CN111185414A - Integrated circuit copper plate dust collector - Google Patents
Integrated circuit copper plate dust collector Download PDFInfo
- Publication number
- CN111185414A CN111185414A CN201911399984.4A CN201911399984A CN111185414A CN 111185414 A CN111185414 A CN 111185414A CN 201911399984 A CN201911399984 A CN 201911399984A CN 111185414 A CN111185414 A CN 111185414A
- Authority
- CN
- China
- Prior art keywords
- roller
- copper plate
- integrated circuit
- ash
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000428 dust Substances 0.000 title claims abstract description 96
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound 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[Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 70
- 239000010949 copper Substances 0.000 title claims abstract description 70
- 238000007598 dipping method Methods 0.000 claims abstract description 37
- 239000000741 silica gel Substances 0.000 claims abstract description 16
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound 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- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Chemical compound 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- 238000005406 washing Methods 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 230000001680 brushing Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective Effects 0.000 description 1
- 230000000717 retained Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000001187 sodium carbonate Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 230000003068 static Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools, brushes, or analogous members
- B08B1/007—Cleaning by methods involving the use of tools, brushes, or analogous members having means to clean the cleaning members before, during or after use
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools, brushes, or analogous members
- B08B1/02—Cleaning travelling work, e.g. a web, articles on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Abstract
The invention relates to the technical field of circuit board processing, in particular to a dust removal device for an integrated circuit copper plate, which comprises a processing table, wherein a spiral ash removal roller made of silica gel is rotatably arranged above the processing table, the ash removal roller can be in contact with the copper plate, a spiral ash dipping roller which can be meshed with the ash removal roller is arranged above the ash removal roller, an adhesive layer is arranged on the surface of the ash dipping roller, and a material pushing mechanism for intermittently pushing the copper plate is arranged on the processing table. The invention can solve the problem that secondary dust is easy to generate in brush dust removal and wind dust removal in the prior art.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a dust removal device for an integrated circuit copper plate.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, can miniaturize and visualize the circuit, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.
The manufacture of the circuit board usually comprises cutting the copper foil substrate into a size suitable for processing, and before laminating the film on the substrate, roughening the copper foil on the surface of the substrate by brushing, microetching, etc. and then adhering the dry film photoresist thereon at a suitable temperature and pressure. The substrate with the dry film photoresist adhered thereon is sent into an ultraviolet exposure machine for exposure, the photoresist generates polymerization reaction after being irradiated by ultraviolet rays in the light transmission area of the negative film, and the circuit image on the negative film is transferred to the dry film photoresist on the surface of the plate. After the protective adhesive film on the film surface is torn off, the area which is not illuminated on the film surface is developed and removed by sodium carbonate aqueous solution, and then the exposed copper foil is corroded and removed by hydrochloric acid and hydrogen peroxide mixed solution to form a circuit. Finally, the dry film photoresist which is finished is washed and removed by sodium hydroxide aqueous solution.
In order to ensure the quality of the circuit board, the copper foil substrate (also called copper plate) needs to be dedusted in the processing process, and wind power dedusting and brush dedusting are mostly adopted in the prior art, so that secondary dust raising is easily generated. Electrostatic dust removal is also adopted, but the surface physical and chemical properties of the copper plate are easily influenced by static electricity.
Disclosure of Invention
The invention aims to provide a dust removal device for an integrated circuit copper plate, which aims to solve the problem that secondary dust is easily generated in brush dust removal and wind dust removal in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
integrated circuit copper dust collector, including the processing platform, processing bench top rotates and is provided with the spiral deashing roller that silica gel made, and the deashing roller can contact with the copper, and deashing roller top is provided with can be used for being stained with the ash roller with the spiral of deashing roller meshing, is stained with ash roller surface and sets up the viscose layer, is provided with the pushing equipment who is used for intermittent type to promote the copper on the processing platform.
