CN211938193U - Ultrasonic cleaning apparatus for semiconductor display substrate - Google Patents
Ultrasonic cleaning apparatus for semiconductor display substrate Download PDFInfo
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- CN211938193U CN211938193U CN202020347159.1U CN202020347159U CN211938193U CN 211938193 U CN211938193 U CN 211938193U CN 202020347159 U CN202020347159 U CN 202020347159U CN 211938193 U CN211938193 U CN 211938193U
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- semiconductor display
- display substrate
- cleaning
- installation frame
- ultrasonic
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Abstract
The utility model belongs to the technical field of semiconductor display substrate cleaning equipment, a ultrasonic cleaning equipment for semiconductor display substrate is provided, including the washing tank, ultrasonic generator, washing tool and actuating mechanism, ultrasonic generator sets up in the washing tank, and washing tool is used for placing the semiconductor display substrate, including the installation frame, two backup pads and locking structure, two backup pads set up respectively at the inboard both ends of installation frame, and with installation frame sliding connection, and the relative one side of two backup pads is provided with the V-arrangement groove of mutually supporting respectively, and locking structure is used for locking the position of two backup pads, and actuating mechanism is used for driving the washing tool and makes reciprocal linear motion from top to bottom. The utility model provides an ultrasonic cleaning equipment cleaning efficiency is high for semiconductor display substrate.
Description
Technical Field
The utility model relates to a semiconductor display substrate cleaning equipment technical field, concretely relates to ultrasonic cleaning equipment for semiconductor display substrate.
Background
The semiconductor display substrate is subjected to a plurality of cleaning processes, such as chemical cleaning, ultrasonic cleaning, and ultra-high pressure water cleaning, during the manufacturing process. The chemical cleaning is a cleaning method for removing dirt on the surface of the semiconductor display substrate by soaking the semiconductor display substrate in a chemical reagent for a period of time.
However, in the existing ultrasonic cleaning technology for the semiconductor display substrate, a plurality of semiconductor display substrates are generally stacked, and a pad is arranged between two adjacent semiconductor display substrates to facilitate ultrasonic contact with the semiconductor substrates.
In this manner, the semiconductor display substrates are cleaned, and not only are the semiconductor display substrates stacked one on another in the cleaning tank, but also a spacer is provided between two adjacent semiconductor display substrates. After the cleaning, the semiconductor display substrate and the gasket need to be taken out of the cleaning tank one by one, which is time-consuming and labor-consuming, and finally results in low cleaning efficiency.
SUMMERY OF THE UTILITY MODEL
To the defects in the prior art, the present invention provides an ultrasonic cleaning apparatus for a semiconductor display substrate to improve the cleaning efficiency.
In order to achieve the above object, the present invention provides an ultrasonic cleaning apparatus for a semiconductor display substrate, comprising a cleaning tank and an ultrasonic generating device disposed in the cleaning tank, further comprising a cleaning jig and a driving mechanism,
the cleaning jig is used for placing a semiconductor display substrate and comprises an installation frame, two support plates and a locking structure, wherein the two support plates are respectively arranged at two ends of the inner side of the installation frame and are in sliding connection with the installation frame, V-shaped grooves which are matched with each other are respectively arranged at one opposite side of the two support plates,
the locking structure is used for locking the positions of the two supporting plates,
the driving mechanism is used for driving the cleaning jig to do vertical reciprocating linear motion.
Further, the locking structure includes spout, screw and bolt, the spout sets up on the installation frame, the screw sets up in the backup pad, just the screw with the spout is corresponding, the screw end of bolt pass behind the spout with screw threaded connection.
Furthermore, the number of the V-shaped grooves is multiple, and the V-shaped grooves are sequentially arranged at intervals along the longitudinal direction.
Furthermore, the driving mechanism comprises two screw nut structures and a driving motor, the two screw nut structures are respectively arranged on two sides of the cleaning jig, nuts of the screw nut structures are respectively fixedly connected with the cleaning jig, and a power output end of the driving motor is connected with power input ends of screws of the two screw nut structures.
