JP2008147303A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of performing substrate processing with high quality by effectively preventing chemical vapor to be generated in chemical processing from scattering to the outside of a sink having a processing tank. <P>SOLUTION: The substrate processing apparatus 1 comprises: the processing tanks 2A-2D composed of a bottomed container of which the upper portion is open; a grip mechanism 11 for gripping a wafer W; an elevating device 10 to which the grip mechanism is connected, thereby immersing the wafer into a processing liquid stored in each processing tank and drawing up the wafer from the processing tank; a carrying device 7 to which the elevating device is connected, thereby carrying the wafer to the processing tank; and a scattering prevention cover 8 connected to the carrying device and covering the opening part of the processing tank when the larger amount of vapor, compared with that in a normal situation, is generated and comes upward from the processing tank. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for immersing various substrates such as a semiconductor substrate and a liquid crystal glass substrate in a plurality of types of processing liquids and cleaning the surface thereof.

  Various substrates (hereinafter referred to as “wafers”) such as semiconductor substrates and liquid crystal glass substrates have particles, organic contaminants, metal impurities, etc. (hereinafter collectively referred to as “contamination”) on their surfaces. Various cleaning devices are used to remove this contamination. Among these types of cleaning devices, wet-type cleaning devices are widely used because they can effectively remove contamination and have high throughput.

  This type of cleaning apparatus is generally composed of a carry-in part for carrying in a wafer, a washing process part for washing the carried-in wafer, a drying process part for drying after the washing process, and a carry-out part for taking out the processed wafer. Yes. Among these, the cleaning processing unit has a plurality of processing tanks, for example, chemical liquids such as ammonia, hydrofluoric acid, sulfuric acid, and cleaning liquids such as pure water are stored, and a plurality of processing tanks for performing various processing of the wafer are arranged in a row. The chemical solution processing is performed on the wafer in each processing tank, and the water washing cleaning process is performed with pure water after the chemical solution processing. In addition, wafers are transferred between these processing tanks by a transfer device.

  However, in such a cleaning apparatus, the chemical solution stored in the treatment tank during the chemical treatment, for example, sulfuric acid to which hydrogen peroxide is added is heated to a high temperature, for example, about 120 degrees. When the wafer is immersed in the chemical solution and taken out from the processing tank after the chemical treatment, the chemical solution adhering to the wafer chuck of the transfer mechanism and the processed wafer evaporates, and is scattered and diffused into the apparatus as a chemical mist. There is a risk of contamination of other wafers and other apparatus members. Therefore, such a cleaning apparatus is provided with scattering prevention means including a partition wall for isolating the processing tank (for example, see Patent Documents 1 and 2 below).

  For example, a substrate processing apparatus disclosed in the following Patent Document 1 is provided with a partition wall between a processing tank and handling means for transporting a wafer. This partition prevents the chemical vapor generated from the treatment tank from entering the movable mechanism of the handling means, so that the movable mechanism is not corroded by the chemical vapor, and conversely, particles from the mechanism section No entry into the processing tank.

Moreover, the washing | cleaning apparatus disclosed by the following patent document 2 encloses the circumference | surroundings of a processing tank with the partition plate and the shielding board. 5 is a perspective view showing a part of the wet type cleaning apparatus described in Patent Document 1 below, that is, the vicinity of the chemical treatment tank, and FIG. 6 is a longitudinal sectional view of the cleaning apparatus.
As shown in FIG. 5, the cleaning apparatus 20 includes water cleaning cleaning tanks 22 and 24 arranged before and after the chemical cleaning tank 23. The chemical cleaning tank 23 stores the outer outer tank 23 a and the chemical liquid. And an inner tank 23b in which the wafer W is immersed.

The outer tub 23a is provided with a partition plate 25 at the rear end portion and a shielding plate (mist separator) 26 at the front end portion, and the partition plate 25 is a fan filter unit located on the ceiling portion as shown in FIG. F ₅ is suspended, the shield plate 26 is secured by bolts or the like on the outside of the outer tub 23a. The shielding plate 26 is formed in a substantially U shape, and a notch recess 26a is formed in a substantially central portion thereof. The notch recess 26 a has a size that matches the vertical movement of the wafer chuck 21. Further, a shielding plate 27 and a partition plate 28 having the same configuration as the shielding plate 26 and the partition plate 25 are provided at the front and rear ends of the water washing treatment tank 22, and the shielding plates 29 and 28 are also provided at the front and rear ends of the water washing treatment tank 24. A partition plate 30 is provided. The respective shielding plates 26, 27, 29 and the partition plates 25, 28, 30 are connected to each other in an airtight manner.

