TW201605635A - Adhesive layer removing apparatus and adhesive layer removing method - Google Patents

Abstract

Provided is an adhesive layer removing apparatus (10), which comprises: a stripping and eliminating means (20) for stripping and eliminating an adhesion agent layer portion (AD1) protruded from a pre-specified region (AR) of a to-be-adhered body (WF) between the to-be-adhered body (WF) and a base material (BS), wherein an adhesion sheet (AS) is formed of at least the base material (BS) and an adhesion agent layer (AD) adhered to the to-be-adhered body (WF); and a moving means (30) for relatively moving the stripping means (20) and the adhesion sheet (AS) along an outer edge of the adhesion sheet (AS).

Description

Substrate layer removing device and adhesive layer removing method

The present invention relates to an adhesive layer removing device and an adhesive layer removing method.

It is known that an adhesive layer removing device which is attached to the adhesive layer of the adhesive sheet of the adherend is known (for example, Japanese Laid-Open Patent Publication No. Hei 9-148283).

In the adhesive layer removing device of Document 1, when the adhesive (attached to the wafer) (attached to the adherend) of the support substrate is followed by the adhesive resin, the outer edge portion of the adhesive resin is removed by etching.

However, the conventional adhesive layer removing device of Document 1 has a problem that the etchant is prepared by blending the adherend and the subsequent sheet, and it is necessary to perform the shielding treatment on the adherend, which has a problem of lack of generality.

An object of the present invention is to provide an adhesive layer removing device and an adhesive layer removing method which can improve general versatility.

The adhesive layer removing device of the present invention is characterized in that The means for removing is a bonding sheet composed of at least a substrate and an adhesive layer attached to the adherend, and an adhesive layer portion which is beyond the prescribed area of the adherend is from the adhered body. And removing between the substrates; and moving means for moving the dialing means and the sheet along the outer edge of the sheet.

In the adhesive layer removing device of the present invention, the aforementioned hand is removed The segment preferably includes an abutting member that abuts against an outer edge of the adhesive layer, and a rotating means that rotates the abutting member around a rotation axis of the abutting member.

Further, the adhesive layer removing device of the present invention is provided with prevention of being It is preferable that the removed adhesive layer is further adhered to the adhesion preventing means of the adherend.

Further, the adhesive layer removing device of the present invention is provided with the former The hardening means for partially hardening the adhesive layer which is outside the prescribed area of the adherend is preferred.

The method for removing an adhesive layer of the present invention, characterized in that For the subsequent sheet composed of at least the substrate and the adhesive layer attached to the adherend, the portion of the adhesive layer which is beyond the predetermined area of the adherend is from the adhered body and the substrate a process of being dialed by a dialing means; and a process of moving the aforementioned means and the aforementioned succeeding sheet relative to each other along the outer edge of the sheet.

According to the invention as above, because from the adherend The adhesive layer is removed between the substrates, so it is not necessary to mix the adhered body and then the sheet to prepare an etching solution and perform shielding treatment on the adherend, which can be improved. Generality.

And when the dialing means is provided with the abutting member and the turning means, Since the dispensed adhesive layer can be attached to the abutting member, the removal operation of the adhesive layer can be simplified.

Further, when the re-adhesion preventing means is provided, it is possible to prevent the adhesive layer from reattaching to the adherend and the subsequent sheet.

When the curing means is provided, even if the adhesive layer is soft, the portion of the adhesive layer which is beyond the predetermined area of the adherend does not remain in the adherend or the substrate, and can be surely adhered to the adherend and the base. Remove between materials.

