KR20160128112A - Pulley, the manufacturing method thereof and wire saw apparatus having the same - Google Patents

Pulley, the manufacturing method thereof and wire saw apparatus having the same Download PDF

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Publication number
KR20160128112A
KR20160128112A KR1020150059941A KR20150059941A KR20160128112A KR 20160128112 A KR20160128112 A KR 20160128112A KR 1020150059941 A KR1020150059941 A KR 1020150059941A KR 20150059941 A KR20150059941 A KR 20150059941A KR 20160128112 A KR20160128112 A KR 20160128112A
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KR
South Korea
Prior art keywords
wheel
wire
pulley
guide
guide ring
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KR1020150059941A
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Korean (ko)
Inventor
백성선
우남규
장순호
최효일
김남기
배동우
정승구
이영준
정재훈
장형욱
이상한
김동진
Original Assignee
웅진에너지 주식회사
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Priority to KR1020150059941A priority Critical patent/KR20160128112A/en
Publication of KR20160128112A publication Critical patent/KR20160128112A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
    • F16H55/32—Friction members
    • F16H55/36—Pulleys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D55/00—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts
    • B23D55/08—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts of devices for guiding or feeding strap saw blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A pulley is provided. And a guide ring formed with a coupling groove on an inner circumferential surface thereof and engaging with an outer circumferential portion of the wheel and having a guide groove for guiding the wire on the outer circumferential surface, wherein the guide ring is integrally formed with the wheel by a molding method.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a pulley, a manufacturing method thereof, and a wire saw apparatus including the same,

The present invention relates to a pulley and a wire saw apparatus including the same.

A wafer widely used as a material for manufacturing semiconductor devices refers to a single crystal silicon thin plate. Such wafers include a slicing process for thinly cutting a single crystal silicon ingot into a wafer shape, a lapping process for improving the flatness while polishing the wafer to a desired wafer thickness, an etching process for removing the damaged layer inside the wafer, Polishing is performed to improve etching, surface hardening and flatness, and cleaning to remove contaminants on the surface of the wafer.

Monocrystalline silicon ingots are generally grown and manufactured according to the Czochralski method. This method is a method of melting polycrystalline silicon in a crucible in a chamber, immersing a single crystal seed crystal into molten silicon, and gradually growing the molten silicon into a silicon single crystal ingot having a desired diameter.

After the growth of the ingot is completed, a slicing process for cutting the ingot into wafer units is performed. In this slicing step, there is a wire saw method in which a wire is run at a high speed and a slurry solution is sprayed thereon to cut the slurry by the friction between the slurry and the ingot.

On the other hand, after the pulleys used in the conventional wire saw apparatus are fixed once, there is no special management. This results in irregular wear due to friction generated between the pulley and the wire due to long-term operation.

This causes twisting of the wire, and when the twisted wire is continuously operated, disconnection occurs and the production yield is lowered.

Further, the pulleys used in the conventional wire saw apparatus are warped in the process of detaching and attaching the guide ring formed of the urethane material, so that wire twisting phenomenon may occur.

At this time, if the pulleys are not aligned with each other in a straight line, such wire twisting phenomenon can occur more frequently.

An embodiment of the present invention is to provide a pulley capable of improving the quality of a wafer by preventing twisting of a wire and reducing weight to reduce unnecessary wear by reducing inertia force during operation and a wire saw apparatus including the same .

According to one aspect of the present invention, there is provided a wheel having a disk-shaped wheel, a guide ring having a coupling groove formed on an inner circumferential surface thereof and coupled to an outer circumferential portion of the wheel and having a guide groove for guiding the wire on an outer circumferential surface thereof, A pulley formed integrally with the wheel is provided.

At this time, the engaging groove may be formed to correspond to the outer circumferential portion of the wheel so as to cover the outer circumferential portion of the wheel.

At this time, the cross-section of the coupling groove may have a U-shape.

At this time, the cross section of the guide groove may have a V shape.

At this time, the wheel may have a first through hole formed at a central portion thereof, and a plurality of second through holes formed on the same circumference around the first through hole.

At this time, the wheel may be made of a metal material, and the guide ring may be made of a resin material.

According to another aspect of the present invention, there is provided a wire cutting method, comprising: a wire cutting an ingot; a pair of guide rollers wound on an outer circumferential surface of the wire to move the wire; and the aforementioned pulley guiding or recovering the wire with the pair of guide rollers A wire saw apparatus is provided.

