JP2002254288A - Apparatus and method for finishing work - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for a finishing work capable of performing the finishing work so that every streak lies in the same direction. SOLUTION: The finishing apparatus 1 is equipped with a brush 11 having a plurality of brush hairs 13, 13, etc., with abrasive particles stuck thereon and a motor 14 that rotates the brush 11 around a rotating shaft 12. The apparatus is also equipped with a rotating table 41 that supports a wafer W with its processing face positioned upside. The brush 11 is horizontally movably supported by a traveling mechanism 15 relative to the rotating table 41. The finishing work is performed such that the brush 11 is traveled by the traveling mechanism 15 toward the rotating table 41 with the brush being rotated while holding the rotating table 41 at a standstill, through which the brush hairs 13, 13, etc., of the brush 11 touche the processing face of the wafer W to finish the face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a finishing apparatus and a finishing method, and more particularly to a finishing apparatus and a finishing method for performing a finishing process after grinding a wafer with a grindstone.

[0002]

2. Description of the Related Art For example, when manufacturing an IC chip,
After fabricating an IC (integrated circuit) on one side of a mirror-finished silicon wafer, one side grinding of the wafer is performed as backside processing. When such single-side grinding is performed, after roughing the processed surface of the wafer using a rough grindstone having a relatively large roughness, the processed surface of the wafer is finish-ground with a finishing grindstone having a small roughness. Subsequently, as a finishing step, polishing is performed on the processed surface of the finish-ground wafer.

[0003]

However, the polishing performed in the above-mentioned conventional finishing process requires a chemical treatment, so that the subsequent cleaning becomes complicated and the processing speed is slow. On the other hand, it is conceivable that the finish grinding is performed by grinding with a finish whetstone having extremely small roughness. For grinding with a finishing whetstone,
There are infeed grinding and throughfeed grinding. In in-feed grinding, grinding is performed while rotating the grindstone and the wafer so that the thickness center of the cup-shaped grindstone is aligned with the rotation center of the wafer. In the through-feed grinding, grinding is performed by using a cup-shaped grindstone having a diameter larger than that of a wafer and rotating the wafer and the grindstone while passing the grindstone through the processed surface of the wafer.

[0004] In the infeed grinding, the streaks remaining on the processed surface of the wafer after the grinding are not directed in a certain direction. If the streak is not directed in a certain direction, there is a problem that when the chip is cut out from the wafer, the streak remains in the width direction of the chip and a chip that is easily damaged is generated. On the other hand, when performing through-feed grinding, since the streaks remain in a certain direction, it is possible to prevent the generation of chips that are easily broken by aligning the chip cutting directions. However, through feed grinding has a problem in that the flatness and the stability of roughness are low, and it is not practical to use it for finishing.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a finishing apparatus capable of performing finishing by aligning the direction of a streak in a fixed direction.

[0006]

According to a first aspect of the present invention for solving the above-mentioned problems, there is provided a plurality of bristles on which abrasive grains are fixed, and these bristles radiate from a rotating shaft. A finishing brush attached to the rotating shaft extending in the direction, and a rotation drive unit for rotating the finishing brush around the rotating shaft, while a working surface of the workpiece is the finishing brush. Holding means for holding the workpiece so as to be arranged substantially in parallel with the rotation axis of the brush, so that the finishing brush and the holding means move relatively, so that the finishing brush and A moving drive unit configured to move at least one of the holding units; the rotation driving unit rotating the finishing brush; and the moving driving unit rotating the finishing brush and the finishing brush. And at least one of the holding means is linearly moved in a predetermined direction along a processing surface of the workpiece by the movement driving means, and the bristles of the finishing brush are processed on the workpiece. This is a finish processing apparatus characterized in that finish processing is performed by contacting the surface.

In the invention according to claim 1, a finishing brush having brush bristles to which abrasive grains are fixed is used for finishing. By using this finishing brush,
Finishing with stable flatness and roughness can be performed. Here, since the finishing brush extends radially from the rotation axis, the finishing brush is rotated around the rotation axis, and at least one of the finishing device and the holding means is moved along the surface to be processed. By passing through the processing surface of the workpiece while moving linearly in the predetermined direction, it is possible to leave streaks aligned in a certain direction. Therefore, when the workpiece is a wafer and the chips are cut out from the wafer and the chips are aligned in the same direction, it is possible to prevent generation of a wafer that is easily broken.

[0008] The invention according to claim 2 is used in a subsequent step of a grinding device for grinding a processed surface of a workpiece, and finishing the processed surface of the workpiece that has been ground by the grinding device. The finishing device according to claim 1, wherein:

In the invention according to claim 2, a finishing device is used in a subsequent step of the grinding device. For this reason, even if a streak remains in the grinding process, the streak can be removed at the time of finishing processing, and a streak in a uniform direction can be left.

