CN113663995A - Anti-deformation clamping mechanism for cleaning wafer box - Google Patents
Anti-deformation clamping mechanism for cleaning wafer box Download PDFInfo
- Publication number
- CN113663995A CN113663995A CN202110730269.5A CN202110730269A CN113663995A CN 113663995 A CN113663995 A CN 113663995A CN 202110730269 A CN202110730269 A CN 202110730269A CN 113663995 A CN113663995 A CN 113663995A
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- Prior art keywords
- clamping
- cleaning
- frame
- wafer
- box
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
- B08B9/283—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking by gas jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/0821—Handling or manipulating containers, e.g. moving or rotating containers in cleaning devices, conveying to or from cleaning devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
- B08B9/30—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking and having conveyors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses an anti-deformation splitting mechanism for a wafer cassette, which comprises a clamping frame, a clamping arm, a clamping cylinder, adsorption bowls and a vacuum generator, wherein the clamping frame is arranged at the lower end of a supporting frame, the clamping arm is arranged at the lower end of the clamping frame, the fixing part of the clamping cylinder is arranged at the middle position of the top of the clamping frame, the clamping cylinder is used for driving the clamping arm to extend or contract so as to enable the two adsorption bowls to be changed from a relative state to a downward state, the adsorption bowls are arranged at the lower ends of the clamping arms, and the vacuum generator is used for enabling negative pressure to be generated in the adsorption bowls. The utility model provides a deformation fixture prevents for washing wafer box adsorbs bowl and adsorbs the body and the lid of wafer box respectively under the vacuum generator effect, by the centre gripping arm under the drive of centre gripping cylinder, makes the body of wafer box and lid reach the state of alternate segregation in the state that is in the same place, washs the back that finishes, can make the body and the lid of wafer box be in the same place by the centre gripping arm again, has realized automatic wafer box that combines, convenient washing to wafer box.
Description
Technical Field
The invention relates to the field of wafer box cleaning, in particular to an anti-deformation clamping mechanism for cleaning a wafer box.
Background
The wafer box mainly plays a role in placing and conveying wafers in semiconductor production, and in order to simplify transportation and reduce the risk of contamination as much as possible, a chip manufacturer uses the wafer box to carry and store the wafers; the wafer box has symmetrical grooves therein, and the grooves have strictly uniform dimensions for supporting both sides of the wafer, and usually one wafer box holds 25 wafers. The wafer box is generally made of a temperature-resistant, wear-resistant and anti-static semitransparent plastic material, and additives with different colors are used for distinguishing metal process sections in semiconductor production; in the cleaning process of the wafer box, a mechanism is needed to open the wafer box and place the body and the cover body of the wafer box into the cleaning tank to complete cleaning, so that a mechanism capable of opening, clamping and separating wafers is urgently needed.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide a deformation preventing clamping mechanism for cleaning a wafer cassette.
The invention realizes the purpose through the following technical scheme:
the utility model provides a clamping mechanism of preapring for an unfavorable turn of events for rinsing wafer box, includes holding frame, centre gripping arm, centre gripping cylinder, adsorbs bowl, vacuum generator, the holding frame is installed the support frame lower extreme, the centre gripping arm is installed the holding frame lower extreme, centre gripping cylinder fixed part is installed centre gripping frame top intermediate position, the centre gripping cylinder is used for the drive the centre gripping arm extends or contracts so that two adsorb the bowl and alternate between the relative state to the state down, it installs to adsorb the bowl the centre gripping arm lower extreme, vacuum generator is used for making adsorb and produce the negative pressure in the bowl.
Preferably, in the anti-deformation clamping mechanism for cleaning the wafer cassette of the invention, the clamping frame is connected with the supporting frame through bolts, the clamping arm is rotatably connected with the clamping frame, and the clamping cylinder fixing part is connected with the clamping frame through bolts.
Preferably, according to the deformation-preventing clamping mechanism for cleaning the wafer cassette of the present invention, the telescopic part of the clamping cylinder is provided with the sliding frame, and the upper end of the clamping arm is arranged at the inner side of the sliding frame of the telescopic part of the clamping cylinder.
