KR102324308B1 - Apparatus and method for removing adhesive layer - Google Patents

Abstract

The adhesive layer removing apparatus 10 has a predetermined area AR of the adherend WF with respect to the adhesive sheet AS comprising at least the base BS and the adhesive AD layer adhered to the adherend WF. A scraping-out means 20 for scraping the adhesive layer portion AD1 protruding from between the adherend WF and the base material BS, and the scraping-out means 20 and the adhesive sheet AS are applied to the adhesive sheet ( A moving means 30 for relatively moving along the outer edge of the AS is provided.

Description

Adhesive layer removal device and adhesive layer removal method {APPARATUS AND METHOD FOR REMOVING ADHESIVE LAYER}

The present invention relates to a device for removing an adhesive layer and a method for removing an adhesive layer.

DESCRIPTION OF RELATED ART Conventionally, the adhesive bond layer removal apparatus which removes the adhesive bond layer of the adhesive sheet adhering to a to-be-adhered body is known (for example, refer Document 1: Unexamined-Japanese-Patent No. 9-148283).

The adhesive layer removal device described in Document 1 is configured to remove by etching the outer edge of the adhesive resin using an etchant when grinding a wafer (adherent) adhered to a support substrate with an adhesive resin (adhesive sheet). have.

However, the conventional adhesive layer removal apparatus as described in Document 1 has a problem that it lacks versatility because it is necessary to prepare an etching solution according to the adherend or the adhesive sheet, or to perform a mask treatment on the adherend.

An object of the present invention is to provide an adhesive layer removing device and an adhesive layer removing method capable of improving versatility.

The adhesive layer removing apparatus of the present invention scrapes off an adhesive layer portion protruding from a predetermined area of the adherend from between the adherend and the substrate with respect to an adhesive sheet comprising at least a substrate and an adhesive layer adhered to an adherend. It is characterized by comprising: a scraping-out means; and a moving means for relatively moving the scraping-out means and the adhesive sheet along an outer edge of the adhesive sheet.

In the adhesive layer removing apparatus of the present invention, the scraping means includes a contact member in contact with the outer edge of the adhesive layer, and a rotation means for rotating the contact member about a rotation axis of the contact member. desirable.

Moreover, it is preferable that the adhesive bond layer removal apparatus of this invention is equipped with the re-adhesion prevention means which prevents the adhesive bond layer scraped off from re-adhering to the said to-be-adhered body.

Moreover, it is preferable that the adhesive bond layer removal apparatus of this invention is provided with hardening means which hardens the adhesive bond layer part protruding from the predetermined area|region of the said to-be-adhered body.

In the adhesive layer removal method of the present invention, with respect to an adhesive sheet comprising at least a substrate and an adhesive layer adhered to an adherend, a portion of the adhesive layer protruding from a predetermined area of the adherend is scraped off from between the adherend and the substrate. It is characterized by comprising: a step of scraping with a means; and a step of relatively moving the scraping means and the adhesive sheet along an outer edge of the adhesive sheet.

According to the present invention as described above, since the adhesive layer is scraped off from between the adherend and the substrate, there is no need to prepare an etching solution according to the adherend or the adhesive sheet or to perform a mask treatment on the adherend, thereby improving versatility. can

Moreover, if the scraping-out means is provided with a contact member and a rotation means, since the scraped-off adhesive bond layer can be wound around a contact member, the removal operation|work of the said adhesive bond layer can be simplified.

In addition, by providing the re-adhesion preventing means, it is possible to prevent the adhesive layer from re-adhering to the adherend or the adhesive sheet.

In addition, if the curing means is provided, even when the adhesive layer is soft, it is possible to reliably scrape from between the adherend and the substrate without leaving the portion of the adhesive layer protruding from the predetermined area of the adherend to remain on the adherend or the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a side view of the adhesive bond layer removal apparatus which concerns on one Embodiment of this invention.
It is an operation explanatory drawing of the sheet|seat adhesive bond layer removal apparatus of FIG.
It is an operation explanatory drawing of the sheet|seat adhesive bond layer removal apparatus of FIG.
It is an operation explanatory drawing of the adhesive bond layer removal apparatus which concerns on the modified example of this invention.
It is operation explanatory drawing of the adhesive bond layer removal apparatus which concerns on the modified example of this invention.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described based on drawing.

In the following, without taking the reference drawing as an example, for example, when directions such as up, down, left, right, anterior, and medial are shown, all of FIG. is the proper direction), the up, down, left, and right directions are parallel to the ground, the front is the front direction perpendicular to the ground, and the back is the inner direction perpendicular to the ground.

