CN218517271U

CN218517271U - Foreign matter removing device for semiconductor packaging

Info

Publication number: CN218517271U
Application number: CN202222203252.7U
Authority: CN
Inventors: 周浩明; 王家松
Original assignee: Hitech Semiconductor Wuxi Co Ltd
Current assignee: Hitech Semiconductor Wuxi Co Ltd
Priority date: 2022-08-22
Filing date: 2022-08-22
Publication date: 2023-02-24
Anticipated expiration: 2032-08-22

Abstract

The utility model discloses a be used for semiconductor package foreign matter clearing device, including the inside fixed mounting of packaging hardware body there is the encapsulation mould, the inside movable mounting of packaging hardware body has movable assembly, and movable assembly's surface movable mounting has the clearance subassembly. In the above scheme, set up movable subassembly and clearance subassembly, can drive its surface mounting's brush and carry out synchronous rotation, consequently the brush can adsorb the inside residue of packaging mold when rotating, when the brush needs to be changed, through the shrink of second electric telescopic handle, drive first U template and second U template and remove to the both sides of spliced pole respectively, consequently, can drive the both sides that first erection column and solid fixed ring break away from the brush, make the brush dismantle from the clearance subassembly, make things convenient for operating personnel to clear up its surperficial adsorbed debris or change the brush is whole, thereby the effect of improving the device practicality has been reached.

Description

Foreign matter removing device for semiconductor packaging

Technical Field

The utility model relates to a semiconductor package technical field, more specifically say, the utility model relates to a be used for semiconductor package foreign matter clearing device.

Background

A semiconductor is a material with good wire performance, and is commonly used for manufacturing chips, and during the chip processing, corresponding semiconductor packaging devices are generally used.

However, in practical use, there still exist some disadvantages, such as: in the process of resin packaging of the substrate and the chip, due to the chemical characteristics of resin, substances in the resin are often remained in the packaging device, foreign substances are formed after a long time, the service life of a device is influenced, and in normal operation, the poor operation is caused, so that the die needs to be cleaned manually, more time is spent, and the normal packaging progress is delayed.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defects of the prior art, the embodiment of the utility model provides a be used for semiconductor package foreign matter clearing device to solve the inside mould of prior art packaging hardware and need the manual work to carry out clear problem.

In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a be used for semiconductor package foreign matter clearing device, includes the packaging hardware body the inside fixed mounting of packaging hardware body has the encapsulation mould, the inside movable mounting of packaging hardware body has movable assembly, movable assembly's surface movable mounting has the clearance subassembly.

Wherein, the activity subassembly includes the bottom plate, the top surface fixed mounting of bottom plate has first electric telescopic handle, first electric telescopic handle's top surface fixed mounting has the connecting plate, two there are first mounting panel and second mounting panel on the surface of connecting plate fixed mounting respectively, the inside fixed mounting of first mounting panel has first drive arrangement, first drive arrangement's fixed surface installs the threaded rod, the inside fixed mounting of second mounting panel has the gag lever post.

The cleaning assembly comprises a moving block, a second electric telescopic rod is fixedly mounted on the surface of the moving block, and a connecting assembly is movably mounted on the surface of the second electric telescopic rod.

Wherein, coupling assembling includes first U template, the movable surface mounting of first U template has the spliced pole, the inside movable mounting of spliced pole has the second U template, the fixed surface of first U template installs second drive arrangement, the fixed surface of second drive arrangement installs first erection column, the surface demountable installation of first erection column has the brush, the fixed surface of second U template installs solid fixed ring, gu fixed ring's inside movable mounting has the second erection column.

The bottom surface of the bottom plate is fixedly connected with the bottom surface inside the packaging device body, the surfaces of the threaded rod and the limiting rod are movably connected with the inside of the moving block, and one end of the threaded rod is movably connected with the surface of the connecting plate.

The surfaces of the second driving device and the second U-shaped plate are fixedly connected with one ends of the two second electric telescopic rods respectively, and the surface of the second mounting column is movably connected with the right side of the brush.