  In addition, as shown in FIG. 6, the cleaning processing section includes a drive area X in a space area where the transfer device moves on the front side and a processing area Y in which each processing tank exists on the back side, with the shielding plate 26 row as a boundary. It is divided into and separated.

According to the cleaning device 20, is disposed shield plate 26 and the partition plate 25 around the inner tank 23b, since clean air is blown downward further from upward by the fan filter unit F _5, the wafer The chemical mist generated when the chuck 21 moves up and down is efficiently exhausted from the exhaust port 31 through the space P between the outer tank 23a and the inner tank 23b and the space P below the inner tank 23b. This prevents the chemical mist from diffusing into the apparatus. At this time, the rear side of the inner tank 23b is completely blocked by the partition plate 25, and the front side is also blocked to a considerable extent by the shielding plate 26. Therefore, the chemical mist is exhausted very efficiently with the airflow. Further, the inside of the cleaning processing section is divided into a drive area X and a processing area Y by a shielding plate array, and each area is supplied with air from the fan filter unit F _5, while the drive area X is in the exhaust plate 31. The processing area Y is further exhausted from the gap between the outer tank 23a and the inner tank 23b. Therefore, it is possible to prevent the chemical mist and particles from being diffused in the apparatus by controlling the air supply / exhaust amount for each area to control the atmosphere in the apparatus to generate an air current without stagnation.

Japanese Patent Laid-Open No. 10-27770 (paragraph [0016], FIG. 2) JP-A-7-176509 (paragraphs [0043] to [0047], FIG. 2 and FIG. 3)

  According to the substrate processing apparatus disclosed in Patent Document 1, since the partition wall is provided between the processing tank and the handling means for transporting the wafer, the chemical vapor generated from the processing tank can move the moving mechanism of the handling means, etc. Therefore, the moving mechanism and the like are not corroded by the chemical vapor. However, the partition wall is only provided between the treatment tank and the handling means, and there is a possibility that the chemical vapor leaks from a place where the partition wall does not exist and enters the other.

On the other hand, in the cleaning device 20 disclosed in Patent Document 2, the periphery of the treatment tanks 22 to 24 is covered with the partition plates 25, 28, and 30 and the shielding plates 26, 27, and 29. It is possible to effectively prevent the diffusion into 20. However, the cleaning apparatus 20 is provided with the partition plates 25, 28, 30 and the shielding plates 26, 27, 29 attached to the individual processing tanks 22-24 arranged in a row, and the shielding plates 26, 27, respectively. 29 and the partition plates 25, 28, 30. For example, each of the shielding plates 26, 27, 29 requires a large concave groove into which the transfer arm is inserted. For this reason, the flow of the gas passing through the concave groove is generated in both directions from the transport mechanism toward the processing tank and in the opposite direction from the processing tank toward the transport mechanism as the transport mechanism moves. Moreover, in this apparatus, the vapor | steam which penetrated into the drive area X is discharged | emitted by the exhaust hole between the drive area X and the space P, but it has penetrate | invaded the drive area X once, and movement of a conveyance machine is carried out. For example, there is a possibility of staying below the exhaust hole. Furthermore, chemical vapor but will be pushed down by the supply air of the upper fan filter unit F _5, since the fan filter unit F ₅ may not the same amount only always supplied throughout the device, the occurrence of chemical vapor It is difficult to control such that a large amount of air is supplied when there is a large amount and a small amount of air when there is little steam.

  The present invention has been made to solve such problems of the prior art, and the object of the present invention is to effectively suppress the chemical vapor generated during the chemical treatment from being scattered outside the treatment tank and to achieve high quality. An object of the present invention is to provide a substrate processing apparatus that enables substrate processing.

In order to achieve the above object, the substrate processing apparatus according to claim 1 is characterized in that a processing tank comprising a bottomed container having an open top, a gripping mechanism for gripping a substrate to be processed, and the gripping mechanism are connected to each other. And an elevating device for immersing the substrate to be processed in the processing liquid stored in the processing tank and pulling up the substrate from the processing tank, and the elevating device are connected to move the substrate to be processed to the processing tank. In a substrate processing apparatus comprising a transport device for transporting,
A scatter prevention cover connected to the transfer device capable of covering the opening of the treatment tank when a large amount of steam is generated and raised from the treatment tank in a larger amount than normal is provided.

