CN211163353U

CN211163353U - Wafer grinding device with cleaning function

Info

Publication number: CN211163353U
Application number: CN201921762462.1U
Authority: CN
Inventors: 陆孙华
Original assignee: Inbest Micro Electronic Suzhou Co ltd
Current assignee: Inbest Micro Electronic Suzhou Co ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-08-04
Anticipated expiration: 2029-10-21

Abstract

The utility model discloses a wafer grinding device with cleaning function, including the roof, the funnel dish, the linking stop, water tank shell and water spray, the roof passes through the flexible post of second and third bracing piece fixed connection, third bracing piece and water tank shell fixed connection, water tank shell and linking stop fixed connection, the right side of water filter in the inner chamber of water tank shell is the water purification chamber, the immersible pump has been placed in the water purification chamber, the immersible pump communicates with being connected the water pipe base each other through first water pipe, it communicates with water spray each other through first water pipe and water spray to connect the water pipe base, linking stop passes through first bracing piece and funnel dish fixed connection. The utility model provides a can only process the grinding to single wafer to and often there is the deviation dislocation when placing the wafer, and then lead to the suction plate can not firmly inhale tightly with the wafer, the wafer throws easily when grinding and flies, and traditional wafer grinding device can only carry out simple washing simultaneously, can not effectually carry out abluent problem to the wafer surface.

Description

Wafer grinding device with cleaning function

Technical Field

The utility model relates to a wafer processing technology field specifically is a wafer grinding device with cleaning function.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular, various circuit element structures can be manufactured on the silicon wafer, and further an integrated circuit product with a specific electric function can be manufactured, the original material of the wafer is silicon, the surface of a ground shell is provided with a large amount of silicon dioxide, silicon dioxide ore is refined through an electric arc furnace, chloridized by hydrochloric acid, and distilled to manufacture high-purity polycrystalline silicon, then the polycrystalline silicon is melted to be pulled out of a monocrystalline silicon crystal rod, and then the monocrystalline silicon crystal rod is cut into a thin wafer, when the integrated circuit is manufactured, the wafer is required to be thinned on the back surface in order to reduce the thermal resistance of a device, improve the working heat dissipation and cooling capacity and be convenient to package, when the integrated circuit is manufactured on the front surface of the silicon wafer, the existing wafer grinding equipment only can process and, the wafer grinding device has the advantages that the wafer grinding device is low in efficiency, time and labor are wasted, deviation and dislocation often exist when wafers are placed on the conventional wafer grinding device, then the suction plate cannot firmly suck the wafers tightly, the wafers are easily thrown away during grinding, a large number of wafers are wasted due to damage of the device, even casualties occur, the conventional wafer grinding device can only be simply washed, the surface of the wafers cannot be effectively cleaned, and therefore the defects of the prior art need to be improved, and the problems are solved.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

An object of the utility model is to provide a wafer grinding device with cleaning function to solve the problem that proposes among the above-mentioned background art.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a wafer grinding device with a cleaning function comprises a top plate, a funnel disc, a connecting baffle plate, a water tank shell and a water spraying piece, wherein the lower portion of the top plate is fixedly connected with the top of a third supporting rod through a second telescopic column, the bottom of the third supporting rod is fixedly connected with the outer wall of the bottom of the water tank shell, the upper portion of the water tank shell is fixedly connected with the bottom of the connecting baffle plate, a water filtering piece is arranged in an inner cavity of the water tank shell, the left side of the water filtering piece in the inner cavity of the water tank shell is fixedly connected with the inner wall of the water tank shell, a water purifying cavity is formed in the right side of the water filtering piece in the inner cavity of the water tank shell, a sewage cavity is formed in the left side of the water filtering piece in the inner cavity of the water tank shell, a submersible pump is placed in the water purifying cavity, the submersible pump is mutually communicated with the lower portion of the connecting water pipe base through a first water pipe, the connecting, connecting baffle's upper portion is through first bracing piece and funnel dish fixed connection, first connecting rod and first connecting piece fixed connection are passed through to the lower part of roof, the top fixed connection of the second gear that sets up in the first connecting piece and first connecting post, the one end fixed connection of first connecting post and second connecting rod, the other end and the brushless motor fixed connection of second connecting rod, brushless motor is three, it is three respectively fixedly connected with polishing emery wheel, coarse sand emery wheel and fine sand emery wheel on brushless motor's the output shaft.

