CN105665339B - A kind of drying device and drying means for groove profile wet method equipment - Google Patents
A kind of drying device and drying means for groove profile wet method equipment Download PDFInfo
- Publication number
- CN105665339B CN105665339B CN201610088128.7A CN201610088128A CN105665339B CN 105665339 B CN105665339 B CN 105665339B CN 201610088128 A CN201610088128 A CN 201610088128A CN 105665339 B CN105665339 B CN 105665339B
- Authority
- CN
- China
- Prior art keywords
- drying
- nozzle
- groove profile
- transmission arm
- wet method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of drying device and drying means for groove profile wet method equipment, drying device is set by the loading and unloading wafer area in groove profile wet method equipment, and the nozzle for passing through drying device, to at least both sides jet drying gas for entering the transmission arm for loading and unloading wafer area from dry slot, transmission arm is dried, and the eject position of dry gas can be adjusted, distance and angle, the environment that groove profile wet clean equipment loads and unloads wafer area can be improved, prevent steam from gathering, defect is condensed so as to effectively avoid crystal column surface from producing.
Description
Technical field
The present invention relates to semiconductor manufacturing facility technical field, it is used for groove profile wet method equipment more particularly, to one kind, can
Prevent wafer surface in loading and unloading from producing the drying device and drying means for condensing defect.
Background technology
In the processing technology of semiconductor crystal wafer, crystal column surface easily produces condense defect under water vapour environment
(condensation defect), if cleaning link of this defect before some critical processes such as ion implanting or before gate oxide deposit
Produce, will have a negative impact to the yield of wafer.
Referring to Fig. 1, flow chart when Fig. 1 is a kind of existing wet clean equipment cleaning wafer using groove profile.Such as Fig. 1
Shown, groove profile wet clean equipment 10 used in cleaning is generally divided into rinse bath 1, dry slot 2 and loads and unload
Wafer area 3.Wafer is typically introduced into loading and unloading wafer area 3, is then transported on arm 4 and wafer is sent into rinse bath 1
Wet clean process is carried out, wafer can be sent to dry slot 2 and carry out dry tack free by transmission arm 4 after cleaning terminates, and be done
Arm 4 is transmitted after the completion of drying process to be sent to loading and unloading wafer area 3 by wafer again, and last wafer leaves equipment
(direction of arrow is signified as shown).
From above-mentioned flow, surface is dry after wafer is in drying process, does not have condensation defect problem now.
In groove profile wet method equipment, due to its loading and unloading wafer area and the public same transmission arm in cleaning wafer region, institute
Some steam that its side wall remains can be taken to loading and unloading wafer area generally to transmit arm, cause loading and unloading
The environment of wafer area is full of steam.Although current various groove profile wet method equipments have the appliance arrangement of cleaning transmission arm,
Vapor adhesion is always had in the cleaning such as side wall of transmission arm dead angle part, wafer is sent to loading so as to cause to transmit arm
And more or less can be with a little steam during unloading wafer area.
Long-time stemming moisture accumulation can cause the environment for loading and unloading wafer to be deteriorated, if loading and unloading wafer area ring
Border steam is serious, then wafer may will produce condensation defect when finally entering loading and unloading wafer area.Moreover, by
In this link be final tache of the wafer in wet method equipment, subsequently without drying process, so, the now condensation defect on wafer
It can not remove.
Therefore, how to improve the environment that groove profile wet clean equipment loads and unloads wafer area, prevent steam from gathering, keep away
Exempt from crystal column surface and produce condensation defect, just turn into and work as previous important topic.
The content of the invention
It is an object of the invention to overcome drawbacks described above existing for prior art, there is provided a kind of for groove profile wet method equipment
Drying device and drying means, the environment that groove profile wet clean equipment loads and unloads wafer area can be improved, prevent steam collection
It is poly-, avoid crystal column surface from producing and condense defect.
To achieve the above object, technical scheme is as follows：
A kind of drying device for groove profile wet method equipment, the groove profile wet method equipment include rinse bath, dry slot and
Load and unload wafer area, and transmitted wafer in-between by transmitting arm, the drying device includes at least two groups
Dry gas nozzle, the nozzle pass through the spray located at the opposite sides for loading and unloading wafer area, the drying device
Mouth, to the transmission arm both sides jet drying gas for entering loading and unloading wafer area from dry slot, to the transmission arm
It is dried；Wherein, nozzle described in every group is separately mounted on three axial moving mechanisms, also, the nozzle is also installed
On a rotating mechanism, when being dried, make nozzle described in every group with transmitting the horizontal level between arm, vertical position
Put, mutual distance and spray angle are in adjustable state, so as to the contour structures footprint characteristic according to transmission arm, mobile spray
Mouth is allowed to be located at appropriate position, and comprehensive drying is carried out to the both sides for transmitting arm, avoids producing technique dead angle, and to from
The flows of dry gases and pressure of the nozzle injection are adjusted, and it is played optimal drying effect.
