JP2015224317A - Adhesive layer removing device and adhesive layer removing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive layer removing device and an adhesive layer removing method capable of improving versatility.SOLUTION: Provided is an adhesive layer removing device 10 including: a scraping-out means 20 of scraping out an adhesive layer part AD1 squeezed out from the prescribed area AR of the body WF to be adhered to an adhesive sheet AS at least made of a base material BS and an AD layer pasted on the body WF to be adhered from a space between the body WF to be adhered and the base material BS; and a moving means 30 of relatively moving the scraping-out means 20 and the adhesive sheet AS along the periphery of the adhesive sheet AS.

Description

  The present invention relates to an adhesive layer removing apparatus and an adhesive layer removing method.

Conventionally, an adhesive layer removing apparatus that removes an adhesive layer of an adhesive sheet attached to an adherend is known (see, for example, Patent Document 1).
The adhesive layer removing apparatus described in Patent Document 1 uses an etching solution to remove the outer edge portion of the adhesive resin when grinding a wafer (adhered body) bonded to a support substrate with an adhesive resin (adhesive sheet). It is configured to be removed by etching.

JP-A-9-148283

  However, since the conventional adhesive layer removing apparatus as described in Patent Document 1 must prepare an etching solution in accordance with the adherend or the adhesive sheet or perform mask processing on the adherend. There is a disadvantage that it lacks versatility.

  The objective of this invention is providing the adhesive layer removal apparatus and adhesive layer removal method which can improve versatility.

  The adhesive layer removing apparatus according to the present invention provides an adhesive layer portion protruding from a predetermined region of the adherend on the adhesive sheet comprising at least a base material and an adhesive layer attached to the adherend. It is characterized by comprising scraping means for scraping from between the body and the substrate, and moving means for relatively moving the scraping means and the adhesive sheet along the outer edge of the adhesive sheet.

In the adhesive layer removing apparatus of the present invention, the scraping means includes a contact member that contacts an outer edge of the adhesive layer, and a rotation that rotates the contact member around a rotation axis of the contact member. And means.
Moreover, it is preferable that the adhesive layer removal apparatus of this invention is equipped with the re-adhesion prevention means which prevents the scraped-out adhesive layer from re-adhering to the said adherend.
Moreover, it is preferable that the adhesive layer removal apparatus of this invention is equipped with the hardening means to harden the adhesive bond layer part which protruded from the predetermined area | region of the said to-be-adhered body.

  In the adhesive layer removing method of the present invention, the adhesive layer portion protruding from a predetermined region of the adherend is attached to the adhesive sheet composed of at least a base material and an adhesive layer attached to the adherend. It is characterized by comprising a step of scraping with a scraping means from between the body and the substrate, and a step of relatively moving the scraping means and the adhesive sheet along the outer edge of the adhesive sheet.

  According to the present invention as described above, in order to scrape the adhesive layer from between the adherend and the substrate, an etching solution is prepared according to the adherend or the adhesive sheet, or mask treatment is performed on the adherend. There is no need to go, and versatility can be improved.

Further, if the scraping means is provided with the abutting member and the rotating means, the scraped adhesive layer can be wound around the abutting member, so that the operation of removing the adhesive layer can be simplified.
Furthermore, if a re-adhesion preventing means is provided, it is possible to prevent the adhesive layer from re-adhering to the adherend or the adhesive sheet.
Further, if a curing means is provided, even if the adhesive layer is soft, the adhesive layer portion protruding from a predetermined region of the adherend is not left on the adherend or substrate, It can be surely scraped from between the substrate.

The side view of the adhesive bond layer removal apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the sheet adhesive layer removal apparatus of FIG. Operation | movement explanatory drawing of the adhesive bond layer removal apparatus which concerns on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the following, without giving a reference figure, for example, when directions such as up, down, left, right, or near side, back side are shown, all of FIG. The top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction perpendicular to the page. To do.

