CN116967235B - Wafer box automatic cleaning and detecting integrated equipment and method - Google Patents
Wafer box automatic cleaning and detecting integrated equipment and method Download PDFInfo
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- CN116967235B CN116967235B CN202311240439.7A CN202311240439A CN116967235B CN 116967235 B CN116967235 B CN 116967235B CN 202311240439 A CN202311240439 A CN 202311240439A CN 116967235 B CN116967235 B CN 116967235B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 141
- 238000000034 method Methods 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 148
- 230000007246 mechanism Effects 0.000 claims abstract description 82
- 238000001514 detection method Methods 0.000 claims abstract description 64
- 238000002347 injection Methods 0.000 claims abstract description 64
- 239000007924 injection Substances 0.000 claims abstract description 64
- 238000005070 sampling Methods 0.000 claims abstract description 58
- 239000007788 liquid Substances 0.000 claims abstract description 38
- 239000012535 impurity Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000010926 purge Methods 0.000 claims abstract description 20
- 238000005086 pumping Methods 0.000 claims description 23
- 239000000428 dust Substances 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 9
- 230000007306 turnover Effects 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 10
- 230000000694 effects Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 113
- 230000003749 cleanliness Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 101000931462 Homo sapiens Protein FosB Proteins 0.000 description 1
- 102100020847 Protein FosB Human genes 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/22—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by soaking alone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G65/00—Loading or unloading
- B65G65/23—Devices for tilting and emptying of containers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
- G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/18—Water
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Food Science & Technology (AREA)
- General Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses integrated equipment and a method for automatically cleaning and detecting wafer boxes, which comprise a drainage cleaning station and a cleaning and detecting station which are arranged in parallel, a box swinging mechanism arranged at the cleaning and detecting station, a water injection sampling mechanism positioned above the box swinging mechanism, a water supply unit for supplying clean water to the water injection sampling mechanism, an impurity detection unit for detecting liquid samples collected by the water injection sampling mechanism and a purging module for purging residual water stains in the cleaned wafer boxes; the material box swinging mechanism comprises a first motor, an X rotating shaft driven by the first motor to rotate, a first support fixed on the X rotating shaft, a second motor fixed on the first support, a Y rotating shaft rotatably arranged on the first support and driven by the second motor to rotate, a second support fixed on the Y rotating shaft and a bearing disc arranged on the second support and used for bearing the wafer box. The invention improves the cleaning effect and the cleaning detection efficiency of the wafer box and saves water resources.
Description
Technical Field
The invention belongs to the technical field of wafer box cleaning equipment, and particularly relates to integrated equipment and method for automatically cleaning and detecting a wafer box.
Background
The open front waferbox FOUP (Front Opening Unified Pod) is a container used in semiconductor processes to protect, transport, and store wafers, and has high cleanliness on the wafer cassette because of the high cleanliness of the wafer surface during the manufacturing process. Therefore, the wafer cassette needs to be cleaned before carrying the wafers.
The cleaning and the detection of traditional wafer box all adopt manual operation, and operating personnel hand the water gun and clean the inside wafer box, then carry the impurity detection mechanism with the wafer box again in carrying impurity detection mechanism, and is efficient, and intensity of labour is big.
In the prior art, patent publication number CN210647622U discloses an automatic cleaning and detecting device for a carrier, which comprises a cleaning machine and an impurity detecting machine, wherein the carrier is conveyed into the cleaning machine through a conveying mechanism to automatically clean the carrier, then the carrier is conveyed to the impurity detecting machine beside through a mechanical arm, the impurity detecting machine is provided with a water injection pipe and two water suction pipes, one water injection pipe is used for injecting water into the carrier, one water suction pipe is used for sampling water in the carrier, the other water suction pipe is used for pumping water in the carrier, during detection, 8 liters of pure water is injected into the carrier through the water injection pipe, then one water suction pipe takes 10 milliliters of aqueous solution as a detection sample, the detection sample is sent into the detecting machine to detect impurities, and then the injected water absorbs light through the other water suction pipe; and then, the air inlet device is used for blowing the carrier, so that the water vapor is dried, and the cleaning is completed. However, this detection device has the following disadvantages:
(1) The cleaning machine and the detecting machine are two independent devices, water resources are consumed for cleaning the cleaning machine after the carrier enters the cleaning machine, then the carrier enters the detecting machine, 8 liters of pure water is required to be injected into the carrier again by the detecting machine, the water resources are seriously consumed, and the environment is not protected;
(2) After the carrier is cleaned, the carrier is put into a detection machine for detection, and water is refilled, so that the time consumption for cleaning and detecting the whole body is long;
(3) In the detector, water in the carrier is discharged in a suction pipe suction mode, so that the efficiency is low and the time is relatively long;
(4) The structure of the cleaning machine is not explicitly described, and it is unclear how to clean the carrier;
(5) If the detecting machine detects that the carrier has impurities and does not meet the cleanliness requirement, the carrier needs to be taken out of the detecting machine and then put back into the cleaning machine for cleaning, and the carrier is put into the detecting machine again for detection after cleaning is finished, and the carrier is moved back and forth for a plurality of times, and as the cleaning mechanism is of a closed cavity structure, the carrier needs to be put in and taken out for a long time, so that the cleaning detection time is seriously prolonged, and the cleaning test efficiency is low;
(6) In the detection machine, the impurity detection is carried out by directly sampling after water injection into the carrier, the injected water does not fully collide with the inside of the carrier, the inside cleanliness of the carrier cannot be directly reflected, and the detection result is not accurate enough and is not scientific and reliable enough.
Therefore, it is necessary to provide a new integrated apparatus and method for cleaning and inspecting wafer cassettes automatically to solve the above-mentioned problems.
Disclosure of Invention
One of the main purposes of the invention is to provide an integrated device for automatically cleaning and detecting wafer boxes, which improves the cleaning effect and the cleaning and detecting efficiency of the wafer boxes and saves water resources.
The invention realizes the aim through the following technical scheme: the integrated equipment for automatically cleaning and detecting the wafer box comprises a drainage cleaning station and a cleaning detection station which are arranged in parallel, a first supporting plate arranged at the drainage cleaning station, a box swinging mechanism arranged at the cleaning detection station, a water injection sampling mechanism positioned above the box swinging mechanism, a water supply unit for supplying clean water to the water injection sampling mechanism, an impurity detection unit for detecting a liquid sample collected by the water injection sampling mechanism, and a purging module for purging residual water stains in the cleaned wafer box; the material box swinging mechanism comprises a first motor, an X rotating shaft driven by the first motor to rotate, a first bracket fixed on the X rotating shaft, a second motor fixed on the first bracket, a Y rotating shaft rotatably arranged on the first bracket and driven by the second motor to rotate, a second bracket fixed on the Y rotating shaft and a bearing disc arranged on the second bracket and used for bearing the wafer box;
the water injection sampling mechanism comprises a water injection module and a water pumping sampling module; the water injection module comprises a water injection pipe positioned above the material box swinging mechanism and a third motor for driving the water injection pipe to horizontally swing, and the water injection pipe is communicated with the water supply unit; the sampling module draws water including being located draw water sampling tube, the drive of feed box wabbler mechanism top draw water sampling tube carries out horizontal oscillation's fourth motor, support the second backup pad of fourth motor and drive the second backup pad carries out the fifth motor of up-and-down motion, draw water sampling tube intercommunication impurity detecting element.
Further, a weighing module is arranged on the second support, and the bearing plate is arranged on the working face of the weighing module.
Further, a plurality of limiting plates for limiting the periphery of the wafer box are arranged in the bearing plate.
Further, a liquid outlet is formed in the bottom of the bearing plate and close to one of the corner positions, and a liquid leakage sensor is arranged at the liquid outlet.
Further, the first supporting plate is of a plate body structure with arranged hollowed holes, and a drainage structure is arranged below the first supporting plate; the periphery of the first supporting plate is provided with a surrounding baffle.
Further, the water injection sampling mechanism further comprises a dust cover, and the dust cover encloses the third motor, the fourth motor, the driving part and the transmission part of the fifth motor.
Further, the water injection pipe is arranged at one end of a third supporting plate, and the other end of the third supporting plate is fixedly connected with the rotating end of the third motor; the third motor drives the third supporting plate to horizontally rotate so as to rotate the water injection pipe to the position above the wafer box; the pumping sampling tube is arranged at one end of a fourth supporting plate, and the other end of the fourth supporting plate is fixedly connected with the rotating end of the fourth motor; the fourth motor drives the fourth supporting plate to horizontally rotate so as to rotate the pumping sampling tube to the position above the wafer box; one side of the dust cover is provided with a first avoidance notch for the third support plate to horizontally swing, and the other opposite side is provided with a second avoidance notch for the fourth support plate to horizontally rotate and move up and down.
Further, the device also comprises a hood, wherein the hood encloses the drainage cleaning station, the cleaning detection station, the water injection sampling mechanism, the material box swinging mechanism and the first supporting plate; and an exhaust unit is arranged at the top of the hood.
Further, the wafer box cleaning device further comprises a turnover conveying mechanism, wherein the wafer box is conveyed between the drainage cleaning station and the cleaning detection station, and cleaning water in the wafer box is poured onto the drainage cleaning station.
Further, the turnover carrying mechanism comprises a sixth motor, a fifth supporting plate which is driven by the sixth motor to horizontally move between the drainage cleaning station and the cleaning detection station, a seventh motor fixed on the fifth supporting plate, a sixth supporting plate which is driven by the seventh motor to move up and down, an eighth motor fixed on the sixth supporting plate, a rotating plate which is driven by the eighth motor to rotate around a Y axis, a ninth motor fixed on the rotating plate and a clamping plate which is driven by the ninth motor to clamp or open.
Further, the purge module is mounted on the rotating plate or the clamping plate.
Another object of the present invention is to provide a wafer cassette automatic cleaning and detecting method based on the above integrated apparatus, which includes the following steps:
s1, placing a wafer box to be cleaned on the bearing plate and positioning the periphery of the wafer box;
s2, moving a water injection pipe in the water injection sampling mechanism to the position above the wafer box, and injecting a set amount of water;
s3, the material box swinging mechanism drives the bearing disc to swing along the X axis and the Y axis with the wafer box according to a set program, and the interior of the wafer box is sufficiently cleaned;
s4, after cleaning, moving a water pumping sampling tube in the water injection sampling mechanism to a space above the wafer box, then descending and extending to a set depth below the liquid level in the wafer box, extracting a set amount of sample liquid, and then conveying the sample liquid to the impurity detection unit for impurity detection; if the detection is not qualified, executing the step S5, and if the detection is qualified, executing the step S6;
s5, pouring the cleaning water in the wafer box at the drainage cleaning station, then placing the wafer box back on the bearing plate, and repeating the steps S2-S4;
s6, pouring the cleaning water in the wafer box at the drainage cleaning station, and then drying residual water stains in the wafer box by using the purging module to finish cleaning and detecting of the wafer box.
Further, a liquid outlet is formed in the bottom of the bearing plate and close to one of the corner positions, and a liquid leakage sensor is arranged at the liquid outlet; before or after the step S3, the material box swinging mechanism drives the bearing plate to deflect towards the direction of the liquid discharge port by a set angle, and the leakage sensor is utilized to detect whether the wafer box has a leakage phenomenon or not.
Compared with the prior art, the integrated equipment and method for automatically cleaning and detecting the wafer box have the beneficial effects that: the cleaning effect and the cleaning detection efficiency of the wafer box are improved, and the water resource is saved. The method comprises the following steps:
(1) The wafer box cleaning and detecting are integrated in the same equipment and are concentrated on the same cleaning and detecting station, the wafer box is not required to be moved after being cleaned, and the cleaning water is directly utilized for impurity detection, so that compared with the original structure, the wafer box cleaning device omits the carrying action of carrying the wafer box from the cleaner to the detecting mechanism; on the other hand, the action of dumping the cleaning water of the wafer box and the action of refilling water of the wafer box in the detector are omitted, and the detection efficiency is improved;
(2) The wafer box is cleaned by using the box swinging mechanism, and then the impurity is detected by using the cleaning water, so that the cleanliness condition inside the wafer box can be reflected more effectively and more truly; on the other hand, water is not required to be injected again, so that water resources are saved, and the environment is protected;
(3) The wafer box is effectively cleaned by arranging the material box swinging mechanism, so that the cleaning effect is improved;
(4) If the impurity detection is unqualified after the wafer box is cleaned for one time, the wafer box is not required to be reversely conveyed, the cleaning water in the wafer box is only required to be poured out and then is cleaned for the second time, the impurity detection can be directly carried out at a cleaning detection station after the secondary cleaning is finished, and the repeated cleaning detection efficiency is higher;
(5) The material box swinging mechanism is provided with a liquid leakage detection sensor, so that liquid leakage detection of the wafer box can be realized;
(6) The drainage cleaning station is arranged beside the cleaning detection station, and the drainage of the cleaning water in the wafer box is completed in a direct dumping mode, so that the efficiency is higher compared with that of a suction mode.
Drawings
FIG. 1 is a schematic view of an embodiment of the present invention with a hood front baffle removed;
FIG. 2 is a schematic view of the structure of the hood according to the embodiment of the present invention with a baffle plate removed;
FIG. 3 is a schematic front view of the hood according to the embodiment of the present invention with the front side baffle removed;
FIG. 4 is a schematic view of a swing mechanism for loading wafer cassettes according to an embodiment of the present invention;
FIG. 5 is a schematic diagram showing the front view of the swing mechanism of the cartridge according to the embodiment of the present invention;
FIG. 6 is a schematic perspective view of a rocking mechanism of a cartridge according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a water injection sampling mechanism according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a position layout structure of a turnover carrying mechanism and a water injection sampling mechanism according to an embodiment of the present invention;
FIG. 9 is a schematic top view of a turnover handling mechanism according to an embodiment of the present invention;
the figures represent the numbers:
100-automatic cleaning and detecting integrated equipment of the wafer box;
200-wafer cassettes;
1-a first supporting plate, 11-hollowed holes and 12-enclosing barriers;
2-a purging module;
the device comprises a 3-material box swinging mechanism, a 31-first motor, a 32-X rotating shaft, a 33-first bracket, a 34-second motor, a 35-Y rotating shaft, a 36-second bracket, a 37-weighing module, a 38-bearing disc, a 39-limiting plate, a 310-liquid outlet and a 311-sensor;
4-water injection sampling mechanism, 41-water injection pipe, 42-third motor, 43-water pumping sampling pipe, 44-fourth motor, 45-second support plate, 46-fifth motor, 47-third support plate and 48-fourth support plate;
5-hood; 6-an exhaust unit; 7-a dust cover, 71-a first avoidance gap, 72-a second avoidance gap;
8-overturning and conveying mechanism, 81-sixth motor, 82-fifth supporting plate, 83-seventh motor, 84-sixth supporting plate, 85-eighth motor, 86-rotating plate, 87-ninth motor and 88-clamping plate.
Detailed Description
Embodiment one:
referring to fig. 1-9, the present embodiment is an integrated apparatus 100 for automatic cleaning and detecting of wafer cassettes, which includes a drainage cleaning station and a cleaning and detecting station arranged in parallel, a first support plate 1 arranged at the drainage cleaning station, a cassette swinging mechanism 3 arranged at the cleaning and detecting station, a water injection sampling mechanism 4 positioned above the cassette swinging mechanism 3, a water supply unit (not identified in the figure) for supplying clean water to the water injection sampling mechanism 4, an impurity detecting unit (not identified in the figure) for detecting a liquid sample collected by the water injection sampling mechanism 4, and a purging module 2 for purging residual water stains inside the wafer cassettes after cleaning; the first supporting plate 1 is a plate body structure with arranged hollowed-out holes 11, and a drainage structure is arranged below the first supporting plate.
The first support plate 1 is used for dumping and draining the cleaning water after the wafer box is cleaned; on the other hand provides a supporting platform, is convenient for carry out the weather clearance of residual water stain after the wafer box washs. The periphery of the first supporting plate 1 is provided with a surrounding baffle 12 to prevent the wafer box from flowing into an external or lateral cleaning detection station during pouring water.
The material box swinging mechanism 3 comprises a first motor 31, an X rotating shaft 32 driven by the first motor 31 to rotate, a first bracket 33 fixed on the X rotating shaft 32, a second motor 34 fixed on the first bracket 33, a Y rotating shaft 35 rotatably arranged on the first bracket 33 and driven by the second motor 34 to rotate, a second bracket 36 fixed on the Y rotating shaft 35, a weighing module 37 fixed on the second bracket 36, a bearing disc 38 arranged on the working surface of the weighing module 37 and a plurality of limiting plates 39 arranged in the bearing disc 38 and limiting the periphery of the wafer box 200.
The weighing module 37 can detect whether the wafer cassette is placed in the carrying tray or not on the one hand, and can detect whether the water injection amount for cleaning is sufficient or not on the other hand.
In addition, a liquid leakage sensor (not shown) is provided at the bottom of the carrier tray 38 near one of the corners. Before or after the cleaning, the first motor 31 and the second motor 34 drive the carrier plate 38 to tilt in the rotation angle direction, and the leakage sensor detects whether the wafer cassette 200 has a leakage phenomenon. A drain 310 is also provided at the bottom of the carrier tray 38 near the corner. The liquid leakage sensor is arranged at the liquid outlet 310, when liquid flows through the liquid outlet 310, the liquid can be contacted with a detection belt of the liquid leakage sensor, so that current flows in the detection belt; the electrode on the detection belt can induce the change of current, so that the leakage detection is realized.
The carrier tray 38 also has a sensor 311 disposed therein for detecting whether the wafer cassette 200 is in place.
During cleaning, the wafer box 200 is placed in the carrying disc 38, and the limiting plate 39 is used for limiting, so that the wafer box 200 cannot horizontally move in the carrying disc 38; then, the water injection sampling mechanism 4 injects a set amount of water into the wafer box 200, and the first motor 31 and the second motor 34 jointly or sequentially act to drive the wafer box 200 to swing around the X/Y axis, so that the automatic cleaning of the interior of the wafer box is realized. Through the swing of the X/Y axis, the wafer box can simulate manual cleaning action to enable the cleaning water to generate rotary motion or back and forth sloshing motion in the wafer box, and the motion of the cleaning water is utilized to generate larger impact force on the inner wall of the wafer box, so that impurities on the surface of the inner wall of the wafer box are washed away, and further the cleaning effect is improved.
The swing angle and the rotation speed of the wafer cassette 200 can be flexibly set according to the water amount during cleaning and the size of the wafer cassette.
The water injection sampling mechanism 4 comprises a water injection module and a water pumping sampling module. The water injection module comprises a water injection pipe 41 positioned above the material box swinging mechanism 3 and a third motor 42 for driving the water injection pipe 41 to horizontally swing, and the water injection pipe 41 is communicated with the water supply unit. The pumping sampling module comprises a pumping sampling tube 43 positioned above the material box swinging mechanism 3, a fourth motor 44 for driving the pumping sampling tube 43 to horizontally swing, a second supporting plate 45 for supporting the fourth motor 44, and a fifth motor 46 for driving the second supporting plate 45 to move up and down, and the pumping sampling tube 43 is communicated with the impurity detection unit.
The embodiment further comprises a hood 5, wherein a drainage cleaning station, a cleaning detection station and various mechanisms (a water injection sampling mechanism 4, a material box swinging mechanism 3 and an impurity detection unit) are enclosed and blocked to form a relatively closed space, and an exhaust unit 6 is arranged at the top of the hood 5 to continuously maintain the cleanliness of air in the hood 5.
The embodiment also provides a wafer box automatic cleaning detection method, which comprises the following steps:
s1, placing a wafer box 200 to be cleaned on a bearing disc 38, and clamping the periphery of the wafer box 200 through a limiting plate 39;
s2, the water injection pipe 41 rotates to the upper side of the wafer box 200, a set amount of water is injected, and meanwhile, the weighing module 37 monitors the water quantity injected into the wafer box 200 in a closed loop manner; the water injection pipe 41 rotates to the side after water injection is completed so as to avoid interference in the shaking process of the wafer box 200;
s3, the first motor 31 and the second motor 34 drive the carrying disc 38 to swing along the X axis and the Y axis of the wafer box 200 according to a set program, and the interior of the wafer box 200 is sufficiently cleaned;
s4, after the cleaning is finished, the water pumping and sampling tube 43 rotates to a space above the wafer box 200, then descends and stretches into a set depth below the liquid level in the wafer box 200, samples with a set amount are extracted, and then the samples are conveyed into the impurity detection unit for impurity detection; if the detection is not qualified, executing a step S5; if the detection is qualified, executing a step S6;
s5, pouring the cleaning water in the wafer box 200 into the drainage cleaning station to be discharged, then placing the cleaning water back onto the bearing disc 38, and repeating the steps S2-S4;
s6, carrying the wafer box 200 onto the first supporting plate 1, pouring out water in the wafer box 200, discharging the water through a drainage structure below, and then drying residual water in the wafer box 200 by using the blowing module 2 to finish cleaning and detecting the wafer box.
Before or after step S3, the first motor 31 and the second motor 34 drive the carrier tray 38 to deflect towards the liquid drain 310 by a set angle, and the leakage sensor is used to detect whether the wafer box 200 has a leakage phenomenon, so that the leakage detection of the wafer box can be completed. When the liquid leakage sensor detects the liquid leakage phenomenon, the device alarms, an operator checks whether the wafer box 200 really has the leakage or not, splashes out in the shaking process, and observes whether the swinging amplitude of the material box swinging mechanism 3 is reasonable or not.
In order to minimize the influence of metal scraps generated by mechanical driving on the cleaning effect of the wafer box; the driving parts and the transmission parts of the third motor 42, the fourth motor 44 and the fifth motor 46 are enclosed by the dust cover 7 to form a relatively closed structure in the embodiment so as to prevent mechanical friction scraps from being adjusted into the wafer box.
The water injection pipe 41 is arranged at one end of a third supporting plate 47, the other end of the third supporting plate 47 is fixedly connected with the rotating end of the third motor 42, and the water injection pipe 41 is overhanging and extending out through the third supporting plate 47, so that the water injection pipe 41 can extend into the upper part of the wafer box 200 through horizontal rotation. A first avoidance gap 71 for the third support plate 47 to swing horizontally is formed on one side of the dust cover 7.
The pumping sampling tube 43 is arranged at one end of a fourth supporting plate 48, the other end of the fourth supporting plate 48 is fixedly connected with the rotating end of the fourth motor 44, and the pumping sampling tube 43 is overhanging and extending out through the fourth supporting plate 48, so that the pumping sampling tube 43 can extend into the upper part of the wafer box 200 through horizontal rotation. The other opposite side of the dust cover 7 is provided with a second avoidance gap 72 for the fourth support plate 48 to horizontally rotate and move up and down.
In this embodiment, the wafer cassette 200 is manually carried between the drainage cleaning station and the cleaning detection station, so that the influence of metal chips generated by mechanical driving on cleaning the wafer cassette can be reduced as much as possible; because the drainage cleaning station and the cleaning detection station are adjacently arranged in the same equipment, the path for carrying the wafer box by an operator is very short, and the translation carrying with a larger distance basically does not exist, so that the labor intensity can be reduced. Therefore, when the wafer box is manually carried, the purging module 2 can be an air gun which is hung above the first supporting plate 1, and an operator can hold the air gun to purge the wafer box.
In other embodiments, the turnover handling mechanism 8 may be provided to perform automatic handling. The turnover conveying mechanism 8 includes a sixth motor 81, a fifth support plate 82 horizontally moved between the drain cleaning station and the cleaning detection station by the sixth motor 81, a seventh motor 83 fixed to the fifth support plate 82, a sixth support plate 84 vertically moved by the seventh motor 83, an eighth motor 85 fixed to the sixth support plate 84, a rotating plate 86 rotated about the Y axis by the eighth motor 85, a ninth motor 87 fixed to the rotating plate 86, and a chucking plate 88 for performing a chucking or opening operation by the ninth motor 87.
When in carrying, the two clamping plates 88 clamp and hold the cleaned wafer box on the cleaning detection station, and then lift the wafer box upwards to separate from the limit of the limit plate 39; then, the wafer box 200 is tilted by horizontally moving to a set position and the eighth motor 85 drives the rotating plate 86 to rotate around the Y axis, so that water in the wafer box 200 is poured out and poured onto the first supporting plate 1; after the dumping is finished, the wafer box 200 is placed on the first supporting plate 1 after being aligned, and the carrying is finished.