  According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the opening of the processing tank is provided with a lid that opens and closes the opening, and the anti-scattering cover includes the lid The upper part of the opening is covered when the body is opened.

  According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the scattering prevention cover is a cover body whose outer periphery is surrounded by a side plate and whose upper part is closed and whose lower part is opened. The gripping mechanism is taken in and out through the opening below the anti-scattering cover, and when the substrate to be processed is lifted from the processing tank by the lifting device, the substrate to be processed is The gripping mechanism for gripping and the substrate to be processed are accommodated in the scattering prevention cover.

  According to a fourth aspect of the present invention, in the substrate processing apparatus of the third aspect, the scattering prevention cover is provided with an injection nozzle for injecting an inert gas on an inner surface of the ceiling. .

  According to a fifth aspect of the present invention, in the substrate processing apparatus of the third or fourth aspect, the opening of the anti-scattering cover extends to a position close to an opening of a sink that accommodates the processing tank. It is characterized by being.

  The invention according to claim 6 is the substrate processing apparatus according to any one of claims 1 to 5, wherein the scattering prevention cover is moved in a horizontal direction by a pair of support members different from the lifting device. It is connected to the transport device.

  The invention described in claim 7 is the substrate processing apparatus according to claim 6, wherein the gripping mechanism housed inside the scattering prevention cover and the lifting device outside the scattering prevention cover are supported. It is connected by an arm, and a slit is formed in one side plate of the scattering prevention cover so that the supporting arm does not hinder the lifting and lowering operation of the gripping mechanism by the lifting device.

  According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the first to seventh aspects, the scattering prevention cover is formed of a transparent member through which the inside can be seen.

  The invention described in claim 9 is the substrate processing apparatus according to any one of claims 1 to 8, wherein the processing tank, the gripping mechanism, the transfer device, the lifting device, and the anti-scattering cover are clean airflow generating means. It is stored in a provided storage chamber.

  By providing the above configuration, the present invention has the following excellent effects. That is, according to the first aspect of the present invention, since the scattering prevention cover can be moved onto the processing tank by the transport device when a large amount of steam is generated from the processing tank, the steam can be prevented from being released to the outside. For example, it is possible to prevent the outside of the treatment tank from being contaminated by the chemical solution even if the high-temperature chemical solution is evaporated. Therefore, unlike the prior art, there is no need to provide a partition plate between each processing tank and the transfer device, and scattering of the processing liquid can be effectively suppressed with a simple configuration.

  According to invention of Claim 2, since a cover body is provided in the upper part of a processing tank and this processing body is covered with a scattering prevention cover when this cover body is opened, discharge | release to the exterior of a vapor | steam can be suppressed effectively. .

  According to the invention of claim 3, when the substrate to be processed is pulled up from the processing tank, the holding mechanism for holding the substrate to be processed and the substrate to be processed are accommodated in the scattering prevention cover. It is possible to prevent chemical vapor evaporated from the treatment liquid adhering to the outside from being scattered outside the scattering prevention cover. The same effect can be obtained for steam that rises only when the lid is opened.

  According to the invention of claim 4, by providing the injection nozzle on the ceiling inner surface of the scattering prevention cover, it is possible to inject the inert gas from the ceiling injection nozzle when the substrate to be processed is pulled up from the processing tank. Thus, the vapor of the treatment liquid in the scattering prevention cover can be efficiently discharged. In addition, there is an effect of cooling the substrate pulled up from the high-temperature processing liquid, and the thermal shock when the substrate is put into the washing treatment tank can be reduced.

  According to the invention of claim 5, the scattering prevention cover becomes a long cylindrical body by extending the scattering prevention cover opening to a position close to the opening of the sink in which the treatment tank is accommodated. The substrate to be processed pulled up from the substrate and the holding mechanism for holding the substrate are covered with the long anti-scattering cover, so that the amount of the processing liquid scattered outside the anti-scattering cover is reduced.

  According to the invention of claim 6, since the scattering prevention cover is connected and fixed to the conveying device via a pair of support members different from the lifting device to which the gripping mechanism is connected, the vertical movement of the lifting device is prevented from scattering. The substrate can be moved up and down smoothly without being obstructed by the cover or the support member.

  According to the seventh aspect of the present invention, the movement of the gripping mechanism is smoothed by providing the slit on the one side wall surface of the anti-scattering cover so that the support arm supporting the gripping mechanism can move up and down.

  According to the invention of claim 8, since the scattering prevention cover is formed of the transparent member that can see through the inside, the state inside the prevention cover can be easily inspected.

  According to the ninth aspect of the present invention, the cleanliness of the storage chamber can be maintained by the clean air flow generating means. Further, since the transport device moves together with the anti-scatter cover, there are areas where the transport device is present and areas where the transport device is not present. In an area where there is no transfer device, the supply of clean air by the clean air flow generation means and the exhaust from the sink are balanced. However, in the area where the transport device is located, the transport device and the anti-scatter cover prevent the clean air from the clean air flow generating means from being released to the exhaust of the sink, so that the air pressure increases at the same time as the air flow speed increases near the anti-scatter cover. . Further, in the scattering prevention cover, the air pressure is lowered by the exhaust from the sink, so that an air flow is generated in a direction in which the clean air outside the cover enters the scattering prevention cover through the slit. Accordingly, the chemical vapor in the scattering prevention cover does not flow out of the scattering prevention cover from the slit, so that the conveying device is not rusted by the chemical vapor.

  Hereinafter, the best embodiment of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a substrate processing apparatus for embodying the technical idea of the present invention, and is not intended to identify the present invention as this substrate processing apparatus. Other embodiments within the scope of the claims are equally applicable. FIG. 1 is a schematic front view schematically showing a partial configuration of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 contains one processing tank and the processing tank in the substrate processing apparatus of FIG. FIG. 3 is a cross-sectional view taken along the line XX of FIG. 2, and FIG. 4 is a perspective view of the anti-scattering cover viewed obliquely from the rear. Also, in the following description, unless there is a particular need to distinguish, the chemical solution and the cleaning liquid (pure water) are collectively referred to as a processing liquid, and a processing tank for storing the chemical liquid for further explanation is a chemical processing tank, The treatment tank that stores pure water will be referred to as a water washing treatment tank.

  A substrate processing apparatus 1 according to an embodiment of the present invention is a wet type processing apparatus that performs a predetermined chemical process on the surface of a wafer W by immersing a plurality of wafers W in a plurality of types of processing liquids. Although detailed illustration relating to the overall diagram is omitted, the substrate processing apparatus 1 includes a carry-in unit for loading unprocessed wafers W in units of cassettes C, and substrate processing for performing processing such as cleaning on the loaded wafers W. A drying processing unit that dries after the cleaning process, and a carry-out unit that takes out the processed wafer W in units of cassette C. These carry-in / carry-out unit, substrate processing unit, accessory parts thereof, and the like are accommodated in a storage chamber of a predetermined size.

  The carry-in unit includes a placement unit A for placing two cassettes C each including a plurality of unprocessed wafers W, for example, 25 cartridges, and a transport mechanism (not shown) that transports the cassettes C. Yes. The substrate processing unit transports the wafer W between the plurality of processing tanks 2A to 2D and the adjacent processing tanks 2A to 2D arranged in parallel in one direction, and accommodates the wafer W in the processing tanks 2A to 2D. A wafer chuck 11 for holding the wafer W is attached to the carrier / lifting apparatus, and the wafer W is gripped by the wafer chuck 11 and transferred between the processing tanks 2A to 2D. The storage tanks 2A to 2D can be accommodated and taken out. In addition, the detailed structure about process tank 2A-2D is mentioned later. Furthermore, the carry-out part also has a mounting part B and a transport mechanism that are substantially the same as the carry-in part.

  FIG. 1 shows a carry-in section and a part of the substrate processing section of the substrate processing apparatus 1. As shown in FIG. 1, the substrate processing apparatus 1 includes a placement unit A for placing wafers W stored in a cassette C carried in by a transport mechanism, and approximately one row adjacent to the placement unit A. A plurality of processing tanks 2A to 2D arranged in the above, a drying processing tank 2E for drying after the cleaning process, and a mounting portion B on which the wafers W processed in the processing tanks 2A to 2E are mounted. ing.

