CN214817691U - Polishing carrier disc cleaning and storing device - Google Patents
Polishing carrier disc cleaning and storing device Download PDFInfo
- Publication number
- CN214817691U CN214817691U CN202120402414.2U CN202120402414U CN214817691U CN 214817691 U CN214817691 U CN 214817691U CN 202120402414 U CN202120402414 U CN 202120402414U CN 214817691 U CN214817691 U CN 214817691U
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- Prior art keywords
- cleaning
- polishing
- dish
- bearing structure
- brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 104
- 238000005498 polishing Methods 0.000 title claims abstract description 85
- 238000003860 storage Methods 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 238000004851 dishwashing Methods 0.000 claims abstract description 5
- 239000007921 spray Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000003749 cleanliness Effects 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 239000008187 granular material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000000227 grinding Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120402414.2U CN214817691U (en) | 2021-02-23 | 2021-02-23 | Polishing carrier disc cleaning and storing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120402414.2U CN214817691U (en) | 2021-02-23 | 2021-02-23 | Polishing carrier disc cleaning and storing device |
Publications (1)
Publication Number | Publication Date |
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CN214817691U true CN214817691U (en) | 2021-11-23 |
Family
ID=78952755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202120402414.2U Active CN214817691U (en) | 2021-02-23 | 2021-02-23 | Polishing carrier disc cleaning and storing device |
Country Status (1)
Country | Link |
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CN (1) | CN214817691U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114274041A (en) * | 2021-12-24 | 2022-04-05 | 西安奕斯伟材料科技有限公司 | Double-side polishing apparatus and double-side polishing method |
-
2021
- 2021-02-23 CN CN202120402414.2U patent/CN214817691U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114274041A (en) * | 2021-12-24 | 2022-04-05 | 西安奕斯伟材料科技有限公司 | Double-side polishing apparatus and double-side polishing method |
CN114274041B (en) * | 2021-12-24 | 2023-03-14 | 西安奕斯伟材料科技有限公司 | Double-side polishing apparatus and double-side polishing method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220701 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |