CN112460971A - Silicon wafer drying device and method - Google Patents
Silicon wafer drying device and method Download PDFInfo
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- CN112460971A CN112460971A CN202011368754.4A CN202011368754A CN112460971A CN 112460971 A CN112460971 A CN 112460971A CN 202011368754 A CN202011368754 A CN 202011368754A CN 112460971 A CN112460971 A CN 112460971A
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- 238000001035 drying Methods 0.000 title claims abstract description 109
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 76
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 76
- 239000010703 silicon Substances 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 31
- 235000012431 wafers Nutrition 0.000 claims abstract description 72
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000010926 purge Methods 0.000 claims abstract description 13
- 238000001914 filtration Methods 0.000 claims abstract description 12
- 238000009833 condensation Methods 0.000 claims abstract description 11
- 230000005494 condensation Effects 0.000 claims abstract description 11
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
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- 238000007906 compression Methods 0.000 claims description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- 230000009467 reduction Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 7
- 230000003139 buffering effect Effects 0.000 claims description 7
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 6
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000003085 diluting agent Substances 0.000 claims description 2
- 238000000746 purification Methods 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
- F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
- F26B15/14—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined the objects or batches of materials being carried by trays or racks or receptacles, which may be connected to endless chains or belts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/02—Circulating air or gases in closed cycles, e.g. wholly within the drying enclosure
- F26B21/04—Circulating air or gases in closed cycles, e.g. wholly within the drying enclosure partly outside the drying enclosure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/06—Controlling, e.g. regulating, parameters of gas supply
- F26B21/08—Humidity
- F26B21/086—Humidity by condensing the moisture in the drying medium, which may be recycled, e.g. using a heat pump cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a silicon wafer drying device and a method thereof, wherein the silicon wafer drying device and the method thereof comprise a texturing flower basket conveying device, a first buffer cavity, a first low-pressure cavity, a drying cavity, a second low-pressure cavity and a second buffer cavity, the texturing flower basket conveying device is used for conveying texturing flower baskets loaded with silicon wafers and discharged at equal intervals, the texturing flower basket conveying device is sequentially provided with the first buffer cavity, the first low-pressure cavity, the drying cavity, the second low-pressure cavity and the second buffer cavity along the conveying direction, two side doors are arranged among the cavities to separate the cavities into closed spaces, the buffer cavity and the low-pressure cavities are respectively connected with a vacuum system, and a gas filtering and reducing system, a heating temperature control system, a gas purging system and a water vapor condensation circulating system are arranged in the drying cavity. By the method, the silicon wafer and the texturing flower basket after texturing can be dried, the surface oxidation of the silicon wafer caused by water vapor and oxidizing atmosphere in the drying process is avoided, and the poor product manufacturing process is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor device production, in particular to a silicon wafer drying device and a silicon wafer drying method.
Background
Environmental pollution and energy crisis are increasingly prominent, in recent years, China focuses on energy structure adjustment, preferentially develops clean energy and obtains great effect, solar energy is inexhaustible, is the new energy with the most development potential, is the main power of future energy systems, solar cells are devices capable of converting solar energy into electric energy, and the technology is mainly divided into three categories: the first type is a single crystal/polycrystal traditional diffusion method technology, the efficiency is low, and the efficiency is eliminated by the market; the second type is PERC technology, which is an upgrade of the former technology, and the efficiency can be improved by adding some equipment, which is already the mainstream technology in the existing market; the third technology is an N-type high-efficiency solar technology represented by HIT, IBC or HBC technology, and particularly the HIT heterojunction technology has a blowout phenomenon in 2020 due to high efficiency improvement potential, so that the replacement of PERC market into a new market mainstream will be a necessary trend.
No matter the conventional PERC battery, the TOPcon structure and the HIT structure are adopted, the silicon wafer cleaning and texturing process is required, the structural schematic diagram of the conventional texturing and drying equipment is shown in figure 1, and the equipment comprises a feeding and discharging platform, a drying cavity, an air filter, a compression fan and a heating and temperature control system; the flocking flower basket 01 after the slow lifting and pulling process is placed on the feeding platform 02 and is driven by a belt of the transmission device 03, the flocking flower basket is conveyed to the drying cavity 04, a plurality of compression fans 05 are arranged in the drying cavity, the compression fans can compress and accelerate air filtered by the air filter 06 and then blow the air onto the flower basket, and after blowing and drying, the air is conveyed to the discharging platform through the conveying belt to complete the whole drying process.
