the other processing tanks 9, 11, and 12 is supplied to a drainage tube (not shown) connected to each processing tank.
Done through. A storage tank 20 for storing each processing solution to be supplied to each of the processing tanks 9 to 13 is provided.
, And various processing liquids are supplied from the storage tank 20 to each processing tank via a supply tube (not shown).

The automatic processing apparatus automatically performs the steps from cleaning to drying of a semiconductor substrate 22 such as a silicon wafer or a glass substrate. The washing and drying of 22 can be completed. The semiconductor substrate 22 is circular and has a diameter of about 200 m / m. These fifty semiconductor substrates 22 are held by holding means 24 shown in FIGS. 1 and 2, and the holding means 24 is transported along a predetermined path by a transport means 25 shown in FIG. Go around the tank. The holding means 24 is
The semiconductor substrates 22 are arranged and held such that the main surfaces of the semiconductor substrates overlap with each other and each of the semiconductor substrates 22 stands upright.

As shown in FIGS. 1, 3 and 4, the transfer means 25 includes a rail 27 extending in the direction in which the processing tanks 9 to 12 are arranged, that is, in a horizontal direction. 27 has a movable base 29 slidably mounted on a bracket 28a via a bracket 28a and a slider 28b. As shown in FIGS. 3 and 4, the rail 27 is mounted on a support plate 30 fixed to the housing 3. As is clear from FIGS. 4 and 5, the movable base 29 is formed in a substantially rectangular plate shape as a whole.

The movable base 29 is attached in the vicinity of its upper end so as to be suspended from the rail 27. As shown in FIGS. 2 to 4, a bracket 32 is attached to the lower end of the movable base 29. A pair of rollers 33 is provided via the. The rollers 33 are provided in the housing 3
A guide plate 34 arranged in parallel with the rail 27 is sandwiched from the left and right. With this configuration, the movable base 29 can move smoothly.

As is apparent from FIGS. 3 and 4, a long rack 36 is fixed to the lower surface of the support plate 30 carrying the rail 27 in parallel with the rail 27. On the other hand, on the movable base 29, a speed reduction mechanism 37 including a final gear 37a meshing with the rack 36 is provided.
And a motor 38 for applying a torque to the speed reduction mechanism 37. That is, the movable base 29 reciprocates along the rail 27 by rotating the motor 38 forward and backward.

As shown in FIG. 5, on the movable base 29,
A rail 40 is attached to extend in the up-down direction. Then, a slider 41 is provided on the rail 40.
(Also shown in FIG. 4) is slidably provided.
A lifting plate 42 is fixed to 1. A movable pole 45 is attached to the lifting plate 42 via a fixed block 43 so as to extend in the vertical direction. An elongated worm 46 is arranged in parallel with the movable pole 45, and is rotatably attached to the movable base 29 via a pair of upper and lower bearings 47a and 47b. A nut 49 screwed to the worm 46 is provided, and the nut 49 is fixed to the lifting plate 42.

The lower end of the worm 46 protrudes below the bearing 47b, and a pulley 50 is fitted to this protruding portion. A geared motor 52 is provided on the movable base 29 and beside the bearing 47b.
A pulley 53 is also fitted to the output shaft of the geared motor 52, and a belt 54 is wound around both pulleys 50 and 53. That is, when the geared motor 52 rotates forward and backward, the worm 46 rotates forward and backward, and the movable pole 45 performs a lifting operation together with the lifting plate 42 carrying the worm 46.

Incidentally, as shown in FIG.
Have two switches 55a and 55 for detecting whether the movable pole 45 is in the raised position or the lowered position.
5b are provided, and these are activated by engagement of a projection 56 provided on the lifting plate 42.

The aforementioned rail 27 and slider 28b
, Movable base 29, rollers 33, guide plate 34, rack 36, reduction mechanism 37, motor 38
, Rail 40, slider 41, lifting plate 42
1, the movable pole 45, the worm 46, the pulleys 50 and 53, the geared motor 52, the belt 54, and related members around them.
The transport means 25 is configured to transport the wafer 4 along with a semiconductor substrate 22 held along a predetermined route (described later) extending outside of each processing tank through an immersion position of the processing liquid in each of the processing tanks 9 to 12. .