The utility model has the advantages that:
1. the utility model provides an ultrasonic cleaning equipment for semiconductor display substrate through being provided with the washing tool to place semiconductor display substrate, thereby improved the cleaning efficiency.
2. The utility model provides an ultrasonic cleaning equipment for semiconductor display substrate through set sliding connection with backup pad and installation frame to can be through changing the distance between the backup pad, and then can place the semiconductor display substrate of different specifications, improved cleaning equipment's adaptability. Simultaneously through set up the V-arrangement groove in the backup pad of washing tool thereby can place the semiconductor display substrate that thickness is different, further improved cleaning equipment's adaptability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a perspective view of an ultrasonic cleaning apparatus for a semiconductor display substrate according to an embodiment of the present invention;
FIG. 2 is a front view of a cleaning jig of the ultrasonic cleaning apparatus for semiconductor display substrates shown in FIG. 1;
fig. 3 is a sectional view taken in the direction a-a shown in fig. 2.
Reference numerals:
1-cleaning tank, 2-ultrasonic generator, 3-cleaning fixture, 31-mounting frame, 32-supporting plate, 321-V-shaped groove, 33-locking structure, 331-sliding groove, 332-screw hole, 333-bolt, 4-driving mechanism, 41-screw nut structure and 42-driving motor.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience of description and simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting.
Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 3, the present invention provides an ultrasonic cleaning apparatus for a semiconductor display substrate, comprising a cleaning tank 1, an ultrasonic generating device 2 disposed in the cleaning tank 1, a cleaning jig 3 and a driving mechanism 4.
The cleaning jig 3 is used for placing a semiconductor display substrate and includes a mounting frame 31, two support plates 32, and a locking structure 33.
Two support plates 32 are respectively disposed at both ends of the inner side of the mounting frame 31 and are slidably coupled with the mounting frame 31. The opposite sides of the two supporting plates 32 are respectively provided with the V-shaped grooves 321 which are matched with each other, the semiconductor display substrates with different thicknesses can be clamped by the V-shaped grooves 321, the adaptability of the cleaning jig 3 is improved, meanwhile, the contact area between the semiconductor display substrates and the V-shaped grooves 321 can be reduced, and the cleaning effect is improved.
The locking structure 33 is used to lock the position of the two support plates 32.
The driving mechanism 4 is used for driving the cleaning jig 3 to do reciprocating linear motion up and down.
In one embodiment, the locking structure 33 includes a sliding slot 331, a screw hole 332 and a bolt 333, the sliding slot 331 is disposed on the mounting frame 31, the screw hole 332 is disposed on the support plate 32, the screw hole 332 corresponds to the sliding slot 331, and a threaded end of the bolt 333 is threaded with the screw hole 332 after passing through the sliding slot 331. When it is necessary to change the position of the support plate 32, the bolts 333 are loosened so that the support plate 32 and the mounting frame 31 can slide with respect to each other. When it is necessary to fix the support plate 32, the bolts 333 are tightened.
In one embodiment, the number of the V-shaped grooves 321 is plural, and the V-shaped grooves are sequentially spaced along the longitudinal direction. This structure contributes to increasing the number of semiconductor display substrates placed in the cleaning jig 3, thereby improving the cleaning efficiency.
In one embodiment, the driving mechanism 4 includes two lead screw nut structures 41 and a driving motor 42, the two lead screw nut structures 41 are respectively rotatably installed on two sides of the cleaning jig 3 through a fixing bracket (not shown in the drawings), and nuts of the two lead screw nut structures 41 are respectively fixedly connected with the cleaning jig 3, the driving motor 42 is fixedly installed on the fixing bracket, and a power output end of the driving motor 42 is connected with a power input end of a lead screw of the two lead screw nut structures 41.