The invention according to claim 3 is characterized in that the finishing brush is detachably attached to the grinding device, and the finishing process is performed by the grinding device. It is a processing device.

In the invention according to claim 3, the finishing brush is used by being attached to the grinding device. For this reason, a finishing process can be performed using a grinding device without providing a finishing device separately.

According to a fourth aspect of the present invention, the workpiece has a crystal orientation oriented in a predetermined direction, and the crystal orientation in the workpiece is at least one of the finishing brush and the holding means. 2. The finish processing is performed in a state where the workpiece is held and positioned by the holding means and the workpiece is positioned in accordance with a moving direction of the workpiece.
A finishing device according to any one of claims 1 to 3.

In the invention according to claim 4, when the workpiece has a predetermined crystal orientation such as a wafer, the finishing process is performed after arranging the wafer in accordance with the crystal orientation. For this reason, a workpiece having a predetermined crystal orientation, such as a wafer, is liable to crack if a streak remains along the crystal orientation. On the other hand, in the invention according to claim 4, since the direction in which the streaks remain can be controlled, it is possible to control so that the streaks do not remain along the crystal orientation. Therefore, a streak can be left in a state where the workpiece is more difficult to be broken.

According to a fifth aspect of the present invention, the brush bristles are
The finishing device according to any one of claims 1 to 4, wherein the finishing device is a nylon thread to which diamond or SiO ₂ abrasive grains are fixed.

Preferably, as the bristles of the finishing brush in the invention according to claim 1, as in claim 5,
Nylon yarn to which diamond or SiO ₂ abrasive grains are fixed can be used.

According to a sixth aspect of the present invention, there is provided a finish having a plurality of brush bristles extending in a radial direction from a rotation axis when finishing a processing surface of a workpiece, wherein the brush bristles have abrasive grains fixed thereto. Holding means for holding the work surface such that the work brush is rotated about the rotation axis, and the work surface of the work is arranged substantially in parallel with the rotation axis of the finish brush; At least one of the holding means and the finishing brush is moved so that the brush relatively moves, and the workpiece is stopped in the rotation direction thereof, and the brush bristles in the finishing brush are moved. Is brought into contact with the processing surface of the workpiece, and the finish is performed while at least one of the processing brush and the holding means is linearly moved in a predetermined direction along the processing surface of the workpiece. A finishing method and performing Engineering.

In the invention according to claim 6, the finishing is performed using a finishing brush having brush bristles to which abrasive grains are fixed for the finishing. Therefore, it is possible to perform finish processing with stable flatness and roughness. In addition, while rotating the finishing brush around the rotation axis, at least one of the finishing device and the holding means is linearly moved in a predetermined direction along the surface to be processed to finish the processed surface of the workpiece. are doing. Therefore, it is possible to leave streaks aligned in a certain direction on the processing surface of the workpiece. Therefore, when the workpiece is a wafer and the chips are cut out from the wafer and the chips are aligned in the same direction, it is possible to prevent generation of a wafer that is easily broken.

The invention according to claim 7 is the finishing method according to claim 4, characterized in that the processing surface of the workpiece to be finished is ground.

In the invention according to claim 7, the machined surface of the object to be ground is finish-ground. For this reason, the streaks left by the grinding process are erased by the finishing process, and the streaks aligned in a certain direction can be left on the work surface of the work.

[0020]

Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a front view of a single-side grinding processing apparatus including a finish processing apparatus according to the present invention,
FIG. 2 is an enlarged view of the vicinity of the finishing device in FIG. 1, and FIG. 3 is a plan view of the single-side grinding device.

As shown in FIGS. 1 and 3, the single-side grinding apparatus M includes a finishing apparatus 1 according to the present invention. Further, a grinding device 2 for performing a grinding process on a wafer W as a workpiece and an automatic tool changing device 3 for changing a grindstone and the like used in the grinding device 2 are provided. A grinding stone stocker 4 is provided beside the automatic tool changer 3. Further, a positioning / cleaning device 5 that performs notch positioning and centering of the wafer W to be ground and cleans the ground wafer W is provided on a side of the finishing device 1. Further, a wafer transfer device 6 that transfers the wafer W between the positioning / cleaning device 5 and the grinding device 2 is provided. In addition, positioning and
Cleaning device 5, first cassette C1 and second cassette C2
Articulated robot 7 for transferring wafer W between
Is provided. The articulated robot 7 transports the unprocessed wafer W taken out of the first cassette C1 to the positioning / cleaning device 5 and transports the ground wafer W to the second cassette C2 for storage.

The finishing device 1 is provided with a finishing brush (hereinafter referred to as "brush") 11, as shown in FIGS. The brush 11 has a roll shape, and a rotation shaft 12 passes through the center of the brush 11. A plurality of brush bristles 13 are attached to the rotating shaft 12. Are arranged at regular intervals in the longitudinal direction of the rotating shaft 12, and are arranged so as to extend radially from the rotating shaft. As shown in FIG. 5, the brush bristles 13 are composed of a number of abrasive grains 13B, 13B,. Abrasive grains 13B, 13B ...
Is made of diamond, and the brush bristles 13 are made of diamond particles 13A having flexibility and diamond abrasive grains 13B.
13B... Exhibit excellent grinding power. Such brush bristles 13 are manufactured, for example, as follows.
First, abrasive grains 13B, 13B,... Are mixed into a solvent made of a nylon material melted in a liquid state. When this solvent is extruded into a thread and solidified, a nylon thread 13A in which the abrasive grains 13B, 13B... Are firmly fixed is completed. The nylon thread 13A is cut into an appropriate length to form the brush bristles 13.

As the brush 15 containing abrasive grains, it is not essential to use a nylon thread, and other brushes can be used as appropriate. Also, diamond and SiO ₂ are suitable as abrasive grains stuck and fixed with a brush, but are not limited to diamond and SiO ₂ , and can be appropriately stuck and fixed with known ultra-hard abrasive grains. Further, the brush bristles may have an aspect in which abrasive grains are attached and fixed to a surface of a nylon thread or the like. Here, for example, in addition to the diamond and SiO ₂ , Al ₂ O ₃ , ZrO ₂ , SiC, CBN,
B ₄ C, Fe ₂ O ₃ , Cr ₂ O ₃ , CeO ₂ , ZrB ₂ , Ti
Fine particles such as B ₂ and TiC can be mentioned. The particle size is such that the average particle size is 10 μm or less, preferably 5 μm.
μm or less, more preferably 1 μm or less, especially 0.1 μm.
Although it is 2 μm or less, it can be appropriately selected depending on the object to be ground and polished. The shape is preferably spherical or nearly spherical, but particles of other shapes can be used depending on the object to be ground.

Further, the finishing device 1 is provided with a motor 14 as a rotary driving means. The motor 14 rotates the brush 11 around a rotation axis, and is arranged coaxially with the rotation shaft 12. Further, the finishing device 1 is provided with a moving mechanism 15 which is a moving driving means for linearly moving the brush 11 in a predetermined direction in the horizontal direction. The moving mechanism includes a ball screw 15A, 15B and a motor 15 for rotating one of the ball screws 15A.
C is provided. A synchronous belt 15D is wound around one end of each of the ball screws 15A and 15B, and the driving force of the motor 15C is applied to the other ball screw 15A.
B. Therefore, the motor 1
5C, the ball screws 15A, 1
5B rotates synchronously.

Further, ball nuts 15E and 15F are attached to both ends of the rotating shaft 12 of the brush 11 via bearings (not shown). Ball nut 1
5E and 15F are screwed into ball screws 15A and 15B, respectively, and when the ball screws 15A and 15B rotate, the ball nuts 15E and 15F are connected to the ball screws 15A and 15B.
A and 15B move in the longitudinal direction. This ball nut 1
The brush 11 moves in the same direction by the movement of 5E and 15F.

The grinding device 2 is provided with a spindle 20 rotatable about a vertical axis Z1. This spindle 2
As shown in FIG. 1, the housing 20 </ b> A that rotatably supports the housing 0 is attached to a movable gantry 22 of a spindle up-down movement device 21 and has a built-in spindle motor 20 </ b> B that drives the spindle 20 to rotate. A ball nut 23 is attached to the movable base 22. The ball nut 23 is screwed into a ball screw 24 rotatably supported by the housing frame F.
By rotating the spindle 2 through the ball nut 23, the moving gantry 22, and the housing 20A.
0 moves up and down. A motor 25 is provided on the housing frame F. A drive pulley 26 is provided on a drive shaft of the motor 25, and a driven pulley 27 is provided on an upper end of the ball screw 24. Further, the driving pulley 26 and the driven pulley 27 are connected via a belt 28. And the motor 25
Is driven, the ball screw 24 is rotated via the belt 28.

A finishing whetstone member 30, which is a cup-shaped whetstone, is fixed to the lower end (tip) of the spindle 20. The finishing whetstone member 30 has a whetstone base 31 and a finishing whetstone 32, and the whetstone base 31 is fixed to the spindle 20 by bolts. As the finishing whetstone 32, for example, a fine whetstone having a mesh size of about $ 2000 is used. The grindstone base 31 is formed with a working fluid supply hole (not shown) so that a working fluid such as water can be jetted toward the finishing grindstone 32. Further, the spindle 20 is provided with a well-known clamp mechanism 29 composed of a draw bar and a ball, and a grindstone mounting portion is formed below the clamp mechanism 29.

