TWM464807U - Wafer cleaning device - Google Patents

Abstract

The utility model discloses a wafer cleaning device comprising a main frame, a wafer loading port, a wafer transferring device, a tank type cleaning device and a single piece cleaning device. The wafer loading port is arranged at the outer side end of the main body frame. The wafer transferring device, the tank type cleaning device and the single piece cleaning device are arranged in the main frame. A wafer box is received and placed in the wafer loading port, and wafer is stored in the wafer box. The tank type cleaning device is provided with a first wafer in and out port used for transferring the wafer. The tank type cleaning device is used for the immersion cleaning of one or more pieces of wafer. The single piece cleaning device is provided with a second wafer in and out port used for transferring the wafer. The single piece cleaning device is used for cleaning and drying the single wafer. The wafer transferring device transfers the wafer among the wafer box at the wafer loading port, the tank type cleaning device and the single piece cleaning device. According to the wafer cleaning device, through the integration of the tank type cleaning device and the single piece cleaning device in the main frame, the transfer of the wafer is completed by one set of wafer transferring device, the period of wafer cleaning process is shortened, the production cost is reduced, and after devices are integrated in one set of device, the occupied space is reduced.

Description

Wafer cleaning device

The present invention relates to the field of semiconductor integrated circuit manufacturing technology, and more particularly to a wafer cleaning apparatus.

For the semiconductor industry, as the critical dimensions of semiconductor devices continue to shrink and new materials are introduced, the cleanliness of semiconductor substrates such as wafer surfaces is becoming more stringent in the manufacturing process of semiconductor devices, and at the same time, due to semiconductors. The shrinking of the critical dimensions of the device narrows the process window for cleaning, which in turn makes it difficult to achieve substrate cleaning efficiency while minimizing substrate surface damage and structural damage. Nowadays, the requirements for the removal of contaminants on the substrate and the degree of damage and structural damage on the substrate surface are becoming higher and higher. Contaminants such as particles, organic matter and metals on the substrate usually require chemical reaction or physical force. To overcome the gravitational or physical adhesion of chemical bonds to be removed.

At present, substrate cleaning is still mainly wet cleaning, and wet cleaning is usually divided into two types: slot cleaning and single chip cleaning. Trench cleaning can process several substrates at the same time, which has high cleaning efficiency. However, with the shrinking of critical dimensions of semiconductor devices, trench cleaning has become increasingly incapable of meeting the requirements of wet cleaning. The biggest disadvantage of tank cleaning is that the removal rate of contaminants is limited because even if high-purity chemicals and deionized water are used in the cleaning, the contaminants washed from the substrate still exist in the cleaning. In the liquid, it will cause secondary pollution to the substrate. In order to avoid secondary contamination of the substrate, single-chip cleaning is gradually replacing the tank cleaning, and single-chip cleaning can effectively prevent secondary contamination of the substrate. During the cleaning of the substrate, new chemical reagents and deionized water are continuously supplied to the surface of the substrate, and the used chemical reagent is directly discharged from the deionized water and recovered. In addition, the yield is an important factor in the transition to single-chip cleaning, which can effectively improve the yield of 100 nanometers and below through the use of single-chip cleaning. Compared with tank cleaning, single-chip cleaning has the advantages of good cleaning effect, high recovery rate of cleaning liquid, and can effectively prevent cross-contamination, but the production capacity is lower than that of tank cleaning.

In some processes, in order to obtain a better cleaning effect, it is necessary to clean the substrate by a combination of trough cleaning and single-chip cleaning, and the existing trough cleaning device and the single-chip cleaning device are completely separate and separate. The device and the substrate are cleaned and dried in the trough cleaning device, and then placed in a single-chip cleaning device for cleaning and drying, thereby resulting in a long cleaning process cycle, high cleaning cost, and large space occupied by the two devices.

The purpose of the present invention is to provide a wafer cleaning device which can not only perform slot cleaning and single-chip cleaning of a wafer, but also can shorten the wafer cleaning process cycle and reduce the cleaning cost, and further, the device takes up less space. .