  In FIG. 1, the adhesive layer removing apparatus 10 protrudes from the predetermined area AR of the wafer WF with respect to the adhesive sheet AS composed of the base material BS and the adhesive AD layer attached to the wafer WF as the adherend. Scraping means 20 for scraping the adhesive layer portion AD1 from between the wafer WF and the base material BS, moving means 30 for relatively moving the scraping means 20 and the adhesive sheet AS along the outer edge of the adhesive sheet AS; Reattachment prevention means 40 for preventing the scraped adhesive AD layer from reattaching to the wafer WF, and a hardening means 50 for curing the adhesive layer portion AD1 protruding from the predetermined area AR of the wafer WF are provided. Note that the adhesive sheet AS has the same planar shape as the wafer WF, and is attached to the wafer WF to form an integrated object WK.

  The scraping means 20 is composed of a flexible member such as rubber, resin, sponge, or brush having at least an outer peripheral portion, and a contact member 21 that contacts the outer edge of the adhesive AD layer, and a linear motion as a drive device. A rotating means that is supported by the output shaft 22A of the motor 22, supports the contact member 21 by the output shaft 23A, and rotates the contact member 21 about the rotation shaft 21A of the contact member 21. A rotation motor 23 as a driving device is provided.

  The moving means 30 is supported by a rotating motor 32 as a driving device supported by a slider 31A of a linear motor 31 as a driving device, and an output shaft 32A of the rotating motor 32, and is not shown in the drawing such as a decompression pump or a vacuum ejector. And a table 33 having a support surface 33A capable of adsorbing and holding the integrated object WK by the decompression means.

  The reattachment prevention means 40 is formed with an opening 41A that expands toward the movement means 30 side, and an insertion port 41C into which the contact member 21 can be inserted is provided on the upper surface portion 41B, and is scraped out to the lower surface portion 41D. A first dust collecting box 41 having a five-surface closed type provided with an exhaust port 41E for the adhesive AD layer (hereinafter referred to as scraped material SR), and an inner surface on the upper side and the lower side of the opening 41A, A nozzle 42 provided so that gas can be blown out into the first dust collection box 41, and a second dust collection box 43 supported by the lower surface portion 41D and communicating with the first dust collection box 41 through the exhaust port 41E. And a backflow prevention member 44 formed in a funnel shape that protrudes from the lower surface portion 41D into the second dust collection box 43 and has an inner diameter that decreases downward from the exhaust port 41E, and a second through a pipe 45A. A vacuum pump or vacuum edge communicating with the dust collection box 43 And a pressure reducing means 45 such as a connector.

  The curing means 50 includes a plate 52 supported by an output shaft 51A of a direct acting motor 51 as a driving device, and a cooling means 53 such as a Peltier element as an energy applying means provided in the plate 52 or a cooling side of a heat pipe. And. The energy applying means can be appropriately selected according to the curing characteristics of the adhesive AD layer, and may be one that imparts curing energy such as hot air, ultraviolet light, microwave, or natural wind.

A procedure for removing the adhesive layer portion AD1 of the adhesive sheet AS attached to the wafer WF in the above adhesive layer removing apparatus 10 will be described.
First, an operator inputs an operation start signal via an input means such as an operation panel (not shown) or a personal computer, and an initial position indicated by a solid line in FIG. When the integrated object WK is placed at a predetermined position on the support surface 33A of the table 33, the moving means 30 drives a decompression means (not shown) to hold the integrated object WK by suction on the support surface 33A.

  Next, the curing means 50 drives the linear motion motor 51 and the cooling means 53, and lowers the plate 52 from the initial position indicated by the solid line in FIG. 1 as shown by the two-dot chain line in FIG. Let Then, after cooling the adhesive sheet AS to cure the adhesive layer portion AD1, the linear motor 51 is driven, the plate 52 is returned to the initial position, and the driving of the cooling means 53 is stopped.