According to still another aspect of the present invention, there is provided a pulley manufacturing method including molding a guide ring on an outer peripheral portion of a disk-like wheel, and machining a guide groove on an outer peripheral surface of the guide ring.

At this time, in the step of machining the guide groove on the outer peripheral surface of the guide ring, the guide groove can be processed into a V-shape.

A pulley and a wire saw apparatus including the pulley according to an embodiment of the present invention include a guide ring to prevent wire twisting and to reduce weight, thereby reducing inertial force during operation, thereby reducing unnecessary wear.

Also, the pulley according to one embodiment of the present invention and the wire saw apparatus including the same can prevent detachment of the wire, thereby improving the quality of the wafer and reducing the defect rate.

According to an embodiment of the present invention, the pulley wheel and the guide ring are integrated so that the twisting of the wire caused by the bending of the wheel during the detachment and attachment of the guide ring and the wheel can be prevented.

According to the pulley manufacturing method according to another embodiment of the present invention, the wheel made of aluminum is prevented from being bent, so that the wire can move on a straight line.

1 is a perspective view illustrating a wire saw apparatus including a pulley according to an embodiment of the present invention.
2 is a front view of a wire saw apparatus including a pulley according to an embodiment of the present invention.
3 is a perspective view illustrating a pulley according to an embodiment of the present invention.
4 is a perspective view showing a cross section of a pulley according to an embodiment of the present invention.
5 is a flowchart showing a pulley manufacturing method according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, where a section such as a layer, a film, an area, a plate, or the like is referred to as being "on" another section, it includes not only the case where it is "directly on" another part but also the case where there is another part in between. On the contrary, where a section such as a layer, a film, an area, a plate, etc. is referred to as being "under" another section, this includes not only the case where the section is "directly underneath"

Hereinafter, a pulley and a wire saw apparatus including the pulley according to an embodiment of the present invention will be described in detail with reference to the drawings.

1 is a perspective view illustrating a wire saw apparatus including a pulley according to an embodiment of the present invention. 2 is a front view of a wire saw apparatus including a pulley according to an embodiment of the present invention.

1 and 2, a wire saw 1 including a pulley 50 according to an embodiment of the present invention includes a wire 5, an ingot support portion 10, a guide roller 7, a supply portion 20, a recovery unit 30, a coolant splitter 41, and a pulley 50.

Accordingly, the wire saw 1 including the pulley 50 according to the embodiment of the present invention can prevent the twist of the wire, thereby improving the quality of the wafer and reducing the weight to reduce the inertial force during operation, .

In addition, the wire saw 1 including the pulley 50 according to an embodiment of the present invention can prevent detachment of the wire into the groove, thereby improving the quality of the wafer and reducing the defect rate.

1 and 2, in an embodiment of the present invention, the wire 5 is of a type that is fixed to the surface by cutting particles, for example, a diamond particle having a certain size and fixed to the surface through nickel electrodeposition .

At this time, in the embodiment of the present invention, the wire 5 of the type in which the cutting particles are fixed can cut a large number of wafers in a short time by increasing the cutting ability.

On the other hand, in one embodiment of the present invention, the ingot 3 is disposed on the upper side of the wire 5 and is cut in units of wafers while descending toward the wire in the slicing process.

Referring to FIG. 1, in one embodiment of the present invention, the ingot support portion 10 may include a work plate 11 and a beam 13 by attaching and supporting an ingot in a slicing process.

On the other hand, the work plate 11 can be attached to one side of the beam 13 using an adhesive member such as an epoxy. At this time, the beam 13 may be made of calcium chloride, glass, quartz, or the like, and the ingot 3 may be mounted on the other side of the beam 13.

That is, as shown in FIG. 1, a work plate 11 may be attached to the top of the beam 13, and an ingot 3 may be attached to the bottom of the beam.

The wire saw apparatus 1 including the pulley 50 according to the embodiment of the present invention can prevent the ingot 3 from being stably fixed by the work plate 11 and the beam 13, Can be prevented from falling downward.

1, in an embodiment of the present invention, the guide rollers 7 may be installed at the bottom of the ingot 3 and may be provided in at least one pair.

At this time, the pair of guide rollers 7 may be spaced apart from each other by a distance larger than the diameter of the ingot 3, for example, as shown in FIG.

On the other hand, the guide roller 7 has a cylindrical shape and a plurality of grooves (not shown) are formed on the outer circumferential surface of the guide roller so that the wire 5 can be wound on the pair of guide rollers 7 at the same time.