A rough grinding wheel member 35 is mounted on the grinding wheel mounting portion. The rough grinding wheel member 35 has a ring-shaped rough grinding wheel holder 36 and a hollow cylindrical rough grinding wheel 37. In addition, a grip portion 38 is formed in the rough whetstone holder 36, and can be gripped by holding arms 51 and 52 of the automatic tool changing device 3 described later. As the rough grindstone 37, for example, a rough grindstone having a mesh size of about $ 600 is used. A pull stud 39 is provided at the rear end of the rough whetstone holder 36.
The pull stud 39 is held by the clamp mechanism 29, and the rough whetstone holder 36 is mounted on the tool mounting portion of the spindle 20.

Further, when the finish grinding is performed by the finishing whetstone 32, a detachable cover member is attached to the tool attaching portion so as to cover the opened tool attaching portion.

Below the spindle 20, there is provided a vacuum holding / rotating device 40 for rotating a wafer W to be ground on one side, which is to be processed, while vacuum-sucking it. The vacuum holding / rotating device 40 has a vertical axis Z2
It has a rotating table 41 which is a holding means of the present invention which can rotate around. The rotary table 41 is provided with a plurality of vacuum suction holes, and a vacuum is applied to the wafer W by applying a negative pressure through the vacuum suction holes. A motor 42 is provided below the turntable 41, and the turntable 41 rotates by driving the motor 42.

The finishing grindstone 32 of the finishing grindstone member 30 and the rough grindstone 37 of the rough grindstone holder 36 have substantially the same diameter, and are equal to or larger than the diameter of the wafer W. Then, when grinding one surface of the wafer W with the grindstones 32 and 37, the center position of the thickness of the grindstones 32 and 37 passes on the vertical axis Z2 which is the rotation center of the wafer W, as shown in FIG. The position is set as follows.

On the side of the grinding device 2 (left side in FIG. 1), a rough grindstone member 35 attached to the tool mounting portion, another rough grindstone member 35 ', another machining tool, a cover member, etc. An automatic tool changer 3 for exchanging the tool is provided. Further, on the side of the automatic tool changer 3, there is provided a grindstone stocker 4 in which a plurality of types of processing tools including a cover member and a plurality of rough grindstone members 35 are stored.

The automatic tool changer 3 includes holding arms 51 and 52 that rotate around a vertical axis Z3. The holding arms 51 and 52 extend radially outward from the center of rotation, respectively, and are held by the holding members provided at the tips of the holding arms 51 and 52 to hold the gripping portion 3 of the rough grindstone member 35.
8 etc. can be held. Further, the holding arms 51 and 52 are attached to the turning table 53, respectively, and can be moved in the radial direction of the turning table 53. Further, a motor 54 for rotating the swivel table 53 around the vertical axis Z3 is provided below the swivel table 53. The turning table 53, the motor 54, and the like are provided on a vertically movable base 55.
The vertical movement base 55 is vertically movable along a rail 56 provided on the housing frame F.

The grinding wheel stocker 4 is disposed on the opposite side of the grinding device 2 via the automatic tool changing device 3. As shown in FIG. 3, the grindstone stocker 4 has machining tool storage units 57 </ b> A to 57 </ b> A for accommodating a plurality of types of machining tools including the rough grindstone member 35.
A storage table 58 having 7E or the like is provided. At the side of the storage table 58, there is provided a cover member storage section 59 that is mounted on the tool mounting section when performing finish grinding and stores a cover member that protects the tool mounting section.

The positioning / cleaning device 5 has a wafer holding board 61. The wafer holding plate 61 is capable of moving up and down and rotatable, and sucks and holds the wafer W transferred from the wafer transfer device 6 or the articulated robot 7. In FIG. 1, a state where the wafer holding plate 61 is rising is indicated by a virtual line, and a state where the wafer holding plate 61 is lowered is indicated by a solid line. Further, a cleaning device 62 for cleaning the wafer W sucked and held by the wafer holding board 61 when the wafer holding board 61 is in a lowered state is provided.
The cleaning device 62 includes a nozzle (not shown), and the wafer W held on the wafer holding plate 61 at the lowered position.
Cleaning liquid is sprayed on the wafer W to wash away chips and the like adhering to the wafer W after processing. A centering device 63 for centering the wafer W is provided above the cleaning device 62. The centering device 63, when the wafer holding plate 61 is at the raised position,
The center of the wafer W is held across the outer peripheral edge of the wafer W held by suction on the wafer holding board 61. The wafer W is located further above the centering device 63.
Upper suction disk 6 for holding vacuum by suction from above
4 are provided. Further, in the cleaning device 62, the position of the notch formed in advance on the wafer W is measured based on the crystal direction of the wafer W, and the notch position is adjusted to a predetermined direction using the rotation of the wafer holding plate 61. Notch alignment devices are provided.

The wafer transfer device 6 includes a transfer arm 66 as shown in FIG. This transfer arm 66
A vacuum pad for vacuum-sucking one surface of the wafer W is attached to the tip of the wafer W. The vacuum pad sucks the back surface of the wafer W and transports the wafer W between the positioning / cleaning device 5 and the rotary table 41 of the vacuum holding and rotating device 40 in the grinding device 2. Further, the wafer W can be directly loaded and unloaded from the position of the positioning / cleaning device 5 to the first cassette C1 side. Further, a reversing device 67 for reversing the transfer arm about a horizontal axis is provided at the base end of the transfer arm 66. By operating this reversing device 67,
The wafer W held by the vacuum pad attached to the tip of the transfer arm 66 can be turned upside down.

The articulated robot 7 is provided with a holding arm 71 for holding the wafer W by suction, as shown in FIG. The holding arm 71 is movable in all directions by many joints formed on the articulated robot 7. The multi-joint robot 7 lifts the wafer W from the lower surface side of the wafer W from the first cassette C1 in which the wafer W is stored with the front surface on the upper surface side before processing, and removes the wafer W from the positioning / cleaning device 5. It is transported on the holding plate 61. The wafer holding plate 61 raises the wafer W slightly to a position separated from the chuck surface when receiving and transferring the wafer W, and the holding arm 71 can be inserted into the gap.

After processing, the wafer W cleaned by the positioning / cleaning device 5 with the back surface facing upward is once suctioned by the upper suction disk 64, and the transfer arm 66 of the wafer transfer device 6 holds the wafer W on the lower surface. Suction from upper side and upper suction plate 64
, The transfer arm 66 is turned over, and the wafer W is placed on the wafer holding plate 61 so that the front surface is again on the upper surface side. Next, the articulated robot 7 inserts the holding arm 71 into the lower surface of the wafer W, sucks the wafer W, removes the wafer W from the positioning / cleaning device 5, and transports the wafer W to the second cassette C2 for storage. .

The operation and operation of the single-side grinding machine M having the finishing machine 1 having the above configuration will be described.
A description will be given of a grinding step in the single-side grinding apparatus M in a stage before explaining the operation of the finishing apparatus 1 according to the present invention.

First, the articulated robot 7 shown in FIG. 3 is operated to take out the wafer W from the first cassette C1 in which the unprocessed wafer W is stored, and transport it to the position of the positioning / cleaning device 5. In the positioning / cleaning device 5, first, the notch alignment of the wafer W is performed. Here, by performing the notch alignment, it is possible to appropriately adjust the direction of the streaks remaining on the wafer W in a later finishing step. Thereafter, the centering of the wafer W is performed by the centering device 63.

After the notch alignment and centering are completed in the positioning / cleaning device 5, the wafer W is once sucked and held on the upper suction disk 64, and the lower surface of the wafer W is sucked and held by the transfer arm 66 of the wafer transfer device 6. The wafer W is turned over and the wafer W is placed on the rotary table 41 of the vacuum holding and rotating device 40 in the grinding device 2 from the positioning / cleaning device 5. At this time, the wafer transfer device 6 transfers the wafer W so that the circumferential direction of the wafer W on which the notch alignment and centering have been performed does not change. Therefore, the rotary table 4
The wafer W on 1 is placed so that the center of the wafer W is located at the rotation center of the turntable 41, and the notch formed on the wafer W is located at a predetermined position.

A rough whetstone member 35 is mounted on a whetstone mounting portion formed on the spindle 20 of the grinding device 2. In this state, as shown in FIG. 6A, the spindle 20 is lowered, the spindle 20 is rotated, and the rotary table 41 of the vacuum holding and rotating device 40 is rotated. The rotation of the spindle 20 causes the rough grindstone member 35 to rotate, and the rotation of the turntable 41 causes the wafer W to rotate. Thus, while rotating the rough grindstone member 35 and the wafer W, the processing surface of the wafer W is roughly ground by the rough grindstone 37 of the rough grindstone member 35.

After the rough grinding by the rough whetstone member 35 is completed,
The rotation of the spindle 20 and the rotary table 41 is stopped, and the spindle 20 is raised. When the spindle 20 is raised, the holding portion 51 of the rough grinding wheel member 35 is gripped by one holding arm 51 in the automatic tool changer 3 shown in FIGS. 1 and 3, and the tool mounting portion of the spindle 20 is held by the other holding arm 52. Hold the cover holder to be attached to the. Then, the rough grindstone member 35 is removed from the tool mounting portion of the spindle 20, and then a cover holder is mounted on the tool mounting portion.

After the cover holder is mounted on the tool mounting portion, the spindle 20 is lowered, the spindle 20 is rotated, and the rotary table 41 is rotated, as shown in FIG. The rotation of the spindle 20 causes the finishing whetstone member 30 to rotate, and the rotation of the turntable 41 rotates the wafer W to finish-grind the processed surface of the wafer W. Here, since the tool mounting portion to which the rough whetstone member 35 is mounted is protected by the cover member, the tool mounting portion is not contaminated by chips or the like accompanying the finish grinding.

After finishing grinding by the finishing whetstone member 30, the rotation of the spindle 20 and the rotary table 41 is stopped and the spindle 20 is raised. When the turntable 41 stops rotating, the stop position is controlled so as to be the same as or a predetermined angular position before starting the rotation. Therefore, the position of the notch formed on the wafer W is returned to the same position as the position where the notch is positioned or to a predetermined angular position.

Subsequently, finish processing by the finish processing apparatus 1 is performed. When the spindle 20 and the rotary table 41 stop and the spindle 20 rises, the motor 14 is operated to rotate the brush 11 around the rotary shaft 12. At this time, the turntable 41 holding the wafer W remains stopped in the rotation direction. When the rotation of the brush 11 is started, the motor 15C of the moving mechanism 15 is operated to rotate the ball screws 15A and 15B.
When the ball screws 15A and 15B rotate, as shown in FIG. 6C, the brush 11 is horizontally moved in a predetermined direction along the processing surface of the wafer W held on the rotary table 41, that is, along the ball screws 15A and 15B. Move linearly.
When the brush 11 starts moving linearly, it reaches the position of the wafer W held by the rotary table 41, and the brush bristles 13, 13.
, And finish-processes the processed surface of the finish-ground wafer W. When finishing, brush 11
Is rotated about the rotation axis 12 and is passed only once on the processing surface of the wafer W. At this time, since the rotary table 41 holding the wafer W is stopped, the brush 1
As shown in FIG. 7, a large number of fine streaks J, J remain on the processing surface of the wafer W through which No. 1 has passed.
J... All point in a fixed direction in the direction in which the brush 11 passes. Therefore, by cutting out the chip T so that the direction in which the streaks J are directed to the longitudinal direction of the chip T, it is possible to manufacture the chip T that is resistant to cracking.

When a chip T is cut out from the wafer W, a notch N formed on the wafer W is used as a reference. A notch N is formed in the wafer W, and the rotary table 41 holds the wafer without changing the position of the aligned notch at the same position or at a predetermined angular position. By performing the finishing process, the direction of the streak is formed in a predetermined direction with respect to the notch position. For this reason, by cutting out the chips T from the wafer W based on the notch N, the chips T can be cut out from the wafer W so that the direction in which the streaks J face is the longitudinal direction of the chips T.

Further, by performing this finishing process, the processing surface of the wafer W is deformed without processing distortion by the flexibility of the nylon thread 13A in the brush bristles 13 and the excellent grinding force of the abrasive grains 13B made of diamond. Higher strength and higher surface state can be obtained. In addition, a post-processing step such as etching or polishing or a chemical is not required, and the surface of the workpiece can be easily cleaned.

When the brush 11 has completely passed over the processing surface of the wafer W and the finishing has been completed, the rotation of the ball screws 15A and 15B by the motor 15C is stopped and the brush 1 is stopped.
Step 1 is stopped. In addition, the motor 14 is stopped to stop the rotation of the brush 11 around the rotation axis 12. Subsequently, the wafer W is transferred from the rotary table 41 to the positioning / cleaning device 5 by the wafer transfer device 6. The positioning / cleaning device 5 lowers the wafer W into the lower cleaning device 62, and sprays a cleaning liquid from a nozzle or the like onto the processing surface of the wafer W at the lowered position, and the wafer W
Is washed. The wafer W cleaned by the positioning / cleaning device 5 is lifted up again, is suction-held by the upper suction disk 64, and subsequently, the wafer W is inverted by the wafer transfer device 6 and is placed on the positioning / cleaning device 5 again. . From this state, the wafer W is transferred to and stored in the second cassette C2 while being held by the holding arm 71 of the articulated robot 7.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. For example, in the above-described embodiment, a brush in which brush bristles are provided in a wider area than the diameter of the wafer W is used. However, as shown in FIG. Can also. When finishing the wafer W with such a brush 80, the brush 80 can be moved in the longitudinal direction of the rotating shaft 12 by a width direction moving means (not shown). In this way, the brush 80 reciprocates on the processed surface of the wafer W, so that the entire processed surface of the wafer W can be finish-processed.

Further, as in the above-described embodiment, it is also possible to adopt a mode in which a finishing brush is attached to the spindle 20 in such a manner that the tool can be replaced without providing the finishing device separately from the grinding device. This example will be described with reference to FIG. In FIG. 9, the same members as those of the above-described embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 9, the finishing apparatus 90 in this example has a holder section 91 to be mounted on a tool mounting section formed on the spindle 20. Holder section 91
, A case 92 is fixed, and a finishing brush 93 is rotatably attached to the case 92.
The finishing brush 93 is provided with a rotating shaft 93A rotating around the horizontal axis X1 and a plurality of brush bristles 93B extending radially from the rotating shaft 93A.

Further, a vertical rotation shaft 94 extending in the direction of the vertical axis Z1 is fixed to the holder portion 91, and rotates with the holder portion 91. The vertical rotation shaft 94 is attached to the case 92 via a bearing 95. Further, the case 92 is provided with a stopper 94 for stopping rotation, and the stopper 94 is provided in the fitting hole 20 formed in the housing 20A 'of the spindle 20'.
a ′ to suppress the rotation of the case 93. The case 92 is attached to a vertical rotation shaft 94, and rotates the vertical rotation shaft 94 about the vertical axis Z1 to the horizontal axis X2.
Orthogonal bulk wheels 96A, 96 that convert to surrounding rotation
B is provided with a rotation axis direction conversion means 96, which is connected to a horizontal rotation axis 97.

The end of the horizontal rotating shaft 97 is attached to a case 92 so as to be rotatable by a bearing 98. A belt 99 is wound around a sprocket (not shown) provided at an end of the horizontal rotating shaft 97,
The belt 99 is wound around a sprocket (not shown) provided on the rotating shaft 93A of the finishing brush 93. With this configuration, when the spindle 20 ′ is rotated, the rotation is transmitted to the finishing brush 93 via the rotation direction converting means 96 and the like. The finishing brush 93 receives the rotating force of the spindle 20 ′ and receives the rotating shaft 93 A.
Rotate around. In this case, the spindle 20 'is provided with a linear moving mechanism (not shown).

When the finish processing is performed by the finish processing device 90, for example, after the finish grinding by the finish whetstone is completed, the holder 91 is gripped by a tool changing device (not shown) and is mounted on the tool mounting portion of the spindle 20 '. . Subsequently, the spindle 20 is lowered until the bristles 93B of the finishing brush 93 come into contact with the processing surface of the wafer W held on the rotary table 41. When the spindle 20 is rotated in this state, the rotational force of the spindle 20 acts as a force for rotating the finishing brush 93 via the rotation direction converting means 96 and the like. In this way, the processing surface of the wafer W can be finish-processed by linearly moving the spindle 20 ′ while rotating the finishing brush 93. Thereafter, the spindle 20 ′ is raised, and the holder 91 is gripped by a tool changing device (not shown) to finish the finishing device 9.
0 is removed, and the finishing work is completed. Note that a mechanism for linearly moving the rotary table 41 may be provided instead of the mechanism for linearly moving the spindle 20 '.

In the above-described embodiment, the brush 11 and the rotary table 41 are relatively moved by the linear movement of the brush 11 with respect to the rotary table 41 holding the wafer W. Or
For example, the wafer W is transferred to a separately provided finishing device, in which the brush is rotating at a fixed position, and the holding device that holds the wafer moves with respect to the brush. Can also. Of course, both the brush and the holding device may move.

Further, in the above-described embodiment, the brush is moved in the horizontal direction. However, for example, a mode in which the brush is moved in the up-down direction by holding the wafer W in an upright state may be adopted.

[0058]

As described above, claim 1 of the present invention is as follows.
According to the invention according to the first aspect, it is possible to provide a finish processing apparatus capable of leaving streaks aligned in a certain direction on a processing surface of a wafer. Therefore, when chips are cut out from this wafer, by aligning the directions, it is possible to prevent the generation of a wafer that is easily broken.

According to the second aspect of the present invention, even if a streak remains in the grinding process, the streak can be removed at the time of finishing work, and the streak in the same direction can be left. It is possible to provide a finishing device capable of performing the above.

According to the third aspect of the present invention, in performing the finishing after the grinding, it is not necessary to separately provide a finishing device separately in addition to the grinding device, and the finishing can be performed using the grinding device. it can.

According to the fourth aspect of the present invention, since the direction in which the streaks remain can be controlled, it is possible to control such that the streaks do not remain along the crystal orientation. Therefore, a streak can be left in a state where the workpiece is more difficult to be broken.