The drying process after the silicon wafer is cleaned is usually carried out by blowing and drying with heated high-pressure air, the surface of the silicon wafer is in a damp and hot environment with sufficient oxygen, the surface of the silicon wafer is inevitably oxidized under the exposure environment with water and oxygen on the surface, but the high-efficiency battery has higher standard on the surface of the silicon chip, the oxide layer on the surface of the silicon chip cannot be too thick, otherwise the subsequent process, especially the coating process, is influenced, therefore, in order to reduce the oxidation of the silicon wafer surface caused by the drying process, the drying temperature is often reduced, the wind speed is reduced, nitrogen is added for auxiliary blowing and the like, although these methods can achieve certain effects, the drying time is increased to affect the productivity, and often, because the influence factors are more, a stable process condition is difficult to find, and based on the defects and the shortcomings, the prior art needs to be improved, and a silicon wafer drying device and a method thereof are designed.
Disclosure of Invention
The invention mainly solves the technical problem of providing a silicon wafer drying device and a silicon wafer drying method, which have compact structure and stable operation, can dry a textured silicon wafer and a textured flower basket, avoid the surface oxidation of the silicon wafer caused by water vapor and oxidizing atmosphere in the drying process and reduce the poor manufacture procedure of products.
In order to solve the technical problems, the invention adopts a technical scheme that: the silicon wafer drying device comprises a texturing flower basket conveying device, a first buffer cavity, a first low-pressure cavity, a drying cavity, a second low-pressure cavity, a second buffer cavity, a vacuum system, a filtering reduction system, a heating temperature control system, a gas purging system and a water vapor condensation circulation system, wherein the texturing flower basket conveying device is used for conveying texturing flower baskets loaded with silicon wafers and discharged at equal intervals, the texturing flower basket conveying device is sequentially provided with the first buffer cavity, the first low-pressure cavity, the drying cavity, the second low-pressure cavity and the second buffer cavity along the conveying direction, two side doors are arranged among the cavities to separate the cavities into closed spaces, the buffer cavity and the low-pressure cavity are respectively connected with the vacuum system and can be pumped to a low-pressure state within short time by a vacuum pump, the pressure intensity can be maintained within 10-1000 Pa after pumping, and the drying cavity is internally provided with the gas filtering reduction system, the heating temperature control system, A gas purging system and a water vapor condensation circulating system.
Preferably, an air inlet pipe is arranged at the top of the drying cavity, a high-efficiency filter is arranged at the outlet of the air inlet pipe, a heating device is arranged outside an air outlet pipeline below the high-efficiency filter, three purging chambers are connected below the air outlet pipeline through three pipelines, a compression fan is arranged in each purging chamber, a temperature sensor is arranged in the drying cavity at the position of the compression fan, two sides of the drying cavity are connected to the high-efficiency filter through return pipes, a condensing device is arranged in the middle of each return pipe, and the high-efficiency filter forms a filtering reduction system; the heating device and the temperature sensor form a heating temperature control system; the blowing chamber and the compression fan form a gas blowing system, and the return pipe and the condensing device form a water vapor condensation circulating system.
Preferably, the filter element of the high efficiency filter contains activated carbon having reducibility for filtering gas having strong oxidizability such as solid particles, water vapor, organic gas, SO2 and ozone, and the high efficiency filter can filter air, nitrogen or a mixture of both.
Preferably, first side door, second side door and third side door have set gradually on first cushion chamber and the first low-pressure chamber, and the second cushion chamber sets gradually fourth side door, fifth side door and sixth side door on the second low-pressure chamber, and first cushion chamber, first low-pressure chamber, second low-pressure chamber and second cushion chamber are connected with vacuum system through first vacuum pump, second vacuum pump, third vacuum pump and fourth vacuum pump respectively.
A drying method of a silicon wafer drying device is characterized in that: the method comprises the following steps:
step 1: feeding and buffering, wherein a texturing flower basket subjected to a slow lifting process is placed on a feeding platform on the left side of a texturing flower basket conveying device, a first side door is opened and a second side door is kept closed, the texturing flower basket is driven by a belt of the texturing flower basket conveying device and conveyed to a first buffer cavity, a texturing flower basket loaded with silicon wafers enters the first buffer cavity, the first buffer cavity closes the first side door and the second side door on two sides, a first vacuum pump is started, air in the first buffer cavity is pumped to form low pressure within 10-1000 Pa, the second side door is opened, the texturing flower basket loaded with the silicon wafers is conveyed to a first low-pressure cavity, the second side door and a third side door are closed, a second vacuum pump is started again to pump the pressure in the low-pressure cavity to be within 10-1000 Pa, the third side door is opened again, the texturing flower basket loaded with the silicon wafers is conveyed to a drying cavity, and the third side door is closed;
step 2: drying, air circulation purification, drying the silicon wafer in the texturing flower basket in a drying cavity, and specifically circulating the process as follows: nitrogen or nitrogen-air mixed gas enters through the air inlet pipe, lost clean gas is supplemented in time to keep positive pressure in the drying cavity, the nitrogen or nitrogen-air mixed gas enters the space of the drying cavity after being filtered by the high-efficiency filter, the high-efficiency filter filters out gas with strong oxidizability such as solid particles, water vapor, organic gas, SO2 and ozone in the gas entering the drying cavity to ensure the cleanness of the gas entering the drying cavity, the clean gas can be heated by the heating device after being efficiently filtered, and the power of the heating device is adjusted according to the temperature feedback sensed by the temperature sensor, SO that the drying temperature is accurately controlled, the temperature is high, the drying process is accelerated, but the oxidation process of the surface of the silicon wafer and the water vapor is accelerated, and the heating temperature control system; the method comprises the following steps that (1) entering clean gas is accelerated by a plurality of compression fans and then is blown to a texturing flower basket and a silicon wafer, air flow on the surface of the silicon wafer is accelerated, so that the drying process is accelerated, the circulated gas is separated to air outlet holes on two sides, the gas reaches a condensing device through a return pipe, water vapor in the return gas is condensed and collected by the condensing device, and the rest gas is continuously circulated to a high-efficiency filter to filter out the rest water vapor and then enters a drying cavity for continuous use;
and 4, step 4: gas updating, because the outside air gets into in the second buffer chamber after the sixth side door is opened, it gets into dry chamber to reduce contaminated air through follow-up step, close fifth side door and sixth, after taking away the air in the second buffer chamber through the fourth vacuum pump, open fifth side door, the air gets into buffer chamber diluent gas in the second low pressure chamber, close fifth side door and fourth side door, the third vacuum pump is opened and is taken out the second low pressure chamber to the low pressure, the fourth side door is opened, gaseous replenishment to the second low pressure chamber in the dry chamber, so, whole material transmission process finishes, so material transmission has avoided in the transmission process that the outside air gets into dry chamber and causes the pollution
Compared with the prior art, the invention has the beneficial effects that:
the whole device is sealed, and the space is positive-pressure and the buffer cavity is used for air suction and air exchange, so that air pollution caused by the inlet and outlet of the silicon wafer-loaded texturing basket is reduced;
the hot water vapor is rapidly liquefied after meeting the low-temperature glass wall suddenly and then flows into the collecting bottle, and other gases in the gas are continuously transmitted and circulated, so that the humidity of the gas in a drying area is reduced, the drying speed is accelerated, and the drying time is shortened;
the gas passes through a filtering reduction high-efficiency filter, so that the gas blown to the surface of the silicon wafer is ensured to be clean as much as possible, and the oxidation and pollution of the surface of the silicon wafer are reduced;
the power of the heating device is adjusted according to the temperature feedback sensed by the temperature sensor, so that the drying temperature is accurately controlled, the drying process is accelerated due to high temperature, but the oxidation process of the surface and water vapor of the silicon wafer is accelerated, and the heating temperature control system is used for process debugging of the drying process.
Drawings
Fig. 1 is a schematic structural diagram of a texturing and drying apparatus in the prior art.