To achieve the above object, the present invention provides a wafer cleaning apparatus comprising: a main body frame, a wafer loading cassette, a wafer transfer apparatus, a trough cleaning apparatus, and a single piece cleaning apparatus. The wafer loading cassette is disposed at the outer end of the main body frame, the wafer transfer device, the trough cleaning device and the single-chip cleaning device Set in the main frame. The wafer is loaded, the wafer cassette is received and placed, and the wafer cassette is used to store the wafer. The trough cleaning device is provided with a first wafer inlet and outlet for transferring wafers, and the trough cleaning device is used for immersion cleaning of one or more wafers. The single-chip cleaning device is provided with a second wafer inlet and outlet for transferring wafers, and the single-chip cleaning device is used for cleaning and drying a single wafer. The wafer transfer device transfers the wafer between the wafer cassette loaded with the wafer, the tank cleaning device, and the single wafer cleaning device.

In summary, the novel wafer cleaning device integrates the trough cleaning device and the single-chip cleaning device into the main body frame, and the wafer transfer device completes the wafer transfer, thereby shortening the wafer cleaning process cycle and reducing The production cost is reduced and the footprint is reduced after being integrated into a set of devices.

110‧‧‧ Mainframe

120‧‧‧ Wafer loading埠

130‧‧‧ wafer transfer device

131‧‧‧Transfer manipulator

131’‧‧‧Transfer manipulator

132‧‧‧Solution Receiver

133‧‧‧manipulator mounting table

134‧‧‧Robot drive

135‧‧‧ bracket plate

136‧‧‧Support

137‧‧‧Limited blocks

138‧‧‧Draining port

140‧‧‧ trough cleaning device

140'‧‧‧ trough cleaning unit

141‧‧ ‧ partition

141’‧‧‧ Shell

142‧‧‧First wafer import and export

142'‧‧‧First wafer import and export

143‧‧‧ trough cleaning tank

143'‧‧‧ trough cleaning tank

144‧‧‧ Sealing cover

144’‧‧‧ Sealing cover

145‧‧‧Seal baffle

145'‧‧‧ Sealed baffle

146‧‧‧Support frame

146’‧‧‧Support frame

147‧‧‧ Lifting mechanism

147’‧‧‧ Lifting mechanism

148‧‧‧ flip mechanism

148’‧‧‧ Turning mechanism

149‧‧‧wafer cassette

150‧‧‧one-piece cleaning device

151‧‧‧Second wafer import and export

152‧‧‧fan screening program unit

153‧‧‧ ‧ frame

154‧‧‧ ‧ boards

155‧‧‧ sealing ring

160‧‧‧Nitrogen protection device

160'‧‧‧Nitrogen protection device

1311‧‧‧ Groove

1311’‧‧‧ Groove

1312‧‧‧through hole

1312’‧‧‧through hole

1313’‧‧‧ raised

1411’‧‧‧ Vent

1431‧‧‧Internal slot

1432‧‧‧ outer trough

1433‧‧‧liquid outlet

1441‧‧‧ top wall

1442‧‧‧ side wall

1443‧‧‧Back wall

1444‧‧‧Guide trough

Figure 1 is a schematic view showing the structure of a wafer cleaning apparatus according to the present invention.

Figure 2 is a schematic view showing still another structure of the wafer cleaning apparatus according to the present invention.

Figure 3 is a block diagram showing the structure of a wafer transfer apparatus according to the present invention.

Fig. 4 is a view showing still another structure of the wafer transfer apparatus according to the present invention.

Figure 5 is a block diagram showing an embodiment of a transfer robot of a wafer transfer apparatus according to the present invention.

Figure 6 shows a schematic cross-sectional structure along VI-VI according to Figure 5 Figure.

Fig. 7 is a view showing the configuration of still another embodiment of the transfer robot of the wafer transfer apparatus according to the present invention.

Figure 8 is a schematic view showing the structure of the trough cleaning apparatus according to the present invention.

Fig. 9 is a view showing the structure of a trough cleaning tank of the trough cleaning apparatus according to the present invention.

Fig. 10 is a view showing the structure of a sealing cover of the trough cleaning apparatus according to the present invention.

Figure 11 is a cross-sectional view showing the sealing cover according to the present invention.

Figure 12 is a schematic view showing the structure of the slot cleaning device according to the present invention for opening the sealing cover.

Fig. 13 is a view showing still another structural view of the slot cleaning device according to the present invention for opening the sealing cover.

Figure 14 is a schematic view showing still another structure of the trough cleaning apparatus according to the present invention.

Fig. 15 is a view showing the structure of still another embodiment of the trough cleaning apparatus according to the present invention.

Figure 16 is a block diagram showing the structure of a single-piece cleaning apparatus according to the present invention.

Fig. 17 is a view showing a sectional structure along XVII-XVII according to Fig. 16.

Fig. 18 is a partially enlarged view showing a portion B according to Fig. 17.

In order to explain the technical content, structural features, objects and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and drawings.

Referring to Figures 1 and 2, a schematic structural view of a wafer cleaning apparatus according to the present invention is disclosed. The wafer cleaning apparatus includes a main body frame 110, a wafer loading cassette 120, a wafer transfer apparatus 130, a tank cleaning apparatus 140, and a single piece cleaning apparatus 150. The wafer loading cassette 120 is disposed at an outer end of the main body frame 110. The wafer loading cassette 120 receives and places a wafer cassette (not shown), and the wafer cassette stores the wafer to be cleaned or cleaned. The number of wafer loading cassettes 120 is not limited to one, and an appropriate number of wafer units 120 can be selected according to the processing capabilities of the wafer cleaning apparatus. The wafer transfer device 130, the tank cleaning device 140, and the single-chip cleaning device 150 are integrated in the main body frame 110, respectively.

As shown in FIGS. 3 and 4, the wafer transfer device 130 includes a transfer robot 131, a solution receiver 132, and a robot mount 133. The transfer robot 131 is used to transfer wafers between the wafer cassette of the wafer loading cassette 120, the tank cleaning device 140, and the single-chip cleaning device 150. The transfer robot 131 and the solution receiver 132 are both mounted on the robot mounting table 133, and the solution receiver 132 is located below the transfer robot 131. During the process, the solution receiver 132 receives the solution dripped from the transfer robot 131. In order to prevent the solution on the transfer robot 131 from dripping into the wafer cleaning device, the wafer cleaning device is contaminated. The solution receiver 132 is generally funnel shaped, with a liquid discharge port 138 at the bottom of the solution receiver 132, and the solution in the solution receiver 132 is discharged from the liquid discharge port 138.

The wafer transfer device 130 also includes a robot drive 134, a bracket plate 135, and a support 136. The robot mounting platform 133 is mounted on the bracket plate 135, and the robot driving device 134 drives the bracket plate 135 to vertically rise or fall along the support 136, thereby causing the robot mounting platform 133 to vertically ascend or descend. Since the transport robot 131 and the solution receiver 132 are mounted on the robot mount 133, the transfer robot 131 and the solution receiver 132 are vertically raised or lowered with the robot mount 133 to adjust the transfer robot 131 and the solution reception. The height of the 132 in the vertical direction. The top end of the support 136 is provided with a pair of limiting blocks 137. When the bracket plate 135 is vertically raised to the limiting block 137 along the support 136, the bracket plate 135 stops rising. The robot drive 134 can be a cylinder.

Usually, two or more transfer robots 131 are provided. Preferably, at least two transfer robots 131 are provided, one of which is for transferring dry wafers and one for transporting robots 131 for transfer. The wet wafer, the transfer robot 131 for transporting the wet wafer, is located below the transfer robot 131 for transferring the dry wafer. The transfer robot 131 can select a robot that is well known to those skilled in the art, but there is a drawback in the conventional robot when the process is processed, that is, the cleaning solution is accumulated on the robot, and the wafer is stuck when the wafer is picked up by a conventional robot. Attached to the robot is not easy to fall off. In order to solve this drawback, the present invention implements an improvement on a conventional manipulator. As shown in FIGS. 5 and 6, the one side of the transfer robot 131 for carrying a wafer is provided with a substantially V-shaped groove 1311. The opening width of the groove 1311 substantially coincides with the width of the terminal end of the transfer robot 131. A plurality of through holes 1312 are defined in the groove 1311, and are stacked on the transfer robot. The cleaning solution on 131 collects in the recess 1311 and drops from the through hole 1312 into the solution receiver 132 below the transfer robot 131.