Next, the holding means 24 which holds the semiconductor substrate 22 and is transferred by the transfer means 25 will be described in detail.

As is particularly clear from FIGS. 6 to 10,
The holding means 24 has a rectangular parallelepiped base portion 58 fixed to the upper end of the movable pole 45, and is attached to the base portion 58 at one end in a cantilever shape so as to be lateral to the base portion 58. It has two cylindrical arm members 59 and 60 extending linearly and parallel to each other. As shown in FIG. 9, the base portion 58 includes a bottom plate 58a and a side plate 58b. As is apparent from the figure, two bearings 62a and 62b are provided in the base portion 58, respectively.
The two arm members 59 and 60 are supported by these bearings so as to be rotatable about the axis thereof.

As shown in FIGS. 7 and 8, a pair of hanger members 63 are attached to the mounting block 65 at the other end of each of the two arm members 59 and 60 and in the vicinity thereof.
It is attached in a hanging state via. Each hanger member 63 is composed of two parallel shafts 67 each having a male screw portion 67a formed at the upper end thereof, and a frame member 68 formed in a U-shape and fixed to the lower ends of the shafts 67. , A nut 65a is attached to the mounting block 65 (see FIG.
). Also, the mounting block 65
Are two divided bodies 65b and 65c formed so as to sandwich each arm member 59 and 60, and fastening members (not shown) such as bolts and nuts for fastening the two divided bodies.
And so on.

The other end of the arm members 59 and 60, that is, the distal end, is provided with connecting means 70 which is pivotally attached to the two distal ends and connects the distal ends to each other. Specifically, the connecting means 70 includes an elastic annular member 70a made of rubber or the like closely fitted to each of the arm members 59 and 60, and two rectangular parallelepiped blocks 70b fitted to the respective annular members 70a. And studs 70c and 70d implanted in each of the blocks 70b and formed with one of a right-handed screw and a left-handed screw, respectively, and a nut 70e that is screwed to the both studs 70c and 70d. .
By providing the connecting means 70, the distal ends of the two arm members 59 and 60 are prevented from being separated from each other or too close to each other.

As shown in FIGS. 7, 8 and 11,
The frame member 68 which is a constituent member of the hanger member 63 described above.
A substrate holding member 72 for holding the semiconductor substrate 22 is attached to a lower end of the base member by bolts (not shown). As shown in FIG. 11 to FIG.
2, two holding grooves 72a with which the outer peripheral portion of the semiconductor substrate 22 can be engaged are arranged in parallel at an equal pitch a, for example. The cross-sectional shape of each of the holding grooves 72a is V
It is shaped like a letter. The substrate holding member 72 has a circular cross section perpendicular to the direction in which the holding grooves 72a are arranged. Each holding groove 72a is formed over the entire circumference of the substrate holding member 72.

As described above, since the cross-sectional shape of the holding groove 72a is V-shaped, the opening angle becomes large and the engagement of the semiconductor substrate 22 with the holding groove becomes easy. Further, the cross-sectional shape of the substrate holding member 72 is circular, and
By forming the holding groove 72a over the entire circumference of the substrate holding member, the holding groove 72a can be easily formed by, for example, a lathe, and the substrate holding member 72 is held by the frame member 68. There is an effect that there is no need to position the substrate holding member 72 in the rotation direction when the member 72 is attached.

As is clear from the above description, two board holding members 72 are attached to each of the two arm members 59 and 60. Therefore, for example, 25 semiconductor substrates 22 can be clamped by a pair of substrate clamping members 72 provided so as to correspond to each other between the arm members.
That is, 50 semiconductor substrates 22 can be held and transported.