  Next, the scraping means 20 drives the linear motion motor 22 to lower the contact member 21 at the initial position indicated by the solid line in FIG. 1 from the insertion port 41C and contact at the position indicated by the two-dot chain line in FIG. The member 21 is stopped. Then, the scraping means 20 drives the rotation motor 23 to rotate the contact member 21, and the moving means 30 drives the linear motor 31 and the rotation motor 32 to rotate the table 33 within the support surface 33A. However, when it is moved rightward, the contact member 21 comes into contact with the outer edge of the adhesive layer portion AD1 as indicated by a two-dot chain line in FIG. Thereafter, when the moving means 30 rotates the table 33 and moves it to the right, as shown in FIG. 2A, the contact member 21 enters between the base material BS and the wafer WF, and the adhesive layer portion. AD1 is scraped in the circumferential direction from between the wafer WF and the base material BS by the contact member 21, and the scraped material SR adheres to the contact member 21, as shown in FIG. It is removed from the monolith WK.

  At this time, the reattachment prevention unit 40 drives the nozzle 42 and the decompression unit 45 to blow out the gas from the opening 41A through the exhaust port 41E toward the second dust collection box 43. As a result, the scraped material SR that has not adhered to the contact member 21 is discharged from the exhaust port 41E without reattaching to the wafer WF, and the scraped material SR is prevented from flowing back by the backflow preventing member 44. 2. Collected in dust collection box 43. As shown in FIG. 1, the gas ejected from the nozzle 42 is formed by the upper surface portion 41B or the lower surface portion 41D and the integrated object WK from a wide space formed by the opening 41A and the integrated object WK. Since the flow velocity increases by moving toward the narrow space, the scraped material SR that has not adhered to the contact member 21 can be efficiently guided toward the second dust collection box 43.

  Then, when the detection means (not shown) detects that the adhesive layer portion AD1 has been all scraped, the scraping means 20, the moving means 30, and the reattachment prevention means 40 are converted into the linear motor 31, the rotation motors 23, 32, The drive of the nozzle 42 and the decompression means 45 is stopped. Next, the scraping unit 20 and the moving unit 30 drive the linear motor 22 and the linear motor 31 to return the contact member 21 and the table 33 to the initial positions. Then, the moving unit 30 stops driving the decompression unit (not shown) and transports the integrated object WK to the next process apparatus or the like manually or by a transport unit (not shown). Thereafter, the same operation is repeated.

According to the above embodiment, in order to scrape the adhesive AD layer from between the wafer WF and the base material BS, an etching solution is prepared according to the wafer WF or the adhesive sheet AS, or a mask process is performed on the wafer WF. There is no need to go, and versatility can be improved.
Further, since the adhesive AD layer is accommodated in the predetermined area AR of the wafer WF, it is possible to prevent the adhesive AD layer from being scraped together with the wafer WF when the wafer WF is ground in the next process.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

  For example, in addition to the configuration of the above-described embodiment, the scraping unit 20 includes a bar member, a squeegee, and a roller that pushes the adhesive layer portion AD1 from between the wafer WF and the base material BS, as shown in FIG. 3B, the adhesive layer portion AD1 extruded by the abutting member 21 is removed after the adhesive layer portion AD1 is extruded by the extrusion device 24, as shown in FIG. Good. Thereby, adhesive layer part AD1 can be scraped out easily. At this time, as shown in FIGS. 3A and 3B, a softening means 60 for softening the extruded adhesive layer portion AD1 and a hardening means 50A for curing the extruded adhesive layer portion AD1 may be provided. . The curing unit 50A and the softening unit 60 can have the same configuration as the energy application unit.

The scraping means 20 is not limited to a flexible member, and for example, a suction nozzle as an abutting member provided so as to be insertable between the wafer WF and the base material BS, and applies a suction force to the suction nozzle. A suction force applying means such as a vacuum pump or a vacuum ejector may be provided, and the adhesive layer portion AD1 may be scraped out while being sucked by a suction nozzle.
Further, the scraping means 20 employs a wire member such as a thread or a wire as a contact member that is sprayed with a fluid such as water or gas on the outer edge of the adhesive AD layer or stretched in the surface direction of the wafer WF without slack, The adhesive member AD1 may be scraped by relatively moving the wire member and the integrated object WK, or a sharp tip member such as a needle may be employed as the contact member 21.
Further, the scraping means 20 may drive the linear motion motor 22 in a state where the contact member 21 and the integrated object WK are rotated, and move the rotated contact member 21 up and down.