FIG. 2 is a schematic structural view of a silicon wafer drying apparatus.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the invention can be more readily understood by those skilled in the art, and the scope of the invention will be more clearly defined.
Referring to fig. 1 and 2, an embodiment of the present invention includes:
a silicon wafer drying device comprises a texturing flower basket conveying device 1, a first buffer cavity 2, a first low-pressure cavity 3, a drying cavity 4, a second low-pressure cavity 5, a second buffer cavity 6, a vacuum system, a filtering reduction system, a heating temperature control system, a gas purging system and a water vapor condensation circulation system, wherein the texturing flower basket conveying device 1 is used for conveying texturing flower baskets 11 loaded with silicon wafers and discharged at equal intervals, the texturing flower basket conveying device 1 is sequentially provided with the first buffer cavity 2, the first low-pressure cavity 3, the drying cavity 4, the second low-pressure cavity 5 and the second buffer cavity 6 along the conveying direction, two side doors are arranged among the cavities to separate the cavities into closed spaces, the buffer cavity and the low-pressure cavity are respectively connected with the vacuum system and can be pumped to a low-pressure state within a short time by a vacuum pump, the pressure can be kept within 10-1000 Pa after being pumped, and the drying cavity 4 is internally provided with the gas filtering reduction system, Heating temperature control system, gas purging system and steam condensation circulation system.
The top of the drying cavity 4 is provided with an air inlet pipe 41, an outlet of the air inlet pipe 41 is provided with a high efficiency filter 42, a heating device 44 is arranged outside an air outlet pipeline 43 below the high efficiency filter 42, the lower part of the air outlet pipeline 43 is connected with three purging chambers 45 through three pipelines, a compression fan 46 is arranged in the purging chamber 45, a temperature sensor 47 is arranged in the drying cavity 4 at the position of the compression fan 46, two sides of the drying cavity 4 are connected to the high efficiency filter 42 through return pipes 48, the middle part of the return pipes 48 is provided with a condensing device 49, and the high efficiency filter 42 forms a; the heating device 44 and the temperature sensor 47 form a heating temperature control system; the purge chamber 45 and the compressor fan 46 constitute a gas purge system, and the return pipe 48 and the condenser 49 constitute a vapor condensation circulation system.
The filter element of the high-efficiency filter 42 is provided with reducing activated carbon inside for filtering strong oxidizing gases such as solid particles, water vapor, organic gas, SO2 and ozone in the gas, and the high-efficiency filter 42 can filter air, nitrogen or the mixed gas of the air and the nitrogen.
The first buffer cavity 2 and the first low-pressure cavity 3 are sequentially provided with a first side door 601, a second side door 602 and a third side door 603, the second buffer cavity 6 on the second low-pressure cavity 5 is sequentially provided with a fourth side door 604, a fifth side door 605 and a sixth side door 606, and the first buffer cavity 2, the first low-pressure cavity 3, the second low-pressure cavity 5 and the second buffer cavity 6 are respectively connected with a vacuum system through a first vacuum pump 201, a second vacuum pump 202, a third vacuum pump 203 and a fourth vacuum pump 204.