Referring to Figure 7, a schematic structural view of yet another embodiment of a transfer robot in accordance with the present invention is disclosed. A side of the transport robot 131' for carrying the wafer is provided with a substantially V-shaped recess 1311', and a plurality of through holes 1312' are formed in the recess 1311'. The difference from the foregoing embodiment is that the surface of the transport robot 131' of the embodiment for carrying the wafer is further provided with a plurality of stepped protrusions 1313'. When the wafer is transported, the plurality of protrusions 1313 'The purpose of holding up the wafer is to minimize the contact area between the wafer and the transfer robot 131', thereby reducing the adhesion between the wafer and the transfer robot 131' to facilitate wafer pick-and-place.

Referring to FIG. 8 and FIG. 12 to FIG. 14 in conjunction with FIGS. 1 and 2, the trough cleaning apparatus 140 includes a partition 141 that isolates the trough cleaning apparatus 140 from the wafer transfer apparatus 130. A wafer transfer device 130 is disposed on the front side of the plate 141, and a groove cleaning device 140 is disposed on the back side of the separator 141. A first wafer inlet and outlet 142 for transferring a wafer is opened on the separator 141, and the transfer robot 131 passes the wafer into the tank cleaning device 140 or from the tank cleaning device 140 through the first wafer inlet and outlet 142. take out. The tank cleaning device 140 disposed on the back side of the partition 141 includes a tank cleaning tank 143, a sealing cover 144, a sealing shutter 145, a support frame 146, a lifting mechanism 147, a turning mechanism 148, and a wafer cassette 149. The trough cleaning tank 143, the sealing cover 144, and the sealing baffle 145 form a closed space for the processing of one or more wafers. The sealing baffle 145 is fixedly mounted on the trough cleaning tank 143. The lifting mechanism 147 is mounted on the support frame 146, the lifting mechanism 147 and the sealing cover 144 is connected, and the lifting mechanism 147 drives the sealing cover 144 to rise or fall to open or close the sealed space. A wafer cassette 149 for placing and holding wafers is mounted on the sealing cover 144, and the turning mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is horizontally disposed within the sealing cover 144 or vertically suspended Under the sealing cover 144.

As shown in Fig. 9, the trough cleaning tank 143 has an inner tank 1431 and an outer tank 1432. The inner tank 1431 stores a cleaning solution such as TMAH, NMP, IPA, DIW or acetone, and the wafer cassette 149 is vertically suspended under the sealing cover 144 and vertically received in the inner groove 1431 for immersion in one or more wafers. Cleaning. The notch of the inner groove 1431 is serrated to prevent the cleaning solution from accumulating on the top surface of the notch of the inner groove 1431. If the cleaning solution is thick, after a period of use, the cleaning solution may solidify at the top of the notch of the inner groove 1431. After the surface is designed to be serrated, the cleaning solution does not accumulate on the top surface of the notch of the inner groove 1431. The bottom surface of the outer groove 1432 is an inclined slope surface, and a liquid outlet 1433 is opened at the bottom of the slope of the slope surface. The liquid outlet 1433 is connected to a liquid inlet of a pump (not shown), and the liquid outlet of the pump is connected to the inner tank 1431 of the tank cleaning tank. A heating device (not shown) is disposed between the liquid outlet of the pump and the inner tank 1431 of the tank cleaning tank. The cleaning solution in the inner groove 1431 overflows through the notch of the inner groove 1431 to the outer groove 1432. Since the bottom surface of the outer groove 1432 is an inclined slope surface, the cleaning solution in the outer groove 1432 is collected at the bottom of the slope surface and is transmitted through The liquid port 1433, the pump and the heating device are then supplied to the inner tank 1431 to constitute a recycling use of the cleaning solution.