AD‧‧‧ adhesive

AD1‧‧‧ adhesive layer part

AR‧‧‧ areas specified

AS‧‧‧ followed by thin slices

BS‧‧‧Substrate

SR‧‧‧Drops

WF‧‧‧ wafer

WK‧‧‧ integral

10‧‧‧Binder layer removal device

20‧‧‧Remove means

21‧‧‧Abutment components

21A‧‧‧Rotary axis

22‧‧‧Directional motor

22A‧‧‧ Output shaft

23,32‧‧‧Rotating motor

23A‧‧‧ Output shaft

24‧‧‧ means of launch

30‧‧‧Mobile means

31‧‧‧Linear motor

31A‧‧‧Sliding parts

32A‧‧‧ Output shaft

33‧‧‧ mounting table

33A‧‧‧Support surface

40‧‧‧Reattachment prevention means

41‧‧‧1st dust box

41A‧‧‧ Opening

41B‧‧‧Upper face

41C‧‧‧ insertion port

41D‧‧‧The lower part

41E‧‧‧Exhaust port

42‧‧‧Nozzles

43‧‧‧2nd dust box

44‧‧‧Backflow prevention component

45‧‧‧Decompression

45A‧‧‧Pipe

50‧‧‧ hardening means

50A‧‧‧hardening means

51‧‧‧Directional motor

51A‧‧‧ Output shaft

52‧‧‧Board

53‧‧‧ cooling means

60‧‧‧softening means

Fig. 1 is a side view showing an adhesive layer removing device according to an embodiment of the present invention.

Fig. 2A is an operation explanatory view of the sheet adhesive layer removing device of Fig. 1.

Fig. 2B is an operation explanatory view of the sheet adhesive layer removing device of Fig. 1.

Fig. 3 is a view for explaining the operation of the adhesive layer removing device according to a modification of the present invention.

Fig. 3B is an operation explanatory view of the adhesive layer removing device according to a modification of the present invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In the following, in the case where the directions of the top, the bottom, the left, the right, or the front, and the back (the Austrian) are displayed, for example, the first picture is taken from the normal direction ( The attached number is the direction of the appropriate direction. The upper, lower, left, and right directions are the directions parallel to the paper surface. The front is the front direction perpendicular to the paper surface, and the rear is the rear perpendicular to the paper surface. Side direction.

In the first embodiment, the adhesive layer removing device 10 is provided with the succeeding sheet AS composed of the substrate BS and the adhesive AD layer attached to the wafer WF as the adherend. The dialing means 20 for removing the adhesive layer portion AD1 from the wafer WF and the substrate BS in the prescribed area AR of the circular WF, and the outer edge of the succeeding sheet AS along the dialing means 20 and the subsequent sheet AS The relatively moving moving means 30, the re-adhesion preventing means 40 for preventing the removed AD layer from being attached to the wafer WF, and the hardening of the adhesive layer portion AD1 which is beyond the predetermined area AR of the wafer WF Means 50. Further, the sheet AS is formed to have the same planar shape as the wafer WF, and is attached to the wafer WF to form an integrated body WK.

The detachment means 20 includes a flexible member made of at least a flexible rubber, resin, sponge, or brush at the outer peripheral portion, and abutting member 21 that abuts against the outer edge of the adhesive AD layer; and is supported The output shaft 22A of the linear motion motor 22 as a drive machine, and the abutment member 21 is supported by the output shaft 23A, and the abutment member 21 is the abutment member 21 The rotating shaft 21A is a centrally rotating turning means and serves as a turning motor 23 for driving the machine.

The moving means 30 is provided with: being supported as a driving machine The rotary motor 32 as the drive device of the slider 31A of the linear motor 31 of the device; and the output shaft 32A supported by the rotary motor 32 have a decompression means (not shown) such as a pressure reducing pump and a vacuum ejector. The mounting table 33 of the support surface 33A that is held by the integrated body WK is held.

The reattachment preventing means 40 is provided with: a moving means The open side portion 41A is formed on the 30 side, and the insertion opening 41C into which the abutting member 21 can be inserted is provided in the upper surface portion 41B, and the AD layer to be removed (hereinafter referred to as the dialing object SR) is provided in the lower surface portion 41D. The first dust collecting box 41 of the five-side blocking type of the exhaust port 41E; and the inner surface of the upper side and the lower side of the opening 41A, and the nozzle 42 for blowing the gas into the first dust collecting box 41; And the second dust collecting box 43 that is supported by the lower portion 41D, communicates with the inside of the first dust collecting box 41 through the exhaust port 41E, and protrudes from the lower surface portion 41D toward the inside of the second dust collecting box 43. The funnel-shaped backflow prevention member 44 which is formed to gradually reduce the inner diameter toward the lower side, and a pressure reducing means 45 such as a vacuum pump and a vacuum ejector which communicate with the inside of the second dust collecting box 43 through the pipe 45A.