Preferably, the nozzle sets up four groups separately in the surrounding for loading and unloading wafer area.
Preferably, it is additionally provided with nozzle described in one group above loading and unloading wafer area.
Preferably, every group of the nozzle is set up in parallel 1-6, and is provided with wide-angle guide housing around nozzle described in every group.
A kind of drying means for groove profile wet method equipment, using the above-mentioned drying device for groove profile wet method equipment,
Including：
, will be into the wafer for loading and unloading wafer area is sequentially transmitted rinse bath, dry slot enters using transmission arm
Row wet clean process simultaneously carries out dry tack free, then, wafer is sent into loading and unloading wafer area again；Open drying
The each group nozzle of device, at least the both sides jet drying gas from transmission arm, to entering the institute for loading and unloading wafer area
Transmission arm is stated to be dried；
Wherein, when the transmission arm being dried, by converting between sprayed dry gas and transmission arm
Level, upright position and mutual distance, and conversion spray angle moves formula and multi-angle to the transmission arm
Drying process, and in course of injection, the flow and pressure of dry gas are adjusted, it is played optimal drying and imitate
Fruit.
Preferably, when the transmission arm being dried, surrounding and upper direction transmission arm injection from transmission arm
Dry gas.
Preferably, the dry gas is heated high pressure nitrogen.
It can be seen from the above technical proposal that the present invention is set by the loading and unloading wafer area in groove profile wet method equipment
Drying device is put, and by the nozzle of drying device, to the transmission arm for entering loading and unloading wafer area from dry slot
At least both sides jet drying gas, transmission arm is dried, and the eject position of dry gas can be adjusted, away from walk-off angle
Degree, the environment that groove profile wet clean equipment loads and unloads wafer area can be improved, prevent steam from gathering, so as to effectively avoid
Crystal column surface, which produces, condenses defect.
Brief description of the drawings
Flow chart when Fig. 1 is a kind of existing wet clean equipment cleaning wafer using groove profile；
Fig. 2 is that a kind of drying device plan structure for groove profile wet method equipment of a preferred embodiment of the present invention is illustrated
Figure.
Embodiment
Below in conjunction with the accompanying drawings, the embodiment of the present invention is described in further detail.
It should be noted that in following embodiments, when embodiments of the present invention are described in detail, in order to clear
Ground represents the structure of the present invention in order to illustrate, special that structure in accompanying drawing is not drawn according to general proportion, and has carried out part
Amplification, deformation and simplified processing, therefore, should avoid being understood in this, as limitation of the invention.
In embodiment of the invention below, referring to Fig. 2, Fig. 2 is one kind of a preferred embodiment of the present invention
Drying device overlooking the structure diagram for groove profile wet method equipment.As shown in Fig. 2 the drying device of the present invention is wet for groove profile
Method equipment 10, the groove profile wet method equipment 10 include being arranged in order the rinse bath 1 of setting, dry slot 2 and load and unload and be brilliant
Circle region 3.Also, the groove profile wet method equipment 10 by transmit arm 4 by wafer rinse bath 1, dry slot 2 and load and
Transmitted between unloading wafer area 3 and (refer to Fig. 1 to be understood).
Please continue to refer to Fig. 2.The drying device may include at least two groups of dry gas nozzle 5,6, the nozzle 5,6
It is connected with dry gas source of supply.The nozzle 5,6 is located relatively at loading and unloaded located at loading and unloading wafer area 3
The both sides of wafer area are carried, the transmission arm 4 for alloing to enter loading and unloading wafer area 3 from dry slot 2 is located at this two groups
Between dry gas nozzle 5,6.
When wafer is sent to loading and unloading wafer area 3 by transmission arm 4 from dry slot 2, the drying device is
It can be loaded and the both sides jet drying of transmission arm 4 of unloading wafer area by opening the control valve of the nozzle 5,6 to entering
Gas, the transmission arm 4 is dried.
, can be by the way that nozzle described in every group 5,6 be arranged on into one three axial movement respectively as a preferred embodiment
In mechanism (figure omits), so as to which nozzle 5,6 described in every group when being dried, can be made with transmitting horizontal, the vertical position between arm 4
Put and mutual distance is in adjustable state, so as to the contour structures footprint characteristic according to transmission arm 4, moving nozzle 5,6 makes
Be located at appropriate position, dry effect can be improved and save time and gas consumption.
