CN211965189U - Chemical cleaning equipment for semiconductor display substrate - Google Patents
Chemical cleaning equipment for semiconductor display substrate Download PDFInfo
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- CN211965189U CN211965189U CN202020348017.7U CN202020348017U CN211965189U CN 211965189 U CN211965189 U CN 211965189U CN 202020348017 U CN202020348017 U CN 202020348017U CN 211965189 U CN211965189 U CN 211965189U
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Abstract
The utility model belongs to the technical field of the semiconductor substrate, a chemical cleaning equipment of semiconductor display substrate is provided, including washing tank, washing tool and actuating mechanism, the washing tool is used for placing the semiconductor display substrate, including installation frame and a plurality of structure of placing, actuating mechanism is used for the drive to wash tool and makes reciprocal linear motion from top to bottom. The utility model provides a chemical cleaning equipment of semiconductor display substrate, the cleaning efficiency is higher.
Description
Technical Field
The utility model relates to a semiconductor substrate technical field, concretely relates to chemical cleaning equipment of semiconductor display substrate.
Background
The semiconductor display substrate is subjected to a plurality of cleaning processes, such as chemical cleaning, ultrasonic cleaning, and ultra-high pressure water cleaning, during the manufacturing process. The chemical cleaning is a cleaning method for removing dirt on the surface of the semiconductor display substrate by soaking the semiconductor display substrate in a chemical reagent for a period of time.
However, in the existing chemical cleaning technology for semiconductor display substrates, a plurality of semiconductor display substrates are stacked, and a pad is arranged between two adjacent semiconductor display substrates so that a chemical reagent can be in contact with the semiconductor substrates.
In this manner, the semiconductor display substrates are cleaned, and not only are the semiconductor display substrates stacked one on another in the cleaning tank, but also a spacer is provided between two adjacent semiconductor display substrates. After the cleaning, the semiconductor display substrate and the gasket need to be taken out of the cleaning tank one by one, which is time-consuming and labor-consuming, and finally results in low cleaning efficiency.
SUMMERY OF THE UTILITY MODEL
To overcome the drawbacks of the prior art, the present invention provides a chemical cleaning apparatus for semiconductor display substrates, which can improve the cleaning efficiency.
In order to achieve the above object, the present invention provides a chemical cleaning apparatus for a semiconductor display substrate, comprising a cleaning tank, a cleaning fixture and a driving mechanism,
the cleaning jig is used for placing a semiconductor display substrate and comprises a mounting frame and a plurality of placing structures,
the placing structure comprises two placing blocks, a clamping plate and a clamping spring, the two placing blocks are symmetrically arranged on two sides of the inner part of the installing frame, sliding grooves are respectively arranged on one opposite sides of the two placing blocks along the length direction of the two placing blocks, the clamping plate is arranged in the sliding grooves in a sliding manner, a sliding rod is arranged at the top of the clamping plate and is connected with the placing blocks in a sliding manner through sliding holes arranged on the placing blocks, the clamping spring is sleeved on the sliding rod, and two ends of the clamping spring are respectively abutted against the clamping plate and the placing blocks,
a plurality of the placing structures are sequentially arranged at intervals along the longitudinal direction,
the driving mechanism is used for driving the cleaning jig to do vertical reciprocating linear motion.
Further, two place the piece one side in opposite directions respectively through the telescopic link with install the frame connection, the cover is equipped with reset spring on the telescopic link, reset spring's both ends respectively with place the piece with install the frame butt.
Further, the clamping plate and the bottom of the sliding groove are provided with a plurality of universal balls.
Furthermore, the driving mechanism comprises two screw nut structures and a driving motor, the two screw nut structures are respectively arranged on two sides of the cleaning jig, nuts of the screw nut structures are respectively fixedly connected with the cleaning jig, and a power output end of the driving motor is connected with power input ends of screws of the two screw nut structures.
The utility model has the advantages that:
1. the utility model provides a chemical cleaning equipment of semiconductor display substrate through being provided with the washing tool of placing the semiconductor display substrate to in place the semiconductor display substrate, thereby improved the cleaning efficiency.
2. The utility model provides a chemical cleaning equipment of semiconductor display substrate will place piece and installation frame connection through the telescopic link to can be through the length that changes the telescopic link and then change two distances of placing the piece, thereby adapt to the not semiconductor display substrate of equidimension, and then improved chemical cleaning equipment's adaptability. In addition, the distance between the two placing blocks of each placing structure is changed, so that semiconductor display substrates with different specifications can be cleaned simultaneously, and the adaptability of the chemical cleaning equipment is further improved.