The utility model discloses an above-mentioned technical scheme's beneficial effect as follows:

in the scheme, the movable assembly and the cleaning assembly are arranged, the threaded rod is driven to rotate inside the first mounting plate through the first driving device, therefore, the movable block mounted on the surface of the threaded rod can move in the horizontal direction inside the first mounting plate, the limiting rod is matched, the cleaning assembly can move synchronously and horizontally as a whole, through extension or contraction of the first electric telescopic rod, the cleaning assembly can lift to a certain height inside the packaging device body, the first mounting column is driven to rotate through the second driving device, the first mounting column can be driven to synchronously rotate while rotating, therefore, the brush can adsorb residues inside the packaging die when rotating, when the brush needs to be replaced, the first U-shaped plate and the second U-shaped plate are driven to move to two sides of the connecting column respectively through contraction of the second electric telescopic rod, the first mounting column and the fixing ring can be driven to separate from two sides of the brush, the brush can be detached from the cleaning assembly, operators can conveniently clean sundries adsorbed on the surface of the brush or replace the sundries on the surface of the brush integrally, and the brush improves the practicability of the device.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a perspective assembly view of the integrated device of the present invention;

FIG. 3 is a schematic view of the movable assembly of the present invention;

FIG. 4 is a schematic view of the cleaning assembly of the present invention;

fig. 5 is a schematic view of the connection assembly structure of the present invention.

[ reference numerals ]

1. A packaging device body; 2. packaging the mold; 3. a movable component; 4. cleaning the assembly; 31. a base plate; 32. a first electric telescopic rod; 33. a connecting plate; 34. a first mounting plate; 35. a second mounting plate; 36. a first driving device; 37. a threaded rod; 38. a limiting rod; 41. a moving block; 42. a second electric telescopic rod; 43. a connecting assembly; 431. a first U-shaped plate; 432. connecting columns; 433. a second U-shaped plate; 434. a second driving device; 435. a first mounting post; 436. a brush; 437. a fixing ring; 438. a second mounting post.

Detailed Description

In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.

Fig. 1 to fig. 5 the embodiment of the utility model provides a be used for semiconductor package foreign matter clearing device, including packaging hardware body 1, packaging hardware body 1's inside fixed mounting has encapsulation mould 2, packaging hardware body 1's inside movable mounting has movable assembly 3, movable assembly 3's surface movable mounting has clearance subassembly 4.

As shown in fig. 3, the movable assembly 3 includes a bottom plate 31, a first electric telescopic rod 32 is fixedly mounted on a top surface of the bottom plate 31, a connecting plate 33 is fixedly mounted on a top surface of the first electric telescopic rod 32, a first mounting plate 34 and a second mounting plate 35 are respectively fixedly mounted on surfaces of the two connecting plates 33, a first driving device 36 is fixedly mounted inside the first mounting plate 34, a threaded rod 37 is fixedly mounted on a surface of the first driving device 36, a limiting rod 38 is fixedly mounted inside the second mounting plate 35, a bottom surface of the bottom plate 31 is fixedly connected with a bottom surface inside the packaging device body 1, surfaces of the threaded rod 37 and the limiting rod 38 are both movably connected with an inside of a moving block 41, one end of the threaded rod 37 is movably connected with a surface of the connecting plate 33, and the cleaning assembly 4 can move inside the packaging device body 1 to a certain extent through the structures of the first electric telescopic rod 32 and the threaded rod 37, so that a mold can be cleaned correspondingly instead of manual work.

Wherein, as fig. 4 to 5, clearance subassembly 4 includes movable block 41, the fixed surface of movable block 41 installs second electric telescopic handle 42, the fixed surface of second electric telescopic handle 42 has coupling assembling 43, coupling assembling 43 includes first U type board 431, the fixed surface of first U type board 431 has spliced pole 432, the inside movable mounting of spliced pole 432 has second U type board 433, the fixed surface of first U type board 431 has second drive arrangement 434, the fixed surface of second drive arrangement 434 has first erection column 435, the surface demountable installation of first erection column 435 has brush 436, the fixed surface of second U type board 433 has fixed ring 437, the inside movable mounting of fixed ring 437 has second erection column 438, the surface of second drive arrangement 434 and second U type board 433 respectively with the one end fixed connection of two second electric telescopic handle 42, the surface of second erection column 438 is connected with the right side movable of brush 436, through the first erection column 435 and the second erection column 438 structure that sets up, can dismantle brush 436 conveniently to the operating personnel.

