CN216501004U - Spraying cleaning transmission device of silicon wafer degumming machine - Google Patents
Spraying cleaning transmission device of silicon wafer degumming machine Download PDFInfo
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- CN216501004U CN216501004U CN202120927123.5U CN202120927123U CN216501004U CN 216501004 U CN216501004 U CN 216501004U CN 202120927123 U CN202120927123 U CN 202120927123U CN 216501004 U CN216501004 U CN 216501004U
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- silicon wafer
- rotating shaft
- gear
- spraying
- transmission device
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Abstract
The utility model discloses a spraying cleaning transmission device of a silicon wafer degumming machine. Belongs to the field of degumming of large-size silicon wafers, and comprises a gear, a rack, a fixed metal plate, a cylinder and a rotating shaft. The silicon wafer spraying device directly adopts gear and rack transmission, does not need force arm transmission, and enlarges the rotating range through the gear, so that the spraying rods on the two sides uniformly and completely cover the silicon wafer; after the silicon wafer is placed into a spraying groove of a degumming machine, a cylinder drives a gear to operate, and the silicon wafer placed into the spraying groove is cleaned; by adopting a gear and rack transmission mode, the spraying rotation range can be better enlarged, the angle adjustment is convenient, the whole silicon wafer is in the cleaning range, the large silicon wafer is more conveniently cleaned, and the quality defect caused by the contamination of the silicon wafer is reduced. By adopting the transmission mechanism, the silicon wafer cleaning efficiency is higher, and the higher production efficiency is achieved.
Description
Technical Field
The utility model belongs to the field of degumming of large-size silicon wafers, particularly relates to a spraying cleaning transmission device of a silicon wafer degumming machine, and particularly relates to a cleaning method for dirt on the surface of a silicon wafer.
Background
In the prior art, degumming of photovoltaic silicon wafers is cleaned in a mode of swinging of an air cylinder driving force arm, the specific operation flow is that after the silicon wafers are degummed and enter a spraying groove, spraying swinging is started, the transmission radius of a swinging arm is small, and when the silicon wafers are cleaned by spraying water from two side edges due to the fact that the size of the silicon wafers is increased, the whole silicon wafer cannot be washed, half of the silicon wafers have residual dirt, and the efficiency is low; the general disadvantages are: the swing radius of the force arm is small, and no space with adjustable swing radius exists; with the development of photovoltaic technology, the demand on large silicon wafers is increasing, and the large silicon wafers have large surface silicon powder residues due to overlarge size after degumming, cannot be washed cleanly, and are adhered together, so that the silicon wafers cannot be separated during inserting, and lamination and fragment loss are caused; therefore, how to solve the above problems becomes a problem that needs to be considered by technicians at present.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: the utility model aims to provide a spraying cleaning transmission device of a silicon wafer degumming machine.
The technical scheme is as follows: the spray cleaning transmission device of the silicon wafer degumming machine comprises a cylinder, a rotating shaft penetrates through the cylinder, two L-shaped fixing metal plates are respectively arranged at two ends of the rotating shaft,
racks are respectively arranged at the upper ends of the two L-shaped fixed metal plates, and gears are arranged on the racks.
Further, the volume of the cylinder is phi 32 x 75 Smm;
the diameter of the rotating shaft is 186.74 mm;
the height of the L-shaped fixed metal plate and the rack is 115.00 mm;
the distance between the two gears is 360.00 mm.
Furthermore, the L-shaped fixed metal plate comprises a vertical bar and a transverse bar for supporting the rack;
and the vertical bar is provided with a vertical hole for moving the rotating shaft.
Furthermore, the two ends of the rotating shaft are provided with grooves clamped in the vertical holes, and the diameter of the outer wall of each groove is matched with that of the inner wall of each vertical hole.
Furthermore, the rack is fixedly arranged on the fixed metal plate.
The gear is characterized by further comprising a spray rod rotating shaft, wherein the spray rod rotating shaft is fixedly arranged in a circular hole formed in the gear in a penetrating mode and is fixed through a check nut.
Has the advantages that: compared with the prior art, the silicon wafer spraying device directly adopts gear and rack transmission, does not need force arm transmission, and enlarges the rotating range through the gear, so that the spraying rods on the two sides uniformly and completely cover the silicon wafer; after the silicon wafer is placed into a spraying groove of a degumming machine, a cylinder drives a gear to operate, and the silicon wafer placed into the spraying groove is cleaned; by adopting a gear and rack transmission mode, the spraying rotation range can be better enlarged, the angle adjustment is convenient, the whole silicon wafer is in the cleaning range, the large silicon wafer is more conveniently cleaned, and the quality defect caused by the contamination of the silicon wafer is reduced. By adopting the transmission mechanism, the silicon wafer cleaning efficiency is higher, and the higher production efficiency is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a diagram of an example of the operation of the present invention;
in the figure, 1 is a cylinder, 2 is a rotating shaft, 3 is a fixed metal plate, 4 is a rack, and 5 is a gear.
Detailed Description
The utility model relates to a spraying cleaning transmission device of a silicon wafer degumming machine, which comprises a cylinder 1, a rotating shaft 2 is arranged in the cylinder 1 in a penetrating way, two L-shaped fixed metal plates 3 are respectively arranged at two ends of the rotating shaft 2,
Further, the volume of the cylinder 1 is phi 32 (diameter) 75Smm (cylinder stroke);
the diameter of the rotating shaft 2 is 186.74 mm;
the height of the L-shaped fixed metal plate 3 and the rack 4 is 115.00 mm;
the distance between the two gears 5 is 360.00 mm.
Furthermore, the L-shaped fixed metal plate 3 comprises a vertical bar and a transverse bar for supporting the rack;
the vertical bar is provided with a vertical hole for moving the rotating shaft 2.
Furthermore, the two ends of the rotating shaft 2 are provided with grooves clamped in the vertical holes, and the diameters of the outer walls of the grooves are matched with the diameters of the inner walls of the vertical holes.
Further, the rack 4 is fixedly arranged on the fixed metal plate 3.
Furthermore, the gear wheel further comprises a spray rod rotating shaft which is fixedly arranged in a circular hole formed in the gear wheel 5 in a penetrating mode and is fixed through a locknut.
Specifically, the transmission method of the spray cleaning transmission device of the silicon wafer degumming machine comprises the following steps:
1. the gear 5 is fixed on the rotating shaft of the spray rod and is fixed by a locknut;
2. the rotating shaft 2 is fixed by a positioning pin and a clamp spring;
3. the rack 4 is fixed on the fixed metal plate 3, and the fixed metal plate 3 can adjust the position of the rack 4 so as to control the transmission range of the gear 5;
4. wherein, the rack 4 and the gear 5 are adjusted in a centering way;
5. the fixed metal plate 3 is fixed on the cylinder 1, the position of the fixed metal plate 3 can be adjusted up and down, and in addition, a rack 4 fixed on the fixed metal plate 3 can be better matched with a gear 5 on the spray shaft;
6. the installation level of the fixed metal plate 3 is adjusted;
7. the compressed air is used for pushing the air cylinder 1 to operate, and the air inlet amount of the compressed air pressure regulating valve is adjusted.
Claims (6)
1. The spray cleaning transmission device of the silicon wafer degumming machine is characterized by comprising a cylinder, a rotating shaft penetrates through the cylinder, L-shaped fixing metal plates are respectively arranged at two ends of the rotating shaft,
racks are respectively arranged at the upper ends of the two L-shaped fixed metal plates, and gears are arranged on the racks.
2. The spray cleaning transmission device of the silicon wafer degumming machine according to claim 1, wherein the volume of the air cylinder is phi 32 x 75 Smm;
the diameter of the rotating shaft is 186.74 mm;
the height of the L-shaped fixed metal plate and the rack is 115.00 mm;
the distance between the two gears is 360.00 mm.
3. The spray cleaning transmission device of the silicon wafer degumming machine according to claim 1,
the L-shaped fixing metal plate comprises a vertical bar and a transverse bar for supporting the rack;
and the vertical bar is provided with a vertical hole for moving the rotating shaft.
4. The spray cleaning transmission device of the silicon wafer degumming machine according to claim 1 or 3,
the two ends of the rotating shaft are provided with grooves clamped in the vertical holes, and the diameters of the outer walls of the grooves are matched with the diameters of the inner walls of the vertical holes.
5. The spray cleaning transmission device of the silicon wafer degumming machine according to claim 1, wherein the rack is fixedly arranged on a fixed metal plate.
6. The silicon wafer degumming machine spray cleaning transmission device according to claim 1, further comprising a spray rod rotating shaft, wherein the spray rod rotating shaft is fixedly arranged in a circular hole formed in the gear in a penetrating manner and is fixed by a locknut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120927123.5U CN216501004U (en) | 2021-04-30 | 2021-04-30 | Spraying cleaning transmission device of silicon wafer degumming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120927123.5U CN216501004U (en) | 2021-04-30 | 2021-04-30 | Spraying cleaning transmission device of silicon wafer degumming machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216501004U true CN216501004U (en) | 2022-05-13 |
Family
ID=81461483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120927123.5U Active CN216501004U (en) | 2021-04-30 | 2021-04-30 | Spraying cleaning transmission device of silicon wafer degumming machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216501004U (en) |
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2021
- 2021-04-30 CN CN202120927123.5U patent/CN216501004U/en active Active
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