JPH11233460A - Slice base peeling equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable sure peeling a slice base from a wafer by using compact constitution. SOLUTION: A wafer Ws with a slice base which is taken out from a cassette 22 with a take-out equipment 26 is brush-cleaned with a cleaning equipment 70, mounted on a heat plate 102 and heated. When adhesive agent is sufficiently and thermally softened, a part of the slice base S is pressed with a pressure plate 114, so that the slice base S is peeled from the wafer W. The wafer W from which the slice base S is peeled is accommodated in a cassette 122 with an accommodating equipment 126.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slice base peeling apparatus, and more particularly to a slice base peeling apparatus for peeling a slice base by cleaning wafers cut one by one by an inner peripheral blade slicing machine or the like. .

[0002]

2. Description of the Related Art When a wafer is cut from an ingot by an inner peripheral blade type slicing machine or the like, a slice base is adhered to an outer peripheral portion of the ingot and cut in order to prevent a defect at a cut end portion. Therefore, the slice base is adhered to the cut wafer. Since this slice base is unnecessary in the subsequent chamfering step and polishing step, it is separated from the wafer after cutting.

[0003] In general, as a method of peeling a slice base from a wafer, the wafer is immersed in hot water (about 90 ° C) to thermally soften an adhesive bonding the wafer and the slice base. A method is employed in which a wafer is pulled up from hot water and a slice base is peeled off.

[0004]

However, when the slice base is peeled off using hot water as described above, there is a drawback that the apparatus is broken down by steam generated from the hot water. The water vapor generated from this hot water can be somewhat suppressed by installing exhaust ducts, etc.
When such an exhaust system is installed, there is a disadvantage that the device itself becomes large.

In addition, when hot water is used, the heating temperature is limited, so that the temperature required for thermal softening cannot be obtained depending on the type of the adhesive, resulting in poor peeling and chipping or cracking of the wafer. There is also a drawback that occurs. In addition, there is also a disadvantage that the temperature is lowered between hot water and peeling to cause poor peeling. Furthermore, in an apparatus that continuously processes wafers stored in a cassette,
When the equipment stops after the wafer is pulled out of hot water,
Since the wafer pulled up from the hot water cannot be returned to the hot water, there is an inconvenience that continuous processing cannot be resumed simultaneously with the restart.

The present invention has been made in view of such circumstances, and has as its object to provide a slice base peeling apparatus capable of reliably peeling a slice base from a wafer with a compact configuration.

[0007]

In order to achieve the above object, the present invention provides a slice base peeling apparatus for peeling a slice base adhered to the periphery of a wafer cut from an ingot from the wafer. A supply cassette in which a large number of wafers are stored, a collection cassette in which the wafers from which the slice base has been peeled are collected, an extraction unit for taking out the wafers with slice bases one by one from the supply cassette, and cleaning the wafers with slice bases Cleaning means, first transport means for transporting the wafer with a slice base taken out by the removal means to the cleaning means, and bonding for heating the wafer with a slice base and bonding the slice base to the wafer Heating means for thermally softening the agent, and heating by the heating means Peeling means for pressing the slice base of the wafer with a slice base having the adhesive thermally softened to peel the wafer from the wafer, and second transport means for transporting the wafer with the slice base washed by the cleaning means to the heating means. A storage unit for storing the wafer from which the slice base has been peeled one by one in the collection cassette, and a third transport unit for transporting the wafer from which the slice base has been peeled by the peeling unit to the storage unit,
It is characterized by consisting of.

According to the present invention, a large number of wafers with slice bases stored in the supply cassette are taken out of the supply cassette one by one by the take-out means, and transferred to the cleaning means by the first transfer means. Then, after being washed by the washing means, it is conveyed to the heating means by the second conveying means. The heating means heats the wafer with the slice base and thermally softens the adhesive bonding the slice base and the wafer. Then, the slice base of the wafer with a slice base having the adhesive thermally softened is pressed by a peeling means to peel the slice base from the wafer. The wafer from which the slice base has been peeled is transported from the peeling means to the storage means by the third transport means, and is stored in the collection cassette by the transport means.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a slice-based peeling apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. 1 and 2 are a front view and a plan view, respectively, showing the overall configuration of a slice-based peeling apparatus according to the present embodiment.

[0010] As shown in FIG.
The separation device 10 includes a supply unit 12, a reversing unit 14, a cleaning unit 16,
The separation unit 18 and the recovery unit 20 are configured as main parts.
You. Hereinafter, each component will be described separately. The supply section
12 has a slice base stored in the cassette 22
Wafer W _SOut of the cassette 22 one by one,
Supply to the next process. The supply unit 12 includes a cassette 22
And a cassette positioning device 24 for positioning the cassette.
Is positioned at a predetermined position by the
Wafer W with slice base from cassette 22_STo
And a take-out device 26.

First, the configuration of the cassette positioning device 24 will be described. As shown in FIG. 1, a base 30 is vertically attached via a support member 28 to the left side of the slice base peeling apparatus main body 10A. This base 3
0, a guide rail 3 as shown in FIG.
2 and 32 are laid vertically, and the guide rail 3
A slide table 34 is slidably supported on 2 and 32.