Further, the nozzle 5,6 can also be arranged on a rotating mechanism (figure omits), to make the nozzle
5th, 6 spray angle is adjustable.So as to when being dried, carry out comprehensive drying to the both sides for transmitting arm 4, avoid producing
Raw technique dead angle.
Please continue to refer to Fig. 2.As a preferred embodiment, it is above-mentioned be oppositely arranged two groups of nozzles 5,6 on the basis of,
Two groups of nozzles 7,8 can also be set loading and unloading the relative other both sides of wafer area 3 again, load and unload so as to be formed in
The surrounding for carrying wafer area 3 sets up nozzle 5-8 described in four groups separately.So, you can realizing can be carried out to the surrounding for transmitting arm 4
Gas is dried.It is further preferred that it can also be further added by setting nozzle described in one group in the top for loading and unloading wafer area 3
(figure omits), to carry out gas drying to it from the top of transmission arm 4.Can be according to transmission arm structure complexity, selection
Specific setting group number of the nozzle around it.
As an optional embodiment, the volume size of arm is transmitted according to different groove profile wet method equipments, in every group
The nozzle quantity can be selected at 1-6, and be set up in parallel, and to expand projected area, improve drying efficiency.Meanwhile also
Wide-angle guide housing 9 can be provided with around nozzle described in every group, the gas angle ejected from nozzle is guided and constrained, to subtract
The invalid loss of few dry gas.
When without using drying device, the nozzle is removed to non-process position using above-mentioned three axial moving mechanism
Put, in order to avoid hinder transmission arm or the traveling of other facilities.
Flow and pressure-control valve (figure omits) are also provided with the nozzle or on its tracheae, so as to from the spray
The flows of dry gases and pressure of mouth injection are adjusted, and it is played optimal drying effect.
In addition, can also be by a control unit (figure omits) to the movement position of the nozzle, spray angle, dry gas stream
Amount, pressure and temperature etc. are controlled, so as to realize the automatic drying to transmitting arm.
Below by embodiment, a kind of drying means for groove profile wet method equipment of the present invention is carried out in detail
Explanation.
A kind of drying means for groove profile wet method equipment of the present invention, it can be used above-mentioned for groove profile wet method equipment
Drying device (refer to Fig. 2 to be understood).
The wet clean process flow (refer to Fig. 1 to be understood) of wafer generally includes：Wafer is typically introduced into loading
And unloading wafer area 3, it is then transported on arm 4 wafer is sent into rinse bath 1 carrying out wet clean process, cleaning terminates
Transmission arm 4 can be sent to wafer dry slot 2 and carry out dry tack free afterwards, and arm 4 is transmitted after the completion of drying process again will
Wafer is sent to loading and unloading wafer area 3, and last wafer leaves equipment.
The present invention is same using transmission arm 4 in the wet clean process flow of above-mentioned wafer, will enter and load and unload
The wafer for carrying wafer area 3 is sequentially transmitted rinse bath 1, dry slot 2 carries out wet clean process and carries out dry tack free.Work as biography
When sending the arm 4 wafer is sent into loading and unloading wafer area 3 again, each group nozzle of drying device is opened, at least from biography
The both sides jet drying gas (such as by nozzle 5,6) of arm is sent, to entering the transmission for loading and unloading wafer area 3
Arm 4 is dried.
Meanwhile when being dried, can be by being controlled to nozzle, to convert dry gas and the transmission that it is sprayed
Level, upright position and mutual distance between arm, and conversion spray angle, to it is described transmission arm move formula and
The drying process of multi-angle.In course of injection, the flow and pressure of dry gas can be also adjusted, it is played most preferably
Drying effect.
Preferably, when the transmission arm being dried, also further (such as spray can be passed through from the surrounding of transmission arm
Mouth 5-8) and the upper direction transmission jet drying gas of arm 4.This can be selected according to the complexity of transmission arm structure, with
Avoid producing technique dead angle.
Preferably, high pressure nitrogen can be used as dry gas；Also, can also be pre- to nitrogen to improve drying effect
First heated.