Further, the moving means 30 may be configured to hold the integrated object WK by a Coulomb force, a mechanical chuck, an adhesive, an adhesive, or the like.
Further, the moving unit 30 may move the scraping unit 20 along the outer edge of the adhesive sheet AS without rotating the table 33 or while rotating the table 33.
Further, the scraping unit 20 and the moving unit 30 may rotate the contact member 21 relatively slowly or faster than the integrated member WK, or may rotate the integrated member WK and the contact member 21. May be rotated at the same speed, or the rotation direction of the integrated object WK and the contact member 21 may be the same or different.
Furthermore, the moving means 30 may hold the integrated object WK from the adhesive sheet AS side.

Further, the reattachment prevention means 40 and the curing means 50A may be singular or a plurality may be provided along the outer edge of the integrated object WK.
Furthermore, the reattachment prevention means 40 may be configured such that the plate 52 can be inserted into the opening 41A. Thereby, the adhesive layer portion AD1 can be scraped out while the adhesive layer portion AD1 is cured by the curing means 50.
The reattachment prevention means 40 also removes scraped matter such as a bar member, a squeegee, an adhesive roller, and a member similar to the contact member 21 that removes the scraped material SR attached to the contact member 21 from the contact member 21. Means may be provided.
Furthermore, the curing means 50 may cure the entire adhesive AD layer, or may cure only the adhesive layer portion AD1.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a quadrangle, and other shapes, or may not have a planar shape, and may have a pressure sensitive adhesive property, a heat sensitive adhesive property, or the like. It may be in the form. Further, the adhesive sheet AS is, for example, one having three or more layers such as one having an intermediate layer between the base BS and the adhesive AD layer, and having a cover layer on the upper surface of the base BS, and further, the base BS May be a so-called double-sided adhesive sheet that can be peeled from the adhesive AD layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the scraping means is configured such that the adhesive layer portion protruding from a predetermined region of the adherend is attached to the adherend and the substrate with respect to an adhesive sheet composed of at least the substrate and the adhesive layer attached to the adherend. As long as it can be scraped from the space, it is not limited in any way as long as it is within the technical scope in light of the technical common sense at the time of filing (explanation of other means and processes is omitted). To do).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Adhesive layer removal apparatus 20 Scraping means 21 Contact member 21A Rotating shaft 23 Rotating motor (rotating means)
30 Moving means 40 Re-adhesion preventing means 50 Curing means AD Adhesive AD1 Adhesive layer part AR area AS Adhesive sheet BS Base material WF Wafer (Substrate)

Claims (5)

For an adhesive sheet composed of at least a base material and an adhesive layer attached to the adherend, the adhesive layer portion protruding from a predetermined region of the adherend is scraped from between the adherend and the base material. Scraping means;
An adhesive layer removing apparatus comprising: a moving means for relatively moving the scraping means and the adhesive sheet along an outer edge of the adhesive sheet.   The scraping means includes an abutting member that abuts on an outer edge of the adhesive layer, and a rotating means that rotates the abutting member about a rotation axis of the abutting member. The adhesive layer removing apparatus according to claim 1.   The adhesive layer removing apparatus according to claim 1, further comprising a reattachment prevention unit that prevents the scraped adhesive layer from reattaching to the adherend.   The adhesive layer removing apparatus according to any one of claims 1 to 3, further comprising a curing unit that cures an adhesive layer portion protruding from a predetermined region of the adherend. For the adhesive sheet consisting of at least the base material and the adhesive layer attached to the adherend, the adhesive layer portion protruding from the predetermined area of the adherend is scraped from between the adherend and the base material. A process of scraping with an exit means;
A method of removing the adhesive layer, comprising: a step of relatively moving the scraping means and the adhesive sheet along an outer edge of the adhesive sheet.

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