The working process of the utility model is as follows: the threaded rod 37 is driven by the first driving device 36 to rotate inside the first mounting plate 34, so that the moving block 41 mounted on the surface of the threaded rod 37 can move horizontally inside the first mounting plate 34, and is matched with the limiting rod 38, so that the cleaning assembly 4 can move synchronously and horizontally as a whole, through extension or contraction of the first electric telescopic rod 32, the cleaning assembly 4 can lift to a certain height inside the packaging device body 1, and the first mounting column 435 is driven to rotate by the second driving device 434, so that the first mounting column 435 can drive the brush 436 mounted on the surface of the first mounting column to rotate synchronously while rotating, so that the brush 436 can adsorb residues inside the packaging mold 2 when rotating, when the brush 436 needs to be replaced, the first U-shaped plate 431 and the second U-shaped plate 433 are driven to move towards two sides of the connecting column 432 respectively by contraction of the second electric telescopic rod 42, so that the first mounting column 435 and the fixing ring 437 can be driven to be separated from two sides of the brush 436, so that the brush 436 can be detached from the cleaning assembly 4, and an operator can conveniently replace the impurities adsorbed on the surface of the brush 436 or replace the brush 436 integrally.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the foregoing is illustrative of the preferred embodiments of the present invention, and is not to be construed as limiting the invention, and any modifications, equivalent alterations, improvements and the like made within the spirit and principle of the invention are intended to be included within the scope of the invention.

Claims

1. The utility model provides a be used for semiconductor package foreign matter clearing device, includes packaging hardware body (1), its characterized in that, the inside fixed mounting of packaging hardware body (1) has encapsulation mould (2), the inside movable mounting of packaging hardware body (1) has movable assembly (3), the surface movable mounting of movable assembly (3) has clearance subassembly (4).

2. The device for removing the foreign matters in the semiconductor packages according to claim 1, wherein the movable assembly (3) comprises a bottom plate (31), a first electric telescopic rod (32) is fixedly installed on the top surface of the bottom plate (31), a connecting plate (33) is fixedly installed on the top surface of the first electric telescopic rod (32), a first mounting plate (34) and a second mounting plate (35) are respectively and fixedly installed on the surfaces of the two connecting plates (33), a first driving device (36) is fixedly installed inside the first mounting plate (34), a threaded rod (37) is fixedly installed on the surface of the first driving device (36), and a limiting rod (38) is fixedly installed inside the second mounting plate (35).

3. The device for removing the foreign matters in the semiconductor package according to claim 1, wherein the cleaning assembly (4) comprises a moving block (41), a second electric telescopic rod (42) is fixedly installed on the surface of the moving block (41), and a connecting assembly (43) is movably installed on the surface of the second electric telescopic rod (42).

4. The device for removing the foreign substances in the semiconductor packages according to claim 3, wherein the connecting assembly (43) comprises a first U-shaped plate (431), a connecting column (432) is movably installed on the surface of the first U-shaped plate (431), a second U-shaped plate (433) is movably installed inside the connecting column (432), a second driving device (434) is fixedly installed on the surface of the first U-shaped plate (431), a first mounting column (435) is fixedly installed on the surface of the second driving device (434), a brush (436) is detachably installed on the surface of the first mounting column (435), a fixing ring (437) is fixedly installed on the surface of the second U-shaped plate (433), and a second mounting column (438) is movably installed inside the fixing ring (437).

5. The device for removing the foreign matters in the semiconductor package according to claim 2, wherein the bottom surface of the bottom plate (31) is fixedly connected with the bottom surface inside the package device body (1), the surfaces of the threaded rod (37) and the limiting rod (38) are movably connected with the inside of the moving block (41), and one end of the threaded rod (37) is movably connected with the surface of the connecting plate (33).

6. The device for removing the foreign matters from the semiconductor package according to claim 4, wherein the surfaces of the second driving means (434) and the second U-shaped plate (433) are fixedly connected to one ends of two second electric telescopic rods (42), respectively, and the surface of the second mounting column (438) is movably connected to the right side of the brush (436).