In Fig. 1 , an adhesive layer removing device 10 removes a predetermined amount of the wafer WF from an adhesive sheet AS composed of a substrate BS and an adhesive AD layer attached to a wafer WF as an adherend. A scraping means 20 for scraping the adhesive layer portion AD1 protruding from the region AR from between the wafer WF and the substrate BS, and the scraping means 20 and the adhesive sheet AS A moving means 30 for relatively moving along the outer edge of the adhesive sheet AS, a reattachment preventing means 40 for preventing the scraped adhesive AD layer from being reattached to the wafer WF, and the wafer ( It is provided with the hardening means 50 which hardens the adhesive bond layer part AD1 protruding from the predetermined area|region AR of WF. In addition, the adhesive sheet AS has the same planar shape as the wafer WF, is adhered to the wafer WF, and forms the integral body WK.

The scraping means 20 is composed of a flexible member such as rubber, resin, sponge, brush, etc., having at least an outer periphery having flexibility, and a contact member 21 in contact with the outer edge of the adhesive (AD) layer, as a driving device While being supported by the output shaft 22A of the linear motor 22, the contact member 21 is supported by the output shaft 23A, and the contact member 21 is rotated centering on the rotation shaft 21A of the said contact member 21. It is a rotating means for making a shovel, and it is provided with the rotation motor 23 as a drive device.

The moving means 30 is supported by a rotary motor 32 as a drive device supported by a slider 31A of the linear motor 31 as a drive device, and an output shaft 32A of the rotary motor 32, and is supported by a pressure reducing pump or vacuum An ejector or the like is provided with a table 33 having a support surface 33A capable of adsorbing and holding the integral object WK by a decompression means (not shown).

The reattachment preventing means 40 is provided with an opening 41A that is enlarged and opened toward the moving means 30 side, and an insertion hole 41C into which the contact member 21 can be inserted into the upper surface portion 41B. A first dust collecting box 41 of a 5-sided occlusion type in which an exhaust port 41E of the scraped adhesive AD layer (hereinafter referred to as scraping material SR) is provided on the lower surface 41D, and an opening 41A The nozzle 42 provided on the inner surface of the upper and lower sides of the first dust collecting box 41 so as to be able to eject gas, the lower surface part 41D, and the first dust collection port 41E through the exhaust port 41E. The second dust collecting box 43 communicating in the box 41 and the second dust collecting box 43 protruding from the lower surface 41D are provided in a funnel shape with the inner diameter decreasing downward from the exhaust port 41E. The formed backflow prevention member 44 and the pressure reduction means 45, such as a pressure reduction pump and a vacuum ejector, which communicate in the 2nd dust collection box 43 via the piping 45A are provided.

The curing means 50 includes a plate 52 supported by an output shaft 51A of the linear motor 51 as a driving device, and a cooling means such as a Pelche element as an energy imparting means provided in the plate 52 or a cooling side of a heat pipe. (53) is provided. Further, the energy imparting means can be appropriately selected according to the curing characteristics of the adhesive (AD) layer, and curing energy such as hot air, ultraviolet rays, microwaves, and natural wind may be applied.

In the above adhesive layer removal apparatus 10, the procedure which removes the adhesive bond layer part AD1 of the adhesive sheet AS adhering to the wafer WF is demonstrated.

First, an operator inputs a signal for starting operation through an input means such as an operation panel or a personal computer (not shown), and a human hand or an articulated robot or a belt conveyor uses a transfer means (not shown) such as a solid line in FIG. When the integrated object WK is loaded at a predetermined position on the support surface 33A of the table 33 in the initial position indicated by The integral body WK is adsorbed and held.

Next, the curing means 50 drives the linear motor 51 and the cooling means 53, and the plate 52 is lowered from the initial position indicated by the solid line in FIG. 1 as indicated by the double-dashed line in FIG. It is brought into contact with the seat AS. Then, after the adhesive sheet AS is cooled and the adhesive layer portion AD1 is cured, the linear motor 51 is driven, the plate 52 is returned to the initial position, and the cooling means 53 is driven. stop

Next, the scraping means 20 drives the linear motor 22, and lowers the contact member 21 at the initial position indicated by the solid line in FIG. Stop the contact member 21 in position. And while the scraping means 20 drives the rotation motor 23 and rotates the contact member 21, the movement means 30 drives the linear motor 31 and the rotation motor 32, When the table 33 is moved in the right direction while rotating within the support surface 33A, the contact member 21 is brought into contact with the outer edge of the adhesive layer portion AD1 as shown by the dashed-dotted line in FIG. 1 . Even after that, when the moving means 30 moves in the right direction while rotating the table 33, the contact member 21 is drawn between the substrate BS and the wafer WF, as shown in FIG. 2A , The adhesive layer portion AD1 is scraped out in the circumferential direction from between the wafer WF and the substrate BS by the contact member 21, and as shown in FIG. 21), the adhesive layer portion AD1 is removed from the integral body WK.