The sealing cover 144 is fastened to the trough cleaning tank 143 to form the above-mentioned sealed space. As shown in Figures 10 and 11, the sealing cover 144 has There is a top wall 1441 and two side walls 1442 and a rear wall 1443 which are connected to the top wall 1441. The top wall 1441, the two side walls 1442 and the rear wall 1443 of the sealing cover 144 enclose a receiving space for receiving the wafer cassette 149. The top wall 1441 of the sealing cover 144 is a sloped bevel that is high in front and low in the front. A bottom of the rear wall 1443 of the sealing cover 144 is formed with a flow guiding groove 1444. During the processing, if the temperature of the cleaning solution in the inner tank 1431 of the tank cleaning tank 143 is high, the cleaning solution is vaporized into steam, and in order to prevent steam leakage, the sealing cover 144 is fastened to the tank cleaning tank 143, together with the sealing block. The plate 145 forms the above-described sealed space. After the steam rises to the top wall 1441 of the sealing cover 144, the vapor liquefies on the top wall 1441 of the sealing cover 144, and the liquefied cleaning solution flows along the top wall 1441 of the sealing cover 144 to the rear wall 1443 of the sealing cover 144 and flows into the guiding groove. 1444, then the cleaning solution flows from the diversion tank 1444 into the outer tank 1432 of the tank cleaning tank 143, and is supplied to the inner tank 1431 through the liquid outlet 1433, the pump and the heating device to constitute a recycling solution of the cleaning solution.

Referring to FIGS. 12 to 14, when the wafer cleaning apparatus 140 is used to clean the wafer, the transfer robot 131 takes out the wafer to be cleaned from the wafer cassette at the wafer loading cassette 120, and at this time, the lifting mechanism 147 drives The sealing cover 144 is raised to the height required for the process, and the flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is horizontally disposed within the sealing cover 144. Then, the transfer robot 131 horizontally places the wafer in the wafer cassette 149 through the first wafer inlet and outlet 142. After placing a plurality of wafers into the wafer cassette 149, the flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is vertically suspended below the sealing cover 144. The lifting mechanism 147 drives the sealing cover 144 to descend, and the trough cleaning tank 143, the sealing cover 144 and the sealing baffle 145 form a dense In the closed space, the wafer cassette 149 suspended under the sealing cover 144 is received in the inner groove 1431 of the trough cleaning tank 143 to soak the cleaning wafer. After the wafer cleaning is completed, the lifting mechanism 147 drives the sealing cover 144 to rise, opens the sealed space, and the turning mechanism 148 drives the wafer cassette 149 to flip, so that the wafer cassette 149 is horizontally disposed in the sealing cover 144, and the conveying robot 131 passes through The first wafer inlet and outlet 142 horizontally takes out the wafer from within the wafer cassette 149.

A nitrogen gas protection device 160 is disposed on the back side of the separator 141, and the nitrogen gas protection device 160 is located above the first wafer inlet and outlet port 142. The nitrogen gas protection device 160 is for blowing nitrogen gas to the transfer robot 131 to keep the transfer robot 131 as dry as possible to prevent the wafer from adhering to the transfer robot 131.

In order to increase the service life of the wafer cleaning apparatus, the present invention discloses a further embodiment of the tank cleaning apparatus, as shown in Fig. 15, in which the partition 141 is replaced by a casing 141', the casing 141' The top wall, the bottom wall, the front wall, the rear wall and the two side walls (one of which is not shown in the figure), the top wall, the bottom wall, the front wall, the rear wall and the two side walls of the outer casing 141' are enclosed by a closed Containment space. The trough cleaning tank 143', the sealing cover 144', the sealing baffle 145', the support frame 146', the elevating mechanism 147', the reversing mechanism 148', and the wafer cassette of the trough cleaning device 140' are housed in the sealed Containment space. The side wall of the outer casing 141' is provided with an exhaust port 1411', which is connected to an exhaust device (not shown). Obviously, the exhaust port 1411' is not limited to being opened on the side wall of the outer casing 141', for example, The exhaust port 1411' may also be formed in the rear wall of the outer casing 141'. The front wall of the outer casing 141' is provided with a first wafer inlet and outlet 142'. Nitrogen protection device 160' is placed outside The front wall of the case 141' is housed in the sealed accommodating space. Nitrogen protection device 160' is located above first wafer inlet and outlet 142'. During the process, the nitrogen gas protecting device 160' always blows nitrogen gas to the first wafer inlet and outlet 142', and the pressure difference between the inside and the outside of the outer casing 141' prevents gas leakage in the outer casing 141'. By providing the outer casing 141', the cleaning solution and gas in the tank cleaning device 140' are not leaked into the wafer cleaning device, so that the life of the wafer cleaning device can be improved.

Referring to Figures 16 through 18, the single-chip cleaning apparatus 150 is used for cleaning and drying a single wafer. The single-chip cleaning device 150 is provided with a second wafer inlet and outlet 151 for transferring wafers. A fan screening program unit (FFU) 152 is disposed at the top of the single piece cleaning device 150. The bottom of the single-chip cleaning device 150 is provided with an exhaust port (not shown). The single piece cleaning device 150 is a completely sealed device, and the gas in the single piece cleaning device 150 can only be discharged through the exhaust port. In order to achieve complete sealing of the single-chip cleaning device 150, the present invention uses a large number of sealing rings to seal the single-piece cleaning device 150. For example, the single-chip cleaning device 150 has a frame 153 and a shelf 154 mounted on the frame 153. A seal ring 155 is provided at the mounting portion of the frame body 153 and the shelf plate 154. An ultra/mega sonic apparatus is provided in the single-chip cleaning apparatus 150 to perform ultrasonic/megasonic cleaning of the wafer in the single-chip cleaning apparatus 150. The cleaning solution in the single-chip cleaning device 150 may be TMAH, NMP, IPA, DIW or acetone.

The present invention is provided with a flame detector and a fire extinguisher nozzle in the tank cleaning device 140 and the single-chip cleaning device 150, respectively, for the purpose of ensuring the safety of the tank cleaning device 140 and the single-chip cleaning device 150.

In order to ensure the tank cleaning device 140/140' and single-chip cleaning The sealing of the device 150, the present invention is provided with an inductive door at the first wafer inlet and outlet 142/142' and the second wafer inlet and outlet 151, respectively, only when the transfer robot 131 needs to pass through the first wafer inlet and outlet 142/ When the 142' or the second wafer inlet and outlet 151 picks up the wafer, the sensing door is opened, and the remaining time period, the sensing door is closed.

The process of cleaning the wafer by the novel wafer cleaning device is as follows: the transfer robot 131 takes out the wafer to be cleaned from the wafer cassette at the wafer loading cassette 120, and at this time, the lifting mechanism 147 drives the sealing cover 144 to rise to the process. The flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is horizontally disposed within the sealing cover 144. Then, the transfer robot 131 horizontally places the wafer in the wafer cassette 149 through the first wafer inlet and outlet 142. After placing a plurality of wafers into the wafer cassette 149, the flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is vertically suspended below the sealing cover 144. The lifting mechanism 147 drives the sealing cover 144 to descend. The groove cleaning tank 143, the sealing cover 144 and the sealing baffle 145 form a closed space. The wafer cassette 149 suspended under the sealing cover 144 is received in the inner groove 1431 of the trough cleaning tank 143. To soak the wafer for cleaning. After the wafer cleaning is completed, the lifting mechanism 147 drives the sealing cover 144 to rise, opens the sealed space, and the turning mechanism 148 drives the wafer cassette 149 to flip, so that the wafer cassette 149 is horizontally disposed in the sealing cover 144, and the conveying robot 131 passes through The first wafer inlet and outlet 142 horizontally takes out the wafer from within the wafer cassette 149. Then, the transfer robot 131 passes the wafer into the single-chip cleaning device 150 through the second wafer inlet and outlet 151 for cleaning and drying. After the wafer is cleaned and dried in the single-chip cleaning device 150, the transfer robot 131 passes through the second wafer inlet and outlet 151 from the single-chip cleaning device 150. The wafer is taken out and placed back to the wafer cassette at the wafer loading cassette 120.

In order to improve the processing efficiency of the single wafer, two or more single-chip cleaning devices 150 are usually provided. In the present invention, two single-chip cleaning devices 150 are provided, and the two single-chip cleaning devices 150 are stacked. In the main body frame 110. When the wafer is placed in the top-level single-chip cleaning device 150 or the wafer is removed from the top-level single-chip cleaning device 150, the robot driving device 134 drives the bracket plate 135 to rise vertically along the holder 136, thereby driving the robot mounting table 133. Vertically rising, the transfer robot 131 is at the same height as the second wafer inlet and outlet 151 of the top sheet single-chip cleaning device 150. When the wafer is placed in the underlying single-chip cleaning device 150 or the wafer is removed from the underlying single-chip cleaning device 150, the robot driver 134 drives the carrier plate 135 to vertically descend along the support 136, thereby driving the robot mounting table 133. The vertical drop causes the transfer robot 131 to be at the same height as the second wafer inlet and outlet 151 of the underlying one-chip cleaning device 150.

The novel wafer cleaning device integrates the trough cleaning device 140 and the single-chip cleaning device 150 into the main body frame 110, and the wafer transfer device 130 completes the wafer transfer, thereby shortening the wafer cleaning process cycle and reducing the wafer cleaning process cycle. Production cost, and the footprint is reduced after being integrated into a set of devices.

In summary, the novel wafer cleaning apparatus has been specifically and specifically disclosed by the above-described embodiments and related drawings, and can be implemented by those skilled in the art. The above described embodiments are only intended to illustrate the present invention, and are not intended to limit the present invention. The scope of the present invention is defined by the scope of the present patent application. As for the change in the number of components described herein or the replacement of equivalent components, etc. A new range of rights.

110‧‧‧ Mainframe

120‧‧‧ Wafer loading埠

130‧‧‧ wafer transfer device

141‧‧ ‧ partition

142‧‧‧First wafer import and export

150‧‧‧one-piece cleaning device

Claims (20)

