JPH10284447A - Wafer adhesive removing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer adhesive removing apparatus capable of automatically removing the adhesive remaining on a wafer after stripping the slice base. SOLUTION: Many wafers W are housed in a cassette 14 with their slice base stripping parts oriented in one direction, and a brush 36 contacted to the stripping parts of the wafers in the cassette is rotated and slid along the stripping parts, thereby removing an adhesive B remaining on the wafers from the wafers.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer adhesive removing apparatus, and more particularly to a wafer adhesive removing apparatus for removing an adhesive remaining on a wafer from which a slice base has been peeled off.

[0002]

2. Description of the Related Art When cutting an ingot, a slice base is adhered to the ingot and cut in order to prevent a defect at a cut end portion. The slice base is peeled from the wafer after cutting, and there are various types of peeling methods such as a hot water type, a heating type, and a dry type.

However, in either case, there is a problem that the adhesive used for bonding the slice base remains on the peeled wafer. For this reason, conventionally, after peeling the slice base from the wafer, an operator has rubbed the portion of the wafer to which the slice base was bonded with a brush to remove the adhesive.

[0004]

However, the method in which the worker removes the adhesive manually one by one as described above has a problem that processing takes a long time and production efficiency is extremely poor. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wafer adhesive removing apparatus that can automatically remove an adhesive remaining on a wafer after a slice base is peeled off.

[0005]

According to the present invention, there is provided a wafer adhesive removing apparatus for removing an adhesive remaining at a slice base peeling portion of a wafer from which a slice base has been peeled. The wafer, a cassette that stores the direction of the slice base peeling unit is fixed, and a brush arranged at a position facing the slice base peeling unit of the wafer stored in the cassette,
Rotation driving means for rotating the brush, forward and backward moving means for moving the brush forward and backward with respect to a slice base peeling portion of a wafer stored in the cassette, and slice base peeling of the wafer stored in the cassette. A moving means for moving the brush along the slice base peeling portion of the wafer, and sliding the brush along the slice base peeling portion of the wafer while rotating the brush. It is characterized in that the adhesive remaining on the slice base peeling portion of the wafer is removed.

According to the present invention, the adhesive remaining on the slice base peeling portion of the wafer is removed from the wafer while rotating, by being rubbed by a brush sliding along the slice base peeling portion.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a wafer adhesive removing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view showing a configuration of an embodiment of a wafer adhesive removing apparatus according to the present invention, and FIG. 2 is a side view thereof.

As shown in FIGS. 1 and 2, a cassette mounting table 12 is provided in a hot water tank 10 in which hot water is stored. On this cassette mounting table 12, a cassette 14 for storing wafers W is removably installed. The wafer W having a rectangular shape is stored in the cassette 14 with the direction of the slice base peeling portion (the portion to which the slice base is adhered) facing upward (see FIG. 3).

In the vicinity of the hot water tank 10, a column 16 is erected vertically. A pair of guide rails 18, 18 are provided on the support 16, and the guide rails 1
A lifting table 22 is supported by the sliders 8 and 18 via sliders 20 and 20 so as to be able to move up and down. A hydraulic cylinder 24 for elevating and lowering is installed near the upper end of the support 16 along the direction in which the guide rails 18 and 18 are arranged. The rod of the lifting hydraulic cylinder 24 is connected to the lifting table 22. The lifting table 22 is moved up and down along the guide rails 18 by driving the lifting hydraulic cylinder 24.

The lower surface of the elevating table 22 has a Y
A pair of guide rails 26, 26 are provided along the direction. The guide rails 26 have a slider 2
A slide frame 30 is slidably supported via 8, 28. On the other hand, a slide hydraulic cylinder 32 is disposed on the upper surface of the elevating table 22 along the guide rails 26, 26. The rod of the sliding hydraulic cylinder 32 is connected to the slide frame 30 via a connecting member 34. By driving the slide hydraulic cylinder 32, the slide frame 30 slides in the Y direction in the drawing along the guide rails 26, 26.

The slide frame 30 is formed in a gate shape, and a brush 36 is rotatably supported below the slide frame 30. An output shaft of a gear box 38 provided on the slide frame 30 is connected to an axis 36 a of the brush 36, and a motor 40 is connected to an input shaft of the gear box 38. The brush 36 is rotated by driving the motor 40.

The brush 36 used here is a nonwoven fabric surface treatment material conventionally used as a brush material. This non-woven fabric surface treatment material is one fiber one
Nylon fibers to which abrasive grains are adhered with an adhesive are entangled in a book to form a cloth.
For No. 6, a non-woven fabric surface treatment material formed in a roller shape is used. This nonwoven fabric surface treatment material has the characteristic that it has elasticity and fits well into the shape of a non-abraded material.

The operation of the embodiment of the wafer adhesive removing apparatus according to the present invention configured as described above is as follows. First, a predetermined number of wafers W are stored in the cassette 14 with the direction of the slice base peeling part facing upward. Then, the cassette 14 in which the wafer W is stored
Is set on the cassette setting table 12 in the hot water tank 10.

At this time, the elevating table 22 is mounted on the hot water tank 1 so as not to hinder the installation of the cassette 14.
It is made to stand by at the stand-by position set above 0. As described above, when the cassette 14 is installed in the hot water tank 10, the wafer W stored in the cassette 14 is immersed in the hot water, and the slice base peeling portion is moved in the Y direction in the drawing. Are arranged along. After that, the wafer adhesive removing device is operated.

First, the lifting hydraulic cylinder 24 is driven, and the lifting table 22 is lowered toward the hot water tank 10. The drive of the lifting hydraulic cylinder 24 is stopped when the rod is extended by a predetermined amount. As a result, the brush 36 supported at the lower portion of the lifting table 22 is moved by the hot water tank 10.
Abuts on the upper portion of the wafer W installed therein, that is, the slice base peeling portion.

The brush 3 which comes into contact with the wafer W
As described above, 6 has an elastic force, and thus contacts the wafer W with an appropriate pressing force. When the driving of the lifting hydraulic cylinder 24 is stopped, the motor 40 connected to the brush 36 is driven, and as a result, the brush 36 starts rotating. At the same time as the drive of the motor 40 is started, the slide hydraulic cylinder 32 connected to the slide frame 30 is driven. As a result, the brush 36 starts to slide along the Y direction in the drawing.

As a result, the brush 36 slides along the slice base peeling portion of the wafer W while rotating, as shown in FIG. The adhesive B remaining on the slice base peeling portion of the wafer W is scraped off by the rotating brush 36 and removed from the wafer W. The adhesive B attached to the wafer W
Since the wafer W is thermally softened by being immersed in hot water, the brush W is easily peeled off from the wafer W when the brush 36 that slides while rotating as described above comes into contact. Therefore, by passing the brush 36 once, most of the adhesive B can be removed.
The brush 36 is reciprocated about two to four times for more completeness.

The reciprocating operation of the brush 36 can be performed by extending and retracting a rod of the slide hydraulic cylinder 32. After the brush 36 reciprocates a predetermined number of times,
The removal operation ends. That is, after the drive of the motor 40 and the slide hydraulic cylinder 32 is stopped, the lift hydraulic cylinder 24 is driven to raise the lift table 22 to the standby position. Then, the cassette 14 is taken out from the hot water tank 10.

As described above, according to the wafer adhesive removing apparatus of the present embodiment, the adhesive can be automatically removed and a large number of wafers W can be processed at one time. Therefore, a series of processing operations after cutting from the ingot can be performed extremely efficiently. As a result, wafer production efficiency is improved. In addition,
In the adhesive removing apparatus according to the present embodiment, more efficient wafer processing becomes possible when performed in combination with a slice-based peeling operation. That is, the slice-based peeling and the removal of the adhesive are performed by using the above-described adhesive removing device according to the following procedure.

As shown in FIGS. 4 and 5, first, the cassette 14 for storing the wafer W is set on the cassette mounting table 12 in the hot water tank 10 in advance. Next, the wafer W cut into a comb blade shape by a wire saw or the like is placed in a hot water tank 1.
It is supported by the arm 42 located above the zero (the arm 42 will be described later), and is immersed in the hot water tank 10. At this time, the wafer W is immersed in hot water so as to be accommodated in the cassette 14 set in the hot water tank 10.

When the wafer W bonded to the slice base is immersed in hot water, the adhesive is thermally softened and spontaneously peels off from the wafer W. The peeled wafer W falls in hot water and is stored in the cassette 14. The wafer W accommodated in the cassette 14
Since the direction of the slice base peeling portion is all directed upward, after all the wafers W are naturally peeled, the operation of removing the adhesive may be performed by the above-described procedure.

Thus, the adhesive removing operation can be performed simultaneously with the peeling of the slice base S, which is extremely efficient. The arm 42 for supporting the wafer W is provided so as to be able to move up and down with respect to the hot water tank 10 by means of elevating means (not shown). It is provided in. Therefore, after the peeling operation of the slice base S is completed, if the evacuation is performed from above the hot water tank 10, the movement of the elevating table 22 and the like during the adhesive removing operation will not be an obstacle.

Further, since the slice base S adhered to the wafer W is further adhered to the mounting block M, when the wafer W is supported by the arm 42, both ends of the mounting block M are held. Next, a second embodiment of the wafer adhesive removing apparatus according to the present invention is described.
An embodiment will be described.

FIG. 6 is a front view showing the configuration of a second embodiment of the wafer adhesive removing apparatus according to the present invention, and FIG. 7 is a side view thereof. As shown in FIGS. 6 and 7,
In the hot water tank 50 in which the hot water is stored, a cassette mounting table 5 is provided.
2 are provided. On this cassette mounting table 52,
A cassette 54 for storing wafers W is installed in a vertically placed state. A large number of square wafers W are stored in a stacked state in the cassette 54, and the direction of the slice base peeling portion is all directed to one direction (left direction in FIG. 7).

In the vicinity of the hot water tank 50, a column 56 is vertically provided. A pair of guide rails 58, 58 are provided on the support 56, and the guide rails 5
Elevating tables 62 are supported by the sliders 8 and 58 so as to be able to move up and down. In the vicinity of the upper end of the column 56, a hydraulic cylinder 64 for elevation is installed along the direction in which the guide rails 58, 58 are arranged. The rod of the lifting hydraulic cylinder 64 is connected to the lifting table 62. The elevation table 62 is moved up and down along the guide rails 58 by driving the elevation hydraulic cylinder 64.

The lower surface of the elevating table 62 has a Y
A pair of guide rails 66, 66 are provided along the direction. The guide rails 66 are provided with a slider 6.
An advance / retreat slide frame 70 is slidably supported via 8, 68. On the other hand, on the upper surface of the elevating table 62, an advancing / retracting slide hydraulic cylinder 72 is disposed along the guide rails 66,66. The rod of the hydraulic cylinder 72 for reciprocating slide is connected to the reciprocating slide frame 70 via a connecting member 74 formed in an L-shape. The forward / backward slide frame 7
By driving the forward / backward slide hydraulic cylinder 72, the slider 0 slides along the guide rails 66 in the Y direction in the figure.

The forward / backward slide frame 70 is formed in an inverted L-shape, and a guide rail 76 is disposed on the front portion 70A along the X direction in the figure. A slide base 80 is slidably supported by the guide rail 76 via a slider 78. Also,
On the front surface 70A of the advance / retreat slide frame 70, along with the guide rail 76, the slide hydraulic cylinder 8 is provided.
2 are provided. This slide hydraulic cylinder 82
Are connected to the slide base 80. The slide base 80 drives the slide hydraulic cylinder 82 to move the guide rail 7.
6 along the X direction in the figure.

A motor 84 is provided on the slide base 80.
Are installed with the direction of the spindle 84a directed vertically downward. A shaft 84a of a brush 86 is connected to a spindle 84a of the motor 84. The brush 86 rotates by driving the motor 84. The structure of the brush 86 is the same as that of the first brush.
The configuration is the same as that of the brush 36 of the embodiment.

The operation of the second embodiment of the wafer adhesive removing apparatus according to the present invention constructed as described above is as follows. First, a predetermined number of wafers W are stacked and stored in the cassette 54 such that the direction of the slice base peeling portion is constant. Then, the cassette 54 in which the wafer W is stored is placed in the cassette mounting table 5 in the hot water tank 50.
Place it on 2

At this time, the elevating table 62 is placed in the hot water tank 5 so as not to hinder the work of installing the cassette 54.
It is made to stand by at the stand-by position set above 0. As described above, when the cassette 54 is installed in the hot water tank 50, the wafer W stored in the cassette 54 is immersed in the hot water, and the slice base peeling portion is moved in the X direction in the drawing. It is arranged along. And after this,
The wafer adhesive removing device is operated.

First, the lifting hydraulic cylinder 64 is driven, and the lifting table 62 is lowered toward the hot water tank 50. The drive of the lifting hydraulic cylinder 64 is stopped when the rod is extended by a predetermined amount, and as a result, the brush 86
The front of the wafer W installed in the hot water tank 50,
That is, they are located at a predetermined interval in front of the slice base peeling section.

When the drive of the hydraulic cylinder 64 for lifting is stopped, the hydraulic cylinder 72 for forward / backward slide is driven, and the forward / backward slide frame 70 slides in the Y direction in the figure (to the right in FIG. 7). The drive of the hydraulic cylinder 72 for advancing and retreating is stopped when the rod is extended by a predetermined amount, and as a result, the brush 86 comes into contact with the slice base peeling portion.

When the drive of the hydraulic cylinder 72 is stopped, the motor 84 connected to the brush 86 is driven. As a result, the brush 86 starts rotating. At the same time as the drive of the motor 84 is started, the slide hydraulic cylinder 82 connected to the slide base 80 is driven. As a result, the brush 86 starts to slide along the X direction in the drawing.

As a result, the brush 86 slides along the slice base separation portion of the wafer W while rotating. Then, the adhesive remaining on the slice base peeling portion of the wafer W is transferred to the brush 8 which slides while rotating.
6 and is removed from the wafer W. The removal operation is completed when the brush 86 reciprocates about 2 to 4 times. At the end of the removing operation, first, the driving of the motor 84 and the slide hydraulic cylinder 82 is stopped, and then the advance / retreat slide hydraulic cylinder 72 is driven to retract the brush 86 from the wafer W. The lifting hydraulic cylinder 64
Is driven to move the elevating table 62 up to the standby position.

The adhesive removal operation is completed by a series of operations as described above, and the wafer W from which the removal has been completed is taken out of the hot water tank 50 together with the cassette 54. As described above, according to the wafer adhesive removing apparatus of the present embodiment, as in the first embodiment, the adhesive can be automatically removed and a large number of wafers W can be processed at once. Therefore, the wafer processing operation can proceed efficiently. As a result, wafer production efficiency is improved.

In this embodiment, the brushes 36, 8
Although a roller formed of a nonwoven fabric surface treatment material is used for 6, the present invention is not limited to this, and a wire brush, a cylindrical grinding wheel, or the like may be used. Further, in the present embodiment, the adhesive is removed while the wafer W is immersed in hot water, but this is because the adhesive is thermally softened by immersing it in hot water. This is because removal becomes easy. Therefore, the brushes 36, 86
If the number of reciprocations is increased, the adhesive can be similarly removed even in the air.

In this embodiment, the case where the adhesive adhered to the square wafer W is removed has been described. However, the present invention can be applied to a round wafer W. In this case, it is necessary to prevent the rotation of the wafer W when removing the adhesive with the brush 36. In the adhesive removing apparatus of the type in which the wafer W is placed horizontally as described in the first embodiment, one end of the wafers W, W,. The wafers W, W,... Are sandwiched between the inner walls of the cassette 14 by pressing with a pad 90 formed of an elastic body such as. Thus, the wafers W, W,... Accommodated in the cassette 14 are fixed and prevented from rotating.

As shown in the drawing, the pad 90 is driven by a hydraulic cylinder 92 connected to the pad 90. By driving the hydraulic cylinder 92, the pad 90 is moved toward the end face of the wafer W. Move forward and backward.
In the adhesive removing apparatus of the type in which the wafer W is placed horizontally as described in the first embodiment, as shown in FIG.
One end of the wafers W, W,... Stored in the cassette 14 is pressed by a pad 90 formed of an elastic body such as rubber,
The wafers W, W,... Are sandwiched between the inner walls of the cassette 14. Thus, the wafers W, W,... Accommodated in the cassette 14 are fixed and prevented from rotating.

As shown in the drawing, the pad 90 is driven by a hydraulic cylinder 92 connected to the pad 90. By driving the hydraulic cylinder 92, the pad 90 is moved toward the end face of the wafer W. Move forward and backward.
Further, in the adhesive removing apparatus of the type in which the wafer W is placed vertically as described in the second embodiment, the wafers W, W,.
A pair of pads 9 each formed of an elastic body such as rubber on both sides thereof
4. Hold at 94. Thus, the wafers W, W,... Accommodated in the cassette 54 are fixed and prevented from rotating.

The driving of the pads 94, 94 is performed as follows. As shown in FIG.
4 are connected to arms 96, 96, respectively.
The arms 96, 96 are rack members 100, 100 slidably supported on guide rails 98, 98.
It is connected to. A pinion gear 102 is engaged with the rack members 100, 100, and a motor 104 is connected to the pinion gear 102. By driving the motor 104, the pair of pads 94, 94 move toward each other and hold the wafers W, W,. Thereby, the wafer W,
The rotation of W,... Is prevented.

[0041]

As described above, according to the present invention,
Since the adhesive can be automatically removed and a large number of wafers W can be processed at one time, the processing of the wafer can be proceeded very efficiently. As a result, wafer production efficiency is improved.

[Brief description of the drawings]

FIG. 1 is a front view of a first embodiment of a wafer adhesive removing apparatus according to the present invention.

FIG. 2 is a side view of FIG. 2;

FIG. 3 is an explanatory diagram illustrating the operation of the wafer adhesive removing device according to the present invention.

FIG. 4 is a front view of another embodiment of the wafer adhesive removing apparatus according to the present invention.

FIG. 5 is a side view of FIG. 5;

FIG. 6 is a front view of a second embodiment of the wafer adhesive removing apparatus according to the present invention.

FIG. 7 is a side view of FIG. 6;

FIG. 8 is a side view of another embodiment of the wafer adhesive removing apparatus according to the present invention.

FIG. 9 is a plan view of another embodiment of the wafer adhesive removing apparatus according to the present invention.

[Explanation of symbols]

 10, 50: Hot water tank 14, 54: Cassette 16, 56: Support column 22, 62: Elevating table 24, 64 ... Hydraulic cylinder for elevating 30: Slide frame 32: Hydraulic cylinder for sliding 36, 86 ... Brush 40, 84 ... Motor Reference numeral 70: forward / backward slide frame 72 ... forward / backward slide hydraulic cylinder 80 ... slide base 82 ... slide hydraulic cylinder B ... adhesive S ... slice base W ... wafer

Claims (2)

[Claims] 1. A wafer adhesive removing apparatus for removing an adhesive remaining on a slice base peeling portion of a wafer from which a slice base has been peeled off, wherein a plurality of wafers are stored with the direction of the slice base peeling portion kept constant. A cassette, a brush disposed at a position facing a slice base peeling portion of a wafer stored in the cassette, a rotation drive unit for rotating the brush, and a slice base for the wafer stored in the cassette. Reciprocating moving means for moving the brush forward and backward with respect to the peeling part; moving means for moving the brush along a slice base peeling part of a wafer stored in the cassette; and Abut on the slice base peeling part of the wafer while rotating the brush. By sliding me,
An apparatus for removing an adhesive from a wafer, which removes an adhesive remaining on a slice base peeling portion of the wafer. 2. The wafer adhesive removing device has a hot water tank in which hot water is stored, and immerses a wafer bonded to a slice base in the hot water and spontaneously peels off the wafer from the slice base. 2. The wafer adhesive removing device according to claim 1, wherein the wafer that falls by falling is stored in the cassette.