The hardening means 50 is provided with: being supported as a driving machine The pallet 52 of the output shaft 51A of the direct-acting motor 51 of the device, and the cooling means 53 such as the lug element of the energy supply means provided in the pallet 52 and the cooling side of the heat pipe. Further, the energy imparting means can be appropriately selected in accordance with the hardening characteristics of the adhesive AD layer, and is given to hot air, ultraviolet rays, microwaves, and natural It is also possible to harden energy such as wind.

In the above adhesive layer removing device 10, the description will be The step of removing the adhesive layer portion AD1 attached to the succeeding sheet AS of the wafer WF.

First of all, the operator is through the operation panel and personal power without a picture. The input means of the brain or the like inputs the signal of the start of the operation, and the integrated object WK is placed on the first figure in the first figure by a non-illustrated conveyance means such as a human hand or a multi-joint robot arm or a belt conveyor belt. In the predetermined position of the support surface 33A of the mounting table 33 in the initial position, the moving means 30 is driven by a decompression means (not shown), and the integrated body WK is suction-held by the support surface 33A.

Next, the hardening means 50 is a direct acting motor 51 and a cooling hand The segment 53 is driven to lower the initial position indicated by the solid line from the first figure in the first drawing as shown by the two-point lock line in the drawing, and the subsequent sheet AS is brought into contact with each other. After the bonding sheet AS is cooled and the adhesive layer portion AD1 is cured, the linear motor 51 is driven to return the pallet 52 to the initial position, and the driving of the cooling means 53 is stopped.

Next, the dialing means 20 drives the linear motor 22, which will In the first drawing, the contact member 21 in the initial position indicated by the solid line descends from the insertion port 41C, and the abutting member 21 is stopped at the position indicated by the two-point lock line in the same figure. Further, the dialing means 20 drives the turning motor 23 to rotate the abutting member 21, and the moving means 30 drives the linear motor 31 and the turning motor 32 to rotate the mounting table 33 in the support surface 33A and to move in the right direction. If it is shown by the two-point lock line in Fig. 1, the abutment member 21 It is abutted on the outer edge of the adhesive layer portion AD1. Then, when the moving means 30 also rotates the mounting table 33 and moves to the right direction, as shown in FIG. 2A, the contact member 21 enters between the substrate BS and the wafer WF, and the adhesive layer portion AD1 is borrowed. The abutting member 21 is removed from the wafer WF and the substrate BS in the circumferential direction. As shown in the drawing, the dial SR is attached to the abutting member 21, so that the adhesive layer portion AD1 is removed from the integral WK. Remove.

At this time, the reattachment prevention means 40 is to take the nozzle 42 and decompression. The means 45 is driven to blow the gas from the opening 41A toward the second dust box 43 through the exhaust port 41E. Thereby, the dial SR that has not adhered to the contact member 21 is not attached to the wafer WF and is discharged from the exhaust port 41E, and the dial SR is prevented from flowing back by the backflow prevention member 44 and is collected. In the second dust box 43. In addition, as shown in FIG. 1, the gas which is ejected from the nozzles 42 is formed by the wide space formed by the opening 41A and the integrated body WK toward the upper surface portion 41B or the lower surface portion 41D and the integral body WK. In the narrow space, the flow rate of the abutting member 21, which is not attached to the abutting member 21, can be efficiently guided toward the second dust collecting box 43 by increasing the flow rate.

And the detection means not shown is to detect the adhesive layer part AD1 When all of the dialing means 20, the moving means 30, and the reattachment preventing means 40 are stopped, the driving of the linear motor 31, the turning motors 23, 32, the nozzle 42, and the decompressing means 45 is stopped. Next, the dialing means 20 and the moving means 30 drive the linear motor 22 and the linear motor 31, and return the abutting member 21 and the mounting table 33 to the initial position. And, the moving means 30 The driving of the decompression means (not shown) is stopped, and the integrated object WK is transported to the apparatus or the like of the secondary process by a hand or a transport means (not shown), and then the same operation is repeated.

According to the above embodiment, since the wafer WF and Since the adhesive AD layer is removed between the substrates BS, it is not necessary to prepare the etching liquid in the wafer WF and the subsequent sheet AS, and the shielding treatment is performed on the wafer WF, so that the versatility can be improved.

And the adhesive AD layer is because of the requirement to shrink to the wafer WF In the field AR, it is possible to prevent the adhesive AD layer from being cut together with the wafer WF when the wafer WF is ground in the secondary process.

As described above, the best configuration and method for implementing the present invention Although the disclosure is as described above, the present invention is not limited thereto. That is, the present invention has been particularly illustrated by the specific embodiments, and is described, but without departing from the spirit and scope of the present invention, the shapes, materials, quantities, and others of the above-described embodiments are The detailed composition, the industry can add a variety of deformations. In addition, the descriptions of the shapes, materials, and the like described above are merely exemplified for easy understanding of the present invention, and are not limited to the present invention, and the names of the members other than the limited ones or all of the shapes, materials, and the like are described. Both are included in the present invention.

For example, the dialing means 20 is in addition to the above embodiment In addition, as shown in FIG. 3A, a push-out means 24 for a bar member, a press roll, a roller, or the like that pushes the adhesive layer portion AD1 from between the wafer WF and the substrate BS is provided, as shown in FIG. 3B. As shown, the push means 24 will follow After the layer of the layer portion AD1 is pushed out, the adhesive layer portion AD1 pushed out by the abutting member 21 may be removed. Thereby, the adhesive layer portion AD1 can be easily removed. At this time, as shown in FIG. 3A and FIG. 3B, it is also possible to provide a softening means 60 for softening the pushed-on adhesive layer portion AD1 and a hardening means 50A for hardening the pushed-back adhesive layer portion AD1. . The curing means 50A and the softening means 60 can be exemplified by the same configuration as the energy applying means.

And the means for removing 20 is not limited to a flexible member, for example, A suction nozzle that can be inserted between the wafer WF and the substrate BS as an abutting member, and a suction pump such as a vacuum pump and a vacuum ejector that impart attractive force to the suction nozzle, and an adhesive layer portion AD1 It is also possible to remove the suction nozzle while sucking it.

Further, the dialing means 20 is toward the outer edge of the AD layer of the adhesive A fluid such as a water and a gas is blown, and a wire member such as a wire of abutting member that does not loosely extend in the surface direction of the wafer WF and a wire member are used, and the wire member and the integral body WK are relatively moved to the adhesive layer portion AD1. Alternatively, the distal acute-angle member such as a needle may be used as the abutting member 21.

And the removing means 20 is to abut the member 21 and the integral body The WK drives the linear motion motor 22 in a rotating state, and the rotating abutting member 21 may be moved up and down.

And the moving means 30 is by Coulomb force, mechanical winding, The composition in which the bulk material WK is held by the adhesive, the adhesive, or the like may be used.

Further, the moving means 30 does not turn the mounting table 33 Move, or rotate the mounting table 33 while placing the dialing means 20 along The outer edge of the sheet AS can then be moved.

And the dialing means 20 and the moving means 30 are the abutting members 21 may rotate more slowly than the integrated body WK, and may be rotated rapidly. The integral object WK and the abutting member 21 may be rotated at the same speed, and the rotation direction of the integral object WK and the abutting member 21 may be the same direction. Yes, different directions are also possible.

Further, the moving means 30 may hold the integrated body WK from the side of the succeeding sheet AS.

Further, the reattachment preventing means 40 and the hardening means 50A may be singular or plural, and may be provided plurally along the outer edge of the integrated object WK.

Further, the reattachment preventing means 40 may be such that the pallet 52 can be inserted into the opening 41A. Thereby, the adhesive layer portion AD1 can be removed while the adhesive layer portion AD1 is cured by the curing means 50.

Further, the reattachment preventing means 40 is provided with a member similar to the rod member, the pressure roller, the bonding roller, and the abutting member 21, which removes the shampoo SR attached to the contact member 21 from the contact member 21. It is also possible to remove the means.

Further, in the curing means 50, the entire AD layer of the adhesive may be cured, and only the adhesive layer portion AD1 may be cured.