The principle and the beneficial effect of the scheme are as follows:
the processing platform is used for placing the copper plate, and the pushing equipment is used for pushing the copper plate to move. The copper plate is placed on the processing table, the ash removal roller on the copper plate is in contact with the surface of the copper plate, the ash removal roller is driven to rotate, dust on the copper plate is adsorbed on the ash removal roller by means of friction between the ash removal roller and the copper plate, and therefore dust removal of the copper plate is achieved. The dust dipping roller is used for sticking away dust on the dust cleaning roller, and the dust is prevented from returning to the copper plate again.
This scheme adopts the deashing roller that silica gel was made to remove dust to the copper, and the soft characteristic of silica gel can not cause wearing and tearing to the copper surface, and silica gel belongs to neutral material, can not influence the physical and chemical properties of copper yet. The mode of utilizing silica gel adhesion dust can not cause the secondary raise dust, utilizes and is stained with the dust roller and clear away the dust on the deashing roller, can prevent that the dust from getting back to on the copper once more. In addition, set the deashing roller into the spiral, even there is the dust not adhesion on the deashing roller, also can be along the rotation of helical blade on the deashing roller to being promoted upwards, finally by the adhesion of the roller of being stained with ash of top, improve the dust removal effect of copper. And the ash cleaning roller and the ash dipping roller are arranged to be spiral, so that the meshing stability of the ash cleaning roller and the ash dipping roller can be improved, and the slipping is avoided. And finally, the dust is cleaned by the dust cleaning roller, and then the dust adhering roller is used for adhering the dust instead of directly adhering the dust on the copper plate by using the adhesive, so that the influence of the adhesive on the copper plate on the physical and chemical properties of the copper plate can be avoided.
Furthermore, the viscose layer is a viscose layer which can be used repeatedly, and one side of the dust dipping roller is provided with a cleaning mechanism for cleaning the dust dipping roller.
The cleaning mechanism is arranged to clean dust on the dust adhering roller in the machining process, so that the subsequent additional cleaning of the dust adhering roller is not needed, and the efficiency is high; and the dust adhering roller is cleaned in the machining process, so that the dust on the dust adhering roller can be prevented from returning to the dust cleaning roller again, and in addition, the dust on the dust adhering roller is cleaned in time, and the dust adhering roller can be ensured to have enough viscosity.
Furthermore, the adhesive layer is a washable adhesive layer, the cleaning mechanism comprises a cleaning box, water is contained in the cleaning box, a rolling brush capable of contacting with the ash dipping roller is arranged in the cleaning box in a rotating mode, and the rolling brush is connected with a driving mechanism for driving the rolling brush to contact with the water.
The driving mechanism is used for driving the rolling brush to be in contact with water, so that the rolling brush is cleaned, and dust on the rolling brush which is wetted with water can be brushed off when the rolling brush is in contact with the dust dipping roller, so that the dust dipping roller is cleaned.
Furthermore, the driving mechanism comprises a connecting rod connected with the rolling brush, the connecting rod is hinged on the cleaning box, the free end of the connecting rod extends out of the cleaning box, the connecting rod is connected with a power mechanism for driving the rolling brush to rotate to the water around a hinged point, and a return spring is connected between the connecting rod and the cleaning box.
The power mechanism drives the connecting rod to rotate around the hinged point, so that the rolling brush rotates into water around the hinged point, the rolling brush can rotate in the water to clean dust on the rolling brush, and the structure is simple.
Furthermore, the power mechanism comprises a cam, a top rod is propped against the upper part of the cam and is connected with the connecting rod.
The cam is used for upwards pushing the ejector rod, so that the free end of the connecting rod moves upwards, the rolling brush moves downwards into water, and the structure is simple.
Further, the brush hairs of the rolling brush are arranged in a spiral shape matched with the dust dipping roller.
The contact area of the brush hair and the dust dipping roller can be increased by the arrangement, so that the roller brush can be better contacted with the dust dipping roller, and the cleaning effect of the dust dipping roller is improved.
Furthermore, the rotating shaft of the dust dipping roller is eccentrically arranged.
So set up, can avoid being stained with the ash roller simultaneously with round brush and deashing roller contact, avoid from this when being stained with the ash roller and the round brush contact power transmission to the deashing roller on cause the influence to the copper.
Further, the pushing mechanism comprises a pushing plate, the pushing plate is connected with a rack, the rack is meshed with an incomplete gear, and the incomplete gear is coaxially connected with the cam.
When the incomplete gear is meshed with the rack, the pushing plate can be pushed to move, so that the copper plate is pushed to move, the contact position of the copper plate and the ash removal roller is changed, and the comprehensive dust removal of the surface of the copper plate is realized; the incomplete gear is coaxially connected with the cam, and the incomplete gear and the cam can be driven to rotate only by one power, so that power resources are saved.
Further, a plurality of feeding rollers are rotatably arranged on the processing table.
The copper can drive the feed roll and rotate when the processing bench moves, has converted the sliding friction between copper and the processing bench into the rolling friction between the feed roll from this, has reduced frictional force, can avoid the copper wearing and tearing.
Further, a silica gel sleeve is arranged on the feeding roller. The soft silica gel cover can further avoid the copper wearing and tearing.
Drawings
Fig. 1 is a schematic longitudinal structure diagram according to a first embodiment of the present invention.
Detailed Description
The following is further detailed by way of specific embodiments:
reference numerals in the drawings of the specification include: the device comprises a processing table 1, a copper plate 2, a dust cleaning roller 3, a mounting frame 4, a dust dipping roller 5, an opening 6, a rolling brush 7, a connecting rod 8, a cleaning box 9, a push rod 10, a material pushing plate 11, a cam 12, an incomplete gear 13 and a rack 14.
Example one
As shown in figure 1, the integrated circuit copper plate dust removal device comprises a rack, wherein a processing table 1 is horizontally arranged on the rack, mounting frames 4 are vertically welded on two sides of the processing table 1, and the two mounting frames 4 are symmetrically arranged by taking the axis of the processing table 1 in the length direction as a symmetrical center line. The mounting frame 4 is rotatably connected with a spiral ash removal roller 3, and the ash removal roller 3 is made of silica gel. The space between the bottom of the ash removing roller 3 and the processing platform 1 is a space for placing the copper plate 2, and after the copper plate 2 is placed, the ash removing roller 3 can be contacted with the copper plate 2. The spiral dust dipping roller 5 which can be meshed with the dust cleaning roller 3 is arranged above the dust cleaning roller 3, the dust dipping roller 5 is rotatably connected to the mounting frame 4, the surface of the dust dipping roller 5 is provided with an adhesive layer, and the rotating shaft of the dust dipping roller 5 is eccentrically arranged. The ash cleaning roller 3 and the ash dipping roller 5 are both connected with motors, and the motors are arranged on the rack. In this embodiment, the adhesive layer is made of a conventional washable traceless adhesive, for example, an adhesive used on a conventional washable hair sticking device (drying speed after washing is fast).
The cleaning mechanism for cleaning the dust dipping roller 5 is installed on the right side of the dust dipping roller 5 and comprises a cleaning box 9, and the cleaning box 9 is installed on the rack. The cleaning box 9 is rotatably provided with a rolling brush 7 which can be contacted with the ash dipping roller 5, the bristles of the rolling brush 7 are spirally arranged in cooperation with the ash dipping roller 5, and the bristles of the rolling brush 7 adopt the bristles of a washing brush in the prior art. An opening 6 for the rolling brush 7 to contact with the dust dipping roller 5 is arranged on the left side wall of the cleaning box 9. The cleaning box 9 is filled with water, and the water level is not too high, so that the water is prevented from being thrown out of the cleaning box 9 when the rolling brush 7 rotates in the water. The top of the cleaning box 9 is provided with a water inlet which is positioned above the rolling brush 7.