Preferably, according to the deformation-preventing clamping mechanism for cleaning the wafer cassette, the fixing frame is connected with the case through bolts, and the purging fan is connected with the fixing frame through bolts.
Preferably, according to the deformation-preventing clamping mechanism for cleaning the wafer cassette, the adsorption bowl is fixedly connected with the clamping arm, and the vacuum generator is connected with the adsorption bowl through a pipeline.
Preferably, the deformation preventing clamping mechanism for cleaning the wafer cassette of the present invention,
the anti-deformation clamping mechanism for cleaning the wafer box is characterized in that two sides of the anti-deformation clamping mechanism are also provided with a cleaning box capable of lifting, and after the clamping arms are stretched, the cleaning box can lift to enable the adsorption bowl and the adsorbed wafer box to enter the cleaning box.
Preferably, the deformation preventing clamping mechanism for cleaning the wafer cassette of the present invention,
an ultrasonic vibration head is arranged in the cleaning box.
Preferably, the deformation preventing clamping mechanism for cleaning the wafer cassette of the present invention,
and blowing fans are further arranged on two sides below the clamping arms, and the blowers are used for blowing and drying the wafer boxes adsorbed by the adsorption bowls which are stretched.
Compared with the prior art, the invention has the following beneficial effects:
1. the utility model provides a deformation fixture prevents for washing wafer box adsorbs bowl and adsorbs the body and the lid of wafer box respectively under the vacuum generator effect, by the centre gripping arm under the drive of centre gripping cylinder, makes the body of wafer box and lid reach the state of alternate segregation in the state that is in the same place, washs the back that finishes, can make the body and the lid of wafer box be in the same place by the centre gripping arm again, has realized automatic wafer box that combines, convenient washing to wafer box.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an anti-deformation cleaning device for a wafer cassette according to the present invention;
FIG. 2 is a partial view of a second shield plate of the anti-deformation cleaning device for a wafer cassette according to the present invention;
FIG. 3 is a sectional view of an anti-deformation cleaning apparatus for a wafer cassette according to the present invention;
FIG. 4 is a partial sectional view of a housing of an anti-deformation cleaning apparatus for a wafer cassette according to the present invention;
FIG. 5 is a partial view of a cleaning mechanism of the deformation preventing cleaning apparatus for a wafer cassette according to the present invention;
FIG. 6 is a partial view of a purging mechanism of the anti-deformation cleaning device for wafer cassettes according to the present invention;
FIG. 7 is a partial view of a clamping mechanism of the anti-deformation cleaning device for wafer cassettes according to the present invention;
fig. 8 is a partial part view of a transfer mechanism of the deformation-preventing cleaning apparatus for a wafer cassette according to the present invention.
The reference numerals are explained below:
1. a purging mechanism; 2. a clamping mechanism; 3. a conveying mechanism; 4. a cleaning mechanism; 5. a filter box; 6. a chassis; 7. a positive pressure fan; 8. a fixed rail; 11. a linkage motor; 12. a support frame; 13. a linkage screw; 14. a fixed mount; 15. purging the fan; 21. a clamping frame; 22. a clamp arm; 23. a clamping cylinder; 24. adsorbing the bowl; 25. a vacuum generator; 31. a first guard plate; 32. a second guard plate; 33. a conveying motor; 34. a conveyor belt; 35. a conveying roller; 41. lifting a screw rod; 42. a cleaning tank; 43. an ultrasonic vibration head.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
example 1
As shown in fig. 3 to 6, the anti-deformation clamping mechanism for cleaning a wafer cassette comprises a clamping frame 21, a clamping arm 22, a clamping cylinder 23, an adsorption bowl 24 and a vacuum generator 25, wherein the clamping frame 21 is installed at the lower end of the supporting frame 12, the clamping arm 22 is installed at the lower end of the clamping frame 21, the fixing part of the clamping cylinder 23 is installed at the middle position of the top of the clamping frame 21, the clamping cylinder 23 is used for driving the clamping arm 22 to extend or contract so as to change the two adsorption bowls 24 from the opposite state to the downward state, the adsorption bowl 24 is installed at the lower end of the clamping arm 22, and the vacuum generator 25 is used for generating negative pressure in the adsorption bowl 24.
