CN219425200U - Automatic brushing device for sapphire substrate slice - Google Patents

Abstract

The application discloses automatic brushing device of sapphire substrate piece relates to wafer cleaning technical field, which comprises a frame, frame top fixed connection guide rail, the frame still includes: the carrier is fixed on the right side of the inner wall of the rack, can move up and down and is used for placing wafers; a drive device secured in the housing, the drive device further comprising: the brush roll, the brush roll has a plurality of groups, the brush roll still includes brush roll and sponge brush roll, the brush roll with sponge brush roll is parallel to each other and the interval sets up, the brush roll with sponge brush roll rotates along opposite direction, presss from both sides tight wafer through brush roll and sponge brush roll, and the full contact wafer surface of sponge brush roll, and wafer surface is brushed in rotation in-process brush roll and sponge brush roll rotation of wafer, and the problem that the wafer surface granule and the dirty attached granule of wafer surface can't drop completely and get rid of has fully been solved, and the cleanliness factor is unqualified is solved.

Description

Automatic brushing device for sapphire substrate slice

Technical Field

The application relates to the technical field of wafer cleaning, in particular to an automatic brushing device for a sapphire substrate slice.

Background

The sapphire crystal has unique machining characteristics, and can obtain a substrate wafer with ultra-precise nano-size precision by adopting the precise grinding and polishing technology of IC wafer machining, and the sapphire crystal has been widely applied to various fields such as scientific technology, national defense and civil industry, electronic technology and the like. The sapphire substrate slice is mainly produced by slicing, grinding, annealing, polishing, cleaning and the like, and cleaning operations are carried out in each working section to reduce dirt pollution in order to ensure the cleanliness of the surface of the wafer.

At present, cleaning agents are generally adopted for cleaning the polished sapphire, cleaning agents are prepared according to a certain concentration ratio, the cleaning agents are heated to 65-75 ℃, wafers are completely soaked in liquid medicine, ultrasonic waves are started, polishing is carried out for cleaning, and then pure water rinsing spraying is carried out for cleaning, wherein the cleaning process is influenced by ultrasonic intensity, particles attached to the surfaces of the wafers cannot be completely removed, and cleanliness is unqualified.

In view of the above, there is a need for an automatic brushing device for sapphire substrate sheets, which can remove particles on the wafer surface and improve the cleanliness.

Disclosure of Invention

The purpose of this application is to solve the unable complete drop of the attached granule of wafer surface and get rid of, the unqualified problem of cleanliness factor, for solving above-mentioned technical problem, provide a can get rid of wafer surface granule, promote the automatic brushing device of sapphire substrate piece of cleanliness factor.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme: an automatic brushing device for a sapphire substrate slice, comprising: frame, frame top fixed connection guide rail, frame still includes: the carrier is fixed on the right side of the inner wall of the frame, can move up and down and is used for placing wafers; the drive arrangement, drive arrangement fixes in the frame, and drive arrangement still includes: the brush rolls are provided with a plurality of groups, and also comprise brush rolls and sponge brush rolls, the brush rolls and the sponge brush rolls are parallel to each other and are arranged at intervals, and the brush rolls and the sponge brush rolls rotate in opposite directions; the bracket is fixedly arranged in the vertical direction below the brush roller; bearings are arranged at two ends of the brush roller, and the bearings are controlled by a motor to synchronously rotate with the brush roller; the spraying device is arranged right above the brush roller; and the manipulator is fixedly connected to the guide rail, the tail end of the manipulator is provided with a sucker, and the manipulator is used for taking and placing wafers.

Further, according to an embodiment of the application, the carrier further comprises a feeding carrier and a discharging carrier, and water tanks are respectively arranged below the feeding carrier and the discharging carrier.

Further, according to the embodiment of the application, rubber rings are arranged at the middle positions of the alignment brush rolls on the support.

Further, according to an embodiment of the application, wherein, drive arrangement still includes reservoir and aqua storage tank, and the reservoir is connected with spray set through circulating line, and the reservoir is used for placing the washing liquid.

Further, according to the embodiment of the application, wherein the water storage tank is connected with the spraying device through the circulating pipeline, the water pumping port is arranged on one side of the water storage tank, the water outlet is arranged at the bottom of the water storage tank, and the reflux port is arranged on one side of the water storage tank.