The rolling brush 7 is connected with a driving mechanism for driving the rolling brush 7 to be in contact with water, and the rolling brush 7 is rotatably arranged in the cleaning box 9 through the driving mechanism. Specifically, the driving mechanism comprises a connecting rod 8 which is rotatably connected to a shaft of the rolling brush 7, the connecting rod 8 is hinged to the right side wall of the cleaning box 9, the free end of the connecting rod 8 extends out of the cleaning box 9 and is connected with a power mechanism which drives the rolling brush 7 to rotate to the water around a hinged point, and a return spring is connected between the hinged point of the connecting rod 8 and the cleaning box 9. The round brush 7 is connected with the motor, and connecting rod 8 welds has the motor frame, and the motor is installed on the motor frame.
The power mechanism comprises a cam 12, the cam 12 is connected with a motor, a push rod 10 is propped against the upper part of the cam 12, and the push rod 10 is welded with the connecting rod 8. The processing table 1 is provided with a pushing mechanism for intermittently pushing the copper plate 2, the pushing mechanism comprises a pushing plate 11, a rack 14 is welded on the right side of the pushing plate 11, an incomplete gear 13 is meshed above the rack 14, and the incomplete gear 13 is coaxially connected with the cam 12.
The specific implementation process is as follows:
the copper plate 2 is flatly placed on the processing table 1, the surface to be dedusted is upward, and the left end of the copper plate 2 is contacted with the bottom of the ash cleaning roller 3. And starting a motor connected with the ash cleaning roller 3 and the ash dipping roller 5 to drive the two to rotate, and simultaneously starting a motor connected with the cam 12 to drive the cam 12 and the incomplete gear 13 to rotate.
The dusting roller 3 is capable of causing dust on the copper plate 2 to adhere thereto by friction when in contact with the copper plate 2, thereby effecting dusting of the copper plate 2. Because the ash dipping roller 5 is meshed with the ash cleaning roller 3, when the ash dipping roller 5 is contacted with the ash cleaning roller 3, the adhesive layer on the ash dipping roller 5 can stick away the dust on the ash cleaning roller 3, thereby realizing the cleaning of the ash cleaning roller 3 and avoiding the dust from returning to the copper plate 2 again. Dust which is not adhered to the dust cleaning roller 3 can also be lifted upwards along the spiral groove on the dust cleaning roller 3 and then adhered by the dust dipping roller 5, so that the dust removal effect is increased.
The dust removal roller 3 made of silica gel removes dust from the copper plate 2, the copper plate 2 is not worn by soft silica gel, and the silica gel is neutral, so that the physical and chemical properties of the copper plate 2 are not affected. The friction between the silica gel and the copper plate 2 is utilized to adsorb dust on the copper plate, so that dust can not be raised.
When the incomplete gear 13 is meshed with the rack 14, the rack 14 can be pushed to move leftwards, so that the copper plate 2 is pushed leftwards through the material pushing plate 11, the contact position of the copper plate 2 and the ash removing roller 3 is changed, and the surface of the copper plate 2 is comprehensively dedusted.
Meanwhile, the starting motor drives the rolling brush 7 to rotate, and water is manually sprayed on the rolling brush 7 in advance. When the dusting roller 5 rotates to contact with the rolling brush 7, the rolling brush 7 wetted with water can brush off dust on the dusting roller 5, thereby realizing cleaning of the dusting roller 5. Because the surface of the dust dipping roller 5 in the embodiment adopts the washable adhesive layer, the brush only wets water, and the redundant moisture of the brush in the rotating process can be thrown away, more moisture can not be retained on the dust dipping roller 5 after the dust dipping roller is cleaned, and dust can not be adhered to the adhesive layer again.
When the dust dipping roller 5 is separated from the rolling brush 7, the cam 12 can intermittently push the push rod 10 upwards, so that the right end of the connecting rod 8 is pushed upwards, the left end of the rolling brush 7 rotates downwards, and the rolling brush 7 is immersed in water. The rolling brush 7 rotates in the water, so that the rolling brush 7 can be cleaned, and dust on the rolling brush 7 is prevented from being adhered to the dust dipping roller 5 again.