A drying method of a silicon wafer drying device is characterized in that: the method comprises the following steps:
step 2: drying, air circulation purifies, closes third side door 603, and the silicon chip in making herbs into wool basket 11 is dry in drying chamber 4, and the specific cycle process is as follows: nitrogen or nitrogen-air mixed gas enters through the gas inlet pipe 41, lost clean gas is supplemented in time to keep positive pressure in the drying cavity 4, the nitrogen or nitrogen-air mixed gas enters the space of the drying cavity after being filtered by the high-efficiency filter 42, the high-efficiency filter 42 filters out gas with strong oxidizability such as solid particles, water vapor, organic gas, SO2 and ozone in the gas entering the drying cavity to ensure the cleanness of the gas entering the drying cavity, the clean gas can be heated through the heating device 44 after being efficiently filtered, the power of the heating device 44 is adjusted according to the temperature feedback sensed by the temperature sensor 47, SO that the drying temperature is accurately controlled, the temperature is high, the drying process is accelerated, and the heating temperature control system 9 can be used for process debugging of the drying process; the entering clean gas is accelerated by a plurality of compression fans 46 and then blown to the texturing flower basket 11 and the silicon wafers, the air flow on the surfaces of the silicon wafers is accelerated, so that the drying process is accelerated, the circulated gas is separated to the air outlet holes on the two sides, the gas reaches a condensing device 49 through a return pipe 48, the water vapor in the return gas is condensed and collected by the condensing device 49, and the rest gas is continuously circulated to a high-efficiency filter 42 to filter the rest water vapor and then enters a drying cavity for continuous use;
and step 3: blanking buffering, after the silicon wafers in the texturing flower basket 11 are dried, opening the fourth side door 604, keeping the fifth 605 side door closed, conveying the texturing flower basket 11 loaded with the silicon wafers to the second low-pressure cavity 5, closing the fourth side door 604, opening the fifth side door 605, conveying the texturing flower basket 11 loaded with the silicon wafers to the second buffering cavity 6, closing the fifth side door 605, opening the sixth side door 606, and conveying the texturing flower basket 11 loaded with the silicon wafers to a blanking platform;
and 4, step 4: and (3) gas updating, because external air enters the second buffer cavity 6 after the sixth side door 606 is opened, polluted air is reduced to enter the drying cavity through subsequent steps, the fifth side door 605 and the sixth side door 606 are closed, the fifth side door 605 is opened after the air in the second buffer cavity 6 is pumped away by the fourth vacuum pump 204, the air in the second low-pressure cavity 5 enters buffer cavity dilution gas, the fifth side door 605 and the fourth side door 604 are closed, the third vacuum pump 203 is opened to pump the second low-pressure cavity 5 to low pressure, the fourth side door 604 is opened, and the gas in the drying cavity 4 is supplemented to the second low-pressure cavity 5.
The steam condensation circulation system accelerates the humidity of the gas in the drying area, and is favorable for accelerating the drying speed, so that the cleanness and high-speed circulation of the drying gas are ensured, the gas can be recycled, the too high cost of the gas is not caused, the wind speed is high, the drying process is accelerated, the oxidation process of accelerating the surface of the silicon wafer and the steam exists, and the power adjustment of the fan can be used for the process debugging of the drying process.
The silicon wafer drying device and the silicon wafer drying method are compact in structure and stable in operation, the silicon wafer and the texturing flower basket after texturing can be dried, the surface oxidation of the silicon wafer caused by water vapor and oxidizing atmosphere in the drying process is avoided, and the poor product manufacturing process is reduced.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A silicon wafer drying device is characterized in that: the silicon wafer drying device comprises a texturing flower basket conveying device, a first buffer cavity, a first low-pressure cavity, a drying cavity, a second low-pressure cavity, a second buffer cavity, a vacuum system, a filtering reduction system, a heating temperature control system, a gas purging system and a water vapor condensation circulation system, wherein the texturing flower basket conveying device is used for conveying a texturing flower basket which is used for carrying silicon wafers and is equidistantly discharged, the texturing flower basket conveying device is sequentially provided with the first buffer cavity, the first low-pressure cavity, the drying cavity, the second low-pressure cavity and the second buffer cavity along the conveying direction, two side doors are arranged between the cavities to separate the cavities into closed spaces, the buffer cavity and the low-pressure cavities are respectively connected with the vacuum system, and the drying cavity is internally provided with the gas filtering reduction system, the heating temperature control system, the gas purging system and the water vapor condensation circulation system.
2. The silicon wafer drying apparatus according to claim 1, wherein: the drying device comprises a drying cavity, a heating device, a compression fan, a condensing device, a high-efficiency filter, a heating device, a heating; the heating device and the temperature sensor form a heating temperature control system; the blowing chamber and the compression fan form a gas blowing system, and the return pipe and the condensing device form a water vapor condensation circulating system.
3. The silicon wafer drying apparatus according to claim 2, wherein: the filter element of the high-efficiency filter is internally provided with active carbon with reducibility for filtering gases with strong oxidizability, such as solid particles, water vapor, organic gases, SO2, ozone and the like in the gases, and the high-efficiency filter can filter air, nitrogen or mixed gases of the air and the nitrogen.