Further, according to an embodiment of the present application, the driving device further includes a baffle plate disposed at a bottom of the driving device, and the baffle plate may switch the discharge or recovery mode.

In order to achieve the above purpose, the embodiment of the present application further provides a method for using the automatic brushing device for the sapphire substrate slice, including the following steps: feeding, namely placing and fixing flower baskets containing wafers on a feeding carrier, placing and fixing empty flower baskets on a discharging carrier, automatically descending a manipulator after the number of the wafers is set, sucking the wafers from the flower baskets containing the wafers by using suction cups, ascending the wafers, moving the wafers to a driving device along a horizontal guide rail, descending the manipulator, placing the wafers between a brush roller and a sponge brush roller, loosening the wafers, and ascending and moving the wafers out; brushing, combining the brush roller and the sponge brush roller to clamp the wafer, enabling the wafer to stand on the rubber ring of the lower support, synchronously rotating the brush roller and the support, pumping the cleaning liquid in the liquid storage tank to spray on the surface of the wafer, and rotating the brush roller to brush the surface of the wafer in the wafer rotation process; washing, namely after washing with a cleaning solution, carrying out dry brushing, namely stopping spraying liquid, so that the surface of the wafer is washed without water, and after washing, carrying out clear water washing, spraying pure water from a clear water pipeline to the surface of the wafer, so as to remove the residual cleaning agent on the wafer; and discharging, namely moving the manipulator to a driving device after the wafer is scrubbed, descending and sucking the wafer, separating the brush roller from the sponge brush roller, lifting the manipulator, moving the manipulator to the upper part of a discharging carrier along a horizontal guide rail, inserting the wafer into a basket after the vacuum is broken, lifting the wafer, descending the discharging carrier, immersing the wafer in water, and placing the wafer on the surface for drying.

Further, according to the embodiment of the application, the manipulator moves along the vertical guide rail during the ascending and descending process, so that collision with other components is prevented.

Further, according to the embodiment of the application, when the cleaning liquid is used for brushing, the baffle at the bottom of the driving device is closed to be in a recovery state, so that the cleaning liquid can be recovered into the water storage tank.

Further, according to the embodiment of the application, when the clean water is scrubbed, the baffle at the bottom is opened to be in a discharge state, and the wastewater produced in the section is directly discharged.

Compared with the prior art, the wafer is clamped through the brush roller and the sponge brush roller, the sponge brush roller fully contacts the surface of the wafer, the brush roller and the sponge brush roller rotate and brush the surface of the wafer in the wafer rotation process, particles on the surface of the wafer are fully removed, the particles attached to the surface of the wafer are fully removed, the problem that the cleanliness is unqualified is solved, the particles on the surface of the wafer can be removed, and the cleanliness is improved.

Drawings

The present application is further described below with reference to the drawings and examples.

Fig. 1 is a schematic sectional view of an automatic brushing device for a sapphire substrate sheet according to embodiment 1 of the present application.

Fig. 2 is a schematic diagram of a driving device of an automatic brushing device for a sapphire substrate slice according to embodiment 1 of the present application.

Fig. 3 is a schematic view of a driving device water storage tank of an automatic brushing device for a sapphire substrate slice according to embodiment 2 of the present application.

Fig. 4 is a schematic view of a stage of an automatic brushing device for a sapphire substrate sheet according to embodiment 2 of the present application.

Fig. 5 is a schematic diagram of a manipulator of an automatic brushing device for a sapphire substrate slice according to embodiment 2 of the present application.

In the accompanying drawings

1. Frame 2, guide rail 10 and carrying platform

101. Feeding stage 102, discharging stage 103 and water tank

11. Drive 110, brush roll 1101, and brush roll

1102. Sponge brush roller 111, bracket 112 and bearing

113. Spray device 114, rubber ring 115 and liquid storage tank

1151. Water pumping port 116, water storage tank 1161 and water outlet

1162. Return port 117, baffle 12, manipulator

121. Suction cup 1163, filter screen 104 and vibration tank

122. Bump block

Detailed Description

In order to make the objects, technical solutions, and advantages of the present utility model more apparent, the embodiments of the present utility model will be further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are some, but not all, embodiments of the present utility model, are intended to be illustrative only and not limiting of the embodiments of the present utility model, and that all other embodiments obtained by persons of ordinary skill in the art without making any inventive effort are within the scope of the present utility model.

In the description of the present utility model, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," "horizontal," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "a," an, "" the first, "" the second, "" the third, "" the fourth, "" the fifth, "and the sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

For purposes of brevity and description, the principles of the embodiments are described primarily by reference to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one of ordinary skill in the art that the embodiments may be practiced without limitation to these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.

Example 1:

according to fig. 1 and 2, the present embodiment provides an automatic brushing device for a sapphire substrate slice, including: frame 1, frame 1 top fixed connection guide rail 2, frame 1 still includes: the carrier 10, the carrier 10 is fixed on the right side of the inner wall of the frame 1, the carrier 10 can move up and down, the carrier 10 is used for placing wafers; the driving device 11, the driving device 11 is fixed in the frame 1, the driving device 11 further includes: the brush roll 110, the brush roll 110 has several groups, the brush roll 110 also includes the brush roll 1101 and sponge brush roll 1102, the brush roll 1101 and sponge brush roll 1102 are parallel and interval to set up each other, the brush roll 1101 and sponge brush roll 1102 rotate in the opposite direction; a bracket 111, the bracket 111 being fixedly disposed in a vertical direction below the brush roller 110; bearings 112, the bearings 112 being disposed at both ends of the brush roller 110, the bearings 112 being rotated synchronously with the brush roller 110 by motor control; the spraying device 113, the spraying device 113 is set up over the brush roll 110; and the manipulator 12 is fixedly connected to the guide rail 2, a sucker 121 is arranged at the tail end of the manipulator 12, and the manipulator 12 is used for taking and placing wafers.

The brush roller 1101 and the sponge brush roller 1102 clamp the wafer, the sponge brush roller 1102 fully contacts the surface of the wafer, particles and dirt on the surface of the wafer are fully removed, and the effects of removing the particles on the surface of the wafer and improving the cleanliness are achieved.

Further, as shown in fig. 1, the carrier 10 further includes a feeding carrier 101 and a discharging carrier 102, a water tank 103 is disposed below the feeding carrier 101 and the discharging carrier, respectively, the feeding carrier 101 and the discharging carrier 102 are mainly used for placing a flower basket, a flower basket containing a wafer is placed on the feeding carrier 101, an empty flower basket is placed on the discharging carrier 102, the flower basket can be replaced by any containing material, after the wafer is cleaned by cleaning liquid, impurities are dissolved in the water or residues of the cleaning liquid, and the impurities dissolved in the liquid can remain on the surface of the wafer, so that the cleaning effect is reduced, the water tank 103 is arranged to enable the wafer to be lifted after being soaked in the water, so that particles on the surface of the wafer can be primarily removed, and the cleanliness is improved.

Further, as shown in fig. 2, rubber rings 114 are disposed at the middle positions of the alignment brush roller 110 on the support 111, and the rubber rings 114 are installed, so that the wafer can rotate during brushing, the brush roller 110 can brush different positions of the wafer, the wafer surface is ensured to be completely cleaned without dead angles, particles on the wafer surface can be removed, and the cleanliness is improved.

Further, as shown in fig. 2, the driving device 11 further includes a liquid storage tank 115 and a water storage tank 116, the liquid storage tank 115 is connected with the spraying device 113 through a circulation pipeline, the liquid storage tank 115 is used for placing cleaning liquid, and particles on the surface of the wafer can be removed by brushing the cleaning liquid.

Further, as shown in fig. 2, the water storage tank 116 is connected with the spraying device through a circulating pipeline, a water pumping port 1151 is arranged on one side of the water storage tank 115, a water outlet 1161 is arranged at the bottom of the water storage tank 116, and a backflow port 1162 is arranged on one side of the water storage tank 116.

Further, as shown in fig. 2, the driving device 11 further includes a baffle 117, the baffle 117 is disposed at the bottom of the driving device 11, the baffle 117 can switch the discharging or recovering mode, and the discharging/recovering state is automatically switched by the baffle 117, so as to avoid diluting the medicament.

The embodiment also provides a using method of the automatic brushing device for the sapphire substrate slice, which comprises the following steps:

feeding, namely placing and fixing flower baskets containing wafers on a feeding carrier 101, placing and fixing empty flower baskets on a discharging carrier 102, automatically descending a manipulator 12 after the number of the wafers is set, sucking the wafers from the flower baskets containing the wafers by using suction cups 121, ascending the wafers, moving the wafers to a driving device 11 along a horizontal guide rail, descending the manipulator 12 to place the wafers between a brush roller 1101 and a sponge brush roller 1102, loosening the wafers, and ascending and moving the wafers out;

brushing, wherein the brush roller 1101 and the sponge brush roller 1102 are combined to clamp the wafer, so that the wafer is erected on the rubber ring 114 of the lower bracket, the brush roller 110 and the bracket 111 synchronously rotate, the cleaning liquid in the liquid storage tank 115 is pumped to be sprayed on the surface of the wafer, and the brush roller 110 rotates to brush the surface of the wafer in the process of rotating the wafer;

washing, namely after washing with a cleaning solution, carrying out dry brushing, namely stopping spraying liquid, so that the surface of the wafer is washed without water, and after washing, carrying out clear water washing, spraying pure water from a clear water pipeline to the surface of the wafer, so as to remove the residual cleaning agent on the wafer;

and discharging, namely moving the manipulator 12 to the driving device 11 after the wafer is scrubbed, descending and sucking the wafer, separating the brush roller 1101 from the sponge brush roller 1102, lifting the manipulator 12, moving the manipulator to the upper part of the discharging carrier 102 along the horizontal guide rail, descending the manipulator to insert the wafer into the basket, lifting the manipulator after breaking vacuum, descending the discharging carrier 102, immersing the manipulator in water, and then placing the manipulator on the surface for drying.

The robot 12 is stopped after completing all wafers in the feeding basket in sequence, and can operate circularly after taking away the empty basket and the discharged wafers on the feeding carrier 101.

The manipulator 12 moves along the vertical guide rail in the ascending and descending processes, mainly for preventing the manipulator 12 from colliding with other components, and the manipulator 12 is used for automatically taking and placing wafers, so that labor is reduced, and the working efficiency is improved.

The brush roller 1101 and the sponge brush roller 1102 are combined to clamp the wafer, the wafer is erected on the rubber ring 114 of the lower support, the brush roller 110 and the support 111 synchronously rotate, the cleaning liquid in the liquid storage tank 115 is pumped to be sprayed on the surface of the wafer, the brush roller 110 rotates to brush the surface of the wafer in the wafer rotation process, in the process, the brush roller 1101 and the sponge brush roller 1102 clamp the wafer, the sponge brush roller 1102 fully contacts the surface of the wafer, particles and dirt on the surface of the wafer are fully removed, the rubber ring 114 is arranged on the lower support, the wafer can rotate in the brushing process, the wafer surface is ensured to be completely cleaned without dead angles, the particles on the surface of the wafer are fully removed, the cleanliness is improved, and the particles on the surface of the wafer can be ensured to be completely removed through multiple brushing and washing processes.

When the cleaning liquid is used for brushing, the baffle 117 at the bottom of the driving device 11 is closed to be in a recovery state, the cleaning liquid can be recovered into the water storage tank 116, and when the cleaning liquid is used for brushing, the baffle 117 at the bottom is opened to be in a discharge state, so that the waste water produced by the section is directly discharged, the operation enables the cleaning liquid to be recycled, the medicament waste is reduced, the production cost is reduced, and the discharge/recovery state of the baffle can be automatically switched, so that the medicament dilution is avoided.

In this embodiment, the wafer is placed in the water tank 103 to primarily remove impurities on the surface of the wafer, the wafer is sucked by the suction disc 121 of the manipulator 12 and then moved to the driving device 11 by the horizontal guide rail, then the wafer brush roller 1101 and the sponge brush roller 1102 are combined and clamped between the wafer brush roller 1101 and the sponge brush roller 1102, the wafer is erected on the rubber ring 114 of the lower bracket, the rubber ring 114 can enable the wafer to rotate during brushing, the brush roller 1101 and the sponge brush roller 1102 fully contact the surface of the wafer, the wafer surface is ensured to be completely cleaned without dead angle, particles on the surface of the wafer are sufficiently removed, cleanliness is improved, the brush roller 110 and the bracket 111 synchronously rotate and are brushed by using cleaning liquid, after brushing by using the cleaning liquid, dry brushing is performed, the surface of the wafer is enabled to be cleaned by water, pure water is sprayed on the surface of the wafer from the clean water pipeline after brushing, the processes of brushing and flushing are performed for a plurality of times, the wafer surface is ensured to be free of impurities, and the effect of fully removing particles on the surface of the wafer is achieved, and cleanliness is improved.

Example 2:

as shown in fig. 3, a filter screen 1163 is disposed at a backflow port 1162 of the water storage tank 116, cleaning solution after cleaning the wafer is recovered to the water storage tank 116, and surface particles and dust in the cleaning solution can be filtered out by matching with the use of the filter screen 1163, so that the cleaning solution is circularly filtered for use, the medicament waste is reduced, the production cost is reduced, and when the filtered cleaning solution is reused, particle dust cannot be doped in the cleaning solution, so that the particles on the surface of the wafer can be removed more effectively in cleaning, and the effect of improving the cleanliness is achieved.

As shown in fig. 4, a vibration groove 104 is arranged in a feeding carrier 101 and a discharging carrier 102, a basket filled with wafers is placed in the vibration groove 104, before cleaning with a cleaning liquid, the vibration groove 104 excites sound wave fluctuation, water flow is affected by the sound wave fluctuation, generated microbubbles can keep vibrating under the action of the sound wave to scrub the surfaces of the wafers, partial particles on the surfaces of the wafers are removed, and then subsequent scrubbing and washing work is performed, so that the effects that the wafers can be cleaned more cleanly, the particles on the surfaces are completely removed, and the cleanliness is improved are achieved.

As shown in fig. 5, when the brush roller 1101 cleans a wafer, certain particle impurities may remain in the brush hair, scratches may remain on the surface of the wafer during the rotation process, and particle impurities on the surface of the wafer cannot be effectively removed during the secondary brushing, so that the bump 122 is arranged on the surface of the manipulator 12, when the sucker 121 sucks the wafer to rise, the bump 122 on the surface of the manipulator 12 makes reverse contact with the brush roller 1101, so that the particle impurities remained in the brush roller 1101 are removed, the cleaning of the particle impurities in the brush roller 1101 is facilitated, and the clean brush roller 1101 can completely remove the particles on the surface of the wafer during the subsequent brushing and flushing work, thereby achieving the effect of improving the cleanliness.

While the foregoing has been described in terms of illustrative embodiments thereof, so that those skilled in the art may appreciate the present application, it is not intended to be limited to the precise embodiments so that others skilled in the art may readily utilize the present application to its various modifications and variations which are within the spirit and scope of the present application as defined and determined by the appended claims.

Claims (6)

1. An automatic brushing device for a sapphire substrate slice, which is characterized by comprising:

the frame, frame top fixed connection guide rail, the frame still includes:

the carrier is fixed on the right side of the inner wall of the rack, can move up and down and is used for placing wafers;

a drive device secured in the housing, the drive device further comprising:

the brush rolls are provided with a plurality of groups, and also comprise brush rolls and sponge brush rolls, wherein the brush rolls and the sponge brush rolls are parallel to each other and are arranged at intervals, and the brush rolls and the sponge brush rolls rotate in opposite directions;

the bracket is fixedly arranged in the vertical direction below the brush roller;

the bearings are arranged at two ends of the brush roller and synchronously rotate with the brush roller under the control of a motor;

the spraying device is arranged right above the brush roller;

the manipulator is fixedly connected to the guide rail, a sucker is arranged at the tail end of the manipulator, and the manipulator is used for taking and placing wafers.

2. The automatic brushing device for the sapphire substrate sheets according to claim 1, wherein the carrying platform further comprises a feeding carrying platform and a discharging carrying platform, and water tanks are respectively arranged below the feeding carrying platform and the discharging carrying platform.

3. The automatic brushing device for the sapphire substrate sheets according to claim 1, wherein rubber rings are arranged on the support in alignment with the middle positions of the brush rolls.

4. The automatic brushing device for the sapphire substrate sheets according to claim 1, wherein the driving device further comprises a liquid storage tank and a water storage tank, the liquid storage tank is connected with the spraying device through a circulating pipeline, and the liquid storage tank is used for placing cleaning liquid.

5. The automatic brushing device for the sapphire substrate sheets according to claim 4, wherein the water storage tank is connected with the spraying device through a circulating pipeline, a water suction port is arranged on one side of the water storage tank, a water outlet is arranged at the bottom of the water storage tank, and a return port is arranged on one side of the water storage tank.

6. The automatic brushing device for the sapphire substrate sheet of claim 1, wherein the driving device further comprises a baffle plate, the baffle plate is arranged at the bottom of the driving device, and the baffle plate can switch the discharging or recycling modes.