On the slide table 34, a first cassette mounting table 36A and a second cassette mounting table 36B are horizontally disposed at a predetermined interval. Cassette 22, 22 slice base wafer with W _S is housed, a first cassette loading table 36A is set on the second cassette load platform 36B, it is locked by locking means not shown.

The cassette 22 has a cubic shape as shown in FIG.
a, 22a,... are partitioned by partition plates 22b, 22b,. Slice base with the wafer W _S is the storage chamber 22a, 22a, is placed in a state of being separated one by one in ... in, are housed. A motor 38 is provided on the back surface of the base 30, and an output shaft of the motor 38 is connected to a vertically disposed screw bar 40. A nut member 34 a provided on the back surface of the slide table 34 is screwed to the screw bar 40. The rotation of the screw bar 40 by the motor 38 causes the slide table 34 to move up and down. When the slide table 34 moves up and down, the cassettes 22 set on the cassette mounting tables 36A and 36B move up and down.

Next, the configuration of the take-out device 26 will be described. As shown in FIGS. 1 and 2, the take-out device 26 is installed horizontally at the upper end of the base 30 via a support member 42. The take-out device 26 has a pusher 44, and the pusher 44 slides horizontally by driving means (not shown) provided in the take-out device main body 26A.

The supply unit 12 constructed as described above, supplies the slice base wafer with W _S in the following manner. When the operator sets the cassettes 22, 22 on the first cassette mounting base 36A and the second cassette mounting base 36B of the cassette positioning device 24, the motor 38 is driven and the wafer W _S with the slice base to be taken out of the cassette 22 first is taken out. Is determined. This positioning is
It said first cassette loading table 36A on the slice base wafer with W _S accommodated in the uppermost storage chamber 22a of the cassette 22 which has been set is positioned so as to be positioned at a predetermined take-out position.

A wafer W _S with a slice base to be taken out of the cassette 22 first, ie, with a slice base stored in the uppermost storage chamber 22a of the cassette 22 set on the first cassette mounting table 36A. When the wafer W _S is located at the unloading position, the pusher 44 is driven by a driving unit (not shown) to horizontally slide forward (toward the cassette 22).

[0017] pusher 44 is slid forward, the slide is pushed by the pusher 44 which moves the slice base wafer with W _S is pushed forward, thereby, slice base wafer with W _S is taken out from the cassette 22. When slice base wafer with W _S as the is taken out from the cassette 22, the pusher 44 is retracted from the cassette 22 to return to the original state.

On the other hand, when the pusher 44 retracts from the cassette 22, the motor 38 of the cassette positioning device 24
There is driven, then the positioning of the slice base wafer with W _S is taken out from the cassette 22 is made. That is, the first cassette load platform slice base wafer with W _S housed in the second stage of the housing chamber 22a of the cassette 22 is set on the 36A is positioned so as to be positioned in the removal position. Then, it is taken out of the cassette 22 in the same manner.

[0019] In this way, the cassette positioning device 24 is the top of the slice base with wafer W _S cassette 22
Upon retrieved from, increased sequentially cassette 22 to position the slice base wafer with W _S contained in the cassette 22 in the removal position. Note that the amount of elevation of the cassette 22 at this time is set to be equal to the vertical interval between the wafers W _S with slice bases W _S , W _S ,.

The wafer W _S with a slice base in the cassette 22 set on the first cassette mounting table 36A.
Is completely removed, the second cassette mounting table 3
The wafer W _S with slice base stored in the uppermost storage chamber 22a of the cassette 22 set on 6A is positioned so as to be located at the extraction position, and is sequentially extracted in the same procedure. .

Further, the slice base with wafers housed in the cassette 22 W _S is the direction of all the slice base S are accommodated so as to become constant. That is, the slice base S is accommodated so as to be located in the pushing direction. Next, the reversing unit 14
Will be described. Inverting unit 14, conveys the slice base wafer with W _S supplied from the supply unit 12 to the cleaning unit 16, a slice base wafer with W _S is rotated 180 °, opposite to the conveying direction in the direction of slice base S Orient it. That is, since the slice base-equipped wafer W _S supplied from the supply unit 12 is supplied in a state where the direction of the slice base S is oriented in the same direction as the transport direction as described above, the wafer is rotated by 180 °. In the direction opposite to the transport direction. This is because the slice base S is oriented in the same direction as the transport direction, so that the members are prevented from being caught on the slice base S and the smooth transport is hindered. in order that the easy to position the wafer W _S per.

The above inversion section 14, as shown in FIGS. 1 and 2, a conveying device 50 for conveying the slice base wafer with W _S, is composed of the rotating device 52 for rotating the slice base wafer with W _S ing. First, the configuration of the transport device 50 will be described. A round belt conveyor 56 is horizontally installed at the upper end of a column 54 vertically erected on the slice base peeling apparatus main body 10A.
The wafer W _S with slice base pushed out of the cassette 22 of the supply unit 12 by the pusher 44 is placed on the belts 56A, 56A of the round belt conveyor 56, and is conveyed to the cleaning unit 16 by the round belt conveyor 56. You.