  These processing tanks 2A to 2E are, for example, a processing tank 2A is a chemical processing tank that performs chemical processing of impurities such as organic contaminants, metal impurities, and particles on the surface of the wafer W with a chemical liquid, and the processing tank 2B is a chemical processing tank. This is a washing treatment tank for washing the wafer W treated with 2A with a washing liquid, that is, pure water. In addition, when it is necessary to process the wafer W processed in the washing treatment tank 2B with a different chemical solution or when it is necessary to increase the throughput by preparing the same chemical solution, the wafer W is adjacent to the washing treatment tank 2B. Then, the chemical solution treatment tank 2C and the water washing treatment tank 2D are further provided, and treatment with different or the same chemical solution is performed. Further, when it is necessary to process with other processing liquids, one or a plurality of chemical processing tanks and water washing tanks are arranged adjacent to the water washing tank 2D in the same manner as the chemical liquid processing tank 2C and the water washing tank 2D. Just set up. In the substrate processing apparatus 1 shown in FIG. 1, a drying treatment tank that performs a final rinsing process using ultrasonic waves or the like and a vapor drying process using a drying medium such as IPA (isopropyl alcohol) adjacent to the water washing treatment tank 2D. 2E is provided, and finish processing (that is, final cleaning and drying processing) of the wafer W processed in each of the processing tanks 2A to 2D is performed. Then, a mounting portion B serving as a carry-out portion of the wafer W is provided adjacent to the drying treatment tank 2E, and carry-out for performing subsequent processing is performed here. In addition, ammonia, ammonium fluoride, phosphoric acid, sulfuric acid, hydrofluoric acid, etc. are used for a chemical | medical solution. Hydrogen peroxide is added depending on the chemical solution. Moreover, although the chemical | medical solution, the water washing, and the drying processing tank were shown as processing tank 2A-2E in FIG. 1, the chuck processing tank etc. which wash | clean and dry the wafer chuck 11 other than these processing tanks 2A-2E are provided, respectively. It is preferable to carry out the treatment.

As shown in FIG. 2, the treatment tanks 2 </ b> A to 2 </ b> D arranged in one row are provided with a total of two transfer / lifting devices 6 that move between adjacent treatment tanks. Among the transfer / lifting devices 6, the transfer / lifting device 6 positioned on the front stage moves a distance before and after the chemical processing tank 2 </ b> A among the arranged processing tanks 2 </ b> A to 2 </ b> D. Specifically, the wafer W is transported from the mounting portion A, the wafer W is immersed in the processing liquid in the chemical processing tank 2A, and the processed wafer W is pulled up from the chemical processing tank 2A and transferred to the adjacent water washing processing tank 2B. To do. FIG. 1 shows chuck covers 8 and 8 mounted on the transfer / lifting device 6, and the chuck cover 8 mounted on the transport / lifting device 6 on the front side is centered on the processing tank 2 </ b> A by the transfer device 7. It moves between the front-rear distance L ₁ , that is, between the placement part A and the treatment tank 2B. The other chuck cover 8 mounted on the transport / lifting device 6 on the rear stage side moves so as to move between the front and rear distance L ₂ around the chemical treatment tank 2C, that is, between the water washing treatment tank 2B and the mounting portion B. It has become.
These mounting portions A and B, the processing tanks 2A to 2D, the transfer / lifting device 6 and their accessory parts are stored in an air-controlled storage case 4.

As shown in FIG. 2, a transport / lift device 6 is provided above the chemical solution processing tank 2 </ b> A, and the chemical solution processing tank 2 </ b> A and the transport / lift device 6 are stored in the storage case 4. The chemical treatment bath. 2A, the inner tank 2 ₁ box-shaped having an opening upward in size bottomed that can accommodate a predetermined amount of treatment liquid and a plurality of wafers W, the outer periphery of the inner tank 2 ₁ there has from the inner tank 2 ₁ and outer tub 2 ₂ for collecting the processing liquid overflowing it, the holder 2 ₃ bottom wall near the wafer W of the inner tank 2 ₁ is placed is provided. The treatment tank 2A includes a treatment liquid supply means (not shown) for supplying a treatment liquid and a discharge means (not shown) for discharging the used treatment liquid discharged from the inner and outer tanks 2 ₁ and 2 ₂ to the outside of the substrate processing apparatus 1. Is provided.