At this time, the grooves may be formed at regular intervals along the longitudinal direction of the guide rollers 7.

Meanwhile, in the wire saw 1 including the pulley 50 according to the embodiment of the present invention, the number and thickness of wafers sliced by the interval of the wires 5 wound on the guide rollers 7 can be determined have.

Referring to FIG. 1, the pair of guide rollers 7 may include a first guide roller 7a and a second guide roller 7b.

1, the first guide roller 7a of the pair of guide rollers 7 is directly connected to the motor 9 so that the first guide roller is rotated by the motor. In addition, the rotational force of the first guide roller 7a can rotate the second guide roller 7b through the wire 5.

On the other hand, the guide roller 7 can be rotated in one direction or in both directions. At this time, as the guide roller 7 is rotated clockwise or counterclockwise, the wire 5 can be driven at a high speed in one direction or in both directions.

In this manner, the ingot 3 can be cut in a direction perpendicular to the longitudinal direction by means of the wire 5 moved in one direction or both directions to produce wafers.

However, when the wire saw apparatus 1 including the pulley 50 according to the embodiment of the present invention moves the wire 5 in both directions to produce a wafer, the wire moves in one direction to produce a wafer The thickness variation of the wafer can be reduced and the quality of the wafer can be improved.

Referring to FIG. 1, the coolant splitter 41 may be formed in a pipe shape extending along the longitudinal direction of the guide roller 7, but the present invention is not limited thereto. The coolant splitter 41 may be formed in any form by spraying a coolant.

Referring to FIG. 1, the coolant splitter 41 may be formed with a through hole through which the coolant can be injected. At this time, the coolant splitter 41 is provided on the upper side of the pair of guide rollers 7 to facilitate cutting of the ingot.

On the other hand, when the ingot is cut by the wire 5 wound on the pair of guide rollers 7, the coolant is fed toward the wire 5 positioned between the first guide roller 7a and the second guide roller 7b, Can be sprayed.

At this time, the coolant may include abrasive grains. When the ingot 3 mounted on the ingot support portion 10 moves toward the wire 5 and is pressed, the ingot 3 is abraded by the abrasive grain coated on the wire, Can be cut.

In this case, in the embodiment of the present invention, the coolant splitter 41 may be connected to the coolant supply unit 43 to supply coolant.

The coolant collecting part 45 can be installed on the lower side of the pair of guide rollers 7 and the receiving grooves 45a opened to the upper side are formed so that the coolant can be collected.

A part of the coolant jetted by the pair of guide rollers 7 in the coolant splitter 41 can be collected in the receiving groove 45a of the coolant collecting portion 45 and collected.

At this time, the coolant collecting part 45 is connected to the coolant supplying part 43, and the coolant collected by the coolant collecting part 45 can be moved to the coolant supplying part 43 again.

Meanwhile, in one embodiment of the present invention, one side of the first guide roller 7a of the pair of guide rollers 7 may be provided with a supply part 20 for supplying a wire, and the second guide roller 7b And a recovery unit 30 for recovering the wire supplied from the supply unit 20 may be installed at one side.

The pulley 50 according to an embodiment of the present invention includes the first tension pulley 50a and the supply pulley 50b of the supply unit 20, the second tension pulley 50 of the recovery unit 30, (50d). The pulley 50 according to an embodiment of the present invention will be described in detail below.

1 and 2, the supply unit 20 may supply the wire to the guide roller 7, including the supply bobbin 21, the first tension pulley 50a, and the supply pulley 50b.

On the other hand, the supply bobbin 21 is disposed on the upper right side of the first guide roller 7a, and the wire 5 is wound to supply the wire.

Referring to FIG. 1, the first tension pulley 50a is installed on the lower side of the supply bobbin 21, and two of them may be installed, but the present invention is not limited thereto. At this time, the first tension pulley 50a can impart tension to the wire 5 and guide the progress of the wire.

On the other hand, the feeding pulley 50b is disposed on the lower right side of the first guide roller 7a and can change the entry position of the wire 5 entering the first guide roller 7a.

However, the feed pulley 50b may be installed on the lower right side of the first guide roller 7a as shown in FIG. 1, but is not limited thereto.

1 and 2, the recovery unit 30 includes a recovery bobbin 31, a second tension pulley 50c, and a recovery pulley 50d to recover the wire from the guide rollers 7.

On the other hand, the recovery bobbin 31 is disposed above the left upper side of the second guide roller 7b, and the wire can be wound and recovered.