The two substrate holding members 72 attached to each of the two arm members 59 and 60 are disposed so that the central axes thereof in the direction in which the holding grooves 72a are arranged coincide with each other. As is clear from FIG. 7, in such a configuration, 5
The total number of the zero semiconductor substrates 22 is arranged in a line along the axial center of the arm members 59 and 60. Each of the substrate holding members 72 and the two hanger members 63 and the mounting blocks 65 supporting the same are also provided. They will be aligned along the axis center. Therefore, the total weight is applied over a considerably long range of the entire lengths of the arm members 59 and 60 in a state close to an evenly distributed load, which is preferable in suppressing the amount of bending of both arm members. By the way, the arm member 5
As another type of attaching two or more board holding members 72 to each of 9 and 60, for example, by making the hanger member 63 long, each of the board holding members 72 is formed with a step in the vertical direction. Attachment to a hanger member is conceivable. However, in this type, each semiconductor substrate 22 and the above-mentioned members for holding them are applied in a concentrated load within a considerably short range of the entire length of each of the arm members 59 and 60. Is increased.

As shown in FIGS. 12 and 13, the substrate holding member 72 has a groove center 72b of a holding groove 72a provided on the substrate holding member 72 in a virtual vertical plane 74, that is, a plane perpendicular to a virtual horizontal plane 75. On the other hand, θ, in this case, 1 ^o ~
It is made to incline within an angle range of 5 ^° . Specifically, as shown in FIG. 7, this inclination is caused by the arm members 59 and 60 whose central axes are inclined by this θ with respect to the virtual horizontal plane 75. Regarding the inclination of the arm members 59 and 60, the mutual assembling angle between a series of components from the housing 3 to the base portion 58 is set so that the inclination θ occurs, or the floor 6 itself, Alternatively, the housing 3 is placed on the virtual horizontal surface 75 with respect to the floor 6.
It may be generated by inclining with respect to. In addition, the center of the axis of the substrate holding member 72 is parallel to the virtual water surface 75, and the holding groove 72a itself is
May be formed so as to be inclined with respect to the virtual vertical plane 74.

As described above, by inclining the groove center 72b of the holding groove 72a of the substrate holding member 72 with respect to the virtual vertical plane 74, the following effects are obtained.

That is, the plurality of semiconductor substrates 22 held by the substrate holding member 72 are inclined and aligned in a state where they are directed in the same direction in parallel with each other by the action of gravity. Therefore, transfer of each semiconductor substrate from the substrate holding member 72 to a substrate container for the next process, in this case, a substrate receiving table (described later) disposed in each of the processing tanks 9 to 12 can be performed without any trouble. The transfer of the semiconductor substrate over the step is facilitated.

On the other hand, as shown in FIGS. 8 and 11, a generally plate-shaped comb-like member 77 is disposed in the vicinity of the above-mentioned substrate holding member 72, and together with the substrate holding member 72. It is fastened to the frame member 68 of the hanger member 63 by bolts (not shown). FIG. 14 and FIG.
As is apparent from FIG. 5, the comb-like member 77 has two holes to correspond to the holding grooves 72a of the substrate holding member 72, respectively.
Five slits 77a are juxtaposed with an equal pitch a. In addition, this comb-shaped member 77 has each slit 7
Tapered surface 77b for guiding each semiconductor substrate 22 into 7a
Are formed.

Since the comb-like member 77 functions as a regulating means for regulating the inclination of the semiconductor substrate 22 with respect to each holding groove 72a of the substrate clamping member 72, and is attached to the frame member 68 together with the substrate clamping member 72, In conjunction with the substrate holding member, as shown in FIG. 11, each semiconductor substrate 22 is tightly engaged with each slit 77a.

As described above, by providing the regulating means for regulating the inclination of the semiconductor substrate 22 with respect to each of the holding grooves 72a of the substrate holding member 72 in conjunction with the operation of the substrate holding member 72, the above-described holding groove is provided. The same effect as the effect based on the inclination of the groove center 72b of the groove 72a, that is, the alignment of the semiconductor substrates 22 can be obtained.

As shown in FIG. 8, a comb-shaped member 77 as the regulating means is provided only in the vicinity of one of the pair of substrate clamping members 72, that is, the two substrate clamping members 72. However, it may be added to both substrate holding members 72. The configuration of the regulating means is not limited to the comb-shaped member 77 as described above. For example, from the side of each semiconductor substrate 22 clamped by the substrate clamping member 72, the main surface of each semiconductor substrate is Inject compressed air diagonally,
A configuration is conceivable in which the semiconductor substrates 22 are aligned in a state where they are oriented parallel to each other in the same direction.