Chemical treatment bath 2A and 2C, the processing solution overflowing the inner tank 2 ₁ is circulated through the further circulation path is recovered in the outer tank 2 _2, impurities accumulated in the respective processing liquid in the time of the circulation removed It has come to be. It also has a function of adjusting the temperature and concentration of the treatment liquid. Although the circulation path is not shown, a filter for filtering the circulating processing liquid, a pump for feeding the processing liquid, a processing liquid supply source, and the like are disposed in the circulation path, and these are connected by piping. Consists of things. In addition, the opening 2 ₀ of the inner tank 2 _1, is provided a lid 3 for opening and closing the opening portion 2 _0. The lid 3 is a provided in order to prevent the liquid medicine or the like volatilized chemical treatment tank 2A, the opening 2 ₀ 2C from leaking to the outside, the opening and closing mechanism for moving the lid 3 (not shown ). The opening 2 _0, is closed when the drug solution into the inner tank 2 ₁ reservoir or wafer is being processed, is opened only when the wafer W passes through the opening 2 _0. The lid is attached only to a liquid tank in which steam is likely to be generated and raised.

As shown in FIGS. 2 and 4, the transport / lift device 6 includes a transport device 7 that is moved in the horizontal direction, and a lift device 10 that is attached to the transport device 7 and can move up and down.
Of these, two support columns (support members) 7 ₁ and 7 ₁ that are vertically arranged at predetermined intervals are connected to the transport device 7, and the support columns 7 ₁ and 71 are connected to the support columns 7 ₁ and 7 ₁ . includes a top portion 7 _T, 7 a pair of support that extends substantially perpendicularly from each of _T arm 7 _2, 7 _2, a chuck cover 8 which is suspended those from the support arm 7 _2, 7 _2. Then, the transport mechanism 7 includes a horizontal movement mechanism for moving the respective support struts 7 _1, 7 ₁ of the base portion 7 _B, 7 _B is the horizontal direction is connected, and a driving means for operating the horizontal movement mechanism (not shown) In addition. For this horizontal movement mechanism and driving means, for example, a mechanism / means using a motor is used.

Chuck cover 8 is provided so as to surround the chuck arms ₁₁ A, 11 _B and the chuck arm ₁₁ A, 11 gripped wafer W to _B. The chuck cover 8 is a scattering prevention cover for preventing the processing liquid adhering to the wafer W or the like, in particular, a high-temperature chemical solution from evaporating, and preventing the evaporated vapor from scattering. cover 8, a space S (see FIG. 2) in which the pair of chuck arms ₁₁ a, 11 _B and these chuck arms ₁₁ a, 11 _B are housed within an open mouth downward ceiling _{8 6} is closed 8 and ₅ is made of a synthetic resin material having chemical resistance and heat resistance. The cylinder body is surrounded by side plates 8 ₁ to 8 ₄ (see FIGS. 2 and 3). The chuck cover 8 is preferably made of a transparent resin material that allows the inside to be seen through. By forming the chuck cover 8 from a transparent resin material, when the wafer chuck 11 and the wafer W gripped by the wafer chuck 11 are accommodated in the chuck cover 8, these members can be visually observed. It is easy to detect if there is. Of course, the degree of contamination in the chuck cover 8 can be easily found.

Further, the one side wall _{8 1} behind the chuck cover 8 is formed with a slit ₈ A, _{8 A} of the support arm ₁₀ 2, 10 ₂ of the pair is inserted to be vertically movable (see Fig. 3). Then, the chuck cover 8 has an open port 8 ₅ capable out the wafer W from the opening of the chemical treatment bath 2A at its lower end, an end portion of the mouth opening 8 ₅ is suspended from the support arm 7 _2, 7 ₂ It has a length that reaches the opening of the sink in the state where Moreover, since the chuck cover 8 With such length becomes unstable becomes vertically long, and one side surface of the support struts 7 _1, 7 ₁ of the intermediate portion and the chuck cover 8 is coupled with the coupling member 7 ₃ .

The ceiling _{8 6} of the chuck cover 8, a nitrogen gas _{(N 2} gas) for injecting the injection nozzle ₉ 1 to 9 _N is provided. These injection nozzles 9 _{1 to} 9 _N are formed in a plurality of supply pipes 9, and these supply pipes 9 are connected to an N ₂ gas supply source (not shown). These injection nozzles 9 _{1 to} 9 _N are not shown in the drawing when the wafer W is processed in the processing tank 2A and then held by the wafer chuck 11 and accommodated in the chuck cover 8. the control of, is fed N ₂ gas from a N ₂ gas supply source, and is down-flow.

