CN113097099A - Cleaning machine table - Google Patents
Cleaning machine table Download PDFInfo
- Publication number
- CN113097099A CN113097099A CN202110250285.4A CN202110250285A CN113097099A CN 113097099 A CN113097099 A CN 113097099A CN 202110250285 A CN202110250285 A CN 202110250285A CN 113097099 A CN113097099 A CN 113097099A
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- Prior art keywords
- cleaning
- section
- transfer
- wafer
- groove type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
The embodiment of the invention discloses a cleaning machine table, which is characterized by comprising: a tank cleaning section, a single-chip cleaning section, and a transfer section; the groove type cleaning part comprises at least one groove type cleaning unit, and the groove type cleaning unit can clean one or more wafers at a time; the single-chip cleaning part comprises at least one single-chip cleaning unit, and the single-chip cleaning unit can clean only one wafer at a time; the transfer section is used for transferring wafers between the trough cleaning section and the single cleaning section.
Description
Technical Field
The invention relates to the field of semiconductor cleaning, in particular to a cleaning machine table.
Background
As the complexity of integrated circuit processes increases, it is desirable to include multiple wet process combinations for cleaning and etching purposes.
At present, a plurality of wet combination processes need to be transferred among a plurality of machines, and the equipment, space and time cost is high.
Disclosure of Invention
In view of the above, embodiments of the present invention provide a cleaning apparatus for solving at least one of the problems in the background art.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the embodiment of the invention provides a cleaning machine table, which comprises: a tank cleaning section, a single-chip cleaning section, and a transfer section;
the groove type cleaning part comprises at least one groove type cleaning unit, and the groove type cleaning unit is used for cleaning one or more wafers at the same time;
the single-chip cleaning part comprises at least one single-chip cleaning unit, and the single-chip cleaning unit is used for cleaning one wafer;
the transfer part is arranged between the groove type cleaning part and the single piece cleaning part and used for transferring the wafer between the groove type cleaning part and the single piece cleaning part.
In the above aspect, the transfer portion is provided between the tank cleaning portion and the single-piece cleaning portion.
In the above solution, the cleaning machine further includes:
a loading end for loading wafers, the loading end comprising a plurality of load ports; the trough wash section has a first side distal from the transfer section, the single piece wash section has a second side distal from the transfer section, a portion of the plurality of load ports is located on the first side, and another portion of the plurality of load ports is located on the second side.
In the above aspect, the trough-type cleaning section and the single-piece cleaning section are arranged in a first direction, the transfer section is disposed adjacent to the trough-type cleaning section in a second direction, and is disposed adjacent to the single-piece cleaning section in the second direction, wherein the first direction is perpendicular to the second direction.
In the above solution, the cleaning machine further includes:
a loading end portion for loading wafers, the loading end portion including a plurality of loading ports provided at a side of the trough type cleaning portion and the single wafer cleaning portion away from the transfer portion.
In the above aspect, the trough cleaning section further includes at least one first transfer unit, and the first transfer unit is configured to transfer the wafer among the plurality of trough cleaning units.
In the above aspect, the single wafer cleaning section further includes at least one second transfer unit for transferring the wafer between the plurality of single wafer cleaning units.
In the above aspect, the first transfer unit or the second transfer unit includes a transfer robot.
In the above solution, the cleaning machine further includes:
and the buffer part is positioned between the groove type cleaning part and the single-chip cleaning part and used for placing the wafer to be transferred.
The cleaning machine provided by the embodiment of the invention comprises: a tank cleaning section, a single-chip cleaning section, and a transfer section; the groove type cleaning part comprises at least one groove type cleaning unit, and the groove type cleaning unit is used for cleaning one or more wafers at the same time; the single-chip cleaning part comprises at least one single-chip cleaning unit, and the single-chip cleaning unit is used for cleaning one wafer; the transfer section is used for transferring wafers between the trough cleaning section and the single cleaning section. Therefore, the groove type cleaning part and the single-chip cleaning part can be mixed and assembled in the same machine, the groove type cleaning process and/or the single-chip cleaning process can be realized in the same machine, the carrying speed of a multi-channel wet method combination process is increased, the time is saved, and the space and some transfer equipment are saved.