Further, as is particularly clear from FIG. 11, the comb-shaped member 77 as the regulating means is disposed above the substrate holding member 72, so that the slit 77 of the comb-shaped member 77 is formed.
The amount of insertion of the semiconductor substrate 22 into “a” increases, and the effect of adjusting the inclination of the semiconductor substrate 22 increases.

Next, a description will be given of the structure of the driving means for driving the semiconductor substrate 22 by using the above-described substrate holding members 72 to hold and release the semiconductor substrates 22.

As shown in FIG. 4 and FIG.
Movable pole 4 supporting a base portion 58 which is a constituent member of
5 is hollow and has a long cylindrical shaft 79 inside.
Is inserted. The upper end of the shaft 79 is connected to the two arm members 59 and 60 described above via a link mechanism 80. As shown in FIGS. 9 and 10, the link mechanism 80 includes two link members 8 fitted at one end to arm members 59 and 60, respectively.
0a and 80b, and a pin 80c for pivotally connecting the other ends of the link members to each other and for pivoting to a small bracket 79a fixed to the upper end of the shaft 79. The link members 80a and 80b are each prevented from rotating with respect to the arm members 59 and 60 by a locking pin 80d. An annular spacer 62c is interposed between the bearings 62a and 62b pivotally supporting the arm members 59 and 60 and the link members 80a and 80b.

On the other hand, as shown in FIGS. 3 to 5, a solenoid 82 is attached to the fixed block 43 supporting the movable pole 45 so that the output shaft protrudes downward. As shown in FIG. 4, the movable base 29 is provided with a flexible cable 82a for supplying and disconnecting power to the solenoid 82.

A lever member 83 is disposed near the solenoid 82, and is rotatably attached to the bracket 32 by a pin 83a at a substantially central portion thereof. One end of the lever member 83 is pivotally connected to the output shaft of the solenoid 82 by a pin 83b, and the other end is pivotally connected to the lower end of the shaft 79 by a pin 83c. That is, when the solenoid 82 operates and stops, the shaft 79 moves up and down, so that the two arm members 59 and 60
, And the semiconductor substrate 22 is held by the board holding members 72 and released.

The shaft 79 described above and the sonolide 82
, The lever member 83 and peripheral small members related to these members constitute torque applying means for applying torque to both arm members 59 and 60. The link mechanism 80 is interposed between the two arm members 59 and 60 and the torque applying means, and functions as a synchronizing means for operating the two arm members synchronously. As described above, in the automatic processing apparatus, a plurality of substrate holding members 72 are attached to each of the two arm members 59 and 60. Therefore, the single link mechanism 80, that is, the synchronizing means, allows a large number, in this case, four, of the board holding members 72 to be operated synchronously.

Drive means for driving each substrate holding member 72 to hold and release the semiconductor substrate 22 by the above-described torque applying means and the link mechanism 80 as the synchronization means. Further, the driving means, each substrate holding member 72, the base portion 58, and both arm members 59 and 6 are provided.
0, the hanger member 63, and the connecting means 70,
The holding means indicated by reference numeral 24 is configured. As described above, the holding unit 24 holds the 50 semiconductor substrates 22 arranged in an upright state such that their main surfaces overlap with each other.

Here, each processing tank 9 shown in FIG. 1 and FIG.
, Each of which is provided on the bottom portion of the semiconductor substrate 22 from the holding means 24 described above.
The substrate receiving base 85 that receives and supports them will be described.

As shown in FIGS. 16 to 18, the substrate receiving base 85 has a pair of receiving members 85a formed in a substantially rectangular plate shape and standing upright in parallel with each other, and both receiving members 85a are attached to both ends thereof. Two coupling plates 85b to be coupled together;
And a bolt (not shown) for fastening the receiving member 85a and the coupling plate 85b.

As shown in FIGS. 16 and 19, each receiving member 85a has an upper end surface formed of a virtual horizontal plane 75 (see FIG. 16).
20 and 21 are formed at an angle of, for example, 45 ^° . As shown in FIGS.
Five receiving grooves 85d are juxtaposed at the same pitch a. Further, a tapered surface 85e for guiding each semiconductor substrate 22 smoothly into the receiving groove 85d is formed.