At this time, the reattachment prevention means 40 drives the nozzle 42 and the pressure reduction means 45, and blows gas from the opening part 41A toward the 2nd dust collection box 43 through the exhaust port 41E. Thereby, the scraping material SR that has not adhered to the contact member 21 is discharged from the exhaust port 41E without being reattached to the wafer WF, and the scraping material SR is removed from the backflow prevention member 44 . It is collected in the second dust collecting box 43 while preventing backflow into the furnace. Moreover, as shown in FIG. 1, the gas ejected from the nozzle 42 is integral with the upper surface part 41B or the lower surface part 41D from the wide space formed by the opening part 41A and the integral body WK. By heading toward the narrow space formed of WK, since the flow rate is rising, the scraping material SR which did not adhere to the contact member 21 can be guide|induced to the 2nd dust collection box 43 direction efficiently.

And, when the detecting means (not shown) detects that the adhesive layer portion AD1 has been scraped all off, the scraping means 20, the moving means 30 and the reattachment preventing means 40 are linear motors 31, The drive of the rotation motors 23 and 32, the nozzle 42, and the pressure reduction means 45 is stopped. Then, the scraping means 20 and the moving means 30 drive the linear motor 22 and the linear motor 31, and return the contact member 21 and the table 33 to an initial position. Then, the moving means 30 stops the driving of the decompression means (not shown), and transfers the integral object WK by a human hand or a transport means (not shown) to the apparatus in the next step, and thereafter, the same operation as described above is performed. Repeated.

According to the above embodiment, since the adhesive agent AD layer is scraped off from between the wafer WF and the base material BS, an etching solution is prepared according to the wafer WF or the adhesive sheet AS, or the wafer WF It is not necessary to perform a mask process, and versatility can be improved.

In addition, since the adhesive layer AD is accommodated in the predetermined area AR of the wafer WF, the adhesive layer AD is prevented from being scraped together with the wafer WF when the wafer WF is ground in the next step. can do.

As mentioned above, although the best structure, method, etc. for implementing this invention are disclosed by the said description, this invention is not limited to this. That is, the present invention is mainly illustrated and described in particular with respect to specific embodiments, but without departing from the technical spirit and desired scope of the present invention, the shape, material, quantity, and other details of the above-described embodiments are provided. In the configuration, a person skilled in the art can add various modifications. In addition, the descriptions in which the shape, material, etc. disclosed above are limited are illustratively described in order to facilitate the understanding of the present invention, and do not limit the present invention. Or descriptions in the names of members except for all limitations are included in the present invention.

For example, the scraping-out means 20 is, in addition to the structure of the said embodiment, as shown in FIG. 3A, the stick which extrudes the adhesive bond layer part AD1 from between the wafer WF and the base material BS. A member, a squeegee, an extrusion means 24 such as a roller is provided, and as shown in FIG. 3B , the adhesive layer portion AD1 layer is extruded by the extrusion means 24, and then the contact member 21 is extruded. You may remove the adhesive bond layer part AD1. Thereby, adhesive bond layer part AD1 can be scraped off easily. At this time, as shown in FIGS. 3A and 3B , a softening means 60 for softening the extruded adhesive layer portion AD1 or a curing means 50A for curing the extruded adhesive layer portion AD1 may be installed. good. The hardening means 50A and the softening means 60 can illustrate the structure similar to the energy provision means.

In addition, the scraping-out means 20 is not limited to a flexible member, For example, a suction nozzle as a contact member provided so that it can be inserted between the wafer WF and the base material BS, and the said suction nozzle is provided with a suction force. A suction force imparting means such as a pressure reducing pump or a vacuum ejector may be provided, and the adhesive layer portion AD1 may be scraped off while suctioning with a suction nozzle.

In addition, the scraping means 20 sprays a fluid such as water or gas on the outer edge of the adhesive (AD) layer, or a wire member such as a thread or wire as a contact member protruding in the plane direction of the wafer WF without relaxation. Adoption may be employed, and the adhesive layer portion AD1 may be scraped off by relatively moving the wire member and the integral body WK, or a tip acute-angled member such as a needle may be employed as the contact member 21 .

In addition, the scraping-out means 20 may drive the linear motor 22 in the state which rotated the contact member 21 and the integral body WK, and may move the contact member 21 which rotated up and down.

Further, the moving means 30 may be configured to hold the integral body WK by Coulomb force, a mechanism chuck, an adhesive, an adhesive, or the like.

In addition, the moving means 30 may move the scraping-out means 20 along the outer edge of adhesive sheet AS, without rotating the table 33, or rotating the table 33.