Further, the material, type, shape, and the like of the succeeding sheet AS and the adherend in the present invention are not particularly limited. For example, the sheet AS may be a polygon having a circular shape, an elliptical shape, a triangular shape, a square shape or the like, and other shapes may be used instead of a planar shape, and pressure-sensitive adhesiveness and sensible heat may be followed. It is also possible to follow the form of sex. Further, the sheet AS is, for example, an intermediate layer between the substrate BS and the adhesive AD layer, and has three or more layers of a cover layer on the upper surface of the substrate BS, and further, the substrate BS may be used as an adhesive. It is also possible to peel off the AD layer as a double-sided sheet. Further, the adherend is, for example, a semiconductor wafer such as a food, a resin container, a semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as a disc, a glass plate, a steel plate, a pottery, a wood board, or the like. A resin plate or the like may be used as a member, an article, or the like in any form. Further, the subsequent sheet AS can be replaced with a functional or application reading method, for example, a label for information recording, a label for decoration, a protective sheet, a dicing tape, a wafer fixing sheet, a die bond tape, a recording layer to form a resin sheet, and the like. Any of the sheets, films, tapes, and the like of any shape are attached to any of the adherends as described above.

Means and processes in the present invention, as long as those means can be achieved The actions, functions, or processes described in the process are not limited, and needless to say, the configurations and processes of one embodiment are not limited at all to the foregoing embodiments. For example, the means for removing is an adhesive sheet which is formed of at least a base material and an adhesive layer attached to the adherend, and which may extend from a predetermined area of the adherend from the adhered body. If the substrate is removed, the technical common sense of the application is compared, and there is no limitation in the technical scope (the description of other means and processes is omitted).

And the driving machine in the foregoing embodiment can be rotated Motor, linear motor, linear motor, single-axis robot, multi-joint machinery Actuators such as an electric motor such as an arm, a pneumatic cylinder, a hydraulic cylinder, a rodless cylinder, a rotary cylinder, etc., and the like may be used in combination of those directly or indirectly (also repeated with examples) .

AD‧‧‧ adhesive

AD1‧‧‧ adhesive layer part

AR‧‧‧ areas specified

AS‧‧‧ followed by thin slices

BS‧‧‧Substrate

WF‧‧‧ wafer

WK‧‧‧ integral

10‧‧‧Binder layer removal device

20‧‧‧Remove means

21‧‧‧Abutment components

21A‧‧‧Rotary axis

22‧‧‧Directional motor

22A‧‧‧ Output shaft

23‧‧‧Rotating motor

23A‧‧‧ Output shaft

30‧‧‧Mobile means

31‧‧‧Linear motor

31A‧‧‧Sliding parts

32‧‧‧Rotating motor

32A‧‧‧ Output shaft

33‧‧‧ mounting table

33A‧‧‧Support surface

40‧‧‧Reattachment prevention means

41‧‧‧1st dust box

41A‧‧‧ Opening

41B‧‧‧Upper face

41C‧‧‧ insertion port

41D‧‧‧The lower part

41E‧‧‧Exhaust port

42‧‧‧Nozzles

43‧‧‧2nd dust box

44‧‧‧Backflow prevention component

45‧‧‧Decompression

45A‧‧‧Pipe

50‧‧‧ hardening means

51‧‧‧Directional motor

51A‧‧‧ Output shaft

52‧‧‧Board

53‧‧‧ cooling means

Claims (5)

An adhesive layer removing device comprising: a removing means for a predetermined sheet formed of at least a base material and an adhesive layer adhered to an adherend, and a predetermined field from the adhered body The excess adhesive layer portion is removed from between the adherend and the substrate; and the moving means is to move the dialing means and the succeeding sheet relatively along the outer edge of the succeeding sheet. The adhesive layer removing device according to claim 1, wherein the removing means includes: an abutting member that abuts against an outer edge of the adhesive layer; and the abutting member as the abutting member The rotating shaft is a centrally rotating means of rotation. The adhesive layer removing device according to claim 1, further comprising a re-adhesion preventing means for preventing the removed adhesive layer from adhering to the adherend. The adhesive layer removing device according to any one of claims 1 to 3, further comprising a curing means for partially curing an adhesive layer which is beyond a predetermined area of the adherend. A method for removing an adhesive layer, comprising: an adhesive agent that extends from a predetermined region of the adherend to a subsequent sheet composed of at least a substrate and an adhesive layer adhered to the adherend; a process in which the layer portion is removed from the adherend and the substrate by a dialing means; and the removing means and the subsequent sheet are relatively moved along the outer edge of the succeeding sheet.