Referring to FIG. 1, the second tension pulley 50c is installed on the lower side of the recovery bobbin 31 and may be provided with two, but not limited thereto. At this time, the second tension pulley 50c can impart tension to the wire and guide the progress of the wire.

On the other hand, the recovery pulley 50d can be disposed on the left lower side of the second guide roller 7b to change the recovery position of the wire recovered from the second guide roller 7b. However, the recovery pulley 50d may be installed on the lower left side of the second guide roller 7b as shown in FIG. 1, but it is not limited thereto.

3 is a perspective view illustrating a pulley according to an embodiment of the present invention. 4 is a perspective view showing a cross section of a pulley according to an embodiment of the present invention.

3, the pulley 50 according to an embodiment of the present invention may include a wheel 51 and a guide ring 57. At this time, the guide ring 57 can be integrally formed with the wheel 51 by casting.

Accordingly, the pulley 50 according to the embodiment of the present invention can guide or recover the wire 5 with the pair of guide rollers 7. [

Accordingly, the pulley 50 according to an embodiment of the present invention includes the guide ring 57 to prevent wire twisting and reduce the weight of the pulley 50, thereby reducing the inertia force during operation, thereby reducing unnecessary wear.

In addition, the pulley 50 according to the embodiment of the present invention prevents the wire from being separated, thereby improving the quality of the wafer and reducing the defect rate.

In an embodiment of the present invention, the wheel 51 may be in the shape of a disc and may be made of metal, for example, aluminum, but is not limited thereto.

In addition, the wheel 51 may have a first through-hole 52 formed at its center, and a plurality of second circumferential grooves 52, A through hole 54 may be formed.

The pulley 50 according to an embodiment of the present invention may include a first through hole 52 and a second through hole 54 to reduce the weight of the pulley 50 and to operate the guide roller 7 in both directions It is possible to reduce the inertia force and reduce the abrasion due to friction.

In one embodiment of the present invention, the guide ring 57 may be ring-shaped in cross section so as to be coupled to the outer circumferential portion of the wheel 51 which is in the form of a disk. The guide ring 57 may be made of a resin material such as urethane, but is not limited thereto.

On the other hand, a guide groove 59 may be formed on the outer peripheral surface of the guide ring 57. At this time, the guide groove 59 may have a V-shaped cross section, but various shapes can be set according to specifications such as load and required stroke required for transmission.

Accordingly, the pulley 50 according to the embodiment of the present invention has the guide groove 59 formed on the outer circumferential surface thereof to guide the wire 5 during operation of the wire saw apparatus 1

On the other hand, the engaging groove 57a of the guide ring 57 may be recessed in the inner circumferential surface of the guide ring 57. At this time, the engaging groove 57a may be formed to correspond to the outer circumferential portion of the wheel so as to be engaged with the outer circumferential portion of the wheel 51 so as to cover the outer circumferential portion of the wheel.

The coupling groove 57a may have a U-shaped cross section to accommodate the outer circumferential portion of the wheel 51, but is not limited thereto.

The pulley 50 according to the embodiment of the present invention is formed by integrally forming the wheel and the guide ring 57 so that the wheel 51 is bent in the process of attaching and detaching the guide ring 57 and the wheel 51 It is possible to prevent the twisting phenomenon of the wire.

When the guide ring 57 can not be repaired, the pulley 50 according to the embodiment of the present invention peels the guide ring 57 from the wheel 51, So that the wheel can be reused repeatedly.

5 is a flowchart showing a pulley manufacturing method according to an embodiment of the present invention.

Referring to FIG. 5, a method of manufacturing a pulley according to another embodiment of the present invention includes sanding an outer circumferential portion of a wheel (S10), applying an adhesive to an outer circumferential portion of the wheel (S20) (S30) casting a guide ring on an outer peripheral portion of the wheel, and machining a guide groove on the outer peripheral surface of the guide ring (S40).

Thus, according to the method of manufacturing a pulley according to an embodiment of the present invention, the wheel 51 made of aluminum is prevented from being bent so that the wire 5 can move linearly.

On the other hand, in step S10 of sanding the outer circumferential portion of the wheel, the surface of the outer circumferential portion of the wheel 51, which is the portion to which the guide ring 57 is engaged, is smoothed. This is to ensure that the outer circumferential portion of the wheel 51 is well coated with adhesive so that it can be easily engaged with the guide ring 57.