In summary, the present invention sets drying device by the loading and unloading wafer area in groove profile wet method equipment, and
By the nozzle of drying device, sprayed at least both sides for entering the transmission arm for loading and unloading wafer area from dry slot dry
Pathogenic dryness body, transmission arm is dried, and eject position, distance and the angle of dry gas can be adjusted, groove profile can be improved
Wet clean equipment loads and the environment of unloading wafer area, prevents steam from gathering, so as to effectively avoid crystal column surface from producing
Condense defect.Present invention could apply to all wet clean equipments, and the limitation without technology node, it is worthy to be popularized.
Above-described is only the preferred embodiments of the present invention, the embodiment and the patent guarantor for being not used to the limitation present invention
Scope, therefore the equivalent structure change that every specification and accompanying drawing content with the present invention is made are protected, similarly should be included in
In protection scope of the present invention.
Claims (7)
1. a kind of drying device for groove profile wet method equipment, the groove profile wet method equipment includes rinse bath, dry slot and dress
Carry and unload wafer area, and transmitted wafer in-between by transmitting arm, it is characterised in that the drying device includes
At least two groups of dry gas nozzles, the nozzle lead to located at the opposite sides for loading and unloading wafer area, the drying device
The nozzle is crossed, to the transmission arm both sides jet drying gas for entering loading and unloading wafer area from dry slot, to described
Transmission arm is dried；Wherein, nozzle described in every group is separately mounted on three axial moving mechanisms, also, the spray
Mouth is also arranged on rotating mechanism, when being dried, make nozzle described in every group and transmit horizontal level between arm,
Upright position, mutual distance and spray angle are in adjustable state, so as to the contour structures footprint characteristic according to transmission arm,
Moving nozzle is allowed to be located at appropriate position, carries out comprehensive drying to the both sides for transmitting arm, avoids producing technique dead angle,
And flows of dry gases and pressure to being sprayed from the nozzle are adjusted, it is set to play optimal drying effect.
2. the drying device according to claim 1 for groove profile wet method equipment, it is characterised in that the nozzle is loading
And the surrounding of unloading wafer area sets up four groups separately.
3. the drying device according to claim 1 or 2 for groove profile wet method equipment, it is characterised in that loading and unloading
Carry and be additionally provided with nozzle described in one group above wafer area.
4. the drying device according to claim 1 or 2 for groove profile wet method equipment, it is characterised in that every group described
Nozzle is set up in parallel 1-6, and is provided with wide-angle guide housing around nozzle described in every group.
5. a kind of drying means for groove profile wet method equipment, usage right requires wet for groove profile described in 1-4 any one
The drying device of method equipment, it is characterised in that including：
Using transmission arm, will enter load and unloading wafer area wafer be sequentially transmitted rinse bath, dry slot carry out it is wet
Method cleaning simultaneously carries out dry tack free, then, wafer is sent into loading and unloading wafer area again；Open drying device
Each group nozzle, at least from transmission arm both sides jet drying gas, to enter load and unloading wafer area the biography
Arm is sent to be dried；
Wherein, when the transmission arm being dried, by converting the water between sprayed dry gas and transmission arm
Flat, upright position and mutual distance, and conversion spray angle, the drying of formula and multi-angle is moved to the transmission arm
Processing, and in course of injection, the flow and pressure of dry gas are adjusted, it is played optimal drying effect.
6. the drying means according to claim 5 for groove profile wet method equipment, it is characterised in that to the transmission arm
When being dried, from the surrounding and upper direction transmission arm jet drying gas of transmission arm.