As shown in FIG. 17, the substrate receiving base 85
The groove center 85f of the provided receiving groove 85d is inclined with respect to the virtual vertical plane 74 at an angle of θ (1 to 5 ^° ). This inclination is, as shown in FIG.
It is generated by inclining by θ with respect to. In addition, the substrate receiving base 85 itself is arranged in parallel with the virtual horizontal plane 75, and the receiving groove 85d itself is positioned at the center 85 of the receiving groove.
f may be formed so as to be inclined with respect to the virtual vertical plane 74.

As described above, the receiving groove 8 of the substrate receiving base 85
By inclining the groove center 85f of 5d with respect to the virtual vertical plane 74, the following effects can be obtained. The inclination of the groove center 85f is adjusted by the holding groove 72 of the substrate holding member 72.
A further synergistic effect can be obtained by making the groove center 72a correspond to the inclination of the groove center 72b. That is, the holding unit 24 shown in FIG. 1 and the like is transported by the transport unit 25, and once delivers the held 50 semiconductor substrates 22 to the substrate receiving table 85. Each transferred semiconductor substrate 2
2 are inclined and aligned in a state where they are directed in the same direction in parallel to each other by the action of gravity based on the configuration of the inclination of the groove center 85f. Therefore, when each semiconductor substrate 22 that has been processed with the processing liquid is again held by the holding means 24 and carried out of the processing tank, the substrate receiving base 85
The upper semiconductor substrates 22 are smoothly fitted into the holding grooves 72a of the substrate holding member 72 provided in the holding means 24, and the holding is performed without any trouble.

Next, the structure of the substrate supply means 8 shown in FIG. 1 will be described in detail. The substrate supply means 8 includes the semiconductor substrate 2
2 are sequentially supplied to the holding position by the holding means 24 in units of 50 sheets.

As shown in FIG. 22, the substrate supply means 8
Has a frame 87. And the frame 87
A guide member 88 is fixedly provided at the upper end of the elevating shaft 8.
9 is slidably held in the vertical direction by the guide member 88. At the upper end of the elevating shaft 89,
Two substrate supporting members 90 each capable of supporting 25 semiconductor substrates are provided side by side. However, since these substrate carrying members 90 are arranged side by side in the direction perpendicular to the paper surface in FIG. 22, only one appears in the figure.

On the other hand, a long worm 92 is connected to the lower end of the elevating shaft 89 via an intermediate plate 91. The worm 92 is placed on the frame 87.
A speed reduction mechanism 93 including a worm wheel (not shown) that meshes with a motor, and a motor 94 that applies torque to the speed reduction mechanism 93 are attached.

The above-described guide member 88, elevating shaft 89, intermediate plate 91, worm 92, reduction mechanism 93, and motor 94 correspond to the position where substrate holding member 90 can be held by holding means 24. Moving means for moving between a position (a position shown by a solid line in FIG. 22) and another position (a position shown by a two-dot chain line in FIG. 22) separated downward from the position is configured.

As shown in FIGS. 23 to 25, the above-described substrate holding member 90 is formed in a substantially rectangular parallelepiped shape as a whole, and has an upper surface on which the outer peripheral portion of the semiconductor substrate 22 can be engaged. The support grooves 90a of the strip are arranged side by side at the same pitch a. Further, a tapered surface 90b for guiding each semiconductor substrate 22 into the support groove 90a is formed. As is apparent from FIG.
a is formed such that the cross-sectional shape perpendicular to the direction in which the support grooves are arranged is an arc shape, and the radius R _{1 of the} arc is
Is equal to the radius of the semiconductor substrate 22 and is about 100 m / m. 24, the cross-sectional shape of the tapered surface 90b is also an arc shape, and the radius of the arc is, for example, 230 m / m. FIG.
As shown in FIG. 24, the substrate holding member 90 has a longitudinal groove 9 extending through the support groove 90a and the tapered surface 90b.
0c is formed.