Drawings
FIG. 1 is a schematic diagram of a tank cleaning machine according to the related art;
FIG. 2 is a schematic diagram of a wafer cleaning machine according to the related art;
FIG. 3 is a schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a cleaning tool according to another embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention; that is, not all features of an actual embodiment are described herein, and well-known functions and structures are not described in detail.
In the drawings, the size of layers, regions, elements, and relative sizes may be exaggerated for clarity. Like reference numerals refer to like elements throughout.
It will be understood that when an element or layer is referred to as being "on" … …, "adjacent to … …," "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to the other elements or layers or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on … …," "directly adjacent to … …," "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention. And the discussion of a second element, component, region, layer or section does not necessarily imply that a first element, component, region, layer or section is present in the invention.
Spatial relationship terms such as "under … …", "under … …", "below", "under … …", "above … …", "above", and the like, may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "below … …" and "below … …" can encompass both an orientation of up and down. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The following detailed description of the preferred embodiments of the invention, however, the invention is capable of other embodiments in addition to those detailed.
The groove type cleaning machine and the single chip cleaning machine are widely applied to the processes of wet etching and/or wet cleaning of integrated circuits and the like. The tank type cleaning machine can simultaneously process a plurality of wafers, has high cleaning efficiency, but can not completely remove pollutants. The single-chip cleaning machine has better cleaning effect, but is lower than the tank type cleaning machine in cleaning efficiency.
Fig. 1 is a schematic structural diagram of a tank cleaning machine in the related art, and as shown in the figure, the tank cleaning machine includes a plurality of cleaning tanks 11, a transfer robot 12, a wafer storage area 13, a loading end 14, and a loading end 15, each cleaning tank 11 can clean one or more wafers at a time, the transfer robot 12 can transfer the wafers among the plurality of cleaning tanks 11, the wafer storage area 13 can store the wafers before or after cleaning, and the loading ends 14 and 15 are used for loading the wafers.
Fig. 2 is a schematic structural diagram of a single wafer cleaning machine of the related art, and as shown in the figure, the single wafer cleaning machine comprises a plurality of cleaning tanks 21, a plurality of transfer robots 22, a loading end 23 and a loading end 24, each cleaning tank 21 can clean one wafer at a time, the transfer robot 22 is used for transferring the wafer, and the loading end 23 and the loading end 24 are used for loading the wafer.
With the complexity of the integrated circuit process increasing, a plurality of wet process combinations including a groove type cleaning machine and a single chip cleaning machine are needed to achieve the purposes of cleaning and etching. Therefore, wafers need to be transferred between the tank cleaning station and the single wafer cleaning station, which requires high equipment, space and time costs.
Based on this, the following technical solutions of the embodiments of the present invention are proposed.
An embodiment of the present invention provides a cleaning machine, including: a tank cleaning section, a single-chip cleaning section, and a transfer section; the groove type cleaning part comprises at least one groove type cleaning unit, and the groove type cleaning unit is used for cleaning one or more wafers; the single-chip cleaning part comprises at least one single-chip cleaning unit, and the single-chip cleaning unit is used for cleaning one wafer; the transfer section is used for transferring wafers between the trough cleaning section and the single cleaning section.
The groove type cleaning part is used for soaking and cleaning one or more wafers, and the single wafer cleaning part is used for cleaning and drying the single wafer.
Cleaning solutions, such as acetone, tetramethylammonium hydroxide (TMAH), hydrochloric acid, and the like, are stored in the tank cleaning units, and the cleaning solutions in the at least one tank cleaning unit may be the same or different.
Similarly, the single-chip cleaning units contain cleaning solutions, and the cleaning solutions in the at least one single-chip cleaning unit can be the same or different.