7. the drying means according to claim 5 for groove profile wet method equipment, it is characterised in that the dry gas is
Heated high pressure nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610088128.7A CN105665339B (en) | 2016-02-17 | 2016-02-17 | A kind of drying device and drying means for groove profile wet method equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610088128.7A CN105665339B (en) | 2016-02-17 | 2016-02-17 | A kind of drying device and drying means for groove profile wet method equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105665339A CN105665339A (en) | 2016-06-15 |
| CN105665339B true CN105665339B (en) | 2018-04-06 |
Family
ID=56305602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610088128.7A Active CN105665339B (en) | 2016-02-17 | 2016-02-17 | A kind of drying device and drying means for groove profile wet method equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105665339B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107514901A (en) * | 2017-08-24 | 2017-12-26 | 昆山同度热泵设备有限公司 | One kind is used for the drying integrated device of day lily fixing and its fixing stoving process |
| CN108007169A (en) * | 2017-11-21 | 2018-05-08 | 武汉华星光电技术有限公司 | A kind of device of dry CST |
| CN111276433B (en) * | 2020-02-27 | 2022-03-18 | 至微半导体(上海)有限公司 | Hot nitrogen injection method for improving drying quality of wafer |
| CN111644414A (en) * | 2020-06-01 | 2020-09-11 | 中国科学院微电子研究所 | Cleaning and drying device and method for semiconductor mechanical chuck |
| TWI783407B (en) * | 2021-03-15 | 2022-11-11 | 楊智仁 | Wet process cleaning equipment and wet process cleaning method |
| CN114353479B (en) * | 2022-03-10 | 2022-07-19 | 智程半导体设备科技(昆山)有限公司 | Wafer drying device |
| CN114963746B (en) * | 2022-05-26 | 2023-09-08 | 广汽本田汽车有限公司 | Blow-drying system for engine cylinder body and cylinder cover |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998001892A1 (en) * | 1996-07-08 | 1998-01-15 | Speedfam Corporation | Methods and apparatus for cleaning, rinsing, and drying wafers |
| CN101047116A (en) * | 2006-03-31 | 2007-10-03 | 大日本网目版制造株式会社 | Substrate processing apparatus |
| TW201145379A (en) * | 2010-03-09 | 2011-12-16 | Tokyo Electron Ltd | Substrate processing device, substrate processing method, and storage medium |
| CN202398571U (en) * | 2011-12-30 | 2012-08-29 | 中芯国际集成电路制造(上海)有限公司 | Cleaning device of mechanical arm |
| CN203250724U (en) * | 2013-04-25 | 2013-10-23 | 盛美半导体设备（上海）有限公司 | Wafer cleaning device |
| CN203553116U (en) * | 2013-11-14 | 2014-04-16 | 中芯国际集成电路制造(北京)有限公司 | Drying tank apparatus |
-
2016
- 2016-02-17 CN CN201610088128.7A patent/CN105665339B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998001892A1 (en) * | 1996-07-08 | 1998-01-15 | Speedfam Corporation | Methods and apparatus for cleaning, rinsing, and drying wafers |
| CN101047116A (en) * | 2006-03-31 | 2007-10-03 | 大日本网目版制造株式会社 | Substrate processing apparatus |
| TW201145379A (en) * | 2010-03-09 | 2011-12-16 | Tokyo Electron Ltd | Substrate processing device, substrate processing method, and storage medium |
| CN202398571U (en) * | 2011-12-30 | 2012-08-29 | 中芯国际集成电路制造(上海)有限公司 | Cleaning device of mechanical arm |
| CN203250724U (en) * | 2013-04-25 | 2013-10-23 | 盛美半导体设备（上海）有限公司 | Wafer cleaning device |
| CN203553116U (en) * | 2013-11-14 | 2014-04-16 | 中芯国际集成电路制造(北京)有限公司 | Drying tank apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105665339A (en) | 2016-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105665339B (en) | A kind of drying device and drying means for groove profile wet method equipment | |
| US9073103B2 (en) | Liquid processing apparatus, liquid processing method, and recording medium having computer program for performing the same method | |
| CN105575855B (en) | Substrate processing apparatus | |
| CN105457879B (en) | A kind of fresh tea passes sorting and fixing method | |
| CN106824929A (en) | A kind of vertical multi-stage quartz tube cleaner and cleaning method | |
| CN104078388A (en) | Recycling unit, substrate treating apparatus | |
| CN106986134B (en) | The cooling cleaning all-in-one machine of casting transport | |
| CN101338967B (en) | Vacuum drying machine and its drying method | |
| KR20100004883A (en) | Trap device and reduced pressure drying apparatus | |
| TW201400202A (en) | Semiconductor cleaner systems and methods | |
| CN112460971A (en) | Silicon wafer drying device and method | |
| CN104971916A (en) | Cleaning apparatus and cleaning method | |
| CN109841545A (en) | A kind of black silicon fluff making device purged | |
| WO2018219153A1 (en) | Perovskite thin film post-treatment apparatus, using method, and application | |
| TWI243420B (en) | Semiconductor wafer cleaning method and apparatus | |
| CN204208853U (en) | Cleaning injection apparatus | |
| CN105964621A (en) | Dust removing system and dust removing method | |
| CN207009480U (en) | A kind of perovskite thin film equipment for after-treatment | |
| CN207542214U (en) | A kind of wafer continuous wash, drying device | |
| CN207779084U (en) | A kind of freeze dryer on-line cleaning system | |
| US20190164787A1 (en) | Apparatus and method for processing substrate | |
| KR100942502B1 (en) | High-speed dryer | |
| CN105405741A (en) | Local cleaning device and method for wafer | |
| CN209526072U (en) | A kind of black silicon fluff making device purged | |
| CN112038257B (en) | Cleaning equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |