CN203553116U - Drying tank apparatus - Google Patents
Drying tank apparatus Download PDFInfo
- Publication number
- CN203553116U CN203553116U CN201320717938.6U CN201320717938U CN203553116U CN 203553116 U CN203553116 U CN 203553116U CN 201320717938 U CN201320717938 U CN 201320717938U CN 203553116 U CN203553116 U CN 203553116U
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- Prior art keywords
- dry slot
- dry
- drying tank
- wafer
- tank
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Abstract
The utility model puts forward a drying tank apparatus for drying a wafer. The drying tank apparatus comprises a first drying tank, a water tank connected with one side wall of the first drying tank, a second drying tank connected to the other side wall of the first drying tank, a water removing unit, and a mechanical arm; a baffle plate is arranged at the first drying tank; the water removing unit is arranged outside the first drying tank and is arranged above the baffle plate in a suspension mode; and the mechanical arm is arranged outside the water tank, the first drying tank, and the second drying tank. Because the water removing unit is arranged outside the first drying tank and is arranged above the baffle plate, when the baffle plate is closed, the water removing unit is capable of carrying out water removing processing on the surface of the baffle plate, so that water drops on the baffle plate can be prevented from dripping on the surface of the wafer when the baffle plate is opened. Therefore, the defect is overcome and thus the wafer yield is improved.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of dry slot device.
Background technology
In field of semiconductor manufacture process, carry out after wet etching needing wafer to be dried processing.First dry processing is that described wafer is cleaned in tank, removes waste liquid or the particle of described crystal column surface, is then that described wafer is moved in dry slot and carries out gas drying, reaches described wafer is carried out to dry object.
Concrete, please refer to Fig. 1, in prior art, dry slot device generally includes: tank 21, the first dry slot 22, the second dry slot 23 and mechanical arm 40, wherein, one sidewall and the described tank 21 of described the first dry slot 22 fix, and another sidewall of described the first dry slot 22 and described the second dry slot 23 fix; Described the first dry slot 22 is provided with shutter 50, and for blocking water droplet that outside falls into etc., described shutter 50 can open and close.
Described dry slot device in use, wafer 10 is first put into described tank 21 by described mechanical arm 40 and is rinsed, then, described wafer 10 is moved to by described mechanical arm 40 that in described the first dry slot 22, to carry out air dry, now, another wafer 10 has also entered in described tank 21 and has cleaned, after it cleans, because 22 li of described the first dry slots have had wafer 10 being dried, therefore described mechanical arm 40 moves to another wafer 10 in described the second dry slot 23 and cleans again.Due to described mechanical arm 40 from described tank 21 with water droplet 30, at described mechanical arm 40 when moving above described the first dry slot 22, described water droplet 30 is easily dropped on described shutter 50, owing to having wafer 10 to be dried in described the first dry slot 22, shutter 50 is now closed.Dry when complete at described wafer 10, described shutter 50 can be opened convenience is shifted out described wafer 10, yet water droplet on described shutter 50 can be dropped in the surface of described wafer 10 conventionally, causes defect.
Utility model content
The purpose of this utility model is to provide a kind of dry slot device, can avoid water droplet to be dropped in the surface of wafer, eliminates defect.
To achieve these goals, the utility model proposes a kind of dry slot device, comprising:
Tank, the first dry slot, the second dry slot, mechanical arm and except water unit, wherein, one sidewall of described the first dry slot is connected with described tank, another sidewall of described the first dry slot is connected with described the second dry slot, described the first dry slot is provided with shutter, described except water unit is located at described the first dry slot, and the unsettled described shutter top that is positioned at, described mechanical arm is positioned at outside described tank, the first dry slot and the second dry slot.
Further, the described water unit that removes comprises air knife, pipeline, cylinder and water deflector cover, and described air knife is connected with described cylinder by described pipeline, and described water deflector cover is positioned at outside described the first dry slot.
Further, described air knife is provided with a plurality of nozzles.
Further, the material of described air knife is polypropylene.
Further, the material of described pipeline is polypropylene.
Further, the material of described water deflector cover is polypropylene.
Compared with prior art, the beneficial effects of the utility model are mainly reflected in: outside the first dry slot, add except water unit, and the described water unit that removes is located to described shutter top, when described shutter is closed, the described water unit that removes can remove water treatment to the surface of described shutter, thereby the water droplet described in avoiding when described shutter is opened on shutter drops to the surface of described wafer, and then eliminate defect, improve the yield of wafer.
Accompanying drawing explanation
The structural representation of dry slot device in Fig. 1 prior art;
Fig. 2 is the structural representation of dry slot device in the utility model one embodiment;
Fig. 3 is except the structural representation of water unit while dewatering in the utility model one embodiment;
Fig. 4 is the structural representation removing in the utility model one embodiment after water unit has dewatered.