In the case of carrying the wafer cassette 200 to be automated, the purging operation of the residual water stain inside the wafer cassette is also designed to be automated in order to further improve the degree of automation, and the purging module 2 may be mounted on the rotating plate 86 or on the clamping plate 88. Preferably on the clamping plate 88, so that the automatic adjustment of the injection angle of the purge module 2 can be realized by driving the rotating plate 86 under the driving of the eighth motor 85; meanwhile, the ninth motor 87 drives the clamping plate 88 to move in the X direction, so that the position of the purging module 2 in the X direction can be adjusted, and purging within the width range of the wafer box in the X direction can be covered.
The blowing holes of the blowing module 2 are arranged in the Y direction to cover the width range of the wafer box in the Y direction.
In order to prevent the overturning and carrying mechanism 8 from interfering with the water injection and sampling mechanism 4, the water injection and sampling mechanism 4 can be arranged on the right side of the cleaning and detecting station, the overturning and carrying mechanism 8 is arranged on the front side or the rear side of the drainage and cleaning station and the cleaning and detecting station, and when the material box swinging mechanism 3 drives the wafer box to swing, the movable module of the overturning and carrying mechanism 8 moves to the drainage and cleaning station to avoid.
The automatic cleaning and detecting integrated equipment and the method can be suitable for cleaning wafer boxes of the types of FOUP, FOSB and the like.
What has been described above is merely some embodiments of the present invention. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the invention.
Claims (11)
1. Wafer box self-cleaning detects integral type equipment, its characterized in that: the cleaning device comprises a drainage cleaning station and a cleaning detection station which are arranged in parallel, a first supporting plate arranged at the drainage cleaning station, a material box swinging mechanism arranged at the cleaning detection station, a water injection sampling mechanism positioned above the material box swinging mechanism, a water supply unit for supplying clean water to the water injection sampling mechanism, an impurity detection unit for detecting a liquid sample collected by the water injection sampling mechanism, and a purging module for purging residual water stains in a cleaned wafer box; the material box swinging mechanism comprises a first motor, an X rotating shaft driven by the first motor to rotate, a first bracket fixed on the X rotating shaft, a second motor fixed on the first bracket, a Y rotating shaft rotatably arranged on the first bracket and driven by the second motor to rotate, a second bracket fixed on the Y rotating shaft and a bearing disc arranged on the second bracket and used for bearing the wafer box;
the water injection sampling mechanism comprises a water injection module and a water pumping sampling module; the water injection module comprises a water injection pipe positioned above the material box swinging mechanism and a third motor for driving the water injection pipe to horizontally swing, and the water injection pipe is communicated with the water supply unit; the water pumping and sampling module comprises a water pumping and sampling tube positioned above the material box swinging mechanism, a fourth motor for driving the water pumping and sampling tube to horizontally swing, a second supporting plate for supporting the fourth motor and a fifth motor for driving the second supporting plate to vertically move, and the water pumping and sampling tube is communicated with the impurity detection unit;
the second bracket is provided with a weighing module, and the bearing disc is arranged on the working surface of the weighing module; the bottom of the bearing plate is provided with a liquid outlet close to one of the corner positions, and a liquid leakage sensor is arranged at the liquid outlet.
2. The wafer cassette automatic cleaning and inspection integrated apparatus as claimed in claim 1, wherein: a plurality of limiting plates for limiting the periphery of the wafer box are arranged in the bearing plate.
3. The wafer cassette automatic cleaning and inspection integrated apparatus as claimed in claim 1, wherein: the first supporting plate is of a plate body structure with hollow holes arranged, and a drainage structure is arranged below the first supporting plate; the periphery of the first supporting plate is provided with a surrounding baffle.
4. The wafer cassette automatic cleaning and inspection integrated apparatus as claimed in claim 1, wherein: the water injection sampling mechanism further comprises a dust cover, and the dust cover encloses the driving part and the transmission part of the third motor, the fourth motor and the fifth motor.
5. The integrated wafer cassette self-cleaning and inspection apparatus of claim 4, wherein: the water injection pipe is arranged at one end of a third supporting plate, and the other end of the third supporting plate is fixedly connected with the rotating end of the third motor; the third motor drives the third supporting plate to horizontally rotate so as to rotate the water injection pipe to the position above the wafer box; the pumping sampling tube is arranged at one end of a fourth supporting plate, and the other end of the fourth supporting plate is fixedly connected with the rotating end of the fourth motor; the fourth motor drives the fourth supporting plate to horizontally rotate so as to rotate the pumping sampling tube to the position above the wafer box; one side of the dust cover is provided with a first avoidance notch for the third support plate to horizontally swing, and the other opposite side is provided with a second avoidance notch for the fourth support plate to horizontally rotate and move up and down.
6. The wafer cassette automatic cleaning and inspection integrated apparatus as claimed in claim 1, wherein: the machine further comprises a machine cover, wherein the machine cover encloses the drainage cleaning station, the cleaning detection station, the water injection sampling mechanism, the material box swinging mechanism and the first supporting plate; and an exhaust unit is arranged at the top of the hood.
7. The wafer cassette automatic cleaning and inspection integrated apparatus as claimed in claim 1, wherein: the wafer box cleaning device further comprises a turnover conveying mechanism, wherein the wafer box is conveyed between the drainage cleaning station and the cleaning detection station, and cleaning water in the wafer box is poured onto the drainage cleaning station.
8. The wafer cassette automatic cleaning and inspection integrated apparatus as claimed in claim 7, wherein: the overturning and carrying mechanism comprises a sixth motor, a fifth supporting plate which is driven by the sixth motor to horizontally move between the drainage cleaning station and the cleaning and detecting station, a seventh motor fixed on the fifth supporting plate, a sixth supporting plate which is driven by the seventh motor to move up and down, an eighth motor fixed on the sixth supporting plate, a rotating plate which is driven by the eighth motor to rotate around a Y axis, a ninth motor fixed on the rotating plate and a clamping plate which is driven by the ninth motor to clamp or open.
9. The wafer cassette automatic cleaning and inspection integrated apparatus as claimed in claim 8, wherein: the purging module is installed on the rotating plate or the clamping plate.
10. A wafer cassette automatic cleaning and inspection method based on the integrated equipment as set forth in claim 1, characterized in that: which comprises the following steps:
s1, placing a wafer box to be cleaned on the bearing plate and positioning the periphery of the wafer box;
s2, moving a water injection pipe in the water injection sampling mechanism to the position above the wafer box, and injecting a set amount of water;
s3, the material box swinging mechanism drives the bearing disc to swing along the X axis and the Y axis with the wafer box according to a set program, and the interior of the wafer box is sufficiently cleaned;
s4, after cleaning, moving a water pumping sampling tube in the water injection sampling mechanism to a space above the wafer box, then descending and extending to a set depth below the liquid level in the wafer box, extracting a set amount of sample liquid, and then conveying the sample liquid to the impurity detection unit for impurity detection; if the detection is not qualified, executing the step S5, and if the detection is qualified, executing the step S6;
s5, pouring the cleaning water in the wafer box at the drainage cleaning station, then placing the wafer box back on the bearing plate, and repeating the steps S2-S4;
s6, pouring the cleaning water in the wafer box at the drainage cleaning station, and then drying residual water stains in the wafer box by using the purging module to finish cleaning and detecting of the wafer box.
11. The wafer cassette automatic cleaning inspection method of claim 10, wherein: a liquid outlet is formed in the bottom of the bearing plate and close to one of the corners, and a liquid leakage sensor is arranged at the liquid outlet; before or after the step S3, the material box swinging mechanism drives the bearing plate to deflect towards the direction of the liquid discharge port by a set angle, and the leakage sensor is utilized to detect whether the wafer box has a leakage phenomenon or not.
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| CN202311240439.7A CN116967235B (en) | 2023-09-25 | 2023-09-25 | Wafer box automatic cleaning and detecting integrated equipment and method |
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| CN202311240439.7A CN116967235B (en) | 2023-09-25 | 2023-09-25 | Wafer box automatic cleaning and detecting integrated equipment and method |
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| CN116967235B true CN116967235B (en) | 2023-12-15 |
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| CN117680453B (en) * | 2024-02-04 | 2024-05-03 | 上海奔曜科技有限公司 | Liquid storage bottle filling module and liquid distribution platform |
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| CN116967235A (en) | 2023-10-31 |
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