Example two
The difference between this embodiment and the first embodiment is that a plurality of feed rollers (not shown in the figure) are rotatably mounted on the processing table 1, the surfaces of the feed rollers are flush, and each feed roller is sleeved with a silica gel sleeve. So set up, copper 2 when sliding on processing platform 1, can promote the feed roll and rotate to change the sliding friction between copper 2 and processing platform 1 into and the feed roll between rolling friction, reduced frictional force, can avoid copper 2 wearing and tearing.
The foregoing is merely an example of the present invention and common general knowledge of known specific structures and features of the embodiments is not described herein in any greater detail. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (10)
1. Integrated circuit copper dust collector, its characterized in that: including the processing platform, processing bench top rotates and is provided with the spiral deashing roller that silica gel made, and the deashing roller can contact with the copper, and the deashing roller top is provided with can be used for being stained with the ash roller with the spiral of deashing roller meshing, is stained with ash roller surface and sets up the viscose layer, and the processing bench is provided with the pushing equipment who is used for intermittent type to promote the copper.
2. The integrated circuit copper plate dust removal device of claim 1, characterized in that: the viscose layer is the viscose layer that can use repeatedly, is stained with ash roller one side and is provided with the clearance mechanism that is used for clearing up the ash stained with roller.
3. The integrated circuit copper plate dust removal device of claim 2, characterized in that: the viscose layer is the viscose layer that can wash, clearance mechanism is including the clearance case, and the splendid attire water in the clearance case, and the clearance incasement rotation is provided with can with be stained with the round brush of ash roller contact, and the round brush is connected with the actuating mechanism of drive round brush and water contact.
4. The integrated circuit copper plate dust removal device of claim 3, characterized in that: the driving mechanism comprises a connecting rod connected with the rolling brush, the connecting rod is hinged to the cleaning box, the free end of the connecting rod extends out of the cleaning box, the connecting rod is connected with a power mechanism for driving the rolling brush to rotate to the water around a hinged point, and a return spring is connected between the connecting rod and the cleaning box.
5. The integrated circuit copper plate dust removal device of claim 4, characterized in that: the power mechanism comprises a cam, a top rod is abutted to the upper side of the cam and connected with a connecting rod.
6. The integrated circuit copper plate dust removal device of claim 5, characterized in that: the brush hair of round brush is with being stained with ash roller complex heliciform setting.
7. The integrated circuit copper plate dust removal device of claim 6, characterized in that: and the rotating shaft of the dust dipping roller is eccentrically arranged.
8. The integrated circuit copper plate dust removal device according to any one of claims 5 to 7, wherein: the pushing mechanism comprises a pushing plate, the pushing plate is connected with a rack, the rack is meshed with an incomplete gear, and the incomplete gear is coaxially connected with the cam.
9. The integrated circuit copper plate dust removal device of claim 8, wherein: the processing table is rotatably provided with a plurality of feeding rollers.
10. The integrated circuit copper plate dust removal device of claim 9, wherein: and the feeding roller is provided with a silica gel sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911399984.4A CN111185414A (en) | 2019-12-30 | 2019-12-30 | Integrated circuit copper plate dust collector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911399984.4A CN111185414A (en) | 2019-12-30 | 2019-12-30 | Integrated circuit copper plate dust collector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111185414A true CN111185414A (en) | 2020-05-22 |
Family
ID=70684408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911399984.4A Pending CN111185414A (en) | 2019-12-30 | 2019-12-30 | Integrated circuit copper plate dust collector |
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| Country | Link |
|---|---|
| CN (1) | CN111185414A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112264249A (en) * | 2020-09-29 | 2021-01-26 | 桃江县德聚人和中小企业公共服务平台有限公司 | Glue storage type wood rubber plate gluing system |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200522 |
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| RJ01 | Rejection of invention patent application after publication |