As shown in FIG. 25, the substrate holding member 90
The groove center 90d of the support groove 90a formed therein is
The virtual vertical surface 74 is inclined at an angle of θ (1 to 5 ^° ). Specifically, this inclination is caused by inclining the substrate holding member 90 itself by θ with respect to the virtual horizontal plane 75, as shown in FIG.
In addition, in addition to this, the substrate holding member 90 itself is
And the support groove 90a itself may be formed such that the groove center 90d of the support groove is inclined with respect to the virtual vertical plane 74.

As described above, by inclining the groove center 90d of the support groove 90a of the substrate holding member 90 with respect to the virtual vertical plane 74, the following effects are obtained.

That is, each semiconductor substrate 22 on the substrate holding member 90 is transported while being held by the holding means 24 shown in FIG. Prior to the holding by the holding means 24, each semiconductor substrate 22 is tilted in a state where the semiconductor substrates 22 are directed in the same direction in parallel with each other on the substrate holding member 90 by the action of gravity based on the tilt configuration of the groove center 90d. Will be aligned. Therefore, the holding means 24 is moved to the substrate holding member 90.
When each of the upper semiconductor substrates 22 is held, the holding means 2
Each semiconductor substrate 22 is smoothly fitted into the holding groove 72a of the substrate holding member 72 provided in 4, and the holding is reliably performed.

In FIGS. 1 and 2, reference numeral 9
Reference numeral 6 denotes a clean box for purifying air in the apparatus, and reference numeral 97 denotes an electrical box.

Next, the operation of the automatic processing apparatus having the above configuration will be briefly described.

First, as shown in FIG. 22, a carrier 99 containing 25 semiconductor substrates 22 each is placed on the substrate supply means 8 by a robot (not shown) or manually.
Are placed. However, since these two carriers 99 are arranged in a direction perpendicular to the paper of FIG.
Only one appears in the figure. Note that this carrier 9
Each of the semiconductor substrates 22 in 9 is arranged so that the main surfaces thereof are overlapped with each other and in an upright state.

When the carrier 99 is placed on the substrate supply means 8, as shown in FIG. 22, the motor 94 of the substrate supply means 8 rotates forward to move the worm 92 upward, and the substrate holding member is moved. 90 rises from the position indicated by the two-dot chain line in the same figure to the position indicated by the solid line via an opening (not shown) formed at the bottom of the carrier 99. As a result, a total of 50 semiconductor substrates 22 accommodated in the two carriers 99, as shown in FIG.
As a result, the carrier is pulled out above the carrier 99 and brought to a position where it can be held by the holding means 24. At this time, as shown, the holding means 24 is waiting just above the carrier 99.

In this state, the solenoid 82 shown in FIGS. 3 to 5 is actuated to project its output shaft, whereby the shaft 79 in the movable pole 45 is raised, and both arm members 59 and 60 are rotated. Therefore, as shown in FIG. 8, the hanger member 63 operates from the state shown by the two-dot chain line to the position shown by the solid line in FIG. 8, and each semiconductor substrate 22 is clamped by the substrate clamping member 72.

Subsequently, the motor 3 shown in FIGS.
8 and the geared motor 52 are appropriately rotated to perform the horizontal movement of the movable base 29 and the elevating operation of the movable pole 45, and each semiconductor substrate 22 together with the holding means 24 holding the same moves along the path Z ₃ shown in FIG. It is transported along X ₆ → Z ₄ , is placed on the substrate receiving table 85 in the processing tank 9, and is immersed in the processing liquid 9 a stored in the processing tank 9. And
The holding state of each semiconductor substrate 22 by the holding means 24 is released, and processing of each semiconductor substrate 22 by the processing liquid 9a, in this case, cleaning is performed. During this washing,
The vibrator 15 attached to the lower part of the processing tank 9 is operated to excite the processing liquid 9a inside the processing tank 9 together with the processing tank 9,
Cleaning is effectively performed. When the cleaning operation in the processing tank 9 is completed, the holding means 24 again returns to each semiconductor substrate 2.
Hold 2. Subsequently, each semiconductor substrate 22 is transported along the route Z ₃ → X ₇ → Z ₄ shown in FIG. The cleaning according to 10a is performed. During this cleaning, the vibrator 16 attached to the processing tank 10 operates.