The transfer unit includes a transfer member, which may be a transfer robot, but is not limited thereto, and may be another device that can transfer a wafer.
In a specific embodiment, the trough type cleaning part, the transfer part and the single sheet cleaning part are arranged in sequence.
Next, refer to fig. 3, which is a schematic structural diagram of a cleaning machine according to an embodiment of the present invention. As shown, the cleaning station includes a trough cleaning section 31, a single-chip cleaning section 32, and a transfer section 33.
The tub cleaning part 31 includes at least one tub cleaning unit 311, at least one first transfer unit 312, and the at least one first transfer unit 312 transfers wafers between the at least one tub cleaning unit 311.
The tank cleaning part 31 further includes a wafer storage area 313, and the wafer storage area 313 is used for storing wafers to be transferred.
The single wafer cleaning part 32 includes at least one single wafer cleaning unit 321, and at least one second transfer unit 322, and the at least one second transfer unit 322 transfers the wafer between the at least one single wafer cleaning unit 321.
The cleaning station further includes a loading end 34 including a plurality of loading ports 341, the trough cleaning portion 31 having a first side away from the transfer portion 33, the single piece cleaning portion 32 having a second side away from the transfer portion 33, a portion of the plurality of loading ports 341 being located at the first side, another portion of the plurality of loading ports 341 being located at the second side.
The loading end 34 receives and positions a wafer cassette for storing wafers.
The number of the load ports may be one or more, and the number of the load ports may be selected according to the processing capacity of the cleaning tool.
The loading ports of the cleaning machine are arranged at two sides of the cleaning machine, and during actual cleaning, wafers can enter from the loading port at the side of the groove type cleaning part and exit from the loading port at the side of the single-chip cleaning part; if the wafer does not need to be cleaned in a single piece, the wafer can enter from the loading port on the side of the groove type cleaning part and exit from the loading port on the side of the groove type cleaning part; if the wafer does not need to be subjected to groove type cleaning, the wafer enters and exits from a loading port on the side of the single wafer cleaning part; the cleaning machine can flexibly select the inlet and the outlet of the wafer according to the requirement.
In another embodiment of the present invention, the transfer portion is disposed adjacent to the trough cleaning portion in a second direction, and is disposed adjacent to the single-piece cleaning portion in the second direction, wherein the first direction is perpendicular to the second direction.
Referring to fig. 4, a schematic structural diagram of a cleaning machine according to another embodiment of the invention is shown. As shown, the cleaning station includes a trough cleaning section 41, a single-wafer cleaning section 42, and a transfer section 43.
The tub cleaning part 41 includes at least one tub cleaning unit 411, at least one first transfer unit 412, and the at least one first transfer unit 412 transfers wafers between the at least one tub cleaning unit 411.
The tank cleaning part 41 further includes a wafer storage area 413, and the wafer storage area 413 is used for storing wafers to be transferred.
The individual piece washing part 42 includes at least one individual piece washing unit 421, and at least one second transfer unit 422, and the at least one second transfer unit 422 transfers the wafer between the at least one individual piece washing unit 421.
The cleaning station 4 further includes a loading end 44 including a plurality of loading ports 441, the plurality of loading ports 441 being disposed at a side of the trough type cleaning part 41 and the single piece cleaning part 42 away from the transfer part 43.
The loading port of the cleaning machine is positioned on one side of the cleaning machine, so that the space area occupied by the cleaning machine can be saved.
In one embodiment, the first transfer unit or the second transfer unit includes a transfer robot, but is not limited thereto, and may be other devices for transferring wafers.
In one embodiment, the cleaning station includes a buffer part (not shown) between the pocket cleaning part and the single wafer cleaning part for placing the wafer to be transferred.
It should be appreciated that reference throughout this specification to "one embodiment," "some embodiments," "other embodiments," "alternative embodiments," or "a particular embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, appearances of the phrases "an embodiment," "some embodiments," "other embodiments," "alternative embodiments," or "a particular embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents, improvements, etc. that are within the spirit and principle of the present invention should be included in the present invention.
Claims (9)
1. A cleaning machine table is characterized by comprising: a tank cleaning section, a single-chip cleaning section, and a transfer section;
the groove type cleaning part comprises at least one groove type cleaning unit, and the groove type cleaning unit is used for cleaning one or more wafers at the same time;
the single-chip cleaning part comprises at least one single-chip cleaning unit, and the single-chip cleaning unit is used for cleaning one wafer;
the transfer part is arranged between the groove type cleaning part and the single piece cleaning part and used for transferring the wafer between the groove type cleaning part and the single piece cleaning part.
2. The cleaning machine station as claimed in claim 1, wherein the transfer part is disposed between the trough cleaning part and the single cleaning part.
3. The cleaning station of claim 2, further comprising:
a loading end for loading wafers, the loading end comprising a plurality of load ports; the trough wash section has a first side distal from the transfer section, the single piece wash section has a second side distal from the transfer section, a portion of the plurality of load ports is located on the first side, and another portion of the plurality of load ports is located on the second side.
4. The cleaning machine station as claimed in claim 1, wherein the trough cleaning section and the single cleaning section are arranged in a first direction, and the transfer section is disposed adjacent to the trough cleaning section in a second direction and adjacent to the single cleaning section in the second direction, wherein the first direction is perpendicular to the second direction.
5. The cleaning station of claim 4, further comprising:
a loading end portion for loading wafers, the loading end portion including a plurality of loading ports provided at a side of the trough type cleaning portion and the single wafer cleaning portion away from the transfer portion.
6. The cleaning station as set forth in claim 1, wherein the trough cleaning section further comprises at least one first transfer unit for transferring wafers among the plurality of trough cleaning units.
7. The cleaning station as claimed in claim 1, wherein the single wafer cleaning section further comprises at least one second transfer unit for transferring wafers among the plurality of single wafer cleaning units.
8. Cleaning station as in claim 6 or 7, characterized in that said first transfer unit or said second transfer unit comprise a transfer robot.
9. The cleaning station of claim 1, further comprising:
and the buffer part is positioned between the groove type cleaning part and the single-chip cleaning part and used for placing the wafer to be transferred.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110250285.4A CN113097099A (en) | 2021-03-08 | 2021-03-08 | Cleaning machine table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110250285.4A CN113097099A (en) | 2021-03-08 | 2021-03-08 | Cleaning machine table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113097099A true CN113097099A (en) | 2021-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110250285.4A Pending CN113097099A (en) | 2021-03-08 | 2021-03-08 | Cleaning machine table |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102349136A (en) * | 2009-03-12 | 2012-02-08 | 东京毅力科创株式会社 | Substrate washing method |
| CN203250724U (en) * | 2013-04-25 | 2013-10-23 | 盛美半导体设备（上海）有限公司 | Wafer cleaning device |
| CN104813438A (en) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Method and apparatus for cleaning semiconductor wafer |
| CN108022855A (en) * | 2016-11-03 | 2018-05-11 | 上海新昇半导体科技有限公司 | A kind of semiconductor wafer wet clean equipment |
-
2021
- 2021-03-08 CN CN202110250285.4A patent/CN113097099A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102349136A (en) * | 2009-03-12 | 2012-02-08 | 东京毅力科创株式会社 | Substrate washing method |
| CN104813438A (en) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Method and apparatus for cleaning semiconductor wafer |
| CN203250724U (en) * | 2013-04-25 | 2013-10-23 | 盛美半导体设备（上海）有限公司 | Wafer cleaning device |
| CN108022855A (en) * | 2016-11-03 | 2018-05-11 | 上海新昇半导体科技有限公司 | A kind of semiconductor wafer wet clean equipment |
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Application publication date: 20210709 |
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