Preferably, a first gear, a second gear and a bearing are arranged in the first connecting piece, a speed reduction motor is fixedly connected to the lower portion of the top plate, an output shaft of the speed reduction motor is fixedly connected with the first gear, the first gear is meshed with the second gear, the bearing is fixedly connected with the first connecting piece, and the first connecting column is sleeved with the bearing.

Preferably, the outer wall of the water tank shell is fixedly connected with a switch, a diaphragm pump and an observation window, the diaphragm pump is communicated with a sewage cavity in the water tank shell, and a water outlet pipe of the diaphragm pump is fixedly connected with a valve.

Preferably, the upper part of the connecting baffle is fixedly connected with a water baffle, the upper part of the connecting baffle is fixedly connected with a vacuum pump, the vacuum pump is communicated with the connecting air pipe piece through a first air pipe, and the connecting air pipe piece is fixedly connected with the suction plate.

Preferably, the suction plate is in telescopic connection with the connecting baffle through a first telescopic column, the suction plate is fixedly connected with the upper portion of the first telescopic column, the lower portion of the first telescopic column is fixedly connected with the connecting baffle, a suction hole is formed in the suction plate, and a water leakage port is formed in the connecting baffle.

Preferably, the connecting baffle is fixedly connected with the supporting plate through a second supporting rod, the supporting plate is fixedly connected with a connecting clamp plate, and the connecting clamp plate is rotatably connected with the water spraying piece through a rotating shaft.

Preferably, the water spraying piece comprises a connecting rotating shaft, a nozzle, an elastic ball, an adjusting hand lever, a second water pipe and a water spraying shell, the inner wall of the water spraying shell is communicated with the nozzle through the second water pipe, the nozzle is rotatably connected with the water spraying shell through the connecting rotating shaft, the water spraying shell is in threaded connection with the adjusting hand lever, and the elastic ball is fixedly connected to the top end of the adjusting hand lever.

(III) advantageous effects

Compared with the prior art, the beneficial effects of the utility model are that: the utility model is provided with three brushless motors, a coarse sand grinding wheel, a fine sand grinding wheel and a polishing grinding wheel are respectively arranged on the brushless motors, thereby the utility model can simultaneously carry out coarse grinding, fine grinding and polishing on three wafers, greatly quickens the grinding efficiency, saves a large amount of personnel expenses, simultaneously smooths the wafers to the suction plate through the funnel disk to align, ensures the accuracy of the wafers on the suction plate, further solves the problem that the wafers are not tightly sucked by the suction plate and are thrown away when being ground, prolongs the service life of the equipment, reduces the rejection rate of wafer processing, simultaneously avoids the casualties caused by throwing away the wafers, simultaneously carries out up-and-down swing through the nozzle in the water spraying piece, leads the polysilicon particles ground on the surfaces of the wafers to be thoroughly washed away, the wafers can not have polysilicon particles remained on the surfaces of the wafers when being polished, ensure that the wafer can not be by the polycrystalline silicon granule fish tail when polishing, reduced the disability rate of wafer, the piece that strains water can filter the polycrystalline silicon granule that contains in the washing liquid in the sewage chamber, makes the polycrystalline silicon granule that contains in the washing liquid in the sewage chamber obtain deposiing, then discharges the polycrystalline silicon granule that deposits into the recycling bin through the diaphragm pump and retrieves, practices thrift the material cost of polycrystalline silicon to cyclic utilization also greatly reduced the pollution to the environment.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the present invention;

FIG. 3 is a top view of the connecting baffle of the present invention;

FIG. 4 is a schematic view of the water spraying member of FIG. 1 according to the present invention;

fig. 5 is a schematic view of the internal structure of the first connecting member of fig. 2 according to the present invention;

fig. 6 is a top view of the brushless motor of fig. 2 according to the present invention.

The reference numbers in the figures are: 1. a top plate; 2. a reduction motor; 3. a funnel tray; 4. a first telescopic column; 5. A vacuum pump; 6. connecting a baffle plate; 7. connecting the water pipe base; 8. a water filtering member; 9. a first water pipe; 10. a water tank housing; 11. a submersible pump; 12. a water purifying cavity; 13. a sewage chamber; 14. a water leakage port; 15. connecting a gas pipe fitting; 16. a first support bar; 17. a second support bar; 18. a support plate; 19. connecting the clamping plates; 20. A water spraying member; 21. sucking a plate; 22. a first connecting rod; 23. a brushless motor; 24. polishing the grinding wheel; 25. A coarse sand grinding wheel; 26. a water baffle; 27. a switch; 28. a valve; 29. a diaphragm pump; 30. a third support bar; 31. a second telescopic column; 32. a fine sand grinding wheel; 33. a first connecting member; 34. sucking holes; 35. a first air pipe; 36. connecting the rotating shaft; 37. a nozzle; 38. a resilient ball; 39. adjusting the hand lever; 40. a second water pipe; 42. a water spray housing; 43. a first gear; 44. a second gear; 45. a first connecting column; 46. A bearing; 47. a second connecting rod; 48. and (4) an observation window.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, an embodiment of the present invention is shown; a wafer grinding device with a cleaning function comprises a top plate 1, a funnel disc 3, a connecting baffle plate 6, a water tank shell 10 and a water spraying piece 20, wherein the lower portion of the top plate 1 is fixedly connected with the top of a third supporting rod 30 through a second telescopic column 31, the second telescopic column 31 can reciprocate the top plate 1 up and down, and further drives a plurality of parts arranged on the lower portion of the top plate 1 through the top plate 1, the bottom of the third supporting rod 30 is fixedly connected with the outer wall of the bottom of the water tank shell 10, the third supporting rod 30 is a connecting part between the water tank shell 10 and the second telescopic column 31, the upper portion of the water tank shell 10 is fixedly connected with the bottom of the connecting baffle plate 6, cleaning liquid is stored in an inner cavity of the water tank shell 10, a water filtering piece 8 is arranged in the inner cavity of the water tank shell 10, the used cleaning liquid in a sewage cavity 13 can be filtered by the water filtering piece 8, the left side and the right, the right side of the water filtering part 8 in the inner cavity of the water tank shell 10 is a water purifying cavity 12, the water purifying cavity 12 is used for storing cleaning liquid filtered by a filtering part, the left side of the water filtering part 8 in the inner cavity of the water tank shell 10 is a sewage cavity 13, the sewage cavity 13 is used for storing the cleaning liquid without being filtered, a submersible pump 11 is placed in the water purifying cavity 12, the submersible pump 11 can convey the cleaning liquid in the water purifier to the water spraying part 20, the submersible pump 11 is communicated with the lower part of the connecting water pipe base 7 through a first water pipe 9, the first water pipe 9 is a connecting part between the connecting water pipe base 7 and the submersible pump 11, the connecting water pipe base 7 is fixedly connected with the connecting baffle 6, the connecting water pipe base 7 can convey the cleaning liquid conveyed by the submersible pump 11 to the three water spraying parts 20 respectively, the upper part of the connecting water pipe base 7 is communicated with the water spraying parts 20 through the first water pipe 9, the upper portion of the connecting baffle 6 is fixedly connected with the funnel disc 3 through the first support rod 16, the funnel disc 3 can adjust the wafer, and further the wafer is aligned with the suction plate 21, the lower portion of the top plate 1 is fixedly connected with the first connecting piece 33 through the first connecting rod 22, the first connecting piece 33 is a connecting part between the speed reduction motor 2 and the first connecting post 45, the second gear 44 arranged in the first connecting piece 33 is fixedly connected with the top end of the first connecting post 45, the second gear 44 can drive the first connecting post 45 to rotate when the first gear 43 rotates, the first connecting post 45 is fixedly connected with one end of the second connecting rod 47, the first connecting post 45 can drive the second connecting rod 47 to rotate, the other end of the second connecting rod 47 is fixedly connected with the brushless motor 23, the second connecting rod 47 can drive the brushless motor 23 to rotate, the brushless motors 23 are three, and the three brushless motors 23 can simultaneously perform coarse grinding, Fine grinding and polishing, wherein the output shafts of the three brushless motors 23 are fixedly connected with a polishing grinding wheel 24, a coarse sand grinding wheel 25 and a fine sand grinding wheel 32 respectively, the polishing grinding wheel 24 can be used for polishing, the coarse sand grinding wheel 25 can be used for coarse grinding, and the fine sand grinding wheel 32 can be used for fine grinding.

Further, be provided with first gear 43 in the first connecting piece 33, second gear 44 and bearing 46, the lower part fixedly connected with gear motor 2 of roof 1, gear motor 2 can drive first gear 43 and rotate, gear motor 2's output shaft and first gear 43 fixed connection, first gear 43 is connected with the meshing of second gear 44, first gear 43 can drive second gear 44 and rotate, bearing 46 and first connecting piece 33 fixed connection, bearing 46 sets up the bottom at first connecting piece 33, first connector 45 is connected with bearing 46 registrate, first connector 45 can be under the effect of bearing 46 more smooth rotation.

Further, fixedly connected with switch 27, diaphragm pump 29 and observation window 48 on the outer wall of water tank shell 10, switch 27, diaphragm pump 29 and observation window 48 all are located the front of water tank shell 10 outer wall, and diaphragm pump 29 is located switch 27 left side below, and observation window 48 is located the left side of diaphragm pump 29, and switch 27 is steerable the utility model provides an electrical components starts or closes, and observation window 48 can convenient to use person observes the washing liquid after using in the sewage chamber 13 in water tank shell 10, and diaphragm pump 29 communicates with sewage chamber 13 in the water tank shell 10 each other, and 29 diaphragm pump can be with the impurity suction of sedimentation in the sewage chamber 13, fixedly connected with valve 28 on 29's the outlet pipe, and valve 28 can control diaphragm pump 29's outlet pipe.

Further, the upper portion fixedly connected with breakwater 26 of connection baffle 6, breakwater 26 can intercept the washing liquid that water spray 20 splashes everywhere when washing the wafer, the upper portion fixedly connected with vacuum pump 5 of connection baffle 6, vacuum pump 5 can produce suction, vacuum pump 5 communicates each other with connecting air pipe 15 through first trachea 35, first trachea 35 and trachea connecting piece are the intercommunication part between vacuum pump 5 and the suction disc 21, connecting air pipe 15 and suction disc 21 fixed connection, suction disc 21 can bear the wafer.

Further, the suction plate 21 is connected with the connecting baffle 6 in a telescopic manner through the first telescopic column 4, the first telescopic column 4 can drive the suction plate 21 to reciprocate up and down, the upper portion fixed connection of the suction plate 21 and the first telescopic column 4, the plunger fixed connection of the suction plate 21 and the first telescopic column 4, the lower portion of the first telescopic column 4 is connected with the connecting baffle 6 in a fixed manner, the base shell of the first telescopic column 4 is connected with the connecting baffle 6 in a fixed manner, the suction plate 21 is provided with a suction hole 34, the vacuum pump 5 can adsorb and fix the wafer through the suction hole 34 arranged on the suction plate 21, the connecting baffle 6 is provided with a water leakage port 14, and the cleaning liquid on the connecting baffle 6 can flow into the sewage cavity 13 through the water leakage port 14.

Further, the connecting baffle 6 is fixedly connected with the supporting plate 18 through a second supporting rod 17, the second supporting rod 17 is a connecting part between the supporting plate 18 and the connecting baffle 6, the supporting plate 18 is fixedly connected with a connecting clamp plate 19, the supporting plate 18 is a carrier of the connecting clamp plate 19, the connecting clamp plate 19 is rotatably connected with a water spraying piece 20 through a rotating shaft, a locking knob is arranged on one side of the connecting clamp plate 19, and the locking knob can be used for locking after the water spraying piece 20 is adjusted to a proper angle.

Further, the water spraying part 20 comprises a connecting rotating shaft 36, a nozzle 37, an elastic ball 38, an adjusting handle bar 39, a second water pipe 40 and a water spraying shell 42, the inner wall of the water spraying shell 42 is communicated with the nozzle 37 through the second water pipe 40, the second water pipe 40 can drive the nozzle 37 to swing up and down by taking the connecting rotating shaft 36 as an axis under the impact of cleaning liquid, the nozzle 37 is rotatably connected with the water spraying shell 42 through the connecting rotating shaft 36, the water spraying shell 42 is in threaded connection with the adjusting handle bar 39, the adjusting handle bar 39 can adjust the elastic ball 38, the elastic ball 38 is fixedly connected to the top end of the adjusting handle bar 39, and the nozzle 37 impacts the elastic ball 38 when swinging up and down and can be buffered under the elastic action of the elastic ball 38.

The working principle is as follows: when the device is used, cleaning liquid is firstly poured into the sewage cavity 13 through the water leakage port 14, then the cleaning liquid in the sewage cavity 13 flows into the water purification cavity 12 through the water filtering part 8, the cleaning liquid in the water purification cavity 12 is completely submerged, then the power cord of the utility model is inserted into an external power socket, then a wafer to be processed is put into the funnel disk 3, then the wafer in the funnel disk 3 slides down to the upper surface of the suction plate 21 under the action of the attraction force, then the button on the switch 27 is pressed to ensure that the device is connected with each electrical element to be connected with a power supply, then the vacuum pump 5 is started, after the vacuum pump 5 is started, the suction force is transmitted into the suction plate 21 through the first air pipe 35 and the connecting air pipe part 15, then the suction plate 21 tightly sucks the wafer through the suction hole 34 arranged on the upper surface, then the first telescopic column 4 is started to jack up the suction plate 21 until the suction plate 21 protrudes out of the upper surface of the funnel disk 3, then the submersible pump 11 is started, the submersible pump 11 inputs the cleaning liquid in the clean water cavity 12 into the connecting water pipe base 7 through the first water pipe 9, then the connecting water pipe base 7 inputs the cleaning liquid into the water spraying member 20 through the first water pipe 9, then the cleaning liquid in the water spraying member 20 is input into the nozzle 37 through the second water pipe 40, then the nozzle 37 sprays the cleaning liquid to the upper surface of the wafer, meanwhile, the second water pipe 40 drives the nozzle 37 to swing up and down by taking the connecting rotating shaft 36 as an axis under the pressure of the cleaning liquid, after the lower part of the nozzle 37 touches the upper surface of the elastic ball 38, the elastic ball 38 upwards bounces the nozzle 37 through elasticity, then the nozzle 37 reciprocates up and down under the action of the second water pipe 40 and the elastic ball 38, then the motor 23 is started, then the second telescopic column 31 drives the top plate 1 to move down, then the top plate 1 drives a series of components arranged at the lower part of the top plate 1 to move down together, then the brushless motor 23 drives the coarse sand grinding wheel 25 to grind the upper surface of the wafer, the coarse sand grinding wheel 25 drives the top plate 1 to jack up upwards through the second telescopic column 31 after grinding is finished, then the brushless motor 23 is closed, the speed reducing motor 2 is started, the second gear 44 is driven to rotate through the first gear 43 arranged on the output shaft of the speed reducing motor 2, then the second gear 44 drives the first connecting column 45, the second connecting rod 47, the brushless motor 23, the polishing grinding wheel 24, the coarse sand grinding wheel 25 and the fine sand grinding wheel 32 to rotate simultaneously, the speed reducing motor 2 is closed after a series of components such as the first connecting column 45, the second connecting rod 47, the brushless motor 23, the polishing grinding wheel 24, the coarse sand grinding wheel 25 and the fine sand grinding wheel 32 rotate clockwise by one hundred twenty degrees, then the same operation is repeated, a new wafer is put into the corresponding coarse sand grinding wheel 25 and the corresponding fine sand grinding wheel 32, and then the same operation is executed, so that the coarse sand grinding wheel 25 and the fine sand grinding wheel 32 simultaneously enter the And grinding, after grinding, executing the same operation, putting a new wafer into the hopper disc 3 corresponding to the coarse sand grinding wheel 25 again, then executing the same operation, grinding and polishing the wafer corresponding to the lower part, after grinding, taking the wafer which is put into the hopper disc 3 for the first time out, putting the wafer into the new wafer, and executing the same operation, wherein the water spraying piece 20 continuously washes the upper surface of the wafer during grinding, and then the cleaning solution flows into the sewage cavity 13 through the water leaking port 14 to circulate.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer grinding device with cleaning function, includes roof (1), funnel dish (3), connection baffle (6), water tank shell (10) and water spray (20), its characterized in that: the top fixed connection of the lower part of roof (1) through second flexible post (31) and third bracing piece (30), the outer wall fixed connection of the bottom of third bracing piece (30) and water tank shell (10) bottom, the bottom fixed connection of the upper portion of water tank shell (10) and linking bridge (6), be provided with in the inner chamber of water tank shell (10) and strain water spare (8), the inner wall fixed connection of the left and right sides and water tank shell (10) of straining water spare (8), the right side of straining water spare (8) is water purification chamber (12) in the inner chamber of water tank shell (10), the left side of straining water spare (8) is sewage chamber (13) in the inner chamber of water tank shell (10), immersible pump (11) has been placed in water purification chamber (12), immersible pump (11) communicate with the lower part of being connected water pipe base (7) each other through first water pipe (9), connect water pipe base (7) and linking bridge (6) fixed connection, the upper portion of connecting water pipe base (7) is through first water pipe (9) and the intercommunication of spraying water spare (20) each other, the upper portion of linking bridge (6) is through first bracing piece (16) and hopper dish (3) fixed connection, the lower part of roof (1) is through first connecting rod (22) and first connecting piece (33) fixed connection, the second gear (44) that set up in first connecting piece (33) and the top fixed connection of first connecting post (45), the one end fixed connection of first connecting post (45) and second connecting rod (47), the other end and the brushless motor (23) fixed connection of second connecting rod (47), brushless motor (23) are three, three respectively fixedly connected with polishing emery wheel (24) on the output shaft of brushless motor (23), A coarse sand grinding wheel (25) and a fine sand grinding wheel (32).

2. The wafer polishing apparatus with cleaning function as claimed in claim 1, wherein: be provided with first gear (43), second gear (44) and bearing (46) in first connecting piece (33), the lower part fixedly connected with gear motor (2) of roof (1), the output shaft and first gear (43) fixed connection of gear motor (2), first gear (43) and second gear (44) meshing are connected, bearing (46) and first connecting piece (33) fixed connection, first spliced pole (45) and bearing (46) registrate and are connected.

3. The wafer polishing apparatus with cleaning function as claimed in claim 1, wherein: fixedly connected with switch (27), diaphragm pump (29) and observation window (48) on the outer wall of water tank shell (10), sewage chamber (13) intercommunication in diaphragm pump (29) and the water tank shell (10), fixedly connected with valve (28) on the outlet pipe of diaphragm pump (29).

4. The wafer polishing apparatus with cleaning function as claimed in claim 1, wherein: the water-retaining plate is characterized in that the water-retaining plate (26) is fixedly connected to the upper portion of the connecting baffle plate (6), the vacuum pump (5) is communicated with the connecting gas pipe fitting (15) through a first gas pipe (35), and the connecting gas pipe fitting (15) is fixedly connected with the suction plate (21).

5. The wafer polishing apparatus with cleaning function as claimed in claim 4, wherein: the suction plate (21) is in telescopic connection with the connecting baffle (6) through the first telescopic column (4), the suction plate (21) is fixedly connected with the upper portion of the first telescopic column (4), the lower portion of the first telescopic column (4) is fixedly connected with the connecting baffle (6), a suction hole (34) is formed in the suction plate (21), and a water leaking port (14) is formed in the connecting baffle (6).

6. The wafer polishing apparatus with cleaning function as claimed in claim 1, wherein: the connecting baffle (6) is fixedly connected with a supporting plate (18) through a second supporting rod (17), the supporting plate (18) is fixedly connected with a connecting clamp plate (19), and the connecting clamp plate (19) is rotatably connected with a water spraying piece (20) through a rotating shaft.

7. The wafer polishing apparatus with cleaning function as claimed in claim 1, wherein: the water spraying piece (20) comprises a connecting rotating shaft (36), a nozzle (37), an elastic ball (38), an adjusting handle rod (39), a second water pipe (40) and a water spraying shell (42), the inner wall of the water spraying shell (42) is communicated with the nozzle (37) through the second water pipe (40), the nozzle (37) is rotatably connected with the water spraying shell (42) through the connecting rotating shaft (36), the water spraying shell (42) is in threaded connection with the adjusting handle rod (39), and the top end of the adjusting handle rod (39) is fixedly connected with the elastic ball (38).