Thereafter, each semiconductor substrate 22 passes through the route Z ₃ → X ₈ → Z ₄ shown in FIG. 1 and the following route Z ₃ → X ₉ →
Is conveyed sequentially following the Z _4, is cleaned by a treatment liquid 11a and 12a of the respective processing tanks 11 and 12. Thus, the cleaning of each semiconductor substrate is completed. Thereafter, the holding means 24
Is the route Z ₃ → X shown in FIG.
_{After 10} → Z ₄ , it is returned to the standby position immediately above the substrate supply means 8 again.

Hereinafter, the above-described series of operations is repeated, and
A large number of semiconductor substrates sequentially supplied by the substrate supply means 8 are cleaned.

On the other hand, the semiconductor substrate 22 which has been cleaned through the processing tanks 9 to 12 is put into the substrate dryer 13 shown in FIG. 1 by another substrate transport means (not shown). After the drying operation is performed by the substrate dryer 13,
Collected and sent to the next step. The substrate dryer 13 dries each semiconductor substrate 22 by centrifugal force.

[0077]

As described above, according to the present invention, a plurality of arm members for supporting the substrate holding member are provided, and the arm member is rotatable so that the arm member is rotatable on the base portion to which the arm member is attached. The arm holding members are driven to rotate by the torque applying means provided in the above-mentioned manner, whereby the substrate holding members are relatively driven. With this configuration, the load applied to each cantilever arm member is suppressed to a small value, the arm member is prevented from tilting, and the transfer of the semiconductor substrate from the substrate holding member to the substrate container for the next process is hindered. And the transfer of the semiconductor substrate over all the steps is facilitated. Further, since the arm member does not tilt as described above, an apparatus for performing some processing on the semiconductor substrate is provided, and the semiconductor substrate is transported and positioned at a processing position by this apparatus. In this case, there is also an effect that this is performed with high accuracy. Further, in the present invention, a plurality of substrate holding members are attached to each of the plurality of arm members. Therefore, if a pair of substrate holding members provided so as to correspond to each other between the arm members hold the semiconductor substrates, for example, 25 semiconductor substrates, a plurality of semiconductor substrates, for example, 50 semiconductor substrates, such as 50 substrates, may be used. Has the effect of being able to pinch and transport at once.

[Brief description of the drawings]

FIG. 1 is an overall vertical sectional view of an automatic processing apparatus according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a longitudinal sectional view including a partial section of a holding unit and a transporting unit included in the automatic processing apparatus shown in FIG. 1;

FIG. 4 is a view on arrow BB in FIG. 3;

FIG. 5 is a view on arrow CC in FIG. 4;

FIG. 6 is a plan view of a holding unit included in the automatic processing device shown in FIG. 1;

FIG. 7 is a view on arrow DD in FIG. 6;

FIG. 8 is a view as seen from the direction of arrows EE in FIG. 7;

FIG. 9 is a plan sectional view of a base portion provided in the holding means shown in FIG. 6;

FIG. 10 is a sectional view taken along line FF of FIG. 9;

FIG. 11 is an enlarged view of a portion G in FIG. 8;

FIG. 12 is a front view of a substrate holding member provided in the holding unit shown in FIG. 6;

FIG. 13 is an enlarged view of a portion H in FIG. 12;

FIG. 14 is a front view of a comb-like member provided in the holding unit shown in FIG. 6;

FIG. 15 is a sectional view taken along the line II of FIG. 14;

FIG. 16 is a front view of a substrate support provided in the automatic processing apparatus shown in FIG. 1;

FIG. 17 is a view as viewed in the direction of arrows JJ in FIG. 16;

FIG. 18 is a view on arrow KK of FIG. 16;

FIG. 19 is an enlarged view of a portion L in FIG. 16;

FIG. 20 is a view taken along the line MM in FIG. 19;

FIG. 21 is a sectional view taken along the line NN in FIG. 19;

FIG. 22 is a front view of a substrate supply unit and a holding unit included in the automatic processing apparatus shown in FIG. 1;

FIG. 23 is a front view of a substrate holding member included in the substrate supply unit shown in FIG. 22;

FIG. 24 is a sectional view taken along the line OO in FIG. 23;

FIG. 25 is a sectional view taken along the line PP of FIG. 23;

FIG. 26 is an overall arrow view of the first conventional apparatus.

FIG. 27 is a front view including a partial cross section of a main part of a second conventional device.

FIG. 28 is a perspective view of a main part of a holding means included in the conventional device shown in FIG. 27;

FIG. 29 is an explanatory diagram of the operation of the conventional device shown in FIGS. 27 and 28;

FIG. 30 is a side view showing a state in which a semiconductor substrate is clamped by a substrate clamping member provided in the conventional apparatus shown in FIGS. 27 and 28;

[Description of sign]

3 Case 8 Substrate supply means 9, 10, 11, 12 Processing tank 9a, 10a, 11a, 12a Processing liquid 13 Substrate dryer 15, 16 Vibrator 18 Drainage means 20 Storage tank 22 Semiconductor substrate 24 Holding means 25 Transport means 27, 40 rail 29 movable base 30 support plate 34 guide plate 36 rack 38, 94 motor 45 movable pole 52 geared motor 58 base unit 59, 60 arm member 63 hanger member 70 connecting means 72 substrate holding member 74 virtual vertical plane 75 virtual horizontal plane 77 Comb-shaped member (regulation means) 80 Link mechanism (synchronization means) 82 Solenoid 85 Substrate support 90 Substrate carrying member

Claims (7)

(57) [Scope of request for utility model registration] 1. A holding means capable of holding a plurality of semiconductor substrates arranged in an upright manner such that their main surfaces are overlapped with each other, and a transfer means for transferring the holding means along a predetermined path. The holding means has a base portion conveyed by the conveying means, and a plurality of holding grooves each capable of engaging with the semiconductor substrate are provided side by side and provided relatively movably on the base portion. A semiconductor substrate transfer device comprising: at least a pair of substrate holding members for holding the semiconductor substrate in cooperation with each other; and driving means for driving each of the substrate holding members. A plurality of arm members attached at one end to be rotatable about an axial center and extending toward the side of the base portion, and having the other end attached to the substrate holding member; Is A semiconductor device having torque applying means attached to the base portion to apply a torque to each of the arm members, wherein a plurality of the substrate holding members are attached to each of the arm members. Transfer equipment for substrates. 2. The method according to claim 1, wherein the plurality of substrate holding members attached to each of the arm members are disposed such that central axes in a direction in which the holding grooves are arranged are substantially coincident with each other. The transfer device for a semiconductor substrate according to claim 1. 3. A synchronizing means interposed between the arm member and the torque applying means for synchronizing the operation of each of the arm members.
A transfer device for a semiconductor substrate according to claim 2. 4. The semiconductor substrate according to claim 1, further comprising a connecting means pivotally attached to the other end of each of said arm members to connect said arm members to each other. Transfer device. 5. The holding means has a hanger member attached to the other end of the arm member in a hanging state,
5. The transfer device for a semiconductor substrate according to claim 1, wherein the substrate holding member is provided at a lower end of the hanger member. 6. A processing tank capable of storing a processing liquid, holding means capable of holding a plurality of semiconductor substrates arranged in an upright state such that their main surfaces overlap with each other, and holding the semiconductor substrates. Transport means for transporting along a predetermined path extending out of the processing tank through a dipping position by the processing liquid in the processing tank together with the semiconductor substrate holding the means,
The holding means is provided with a base portion conveyed by the conveyance means and a plurality of holding grooves with which the semiconductor substrate can be engaged, and is provided relatively movably on the base portion to cooperate with each other. An automatic processing apparatus comprising at least a pair of substrate holding members for holding the semiconductor substrate and driving means for driving each of the substrate holding members, wherein the holding means is provided at one end of the base portion so as to be centered on an axial center. A plurality of arm members which are rotatably mounted and extend toward the side of the base portion, and the other end of which is provided with the substrate holding member. An automatic processing device having torque applying means for applying a torque to each of the arm members attached thereto, and a plurality of the substrate holding members being attached to each of the arm members. . 7. A plurality of substrate holding members attached to each of said arm members are disposed such that their central axes in a direction in which said holding grooves are arranged are substantially coincident with each other. The automatic processing device according to claim 6.