Embodiment
Below in conjunction with schematic diagram, dry slot device of the present utility model is described in more detail, wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to the restriction of relevant system or relevant business, by an embodiment, change into another embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with reference to accompanying drawing, with way of example, the utility model is more specifically described.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 2, in the present embodiment, proposed a kind of dry slot device, for dry wafer 100, described device comprises:
Wherein, mechanical arm 400 is for holding and transmitting described wafer 100, among described wafer 100 immigration described tank 210, the first dry slot 220 and the second dry slots 230, or described wafer 100 is shifted out among described tank 210, the first dry slot 220 and the second dry slot 230; Described tank 210 is for cleaning described wafer 100; Described the first dry slot 220 and the second dry slot 230 are for being dried described wafer 100, described shutter 500 can be closed when 220 pairs of described wafers 100 of described the first dry slot are dried, and open when complete described wafer 100 is dry, convenient described wafer 100 is shifted out.
Please refer to Fig. 3 and Fig. 4, in the present embodiment, the described water unit that removes comprises air knife 620, pipeline 610, cylinder (not shown) and water deflector cover 630, and described air knife 620 is connected with described cylinder by described pipeline 610, and described cylinder is the N that 0.05mPa～0.1mPa is dry for flow is provided
2described N2 can carry out Transformatin via the surface of described pipeline 610 and 620 pairs of described shutters 500 of air knife, water droplet on described shutter 500 300 is all removed totally, avoided described shutter 500 water droplet 300 when opening to drop to the surface of described wafer 100, and then eliminate defect; Described water deflector cover 630 is positioned at outside described the first dry slot 220, its object is mainly after 620 pairs of described shutters 500 of described air knife remove water droplet 300, when described shutter 500 need to be opened, described air knife 620 can move to the below of described water deflector cover 630, avoid having water droplet 300 to drop on described air knife 620, as shown in Figure 4 on described mechanical arm 400.
In the present embodiment, described air knife 620 is provided with a plurality of nozzles, and dry N2 is sprayed to the surface of described shutter 500 by described nozzle, and the material of described air knife 620, pipeline 610 and water deflector cover 630 is polypropylene.
It is pointed out that the described water unit that removes can adopt automatic mode and operate in manual mode, two kinds of patterns can be changed mutually.
To sum up, in the dry slot device providing at the utility model embodiment, outside the first dry slot, add except water unit, and the described water unit that removes is located to described shutter top, when described shutter is closed, describedly can remove water treatment to the surface of described shutter except water unit, thereby described in avoiding when described shutter is opened, the water droplet on shutter drops to the surface of described wafer, and then elimination defect, the yield of raising wafer.
Above are only preferred embodiment of the present utility model, the utility model is not played to any restriction.Any person of ordinary skill in the field; within not departing from the scope of the technical solution of the utility model; the technical scheme that the utility model is disclosed and technology contents are made any type of changes such as replacement or modification that are equal to; all belong to the content that does not depart from the technical solution of the utility model, within still belonging to protection range of the present utility model.
Claims (6)
1. a dry slot device, for dry wafer, is characterized in that, described device comprises:
Tank, the first dry slot, the second dry slot, mechanical arm and except water unit, wherein, one sidewall of described the first dry slot is connected with described tank, another sidewall of described the first dry slot is connected with described the second dry slot, described the first dry slot is provided with shutter, described except water unit is located at described the first dry slot, and the unsettled described shutter top that is positioned at, described mechanical arm is positioned at outside described tank, the first dry slot and the second dry slot.
2. dry slot device as claimed in claim 1, is characterized in that, the described water unit that removes comprises air knife, pipeline, cylinder and water deflector cover, and described air knife is connected with described cylinder by described pipeline, and described water deflector cover is positioned at outside described the first dry slot.
3. dry slot device as claimed in claim 2, is characterized in that, described air knife is provided with a plurality of nozzles.
4. dry slot device as claimed in claim 2, is characterized in that, the material of described air knife is polypropylene.
5. dry slot device as claimed in claim 2, is characterized in that, the material of described pipeline is polypropylene.
6. dry slot device as claimed in claim 2, is characterized in that, the material of described water deflector cover is polypropylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320717938.6U CN203553116U (en) | 2013-11-14 | 2013-11-14 | Drying tank apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320717938.6U CN203553116U (en) | 2013-11-14 | 2013-11-14 | Drying tank apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553116U true CN203553116U (en) | 2014-04-16 |
Family
ID=50471196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320717938.6U Expired - Fee Related CN203553116U (en) | 2013-11-14 | 2013-11-14 | Drying tank apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553116U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105665339A (en) * | 2016-02-17 | 2016-06-15 | 上海华力微电子有限公司 | Drying device used for groove type wet process device and drying method |
-
2013
- 2013-11-14 CN CN201320717938.6U patent/CN203553116U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105665339A (en) * | 2016-02-17 | 2016-06-15 | 上海华力微电子有限公司 | Drying device used for groove type wet process device and drying method |
| CN105665339B (en) * | 2016-02-17 | 2018-04-06 | 上海华力微电子有限公司 | A kind of drying device and drying means for groove profile wet method equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20191114 |