It should be noted that, in fig. 3, the wafer cassette corresponding to the adsorption bowl 24 is in a separable cylindrical shape (the main body and the cover body can be separated from each other), and a plurality of wafers can be stacked inside the wafer cassette, and if the wafer cassette is a wafer cassette of other shape, the adsorption bowl 24 only needs to be set in a corresponding shape.
The deformation-preventing clamping mechanism for cleaning the wafer box of the embodiment comprises a body and a cover body, wherein the body and the cover body of the wafer box are respectively adsorbed by an adsorption bowl 24 under the action of a vacuum generator 25, the body and the cover body of the wafer box are driven by a clamping arm 22 under a clamping cylinder 23, the body and the cover body of the wafer box reach the mutually separated state in the combined state, after the wafer box is cleaned, the body and the cover body of the wafer box can be combined together by the clamping arm 22, the automatic wafer box combination is realized, and the wafer box is convenient to clean.
Further, the clamping frame 21 is connected with the supporting frame 12 through bolts, the clamping arm 22 is rotatably connected with the clamping frame 21, and the fixing portion of the clamping cylinder 23 is connected with the clamping frame 21 through bolts.
Further, the telescopic part of the clamping cylinder 23 is provided with a sliding frame, and the upper end of the clamping arm 22 is arranged on the inner side of the sliding frame of the telescopic part of the clamping cylinder 23.
Further, the fixing frame 14 is connected with the case 6 through bolts, and the purge fan 15 is connected with the fixing frame 14 through bolts.
Further, the adsorption bowl 24 is fixedly connected with the clamping arm 22, and the vacuum generator 25 is connected with the adsorption bowl 24 through a pipeline.
Further, the two sides of the anti-deformation clamping mechanism for cleaning the wafer cassette are further provided with a cleaning box 42 capable of lifting, and after the clamping arm 22 is stretched, the cleaning box 42 can lift to enable the adsorption bowl 24 and the adsorbed wafer cassette to enter the cleaning box 42.
Further, an ultrasonic vibration head 43 is provided in the cleaning tank 42. The ultrasonic vibration head 43 vibrates the cleaning liquid in the cleaning tank 42, thereby improving the cleaning effect.
Further, two sides below the clamping arm 22 are further provided with a blowing fan 15, and the blowing fan is used for blowing and drying the wafer cassette adsorbed by the expanded adsorption bowl 24. The purging fan 15, the cleaning box 42 and the adsorption bowl 24 together form a cleaning mechanism, and the cleaning box 42 is lifted to form avoidance, so that the cleaning and blow-drying operations are effectively completed in the same space.
Example 2
As shown in fig. 1, 2, 3, 4, 5, 6, 7, and 8, an anti-deformation cleaning device for a wafer cassette includes a conveying mechanism 3 for conveying the wafer cassette, a cleaning mechanism 4 for cleaning the wafer cassette, and a case 6, wherein the conveying mechanism 3 is located at the lower side inside the case 6, the cleaning mechanism 4 is located inside the case 6 and above the conveying mechanism 3, the anti-deformation cleaning device further includes a purging mechanism 1 for drying the cleaned wafer cassette, a clamping mechanism 2 for clamping the wafer cassette, a filter box 5, a positive pressure fan 7, and a fixed rail 8, the filter box 5 is located at the top of the case 6, and the positive pressure fan 7 is located at the top of the filter box 5;
the purging mechanism 1 comprises a linkage motor 11, a support frame 12, linkage screws 13, a fixing frame 14 and a purging fan 15, the linkage screws 13 are arranged on the front side and the rear side inside the case 6, the linkage motor 11 is arranged on the front side and the rear side inside the case 6 and is positioned on one side of the linkage screws 13, the upper end of the support frame 12 is arranged on the outer side of the linkage screws 13, the fixing frame 14 is arranged on the front side and the rear side inside the case 6 and is positioned below the linkage screws 13, and the purging fan 15 is arranged on the lower side of the fixing frame 14;
the clamping mechanism 2 comprises a clamping frame 21, a clamping arm 22, a clamping cylinder 23, an adsorption bowl 24 and a vacuum generator 25, wherein the clamping frame 21 is installed at the lower end of the support frame 12, the clamping arm 22 is installed at the lower end of the clamping frame 21, the fixing part of the clamping cylinder 23 is installed at the middle position of the top of the clamping frame 21, the adsorption bowl 24 is installed at the lower end of the clamping arm 22, the vacuum generator 25 is arranged on the side surface of the adsorption bowl 24, and the fixed rail 8 is installed at the position, close to the linkage screw 13, of the top of the case 6;
the conveying mechanism 3 comprises a first guard plate 31, a second guard plate 32, a conveying motor 33, a conveying belt 34, conveying rollers 35, the second guard plate 32 is connected to one end of the case 6 through bolts, the first guard plate 31 is connected to the other end of the case 6 through bolts, the conveying motor 33 is connected to the front side of one end of the second guard plate 32 through bolts, the two conveying rollers 35 are connected to the end parts of the first guard plate 31 and the second guard plate 32 through bearings respectively, the conveying belt 34 is arranged on the outer side of the conveying rollers 35, the first guard plate 31 and the second guard plate 32 are used for supporting the two conveying rollers 35, meanwhile, the conveying rollers 35 on one side are driven to rotate by the rotating part of the conveying motor 33, and the conveying rollers 34 are driven to synchronously rotate through the rotation of the conveying rollers 35;
the cleaning mechanism 4 comprises a lifting screw 41, a cleaning box 42 and an ultrasonic vibration head 43, wherein the lifting screw 41 is connected to the front side and the rear side inside the case 6 through bearings and is positioned at the other end of the linkage screw 13, the cleaning box 42 is connected to the outer side of the lifting screw 41 through threads, the ultrasonic vibration head 43 is arranged on an inclined plane inside the cleaning box 42, the upper end of the lifting screw 41 is connected with the other end of the linkage screw 13 through a bevel gear, the lifting screw 41 is driven to rotate by the bevel gear at the other end of the linkage screw 13, the rear end of the cleaning box 42 is driven to move downwards through the rotation of the lifting screw 41, and the wafer box is cleaned through the ultrasonic vibration head 43 on the inclined plane of the cleaning box 42;
the linkage screw 13 is connected with the case 6 through a bearing, the linkage motor 11 is connected with the case 6 through a bolt, the support frame 12 is connected with the linkage screw 13 through a thread, the linkage screw 13 is driven to rotate by the rotating part of the linkage motor 11, the support frame 12 is driven to move on two sides through the rotation of the linkage screw 13, and therefore the wafer box on the adsorption bowl 24 is driven to move to the upper side of the purging fan 15 for purging;
the clamping frame 21 is connected with the supporting frame 12 through bolts, the clamping arm 22 is rotatably connected with the clamping frame 21, the fixing part of the clamping cylinder 23 is connected with the clamping frame 21 through bolts, the supporting frame 12 is used for driving the clamping frame 21 to move on two sides, and the wafer box is clamped and fixed through the rotation of the clamping arm 22; the top of the case 6 is provided with an air supply square hole, the filter box 5 is connected with the top of the case 6 through a bolt, the positive pressure fan 7 is connected with the filter box 5 through a bolt, external air is fed into the case 6 through the filter box 5 by utilizing the positive pressure fan 7, and the air is filtered through the filter box 5; the telescopic part of the clamping cylinder 23 is provided with a sliding frame, the upper end of the clamping arm 22 is arranged at the inner side of the sliding frame of the telescopic part of the clamping cylinder 23, and the clamping arm 22 is driven to turn over at the lower end of the clamping frame 21 by utilizing the extension and the shortening of the telescopic part of the clamping cylinder 23;
an arc-shaped rubber supporting seat is arranged on the outer side of the conveying belt 34, and the wafer box is fixed by the arc-shaped rubber supporting seat on the outer side of the conveying belt 34;
the fixed frame 14 is connected with the case 6 through bolts, the purging fan 15 is connected with the fixed frame 14 through bolts, the purging fan 15 is supported by the fixed frame 14, and the purging fan 15 is used for purging the wafer boxes before and after cleaning;
adsorb bowl 24 and centre gripping arm 22 fixed connection, vacuum generator 25 is connected with adsorbing bowl 24, utilizes vacuum generator 25 to bleed and makes and adsorb output negative pressure in bowl 24 (the internal surface of adsorbing bowl 24 has a plurality of gas pockets), adsorbs fixedly through adsorbing bowl 24 with the both ends of wafer box.
The working principle is as follows: firstly, a wafer box to be cleaned is placed on an arc-shaped rubber supporting seat on the outer side of a conveying belt 34, a rotating part of a conveying motor 33 drives a conveying roller 35 at the rear end of the conveying motor to rotate at the moment, the conveying belt 34 is driven to rotate towards the interior of a case 6 through the rotation of the conveying roller 35, the wafer box enters the interior of the case 6 along with the rotation of the conveying belt 34 at the moment, meanwhile, a filter box 5 and a positive pressure fan 7 on the top of the case 6 are started, outside air is blown to the interior of the filter box 5 through the positive pressure fan 7, the air is filtered through a filter plate in the filter box 5, and the filtered air continuously flows into the interior of the case 6, so that the air pressure in the case 6 is higher than the outside air pressure, and the wafer box is ensured not to cause secondary pollution after being opened in the interior of the case 6; when the wafer box moves between the two adsorption bowls 24, the carriage of the expansion part of the clamping cylinder 23 drives the upper end of the clamping arm 22 to move upwards, at the moment, the two adsorption bowls 24 at the lower end of the clamping arm 22 are tightly attached to the box cover and the box body of the wafer box, simultaneously, the vacuum generator 25 starts to pump out air in the adsorption bowls 24, so that the two adsorption bowls 24 are adsorbed on the box body and the box cover, then the expansion part of the clamping cylinder 23 pushes the carriage to move downwards, so that the lower end of the clamping arm 22 turns over towards the upper side towards the outer side by taking the connecting position of the clamping frame 21 and the clamping arm 22 as the center, the box body and the box cover of the wafer box are opened by the adsorption of the adsorption bowls 24, then the rotating part of the linkage motor 11 drives the linkage screw 13 to rotate, the support frame 12 and the clamping mechanism 2 are driven to move towards the first guard plate 31 by the rotation of the linkage screw 13, and in the process that the support frame 12 drives the clamping mechanism 2 to move horizontally, the inside of the box body and the box cover after the wafer box is opened is purged through the purging fans 15 on the front side and the rear side inside the case 6, so that part of pollutants such as dust is removed, in the horizontal moving process of the clamping mechanism 2, the other end of the linkage screw 13 and the upper end of the lifting screw 41 are transmitted through the conical teeth, the cleaning box 42 moves downwards under the rotation of the lifting screw 41, when the clamping mechanism 2 moves to the other side of the linkage screw 13, the cleaning box 42 is positioned at the lower side of the adsorption bowl 24, at the moment, the telescopic part of the clamping cylinder 23 begins to be shortened, so that the box body and the box cover of the wafer box on the adsorption bowl 24 are both immersed in the cleaning box 42, at the moment, the ultrasonic vibration head 43 on the inclined surface of the cleaning box 42 is used for cleaning the box body and the box cover, when the cleaning of the wafer box is finished, the telescopic part of the clamping cylinder 23 extends downwards, so that the box body and the box cover keep the horizontal opening state downwards, then, the linkage motor 11 rotates to drive the linkage screw 13 to rotate reversely, the support frame 12 and the clamping mechanism 2 are driven to move towards one side through the reverse rotation of the linkage screw 13, and in the moving process, the purging fan 15 starts to purge the cleaned wafer box body and box cover, so that the cleaned water is dried; when fixture 2 removed initial position, the carriage of 23 pars contractilis of centre gripping cylinder moved up, then 22 lower extremes of centre gripping arms closed to the intermediate position to box body and lid straining again that will adsorb bowl 24 are placed on 34 arc rubber support seats of conveyer belt, then accomplish the washing processing to the wafer box.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (8)
1. The utility model provides a clamping mechanism of preapring for an unfavorable turn of events for rinsing wafer box, its characterized in that, includes clamping frame (21), centre gripping arm (22), centre gripping cylinder (23), adsorbs bowl (24), vacuum generator (25), install clamping frame (21) support frame (12) lower extreme, centre gripping arm (22) are installed clamping frame (21) lower extreme, centre gripping cylinder (23) fixed part is installed clamping frame (21) top intermediate position, centre gripping cylinder (23) are used for the drive centre gripping arm (22) extend or shrink so that two adsorb bowl (24) from relative state to transform between the state down, adsorb bowl (24) are installed centre gripping arm (22) lower extreme, vacuum generator (25) are used for making produce the negative pressure in adsorbing bowl (24).
2. The deformation preventing clamping mechanism for cleaning the wafer cassette according to claim 1, wherein the clamping frame (21) is connected with the supporting frame (12) through bolts, the clamping arm (22) is rotatably connected with the clamping frame (21), and the clamping cylinder (23) fixing part is connected with the clamping frame (21) through bolts.
3. The deformation preventing clamping mechanism for cleaning the wafer cassette according to claim 1, wherein the telescopic part of the clamping cylinder (23) is provided with a sliding frame, and the upper end of the clamping arm (22) is arranged inside the sliding frame of the telescopic part of the clamping cylinder (23).
4. The deformation-preventing clamping mechanism for cleaning the wafer cassette according to claim 1, wherein the fixing frame (14) is connected with the cabinet (6) through bolts, and the purging fan (15) is connected with the fixing frame (14) through bolts.
5. The deformation preventing clamping mechanism for washing the wafer cassette according to claim 1, wherein the adsorption bowl (24) is fixedly connected with the clamping arm (22), and the vacuum generator (25) is connected with the adsorption bowl (24) through a pipe.
6. The deformation preventing clamping mechanism for cleaning the wafer cassette according to claim 1,
the anti-deformation clamping mechanism for cleaning the wafer box is characterized in that cleaning boxes (42) capable of lifting are further arranged on two sides of the anti-deformation clamping mechanism, and after the clamping arms (22) are stretched, the cleaning boxes (42) can be lifted to enable the adsorption bowls (24) and the adsorbed wafer box to enter the cleaning boxes (42).
7. The deformation preventing clamping mechanism for cleaning the wafer cassette according to claim 6,
an ultrasonic vibration head (43) is arranged in the cleaning box (42).
8. The deformation preventing clamping mechanism for cleaning the wafer cassette according to claim 1,
and two sides below the clamping arm (22) are also provided with blowing fans (15), and the blowing fans are used for blowing and drying the wafer boxes adsorbed by the adsorption bowls (24) which are stretched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110730269.5A CN113663995A (en) | 2021-06-29 | 2021-06-29 | Anti-deformation clamping mechanism for cleaning wafer box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110730269.5A CN113663995A (en) | 2021-06-29 | 2021-06-29 | Anti-deformation clamping mechanism for cleaning wafer box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113663995A true CN113663995A (en) | 2021-11-19 |
Family
ID=78538337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110730269.5A Withdrawn CN113663995A (en) | 2021-06-29 | 2021-06-29 | Anti-deformation clamping mechanism for cleaning wafer box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113663995A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116967235A (en) * | 2023-09-25 | 2023-10-31 | 苏州普洛泰科精密工业有限公司 | Wafer box automatic cleaning and detecting integrated equipment and method |
-
2021
- 2021-06-29 CN CN202110730269.5A patent/CN113663995A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116967235A (en) * | 2023-09-25 | 2023-10-31 | 苏州普洛泰科精密工业有限公司 | Wafer box automatic cleaning and detecting integrated equipment and method |
| CN116967235B (en) * | 2023-09-25 | 2023-12-15 | 苏州普洛泰科精密工业有限公司 | Wafer box automatic cleaning and detecting integrated equipment and method |
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Application publication date: 20211119 |