According to the fifth aspect of the present invention, it is possible to use brush bristles suitable as a finishing brush.

According to the invention of claim 6, it is possible to leave streaks aligned in a certain direction on the processed surface of the wafer.

According to the seventh aspect of the present invention, even if a streak remains in the grinding process, the streak can be removed at the time of finishing work, and the streak in the same direction can be left. it can.

[Brief description of the drawings]

FIG. 1 is a front view of a single-side grinding apparatus provided with a finishing apparatus according to the present invention.

FIG. 2 is an enlarged view of the vicinity of the finishing device of FIG. 1;

FIG. 3 is a plan view of a single-side grinding apparatus provided with a finishing apparatus according to the present invention.

FIG. 4 is a perspective view of a finishing device.

FIG. 5 is an enlarged schematic view of brush bristles.

FIG. 6 is a process chart showing a process from a grinding process to a finishing process.

FIG. 7 is a schematic view of a processed surface of a wafer after finishing processing.

FIG. 8 is a plan view showing a modification of the finishing device.

FIG. 9 is an enlarged perspective view showing another modification of the finishing device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Finishing device 2 Grinding device 3 Automatic tool changing device 4 Grinding stone stocker 5 Positioning / cleaning device 6 Wafer transfer device 7 Articulated robot 11 (For finishing) Brush 12 Rotary shaft 13 Brush hair 13A Nylon thread 13B Abrasive 14 Motor 15 Moving mechanism (moving driving means) 15A, 15B Ball screw 15C Motor (rotating driving means) 15D Synchronous belt 15E, 15F Ball nut 20 Spindle 30 Finishing grindstone member 32 Finishing grindstone 35 Rough grindstone member 37 Rough grindstone 40 Vacuum holding and rotating device 41 Rotary table (Holding means) 42 Motor C1 First cassette C2 Second cassette J Streak M Single-side grinding machine N Notch T Tip

Continuation of the front page (72) Inventor Shiro Murai 1 Shinmeicho, Yokosuka-shi, Kanagawa F-term in the Heiwa Toyama Technical Center Co., Ltd. AA18 AB03 AB04 AB06 BA02 BA09 CB01 DA17 3C063 AA07 AB03 BA14 BB01 BB02 BC03 BG10 BH09 CC30 EE28 FF30

Claims (7)

[Claims] A brush having a plurality of bristles to which abrasive grains are fixed, said bristles extending in a radial direction from a rotating shaft and attached to said rotating shaft; Rotating means for rotating the brush about the rotation axis, and holding means for holding the workpiece such that a processing surface of the workpiece is disposed substantially parallel to a rotation axis of the finishing brush. And a moving drive unit for moving at least one of the finishing brush and the holding unit so that the finishing brush and the holding unit relatively move, and The finishing brush is rotated by a driving unit, and at least one of the finishing brush and the holding unit is moved by the moving driving unit. A finishing device for performing a finishing process by linearly moving the object in a predetermined direction along a processing surface of the object and bringing the bristles of the finishing brush into contact with a processing surface of the workpiece. . 2. A process for grinding a work surface of a workpiece, which is used in a subsequent process of a grinding device for grinding the work surface of the workpiece, wherein the work surface of the workpiece that has been ground by the grinding device is finished. 2. The finishing device according to 1. 3. The finishing device according to claim 1, wherein the finishing brush is detachably attached to the grinding device, and finishing is performed by the grinding device. 4. The workpiece has a crystal orientation oriented in a predetermined direction, and the crystal orientation of the workpiece is adjusted to at least one of the finishing brush and the holding means. The finishing apparatus according to any one of claims 1 to 3, wherein the finishing processing is performed in a state where the workpiece is arranged and held and positioned by the holding means. 5. The brush bristles are diamond or S.
finishing apparatus according to any one of claims 1 to 4, characterized in that iO ₂ abrasive grains are nylon thread is fixed. 6. A finishing brush having a plurality of brush bristles extending in a radial direction from a rotation axis for finishing a working surface of a workpiece, wherein said brush bristles are provided with a finishing brush having abrasive grains fixed thereto. While rotating about the axis, the holding means for holding the work surface and the finishing brush are relatively positioned so that the working surface of the work is arranged substantially parallel to the rotation axis of the finishing brush. Like moving
By moving at least one of the holding means and the finishing brush, the workpiece is stopped in the rotation direction, and the bristles of the finishing brush are applied to the processing surface of the workpiece. A finishing method in which at least one of the working brush and the holding means is brought into contact with the workpiece and linearly moved in a predetermined direction along a working surface of the workpiece to perform finishing. 7. The finishing method according to claim 6, wherein the processing surface of the workpiece to be finished is ground.