4. The silicon wafer drying apparatus according to claim 1, wherein: first side door, second side door and third side door have set gradually on first cushion chamber and the first low-pressure chamber, and the second cushion chamber sets gradually fourth side door, fifth side door and sixth side door on the second low-pressure chamber, and first cushion chamber, first low-pressure chamber, second low-pressure chamber and second cushion chamber are connected with vacuum system through first vacuum pump, second vacuum pump, third vacuum pump and fourth vacuum pump respectively.
5. A drying method using the silicon wafer drying apparatus according to any one of claims 1 to 4, characterized in that: the method comprises the following steps:
step 1: feeding and buffering, wherein a texturing flower basket subjected to a slow lifting process is placed on a feeding platform on the left side of a texturing flower basket conveying device, a first side door is opened and a second side door is kept closed, the texturing flower basket is driven by a belt of the texturing flower basket conveying device and conveyed to a first buffer cavity, a texturing flower basket loaded with silicon wafers enters the first buffer cavity, the first buffer cavity closes the first side door and the second side door on two sides, a first vacuum pump is started, air in the first buffer cavity is pumped to form low pressure within 10-1000 Pa, the second side door is opened, the texturing flower basket loaded with the silicon wafers is conveyed to a first low-pressure cavity, the second side door and a third side door are closed, a second vacuum pump is started again to pump the pressure in the low-pressure cavity to be within 10-1000 Pa, the third side door is opened again, the texturing flower basket loaded with the silicon wafers is conveyed to a drying cavity, and the third side door is closed;
step 2: drying, air circulation purification, drying the silicon wafer in the texturing flower basket in a drying cavity, and specifically circulating the process as follows: nitrogen or nitrogen-air mixed gas enters through the air inlet pipe, lost clean gas is supplemented in time to keep positive pressure in the drying cavity, the nitrogen or nitrogen-air mixed gas enters the space of the drying cavity after being filtered by the high-efficiency filter, the high-efficiency filter filters out gas with strong oxidizability such as solid particles, water vapor, organic gas, SO2 and ozone in the gas entering the drying cavity to ensure the cleanness of the gas entering the drying cavity, the clean gas can be heated by the heating device after being efficiently filtered, and the power of the heating device is adjusted according to the temperature feedback sensed by the temperature sensor, SO that the drying temperature is accurately controlled, the temperature is high, the drying process is accelerated, but the oxidation process of the surface of the silicon wafer and the water vapor is accelerated, and the heating temperature control system; the method comprises the following steps that (1) entering clean gas is accelerated by a plurality of compression fans and then is blown to a texturing flower basket and a silicon wafer, air flow on the surface of the silicon wafer is accelerated, so that the drying process is accelerated, the circulated gas is separated to air outlet holes on two sides, the gas reaches a condensing device through a return pipe, water vapor in the return gas is condensed and collected by the condensing device, and the rest gas is continuously circulated to a high-efficiency filter to filter out the rest water vapor and then enters a drying cavity for continuous use;
step 3, buffering blanking, opening a fourth side door after the silicon wafers in the texturing basket are dried, keeping a fifth side door closed, conveying the texturing basket loaded with the silicon wafers to a second low-pressure cavity, closing the fourth side door, opening the fifth side door, conveying the texturing basket loaded with the silicon wafers to a second buffer cavity, closing the fifth side door, opening a sixth side door, and conveying the texturing basket loaded with the silicon wafers to a blanking platform;
and 4, step 4: gas updating, because the sixth side door opens the back and has the outside air to get into in the second cushion chamber, reduce contaminated air and get into dry chamber through follow-up step, close fifth side door and sixth, after taking away the air in the second cushion chamber through the fourth vacuum pump, open the fifth side door, the interior air of second low pressure chamber gets into cushion chamber diluent gas, close fifth side door and fourth side door, the third vacuum pump is opened and is taken out the second low pressure chamber to the low pressure, the fourth side door is opened, dry intracavity gas supply to second low pressure chamber, so, whole material transmission process finishes, so material transmission has avoided in the transmission process that the outside air gets into dry chamber and causes the pollution.
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