Guide members 58, 58 are provided on both sides of the round belt conveyor 56.
Reference numeral 58 is horizontally supported by the upper end of the support 54.
The slice base-equipped wafer W _S conveyed by the round belt conveyor 56 is conveyed while being guided by the guide members 58. Next, the configuration of the rotating device 52 will be described. As shown in FIG. 4, a cylinder 62 is provided at a position above the round belt conveyor 56 via a support bracket 60 provided vertically to the support column 54. The rod of the cylinder 62 advances and retreats vertically with respect to the round belt conveyor 56, and a motor bracket 63 is connected to the end thereof.

A motor 64 is supported by the motor bracket 63, and a suction pad 66 is connected to an output shaft of the motor 64. The suction pad 66 is rotatably supported by a bearing member 68 provided on the motor bracket 63, and is rotated by driving the motor 64. In the rotating device 52 configured as described above,
The suction pad 66 moves up and down by driving the cylinder 62, and rotates by driving the motor 64.

Next, the reversing section 14 constructed as described above is used.
Described transfer method and the inversion method of the slice base with the wafer W _S by. When slice base wafer with W _S from the cassette 22 is pushed out by the pusher 44 of the feeding section 12, the extruded slice base with the wafer W _S is placed on the round belt conveyor 56.

[0026] When the round belt conveyor 56 on the slice base with wafer W _S is placed, the round belt conveyor 5
6 is driven, slice base wafer with W _S is conveyed toward the cleaning portion 16. Note that the slice base wafer with W _S is mounted on the round belt conveyor 56 is detected by a sensor (not shown). And
The round belt conveyor 56 is driven by the detection of this sensor.

The slice base wafer with W _S by a round belt conveyor 56 a predetermined reversing position (the suction pads 6
6), the driving of the round belt conveyor 56 is temporarily stopped. After the stop, the suction pad 66 which is driven into the cylinder 62 by a predetermined amount downward, suction-holds the slice base wafer with W _S on round belt conveyor 56.

The suction pad 66 holding the wafer W _S with slice base is again raised by a predetermined amount by the cylinder 62, and lifts the wafer W _S with slice base from the round belt conveyor 56. Then, it is rotated 180 ° by the motor 64. As a result, the orientation of the slice base S of the wafer W _S with slice base is opposite to the transport direction.

The suction pad 66 is moved by the motor 64 to the position 18.
0 after being ° rotated, it descends again driven in the cylinder 62 to place the slice base wafer with W _S on the round belt conveyor 56. And round belt conveyor 5
The wafer W _S with the slice base placed on 6 is
The round belt conveyor 56 conveys the cleaning unit 14 toward the cleaning unit 14.

[0030] Note that the slice base wafer with W _S is conveyed to the reverse position is detected by a sensor (not shown). The drive of the round belt conveyor 56 is stopped by the detection of this sensor. Next, the cleaning unit 1
6 will be described. Cleaning unit 16, to clean the slice base with wafer W _S. The cleaning unit 16 includes a cleaning device 70 and a wafer positioning device 72.

First, the configuration of the cleaning device 70 will be described. As shown in FIG. 5, a cleaning tank 76 is provided on a gantry 74 provided on the slice base peeling apparatus main body 10A. As shown in FIG. 6, a pair of upper and lower cleaning brushes 78, 78 are rotatably provided inside the cleaning tank 76. The pair of cleaning brushes 78, 78 is driven and rotated by driving means (not shown). The wafer W _S with the slice base is provided with the pair of cleaning brushes 7.
By passing between 8, 78, both sides are brush-cleaned.

Further, the in the vicinity of the cleaning brush 78 are each cleaning solution spray nozzles 80 and 80 are installed, slice base with the wafer W _S while being injected cleaning liquid from the cleaning liquid injection nozzle 80, 80 Brush washed. A pair of upper and lower conveying rollers 82 is provided at the front and rear positions of the cleaning brushes 78 and 78, respectively.
A and 82B are installed. Transport rollers 82A, 82
B is rotated by being driven by a driving means (not shown), respectively, the rotating pair of conveying rollers 82A, the slice base with wafer W _S by 82B is conveyed.

Further, a pair of upper and lower air nozzles 84, 84 are provided at the rear position of the transport rollers 82A, 82B, and the wafer W _S with slice base, which has been brush-cleaned by the cleaning brushes 78, 78, The cleaning liquid attached to the surface is blown off by the compressed air jetted from the air nozzles 84, 84. Next, the configuration of the wafer positioning device 72 will be described. As shown in FIG. 5, a round belt conveyor 86 is installed at a position subsequent to the air nozzle 84. The conveying roller 82A, the wafer W _S with slice base carried by 82B is transported on the round belt conveyor 86, it is conveyed by the round belt conveyor 86 to the right in FIG.

On both sides of the round belt conveyor 86,
Each guide member 88 is disposed, by the guide member 88, the slice base wafer with W _S conveyed by the round belt conveyor 86 is guided. .. Are arranged in an arc shape at the subsequent position of the round belt conveyor 86, and are conveyed by the round belt conveyor 86 to the positioning pins 90, 90,. The wafer W _S with a slice base is positioned at a predetermined delivery position by abutting the peripheral edge of the wafer W _S with a slice base.

The wafer W with the slice base
_S is the positioning pins 90, 90 and abuts ... to the drive of the round belt conveyor 86 is stopped, slice base with the wafer W _S is stopped in a state of being positioned in the delivery position. Positioning pins 90, 90 of the slice base wafer with W _S, ... contact to detects by a sensor (not shown) stops driving the round belt conveyor 86 by the detection.

Next, the peeling section 18 will be described. The peeling section 18 peels the slice base _S from the wafer WS with the slice base, and includes a heating device 92 and a peeling / transporting device 94. First, the configuration of the heating device 92 will be described. As shown in FIG. 7, on a pedestal 98 installed on the slice base peeling apparatus main body 10A,
A heat plate 102 is installed horizontally via a bracket 100. The cleaned in the cleaning unit 16 slice base with the wafer W _S is transferred onto the heat plate 102 by the peeling and conveying device 94 which will be described next. Then, it is heated by the heat plate 102.

Next, the configuration of the peeling / transporting device 94 will be described. 9, 10, and 11 are a front view, a side view, and a plan view of the peeling / transporting device 94, respectively. As shown in the figure, a horizontal slide unit 1 is provided on a support column 104 vertically erected on a slice base peeling apparatus main body 10A.
06 is provided. This horizontal slide unit 10
Reference numeral 6 denotes a horizontal slide rail 106A disposed horizontally on the column 104, and a horizontal slide block 106B which is slid and moved on the horizontal slide rail 106A by driving means (not shown).

The horizontal slide block 106B is provided with a vertical slide unit 108, and the vertical slide unit 108
Vertical slide rail 108A vertically disposed on 6B
And a vertical slide block 108B that slides on the vertical slide rail 108A by driving means (not shown).

The vertical slide block 108B has
Further, a slide plate 110 is provided, and the slide plate 110 is
B moves in the horizontal direction by sliding, and the vertical slide block 108B moves in the vertical direction by sliding. A peeling cylinder 112 is provided at the tip of the slide plate 110 that slides as described above, and a pressing plate 114 is horizontally fixed to the rod tip of the peeling cylinder 112. The pressing plate 114 is formed in a crescent shape as shown in FIG. 11, and the pressing plate 114 presses the slice base S of the wafer W _S with the slice base placed on the heat plate 102. Then, the slice base S is separated from the wafer W.

The slide plate 110 has
The first suction pad 116A and the second suction pad 116B are arranged at a predetermined interval. The wafer W is sucked and held by the first suction pad 116A and the second suction pad 116B, and in this state, the slide plate 110 is transferred by being slid vertically and horizontally.

[0041] The first suction pad 116A carries the slice base wafer with W _S on the heat plate 102 from the delivery position of the cleaning unit 16 described above, the second suction pad 116B will be described later from above the heat plate 102 The wafer after the slice base is peeled is transferred onto the wafer transfer table 128 in the storage section 20. The peeling unit 18 configured as described above peels the slice base _S from the wafer WS with a slice base as follows.

When the wafer with the slice base is transported to a predetermined delivery position after the brush cleaning is completed, the slide plate 110 of the peeling / transporting device 94 is horizontally moved a predetermined distance to the left in FIG. As a result, the slide plate 1
The first suction pad 116A provided on the cleaning unit 1
6 is located directly above the delivery position (the state shown by the two-dot broken line in FIG. 1).

Next, the slide plate 110 moves vertically downward by a predetermined distance. As a result, the first suction pad 116A abuts against the upper surface of the slice base with wafer W _S. This condition first suction pad 116A is running, slice base wafer with W _S by the first suction pad 116A is held by suction. Next, the slide plate 110 again moves vertically upward by a predetermined distance, and then horizontally moves rightward in FIG. 1 by a predetermined distance. As a result,
The first suction pad 116A which the slice base wafer with W _S sucked and held is positioned directly above the heat plate 102 (the state shown by the solid line in FIG. 1).

Next, the slide plate 110 is moved vertically downward.
Move a predetermined distance in the direction. As a result, the first suction package
Way with Slice Base Adsorbed on Hold 116A
C W _SIs placed on the heat plate 102. Said hi
With a slice base placed on the plate 102
Wafer W_SIs held on the first suction pad 116A by suction.
While being held by the heat plate 102
You. Then, the heat plate 102
Wafer W with square_SIs heated,
Adhesive for bonding slice base S and wafer W
Heat softens.

[0045] When the predetermined time from the slice base wafer with W _S is placed on the heat plate 102 (the adhesive sufficient time to heat soften) has elapsed, a release cylinder 112 is driven, the rod The pressing plate 114 fixed to the leading end descends vertically downward. The wafer W _S with the slice base is moved by its lowered pressing plate 114.
As a result, the portion of the slice base S is pressed, and as a result, the slice base S is separated from the wafer W.

[0046] The pressing plate 114 because it is formed into a crescent shape (see FIG. 11), as shown in FIG. 8, the wafer W _S with a slice base on the heat plate 102 is mounted causing the angular deviation even if it has (8 code S _O is the slice base mounting slice base with wafer W _S to the normal on the heat plate 102, code S _X is the angular deviation on the heat plate 102 raised by a slice-based placed on the slice base wafer with W _S.), may be stripped reliably press the slice base S.

[0047] The above manner, the slice base S from the wafer W of the slice base with wafer W _S is peeled off. The peeled slice base S falls under its own weight into the slice base collection box 118 installed below the heat plate 102 and is collected. The slice base recovery box 118 is used for the slice base peeling apparatus main body 10.
When the slice base S has been collected to some extent, the operator removes the collected slice base S from the slice base peeling apparatus body 10A and discards the collected slice base S.

Next, the collecting section 20 will be described. The collection unit 20 stores the wafers W from which the slice bases S have been peeled one by one at predetermined positions of the cassette. This collection unit 2
Reference numeral 0 denotes a cassette positioning device 124 for positioning the cassette 122, and a storage device 126 for storing the wafers W one by one in the cassette 122 positioned at a predetermined position by the cassette positioning device 124.

Since the configuration of the cassette positioning device 124 is the same as that of the above-described cassette positioning device 24 of the supply unit 12, the description thereof is omitted by attaching the same reference numerals as those of the cassette positioning device 24 of the supply unit 12. I do. Also, the configuration of the cassette 122 is the same as that of the cassette 22 set in the supply unit 12 described above, and the description of the configuration will be omitted.

Therefore, only the structure of the storage device 126 will be described here. As shown in FIGS. 7 and 8, the storage device 126 is installed on a pedestal 98 on which the heat plate 102 is provided, and includes a wafer transfer table 128 on which the wafer W is mounted, and a wafer transfer table 128. And a rodless cylinder 130 for horizontally moving.

As shown in FIG. 8, the wafer transfer table 128 is composed of a wafer mounting portion 128A and a claw portion 128B.
8A. The claw portion 128B engages with the peripheral edge of the wafer W when the wafer transfer table 128 slides and supports the wafer W. For this reason, the claw portion 128B
Are formed in a V-shape.

The rodless cylinder 130 is
It is installed horizontally on the gantry 98. The wafer transfer table 128 is horizontally supported by the rodless cylinder 130 via a support member 132, and slides horizontally by driving the rodless cylinder 130. Guide members 134 and 134 are provided on both sides of the storage device 126, respectively.
Are guided on both edges by the guide members 134, 134.

The collection unit 20 configured as described above stores the wafer W in the cassette 122 as follows. When the peeling of the slice base S is completed, the slide plate 110 of the peeling / transporting device 94 horizontally moves a predetermined distance to the left in FIG. As a result, the slide plate 11
The second suction pad 116 </ b> B provided at 0 is located directly above the heat plate 102.

Next, the slide plate 110 moves vertically downward by a predetermined distance. As a result, the second suction pad 116B comes into contact with the upper surface of the wafer W on the heat plate 102. In this state, the second suction pad 116B is driven, and the wafer W is moved by the second suction pad 116B.
Is held by suction. Next, the slide plate 110 is again
Moves vertically upward by a predetermined distance, and after the movement, horizontally moves rightward in FIG. 1 by a predetermined distance. As a result, the second suction pad 116B holding the wafer W by suction is positioned right above the wafer transfer table 128.

Next, the slide plate 110 moves vertically downward by a predetermined distance, and as a result, the wafer W sucked and held by the second suction pad 116B moves to a position at a predetermined height from the wafer transfer table 128. . After the movement, the driving of the second suction pad 116B is stopped, whereby the wafer W is released from the second suction pad 116B, falls on the wafer transfer table 128, and is placed.

When the wafer W is placed on the wafer transfer table 128, the rodless cylinder 130
Is driven, and the wafer transfer table 128 is
The slide moves toward 22. As a result, the wafer W on the wafer transfer table 128 is stored at a substantially central position of the storage chamber 122a of the cassette 122 as shown in FIG.

The wafer W is stored in the storage chamber 12 of the cassette 122.
12a, the motor 38 of the cassette positioning device 124 is driven, and FIG.
As shown in (b), the cassette 122 rises by a predetermined amount. As a result, the partition plates 122b and 12
The wafer W is placed on 2b, and the storage is completed. Note that the cassette 122 is moved up by a predetermined amount as described above, so that the
The positioning of 2a is performed.

After the cassette 122 is lifted, the wafer transfer table 128 is driven by the rodless cylinder 130 and retracts from the cassette 122. The operation of the embodiment of the slice-based peeling apparatus 10 according to the present invention configured as described above is as follows. First, the operator, the cassette 2 in which the first cassette loading table 36A and the slice base with wafer W _S on the second cassette load platform 36B of the cassette positioning device 24 of the supply portion 12 is a large number stored
Set 2 and 22. At the same time, the operator
The empty cassettes 122, 122 are set on the first cassette mounting table 36A and the second cassette mounting table 36B of the cassette positioning device 124 of the collection unit 12. Then, when the above setting is completed, the slice-based peeling device 10
To work.

First, the motor 38 of the cassette positioning device 24 of the supply unit 12 is driven to
Positioning the slice base with the wafer W _S (wafer with slice base is housed in the top of the housing chamber 22a W _S) is taken out from is made. At the same time, the motor 38 of the cassette positioning device 24 of the collection unit 20 is driven to initially store the wafer W in the storage chamber 12.
2a (the uppermost storage chamber 122a) is positioned.

[0060] When the positioning is completed, the pusher 44 of the take-out device 26 is slid to push the slice base wafer with W _S from the cassette 22. The extruded wafer W _S with slice base is placed on the round belt conveyor 56 of the transfer unit 14. The cassette 22
When extruding a slice base wafer with W _S from the pusher 44 is retracted from the cassette 22 to return to the original state.

When the pusher 44 retracts from the cassette 22, the motor 38 of the cassette positioning device 24 is driven, and the slice base-equipped wafer W _S to be taken out next is taken.
Is determined. That is, slice base wafer with W _S housed in the second stage of the housing chamber 22a of the cassette 22 is positioned so as to be positioned in the removal position.

[0062] When the round belt conveyor 56 on the slice base with wafer W _S is placed, the round belt conveyor 5
6 is driven, the slice base with wafer W _S by a round belt conveyor 56 is conveyed to the reversing position. When slice base wafer with W _S is conveyed to the reversing position, the drive of the round belt conveyor 56 is suspended, then the suction pad 66 by a predetermined amount downward. Then, the suction holding the slice base wafer with W _S on the round belt conveyor 56.

[0063] suction pads 66, which holds the slice base wafer with W _S rises a predetermined amount, the round belt conveyor 5
6. Lift the wafer W _S with slice base from above. Then, the wafer W _S with slice base held by suction is rotated by 180 °. As a result, the direction of the slice base S of the wafer W _S with slice base is opposite to the transport direction.

The wafer W _S with the slice base is set to 180
° rotated suction pad 66, places the slice base wafer with W _S on round belt conveyor 56 is lowered again. When the round belt conveyor 56 on the slice base wafer with W _S is placed, round belt conveyor 56 is driven again to convey the slice base wafer with W _S to the cleaning unit 16.

The cleaning unit 16 is rotated by the round belt conveyor 56.
Wafer with slice base W transferred to_SIs
It is delivered to the transport rollers 82A and 82B of the cleaning section 16.
Then, it is transported in the cleaning device 70. And in the process
Dirt adhering to the surface is removed. That is,
Wafer W with square_SIs the transport roller 82A,
82B, the cleaning liquid supply nozzle 8
While the cleaning liquid is supplied from 0 and 80, a pair of rotating
It passes between the cleaning brushes 78, 78, thereby cleaning the surface.
Brush washed. And brush-washed slices
Wafer with base W _SFrom the air nozzles 84, 84
The cleaning liquid adhering to the surface is blown out by the compressed air
It is blown off and dried by this.

The wafer W _S with the slice base washed as described above is transferred from the transfer rollers 82A and 82B onto the round belt conveyor 86 of the wafer positioning device, and is transferred to the delivery position by the round belt conveyor 86. When the wafer W _S with slice base is transported to the delivery position, the wafer W _S with slice base becomes
The seven positioning pins 90, 9 arranged at the delivery position
Stop by contacting 0,. At the same time, the driving of the round belt conveyor 86 is stopped.

[0067] When the slice base wafer with W _S is conveyed to the transfer position, the slide plate 11 of the release portion 18
0 moves a predetermined distance 0 horizontally. As a result, the first suction pad 116A provided on the slide plate 110 is located directly above the delivery position. Next, slide plate 1
10 by a predetermined amount downward, as a result, the first suction pad 116A abuts against the upper surface of the slice base with wafer W _S. The first suction pad 116A is sucking and holding the contact slice base wafer with W _S.

[0068] When the first suction pad 116A to the slice base wafer with W _S is held by suction, slide plate 110 is raised again the predetermined amount, then the predetermined distance 0 horizontal movement. As a result, the wafer W _S with slice base suction-held by the first suction pad 116A is positioned directly above the heat plate 102. Slide plate 110
Is then lowered by a predetermined amount. As a result, the first suction pad 1
Wafer W with slice base held by suction at 16A
_S is placed on the heat plate 102. The slice base-equipped wafer W _S is heated by the heat plate 102 while being held by suction on the first suction pad 116A,
As a result, the adhesive bonding the slice base S is softened by heat.

[0069] Note that during the heating of the slice base wafer with W _S in the heat plate 102, slice base wafer with W _S of handsome is taken out of the cassette 22, the cleaning unit through the same process steps as just It has been transported to 12 delivery positions. When a predetermined time elapses after the wafer W _S with a slice base is placed on the heat plate 102, the peeling cylinder 112 is driven,
The pressing plate 114 fixed to the tip of the rod descends. Then, the lowered pressing plate 114 moves the wafer W
Press the slice base S adhered to. Thereby, the slice base S is separated from the wafer W.

The slice base S peeled off from the wafer W falls under its own weight and falls in the slice base collection box 11.
Collected in 8. When the peeling of the slice base S is completed, the first suction pad 116A releases the suction of the wafer W. After the release, the slide plate 11
0 increases by a predetermined amount. After ascending, slide plate 110
Moves horizontally by a predetermined distance, and as a result, the first suction pad 11
6A is located directly above the receiving position, and the second suction pad 116B is located directly above the heat plate 102.

[0071] Slide plate 110, then a predetermined amount downward, as a result, the first suction pad 116A abuts against the upper surface of the slice base wafer with W _S located in the receiving position, the second suction pad 116B is heat plate 102 It contacts the upper surface of the upper wafer W. And
The first suction pad 116A is attracted and held a slice base wafer with W _S located in the receiving position, the second suction pad 116B adsorbs holds the wafer W on the heat plate 102.

When the wafers W _S and W are sucked and held on the suction pads 116A and 116B, the slide plate 110 rises again by a predetermined amount, and thereafter moves horizontally by a predetermined distance. As a result, the first suction pad 116A is heat plate 10 that attracts and holds the slice base wafer with W _S
The second suction pad 116 </ b> B, which is located directly above the wafer 2 and holds the wafer W by suction,
It is located directly above 8.

The slide plate 110 is then moved down by a predetermined amount.
As a result, the first suction pad 116A holds the suction.
Held wafer W with slice base_SIs a heat pre
The second suction pad 1 is placed on the
The wafer W sucked and held by the wafer 16B is transferred to the wafer transfer table.
It is located at a predetermined height from above the bull 128. here,
With slice base placed on the heat plate 102
Wafer W _SAs described above, the first suction package
Heat plate 102 while being held by suction
Heated by

[0074] Also, while heating the slice base wafer with W _S of handsome in the heat plate 102, slice base wafer with W _S of comedian is taken out of the cassette 22, the same process steps as just And is conveyed to the delivery position of the washing unit 12. On the other hand, the wafer W transferred to a position above the wafer transfer table 128
The drive of the second suction pad 116B is released at that position, and the wafer drops onto the wafer transfer table 128. When the wafer W falls on the wafer transfer table 128 and is placed thereon, the wafer transfer table 128 slides and moves, whereby the wafer W is stored in the storage chamber 122 a of the cassette 122.

Since the second suction pad 116B, which has released the wafer W, is located at a predetermined height from the wafer transfer table 128, the wafer transfer table 1
Even if 28 slides, wafer transfer table 12
8 does not touch. Further, as described above, the cassette 122 rises by a predetermined amount when receiving the wafer W from the wafer transfer table 128, thereby simultaneously positioning the storage chamber 22a for storing the next wafer W. The wafer transfer table 128 is provided for the cassette 1
After ascending, the rodless cylinder 130 drives the rodless cylinder 130 to retreat from the cassette 122.

With the above-described series of steps, the peeling operation of the first wafer is completed, and thereafter, through the same steps, the peeling operation of the second and third wafers proceeds. The slice base S is peeled off from all the slice base wafer with W _S contained in the cassette 22 of the feed section 12, the peeling work where stored in the cassette 122 of the recovery unit 20 is completed. After completion, the operator removes the cassettes 122 from the cassette positioning device 124 of the collection unit 20 and transports the cassettes 122 and 122 together in the next processing step.

[0077] Thus, the slice base peeling apparatus 10 of this embodiment, taken out slice base wafer with W _S accommodated in the cassette 22 in an automatic, washed with automatically stripping the slice base S Can be automatically stored in the cassette 122. Therefore,
Efficient slice-based peeling work can be performed without requiring human intervention.

In the slice base peeling apparatus 10 of the present embodiment, the following effects can be obtained by using the heat plate 102 for peeling the slice base S. That is, when hot water is used, there is a drawback that the device is broken by steam generated from the hot water. However, in the case of the heat plate 102, since no steam is generated, such a problem is eliminated.

When hot water is used, there is no need to install an exhaust duct or the like for treating steam, so that the apparatus becomes compact. In addition, when hot water is used, a temperature required for heat-softening the adhesive cannot be obtained, and a peeling failure may occur. However, in the case of the heat plate 102, the heating temperature is not limited. The wafer can be heated at a sufficient temperature regardless of the type of the agent. Therefore,
No peeling failure occurs.