3. The utility model provides a chemical cleaning equipment of semiconductor display substrate is provided with universal ball through the bottom utensil at pinch-off blades and spout to rolling friction that shifts sliding friction has reduced frictional force, has utilized the less law of ball and plane area of contact simultaneously, has reduced semiconductor display substrate and cleaning equipment's contact surface and has connect, thereby has improved the cleaning performance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a perspective view of a chemical cleaning apparatus for a semiconductor display substrate according to an embodiment of the present invention;
FIG. 2 is a perspective view of a cleaning fixture of the chemical cleaning apparatus for a semiconductor display substrate shown in FIG. 1;
FIG. 3 is a top view of the cleaning fixture shown in FIG. 2;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
fig. 5 is an enlarged view at B shown in fig. 4.
Reference numerals:
1-cleaning tank, 2-cleaning jig, 21-mounting frame, 211-supporting plate, 212-supporting rod, 22-placing structure, 221-placing block, 2211-sliding groove, 2212-sliding hole, 222-clamping plate, 2221-sliding rod, 223-clamping spring, 224-telescopic rod, 225-reset spring, 226-universal ball, 3-driving mechanism, 31-screw nut structure and 32-driving motor.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience of description and simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting.
Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1-5, the present invention provides a chemical cleaning apparatus for semiconductor display substrates, which comprises a cleaning tank 1, a cleaning fixture 2 and a driving mechanism 3.
The cleaning jig 2 is used for placing a semiconductor display substrate, and includes a mounting frame 21 and a plurality of placing structures 22 for placing the semiconductor display substrate.
The mounting frame 21 includes two left and right support plates 211 and a plurality of support rods 212 connecting the two support plates 211.
The placement structure 22 includes two placement blocks 221, a clamping plate 222, and a clamping spring 223. The two placing blocks 221 are symmetrically arranged on two sides of the inside of the mounting frame 21, and the opposite sides of the two placing blocks 221 are respectively provided with a sliding groove 2211 along the length direction thereof, that is, the right side of the left placing block 221 and the left side of the right placing block 221 are respectively provided with a sliding groove 2211. The clamping plate 222 is slidably mounted in the sliding slot 2211, and a sliding rod 2221 is disposed on the top of the clamping plate 222, and the sliding rod 2221 is slidably connected to the placing block 221 through a sliding hole 2212 formed on the placing block 221. The clamping spring 223 is sleeved on the sliding bar 2221, and both ends of the clamping spring 223 are respectively abutted against the clamping plate 222 and the placing block 221, and in a natural state, the clamping spring 223 bears a pressure to provide a stress for clamping the semiconductor display substrate. Preferably, the number of the sliding bars 2221 and the clamping springs 223 is plural and corresponds to one another, so that the clamping force can be increased and the force applied to the semiconductor display substrate can be more uniform. Preferably, an end of the bottom of the clamping plate 222 is provided with a circular arc surface or a slope, and the bottom of the same sliding slot 2211 is provided with a circular arc surface or a slope matched with the circular arc surface or the slope, so as to facilitate the insertion of the semiconductor display substrate.
The plurality of placing structures 22 are sequentially spaced along the longitudinal direction. Thus, the number of semiconductor display substrates cleaned at one time can be increased, thereby improving the work efficiency.
The driving mechanism 3 is used for driving the cleaning jig 2 to do reciprocating linear motion up and down.
When the cleaning device is used, the semiconductor display substrate is inserted between the clamping block and the sliding groove 2211, the semiconductor display substrate is stably placed on the cleaning jig 2 under the action of the elastic force of the clamping spring 223, and then the cleaning jig 2 moves downwards under the action of the driving mechanism 3 and brings the semiconductor display substrate into the cleaning tank 1 for cleaning. After the cleaning is completed, under the action of the driving mechanism 3, the cleaning jig 2 moves upward and takes the semiconductor display substrate out of the cleaning tank 1, and then the semiconductor display substrate is taken out. And finishing one-time cleaning.
In one embodiment, opposite sides of the two placement blocks 221 are respectively connected to the mounting frame 21 through the extension rods 224, that is, the left side of the left placement block 221 and the right side of the right placement block 221 are respectively fixedly connected to the mounting frame 21 through the extension rods 224. The telescopic rod 224 is sleeved with a return spring 225, two ends of the return spring 225 are respectively abutted to the placing block 221 and the mounting frame 21, and the return spring 225 bears pressure in a natural state to provide stress for transversely clamping the semiconductor display substrate. In the using process, the distance between the two placing blocks 221 can be changed by changing the length of the telescopic rod 224, so that semiconductor display substrates with different specifications can be placed, and meanwhile, the distance between each placing structure 22 can be changed, so that the semiconductor display substrates with different specifications can be cleaned at the same time, and the adaptability of the device is improved. In addition, the return spring 225 may provide a laterally clamping stress, thereby making the semiconductor display substrate more stable in placement. Preferably, the number of the expansion rods 224 is plural, and the number of the return springs 225 is equal to and corresponds one-to-one to the number of the expansion rods 224, so that the connection of the placing block 221 and the mounting frame 21 is more stable, and at the same time, the clamping stress for clamping the semiconductor display substrate can be improved.
In one embodiment, the clamping plate 222 and the bottom of the chute 2211 are each provided with a plurality of universal balls 226. This structure can convert the sliding friction between the semiconductor display substrate and the chute 2211 or the clamping plate 222 into the rolling friction between the semiconductor display substrate and the universal balls 226, thereby reducing the friction. Preferably, the gimbal balls 226 are uniformly distributed along the length direction of the clamping plate 222 and the chute 2211 to uniformly apply force to the semiconductor display substrate.
In one embodiment, the driving mechanism 3 includes two screw nut structures 31 and a driving motor 32, the two screw nut structures 31 are respectively disposed on two sides of the cleaning fixture 2 through a bracket (not shown in the drawings), and nuts of the two screw nut structures 31 are respectively fixedly connected with the cleaning fixture 2, the driving motor 32 is mounted on the bracket, and a power output end of the driving motor is connected with a power input end of a screw of the two screw nut structures 31. The driving mechanism 3 with the structure has simple structure and reliable operation.
The working principle of the utility model is as follows:
when the cleaning device is used, the semiconductor display substrate is inserted between the clamping block and the sliding groove 2211, the semiconductor display substrate is stably placed on the cleaning jig 2 under the action of the elastic forces of the clamping spring 223 and the return spring 225, and then the cleaning jig 2 moves downwards under the action of the driving mechanism 3 and brings the semiconductor display substrate into the cleaning tank 1 for cleaning. After the cleaning is completed, under the action of the driving mechanism 3, the cleaning jig 2 moves upward and takes the semiconductor display substrate out of the cleaning tank 1, and then the semiconductor display substrate is taken out. And finishing one-time cleaning.
In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (4)
1. A chemical cleaning apparatus for a semiconductor display substrate, comprising a cleaning tank, characterized in that: also comprises a cleaning jig and a driving mechanism,
the cleaning jig is used for placing a semiconductor display substrate and comprises a mounting frame and a plurality of placing structures,
the placing structure comprises two placing blocks, a clamping plate and a clamping spring, the two placing blocks are symmetrically arranged on two sides of the inner part of the installing frame, sliding grooves are respectively arranged on one opposite sides of the two placing blocks along the length direction of the two placing blocks, the clamping plate is arranged in the sliding grooves in a sliding manner, a sliding rod is arranged at the top of the clamping plate and is connected with the placing blocks in a sliding manner through sliding holes arranged on the placing blocks, the clamping spring is sleeved on the sliding rod, and two ends of the clamping spring are respectively abutted against the clamping plate and the placing blocks,
a plurality of the placing structures are sequentially arranged at intervals along the longitudinal direction,
the driving mechanism is used for driving the cleaning jig to do vertical reciprocating linear motion.
2. A chemical cleaning apparatus for a semiconductor display substrate according to claim 1, wherein: two place the piece one side in opposite directions respectively through the telescopic link with install the frame connection, the cover is equipped with reset spring on the telescopic link, reset spring's both ends respectively with place the piece with install the frame butt.
3. A chemical cleaning apparatus for a semiconductor display substrate according to claim 2, wherein: the clamping plate and the bottom of the sliding groove are provided with a plurality of universal balls.
4. A chemical cleaning apparatus for a semiconductor display substrate according to claim 3, wherein: the driving mechanism comprises two lead screw nut structures and a driving motor, the two lead screw nut structures are respectively arranged on two sides of the cleaning jig, nuts of the two lead screw nut structures are respectively fixedly connected with the cleaning jig, and a power output end of the driving motor is connected with power input ends of lead screws of the two lead screw nut structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020348017.7U CN211965189U (en) | 2020-03-18 | 2020-03-18 | Chemical cleaning equipment for semiconductor display substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020348017.7U CN211965189U (en) | 2020-03-18 | 2020-03-18 | Chemical cleaning equipment for semiconductor display substrate |
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| Publication Number | Publication Date |
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| CN211965189U true CN211965189U (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020348017.7U Active CN211965189U (en) | 2020-03-18 | 2020-03-18 | Chemical cleaning equipment for semiconductor display substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114101208A (en) * | 2021-11-30 | 2022-03-01 | 重庆芯洁科技有限公司 | Ceramic substrate ultrasonic cleaning device for CVD |
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2020
- 2020-03-18 CN CN202020348017.7U patent/CN211965189U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114101208A (en) * | 2021-11-30 | 2022-03-01 | 重庆芯洁科技有限公司 | Ceramic substrate ultrasonic cleaning device for CVD |
| CN114101208B (en) * | 2021-11-30 | 2022-12-20 | 重庆芯洁科技有限公司 | Ceramic substrate ultrasonic cleaning device for CVD |
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