In step S20 of applying an adhesive to the outer peripheral part of the wheel, an adhesive is applied to the surface of the outer peripheral part of the wheel 51 to which the guide ring 57 is coupled. This is for engaging the outer periphery of the wheel with the guide ring when the guide ring 57 is cast on the outer periphery of the wheel 51. [

6, in the step S30 of coupling the wheel to the mold and casting the guide ring on the upper circumferential portion of the wheel, the wheel 51 is coupled to the metal mold, and a raw material Is poured into a mold and hardened.

At this time, the guide ring 57 is cured and joined with the outer peripheral portion of the wheel 51 to which the adhesive is applied.

In step S20 of machining the guide groove on the outer circumferential surface of the guide ring, the wheel 51 to which the guide ring 57 is coupled is fixed to the fixing jig (not shown) Thereby forming a V-shaped groove for guiding.

At this time, in the embodiment of the present invention, the guide groove is formed on the outer peripheral surface of the guide ring after casting the guide ring 57 on the outer peripheral portion of the wheel 51, but the present invention is not limited thereto. can do.

However, in an embodiment of the present invention, when the guide groove 57 is formed on the outer circumferential surface of the guide ring 57 after the guide ring 57 is cast on the outer peripheral portion of the wheel 51, eccentricity due to the assembly tolerance can be prevented.

A pulley and a wire saw apparatus including the pulley according to an embodiment of the present invention include a guide ring to prevent wire twisting and to reduce weight, thereby reducing inertial force during operation, thereby reducing unnecessary wear.

Also, the pulley according to one embodiment of the present invention and the wire saw apparatus including the same can prevent detachment of the wire, thereby improving the quality of the wafer and reducing the defect rate.

According to an embodiment of the present invention, a pulley wheel and a guide ring are integrally formed to prevent a wire twisting phenomenon caused by bending of a wheel in a process of detaching and attaching a guide ring and a wheel.

According to the pulley manufacturing method according to another embodiment of the present invention, the wheel made of aluminum is prevented from being bent, so that the wire can move on a straight line.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: wire saw device 3: ingot
5: wire 7: guide roller
7a: first guide roller 7b: second guide roller
9: motor 10: ingot support
11: work plate 13: beam
20: supply part 21: supply bobbin
30: recovery unit 31: recovery bobbin
41: Coolant distributor 43: Coolant supplier
45: Coolant collecting part 45a: Receiving groove
50: pulley 50a: first tension pulley
50b: feed pulley 50c: second tension pulley
50d: Return pulley 51: Wheel
52: first through hole 54: second through hole
57: Guide ring 57a: Coupling groove
59: Guide groove

Claims (10)

A disc-shaped wheel;
And a guide ring having an engaging groove formed on an inner circumferential surface thereof and engaging with an outer circumferential portion of the wheel and having a guide groove for guiding the wire on an outer circumferential surface thereof,
Wherein the guide ring is integrally formed with the wheel by a molding method. The method according to claim 1,
Wherein the engaging groove is formed to correspond to an outer circumferential portion of the wheel so as to surround the outer circumferential portion of the wheel. 3. The method of claim 2,
Wherein the engaging groove has a U-shaped cross section. The method according to claim 1,
Wherein the guide groove has a V-shaped cross section. The method according to claim 1,
The wheel is formed with a first through hole at the center thereof,
And a plurality of second through holes are formed on the same circumference around the first through holes. The method according to claim 1,
The wheel is made of a metal material, and the guide ring is made of a resin material. A wire cutting the ingot;
A pair of guide rollers wound on the outer circumferential surface of the wire to move the wire; And
A wire saw apparatus comprising a pulley according to any one of claims 1 to 6 for guiding or recovering the wire with the pair of guide rollers. Applying an adhesive to an outer periphery of the wheel;
Coupling the wheel to a mold and casting a guide ring on an outer periphery of the wheel; And
And machining a guide groove on an outer peripheral surface of the guide ring. 9. The method of claim 8,
Further comprising the step of sanding the outer periphery of the wheel prior to applying the adhesive to the outer periphery of the wheel. 9. The method of claim 8,
And the step of machining the guide groove on the outer circumferential surface of the guide ring is to form the guide groove into a V-shape.
KR1020150059941A 2015-04-28 2015-04-28 Pulley, the manufacturing method thereof and wire saw apparatus having the same KR20160128112A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180072119A (en) * 2016-12-21 2018-06-29 안한배 Wire drum structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180072119A (en) * 2016-12-21 2018-06-29 안한배 Wire drum structure

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