In addition, the scraping-out means 20 and the moving means 30 may rotate the contact member 21 relatively later than the integral body WK, and may rotate it early, and the integral body WK and the contact member 21. may be rotated at the same speed, and the rotational directions of the integral object WK and the contact member 21 may be in the same direction or in different directions.

In addition, the moving means 30 may hold|maintain the integral body WK from the adhesive sheet AS side.

In addition, a single piece may be sufficient as the reattachment prevention means 40 and 50 A of hardening means, and you may provide several along the outer edge of the integral body WK.

In addition, the reattachment prevention means 40 may be comprised so that the plate 52 can be inserted into the opening part 41A. Thereby, the said adhesive bond layer part AD1 can be scraped off, hardening the adhesive bond layer part AD1 with the hardening means 50.

In addition, the reattachment preventing means 40 is a member similar to the rod member, squeegee, adhesive roller and contact member 21 for removing the scraping material SR adhered to the contact member 21 from the contact member 21 . You may be provided with scraping-out removal means, such as.

In addition, the hardening means 50 may harden the whole adhesive agent AD layer, and may harden only the adhesive bond layer part AD1.

In addition, the material, type, shape, etc. of the adhesive sheet AS and to-be-adhered body in this invention are not specifically limited. For example, the adhesive sheet AS may have a polygonal shape such as a circle, an ellipse, a triangle or a quadrangle, and other shapes, may not have a planar shape, and may have an adhesive form such as pressure-sensitive adhesive property or heat-sensitive adhesive property. In addition, the adhesive sheet AS is, for example, having an intermediate layer between the base material BS and the adhesive agent AD layer, having a cover layer on the upper surface of the base material BS, etc. A so-called double-sided adhesive sheet which can peel the base material BS from the adhesive agent AD layer may be sufficient. In addition, as an adherend, for example, food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disk, a glass plate, a steel plate, a ceramic plate, a wood plate, or a resin plate, etc. It can also target members or articles in the form of In addition, the adhesive sheet AS is changed to a functional and intended reading method, for example, an information substrate label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, and a resin sheet for forming a recording layer. Any sheet, film, tape, etc. of any shape such as can be adhered to any adherend as described above.

The means and steps in the present invention are not limited at all as long as it is possible to perform the operations, functions, or steps described with respect to those means and steps, and much less, the structures and steps of a simple embodiment shown in the above embodiment are not at all involved. Nothing is limited. For example, the scraping means is capable of scraping an adhesive layer portion protruding from a predetermined area of the adherend from between the adherend and the substrate with respect to an adhesive sheet comprising at least a substrate and an adhesive layer adhered to the adherend. In comparison with the technical common sense at the beginning of the application, it is not limited at all as long as it is within the technical scope (description of other means and processes is omitted).

In addition, the drive device in the above embodiment employs an electric device such as a rotary motor, a linear motor, a linear motor, a single-axis robot and an articulated robot, and an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder and a rotary cylinder. Not only can it be done, but it is also possible to employ a direct or indirect combination of them (in some cases overlapping with those exemplified in the embodiment).

Claims (5)

scraping means for scraping the adhesive layer portion protruding from a predetermined area of the adherend from between the adherend and the substrate with respect to an adhesive sheet comprising at least a substrate and an adhesive layer adhered to the adherend;
a moving means for relatively moving the scraping-out means and the adhesive sheet along an outer edge of the adhesive sheet;
The scraping means includes a contact member contacting the outer rim of the adhesive layer, inserting the contact member between the adherend and the substrate, and scraping the adhesive layer portion from between the adherend and the substrate. Adhesive layer removal device characterized in that out. According to claim 1,
The said scraping-out means is provided with the rotation means which rotates the said contact member about the rotation axis of the said contact member, The adhesive bond layer removal apparatus characterized by the above-mentioned. According to claim 1,
and a re-adhesion preventing means for preventing the scraped-off adhesive layer from re-adhering to the adherend. 4. The method according to any one of claims 1 to 3,
and curing means for curing the portion of the adhesive layer protruding from the predetermined region of the adherend is provided. a step of scraping off an adhesive layer portion protruding from a predetermined region of the adherend with a scraping means from between the adherend and the substrate with respect to an adhesive sheet comprising at least a substrate and an adhesive layer adhered to the adherend;
a step of relatively moving the scraping means and the adhesive sheet along an outer edge of the adhesive sheet;
In the step of scraping off the adhesive layer portion, a contact member in contact with the outer edge of the adhesive layer is drawn between the adherend and the substrate, and the adhesive layer portion is scraped off from between the adherend and the substrate. A method for removing the adhesive layer.

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