When the cleaning jig is used, the driving motor 42 drives the screw rod to rotate, and the screw rod drives the nut to ascend or descend, so that the cleaning jig 3 is conveyed into or lifted out of the cleaning groove 1. The driving mechanism 4 with the structure has simple structure.
Of course, travel switches (not shown in the drawings) for controlling the up-and-down movement of the nut are also arranged above and below the screw rod so as to control the up-and-down reciprocating downward movement of the cleaning jig 3.
The working principle of the utility model is as follows:
during the use, insert the semiconductor display substrate and wash in tool 3, then under actuating mechanism 4's effect, drive and wash tool 3 and move down, wash tool 3 and take the semiconductor display substrate to get into and wash the pond, under the effect of ultrasonic wave generating device 2, wash the semiconductor display substrate, wash after accomplishing, actuating mechanism 4 drive wash tool 3 and move up and leave and wash the pond, take off the semiconductor display substrate who washs and accomplish, accomplish a cleaning work promptly.
In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (4)
1. An ultrasonic cleaning apparatus for a semiconductor display substrate, comprising a cleaning tank and an ultrasonic generating device disposed in the cleaning tank, characterized in that: also comprises a cleaning jig and a driving mechanism,
the cleaning jig is used for placing a semiconductor display substrate and comprises an installation frame, two support plates and a locking structure, wherein the two support plates are respectively arranged at two ends of the inner side of the installation frame and are in sliding connection with the installation frame, V-shaped grooves which are matched with each other are respectively arranged at one opposite side of the two support plates,
the locking structure is used for locking the positions of the two supporting plates,
the driving mechanism is used for driving the cleaning jig to do vertical reciprocating linear motion.
2. An ultrasonic cleaning apparatus for a semiconductor display substrate according to claim 1, wherein: the locking structure comprises a sliding groove, a screw hole and a bolt, the sliding groove is arranged on the installation frame, the screw hole is arranged on the supporting plate and corresponds to the sliding groove, and the threaded end of the bolt penetrates through the sliding groove and then is in threaded connection with the screw hole.
3. An ultrasonic cleaning apparatus for a semiconductor display substrate according to claim 2, wherein: the number of the V-shaped grooves is multiple, and the V-shaped grooves are sequentially arranged at intervals along the longitudinal direction.
4. An ultrasonic cleaning apparatus for a semiconductor display substrate according to claim 1, wherein: the driving mechanism comprises two lead screw nut structures and a driving motor, the two lead screw nut structures are respectively arranged on two sides of the cleaning jig, nuts of the two lead screw nut structures are respectively fixedly connected with the cleaning jig, and a power output end of the driving motor is connected with power input ends of lead screws of the two lead screw nut structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020347159.1U CN211938193U (en) | 2020-03-18 | 2020-03-18 | Ultrasonic cleaning apparatus for semiconductor display substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020347159.1U CN211938193U (en) | 2020-03-18 | 2020-03-18 | Ultrasonic cleaning apparatus for semiconductor display substrate |
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| Publication Number | Publication Date |
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| CN211938193U true CN211938193U (en) | 2020-11-17 |
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| CN202020347159.1U Active CN211938193U (en) | 2020-03-18 | 2020-03-18 | Ultrasonic cleaning apparatus for semiconductor display substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114101208A (en) * | 2021-11-30 | 2022-03-01 | 重庆芯洁科技有限公司 | Ceramic substrate ultrasonic cleaning device for CVD |
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2020
- 2020-03-18 CN CN202020347159.1U patent/CN211938193U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114101208A (en) * | 2021-11-30 | 2022-03-01 | 重庆芯洁科技有限公司 | Ceramic substrate ultrasonic cleaning device for CVD |
| CN114101208B (en) * | 2021-11-30 | 2022-12-20 | 重庆芯洁科技有限公司 | Ceramic substrate ultrasonic cleaning device for CVD |
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