A wafer cleaning device, comprising: a main body frame, a wafer loading cassette, a wafer transfer device, a trough cleaning device, and a single-chip cleaning device, wherein the wafer loading cassette is disposed at an outer end of the main body frame, The wafer transfer device, the trough cleaning device and the single-chip cleaning device are disposed in the main body frame, wherein the wafer loading cassette receives and places the wafer cassette, and the wafer cassette stores the wafer; the trough cleaning device is opened a first wafer inlet and outlet for transferring wafers, and a tank cleaning device for immersing one or more wafers; the single-chip cleaning device is provided with a second wafer inlet and outlet for transferring wafers, and a single-chip cleaning device is cleaned and Drying a single wafer; the wafer transfer device transfers wafers between a wafer cassette loaded with a wafer, a tank cleaning device, and a single wafer cleaning device. The wafer cleaning apparatus according to claim 1, wherein the wafer transfer apparatus comprises at least one transfer robot, a solution receiver, and a robot mount, and the transfer robot and the solution receiver are mounted on the machine. On the hand mounting platform, the solution receiver is located below the transfer robot, and the solution receiver receives the solution dripping from the transfer robot. The wafer cleaning apparatus according to claim 2, wherein the solution receiver has a funnel shape, and a liquid discharge port is opened at a bottom of the solution receiver, and a solution in the solution receiver is discharged from the liquid discharge port. The wafer cleaning apparatus according to claim 2, wherein one side of the transfer robot carrying the wafer is provided with a groove, and the through hole is provided with a plurality of through holes. The wafer cleaning apparatus according to claim 4, wherein one side of the transfer robot carrying the wafer is provided with a plurality of protrusions, and the protrusion is provided From the wafer. The wafer cleaning apparatus according to claim 2, wherein the wafer transfer apparatus further comprises a robot driving device, a bracket plate, and a support, the robot mounting platform is mounted on the bracket plate, and the robot is driven. The device drives the bracket plate to rise or fall vertically along the support. The wafer cleaning device according to claim 1, wherein the trough cleaning device comprises a trough cleaning tank, a sealing cover, a sealing baffle, a support frame, a lifting mechanism, a turning mechanism, and a wafer cassette. The trough cleaning tank, the sealing cover and the sealing baffle form a closed space, the sealing baffle is fixedly mounted on the trough cleaning trough, the lifting mechanism is mounted on the support frame, the lifting mechanism is connected with the sealing cover, and the lifting mechanism is Driving the sealing cover to rise or fall, opening or closing the sealed space, the wafer cassette is mounted on the sealing cover, the turning mechanism drives the wafer cassette to be reversed, and the wafer cassette is horizontally arranged in the sealing cover or vertical Hang straight under the sealing cover. The wafer cleaning apparatus according to claim 7, wherein the trough cleaning tank has an inner tank and an outer tank, and the wafer cassette is housed in the inner tank to soak and clean one or more wafers, and the inner tank The notch is serrated. The wafer cleaning apparatus according to claim 8, wherein the bottom surface of the outer tank of the trough cleaning tank is an inclined slope surface, and the liquid outlet is opened at the bottom of the slope of the slope surface. The wafer cleaning apparatus according to claim 9, wherein the liquid outlet of the outer tank of the trough cleaning tank is connected to the inlet of a pump, and the liquid outlet of the pump and the inside of the trough cleaning tank. Slot connection. The wafer cleaning apparatus according to claim 10, characterized in that a heating means is provided between the liquid outlet of the pump and the inner tank of the tank cleaning tank. A wafer cleaning apparatus according to claim 7, characterized in that The sealing cover is fastened to the trough cleaning tank to form the sealed space, and the sealing cover has a top wall, two side walls and a rear wall, the top wall is a sloped surface with a front high and a low, and a bottom is formed at the bottom of the rear wall. groove. The wafer cleaning apparatus according to claim 7, wherein the tank cleaning apparatus further comprises a partition, the wafer transfer apparatus is disposed on a front side of the partition, the trough cleaning tank, a sealing cover, The sealing baffle, the support frame, the lifting mechanism, the turning mechanism and the wafer cassette are disposed on the back side of the partition, and the first wafer inlet and outlet are opened on the partition. The wafer cleaning apparatus according to claim 7, wherein the trough cleaning apparatus further comprises a casing, and the top wall, the bottom wall, the front wall, the rear wall and the two side walls of the casing are enclosed The accommodating space, the trough cleaning tank, the sealing cover, the sealing baffle, the support frame, the lifting mechanism, the reversing mechanism and the wafer cassette are all accommodated in the sealed accommodating space, the outer casing is provided with an exhaust port and the First wafer import and export. The wafer cleaning apparatus according to claim 1, further comprising a nitrogen gas protecting device disposed in the tank cleaning device and located above the first wafer inlet and outlet of the tank cleaning device. The wafer cleaning apparatus according to claim 1, wherein the single-chip cleaning device is a completely sealed device, and the single-chip cleaning device is provided with a fan screening program unit and is provided with an exhaust port. The gas in the sheet cleaning device can only be discharged through the exhaust port of the single-chip cleaning device. The wafer cleaning apparatus according to claim 16, wherein the single-chip cleaning device has a frame body and a shelf plate mounted on the frame body, and a sealing ring is disposed at a mounting portion of the frame body and the shelf plate. The wafer cleaning apparatus according to claim 1, wherein the monolithic cleaning apparatus is provided with an ultra/mega sonic apparatus. The wafer cleaning apparatus according to claim 1, wherein the first wafer inlet and the outlet and the second wafer inlet and outlet are respectively provided with an inductive gate. The wafer cleaning apparatus according to claim 1, wherein the trough cleaning device and the single-chip cleaning device are respectively provided with a flame detector and a fire extinguisher nozzle.