[0080] Further, the slice base peeling apparatus 10 of the present embodiment, the wafer W _S while placed on the heat plate 102, i.e., while heating, sliced to press the slice base S by the pressing plate 114 base S Is to be peeled off. For this reason, unlike the case of hot water, there is no possibility that the resin is cooled during transporting and conveyed to cause peeling failure. Further, even if the apparatus is stopped, there is no need to return the wafer to the hot water again as in the case of hot water, so that an efficient peeling operation can be performed.

[0081] In the present embodiment uses the heat plate 102 as means for heating the slice base wafer with W _S, slice base with wafer W
_The means for heating _S is not limited to this as long as it is a dry type. For example, the wafer W _S with the slice base held on the table may be heated by blowing hot air or heated using infrared rays or the like.

Further, in the slice-based peeling apparatus 10 of the present embodiment, the transfer of the wafer from the cleaning section 16 to the peeling section 18 and the transport of the wafer from the peeling section 18 to the collecting section 20 are performed by one peeling and separating step.
Since the transfer device 94 is also used, an efficient peeling operation can be realized. That is, in the slice-based peeling apparatus 10 of the present embodiment, the wafer W
From the heat plate 102 to the wafer transfer table 12
8, the wafer W with the slice base which has been waiting at the delivery position of the cleaning unit 12 at the same time
_S is transferred onto the heat plate 102. As a result, useless movement of the apparatus can be omitted, and wafer processing can be performed efficiently. This also makes it possible to reduce the size of the device itself.

The transfer device for transferring the wafer from the cleaning unit 16 to the separation unit 18 and the transfer device for transferring the wafer from the separation unit 18 to the collection unit 20 may be provided separately.
In addition, the transfer of the wafer from the supply unit 12 to the reversing unit 14, the reversing unit 14 to the cleaning unit 16, the cleaning unit 16 to the peeling unit 18, and the wafer from the peeling unit 18 to the storage unit 20 is performed by a single transfer device, for example, the ceiling of the device. The transfer may be performed by a transport device that travels through the section.

[0084]

As described above, according to the present invention,
The slice base can be reliably peeled from the wafer regardless of the type of the adhesive. Further, since no steam is generated as in hot water, the apparatus does not break down. Further, since there is no need to separately provide a device for preventing water vapor, the device itself can be made compact.

[Brief description of the drawings]

FIG. 1 is a front view showing an overall configuration of an embodiment of a slice-based peeling apparatus according to the present invention.

FIG. 2 is a plan view showing an overall configuration of an embodiment of a slice-based peeling apparatus according to the present invention.

FIG. 3 is a side view of the cassette positioning device.

FIG. 4 is a side view showing a configuration of a reversing unit.

FIG. 5 is a plan view showing a configuration of a cleaning unit.

FIG. 6 is a front view showing the internal configuration of the cleaning device.

FIG. 7 is a front view showing a configuration of a heating device and a storage device.

FIG. 8 is a plan view showing a configuration of a heating device and a storage device.

FIG. 9 is a front view showing the configuration of a peeling / transporting device.

FIG. 10 is a side view showing the configuration of a peeling / transporting device.

FIG. 11 is a plan view showing a configuration of a peeling / transporting device.

FIG. 12 is an explanatory diagram of a method for storing a wafer in a cassette.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Slice base peeling apparatus 12 ... Supply part 14 ... Reversing part 16 ... Cleaning part 18 ... Peeling part 20 ... Recovering part 22 ... Cassette 24 ... Cassette positioning device 26 ... Take-out device 50 ... Transport device 52 ... Rotating device 70 ... Cleaning device 72 ... wafer positioning apparatus 92 ... heater 94 ... peeling and transfer apparatus 102 ... heat plate 124 ... cassette positioner 126 ... storage device W _S ... slice base wafer with W ... wafer S ... slice base

Claims (3)

[Claims] In a slice base peeling apparatus for peeling a slice base adhered to a peripheral edge of a wafer cut from an ingot from a wafer, a supply cassette containing a large number of wafers with a slice base and a slice base are peeled. A collection cassette from which the wafers are collected, an extraction unit for extracting the wafers with slice bases one by one from the supply cassette, a cleaning unit for cleaning the wafers with slice bases, and a wafer with slice bases extracted by the extraction unit. A first transfer unit that transfers the wafer to the cleaning unit; a heating unit that heats the wafer with the slice base to thermally soften an adhesive bonding the slice base and the wafer; Heated adhesive base with slice base A peeling unit that presses the slice base of c to peel the wafer from the wafer; a second transporting unit that transports the wafer with the slice base cleaned by the cleaning unit to the heating unit; A slice base peeling apparatus, comprising: a storage unit that stores the wafers one by one in a collection cassette; and a third transport unit that transports the wafer, from which the slice base has been peeled by the peeling unit, to the storage unit. 2. The apparatus according to claim 1, wherein the first transfer unit includes a rotation unit that rotates the wafer with the slice base so that the direction of the slice base is opposite to the transfer direction. A slice-based peeling device as described. 3. The slice base separating apparatus according to claim 1, wherein said separating means includes a slice base collecting means for collecting a slice base separated from said wafer.