Lifting device 10, as shown in FIGS. 2 to 4, the vertical support rods 10 ₁ to be vertically moved along the support posts _{71, 71} of the conveying device 7, the top portion 10 of the support rod 10 ₁ A pair of support arms 10 ₂ , 10 ₂ respectively extending substantially perpendicularly from _T, a pair of opposed chuck arms 11 _A , 11 _B suspended from each support arm 10 ₂ , 10 ₂ , and a support bar 10 ₁ Drive means (not shown) for driving the lifting device 10 connected to the base of the device up and down. A mechanism / means using a servo motor is used as the driving means. Together they are disposed while being vertically movably mounted between the support rods 10 ₁ Each support strut ₇₁ of the conveying device _7, 7 _1, is connected to the supporting struts 7 _1, 7 ₁ same transport device and in It is designed to move horizontally. Thus it provided the support rods 10 ₁ between each of the support pillars 7 _1, 7 _1, so further be unified conveying device into one, the entire substrate processing apparatus 1 can be downsized.

The pair of chuck arms 11 _A and 11 _B has upper ends connected to an arm operating mechanism (not shown) and has a chuck 11 _C that holds the wafer W at the lower end, and the chuck opening / closing mechanism is connected to each of the support arms 10 ₂ and 10 ₂ . It is installed. The chucking of the wafer W by the chuck arms 11 _A and 11 _B is performed by driving means (not shown) in the chuck box (10 _T ) connected to the arm operating mechanism. Incidentally, the gripping of the wafer W by the chuck arms 11 _A and 11 _B or release of the gripping is performed by slightly rotating the chuck arms 11 _A and 11 _B by the driving means.

  Clean airflow generating means 5 is provided on the ceiling of the transfer chamber 4. This clean air flow generation means 5 has an air supply unit having a fan for blowing air (not shown) and an air purification filter disposed below the air supply unit, and causes clean air to flow down into the transfer chamber 4. It is configured to form a downflow. That is, the processing solution vapor generated from the processing tank 2A and the floating particles accompanying the substrate transfer are sucked and exhausted through the forced exhaust port while flowing down along with the downflow.

The sink is formed with a discharge path for discharging the gas blown from the jetting nozzles 9 _{1 to} 9 _N in the transfer chamber 4 and the jet nozzles 9 _{1 to} 9 _N in the chuck cover 8 to the outside of the apparatus. . This discharge path is formed by, for example, a partition wall 4a standing on the wall surface of the boundary between the transfer chamber 4 and the sink, and the air or the like downflowed from the clean air flow generating means 5 is guided by this partition wall 4a to be processed. The route is such that it is discharged out of the apparatus by an unillustrated exhaust facility provided below the tank 2A. In addition, the machine room in which the base of the transfer machine is located is exhausted little by little from the apparatus using a pressure difference between the inside and outside of the apparatus through a slight gap. For this reason, the particles in the machine room are moved out of the apparatus.

  Although this substrate processing apparatus 1 is configured as described above, the supply and discharge of the processing liquid to the transfer device 7, the lifting device 10, the clean air flow generating means 5, and the processing tanks 2A to 2D are not shown. Connected to the control device, each device and mechanism are operated by a control program installed in the control device.

Next, the operation of the substrate processing apparatus 1 configured as described above will be described. In FIG. 1, the transport / lifting devices 6 and 6 are provided at the front and rear stages, respectively, but the transport / lifting devices 6 and 6 perform the same operation, and thus description thereof is omitted.
First, the wafer W is transferred by the transfer device 7 while being accommodated in the chuck cover 8 from the placement portion A of the carry-in portion to directly above the chemical treatment tank 2A. Next, N ₂ is supplied from the injection nozzles 9 _{1 to} 9 _N to prepare for steam rise when the lid 3 is opened. Then, by actuating the lifting device 10 is opened the lid 3 of the chemical treatment bath 2A, the wafer on the holding table 2 ₃ immersed in pooled chemical wafer W held by the wafer chuck 11 in the processing vessel 2A W is placed and chemical treatment is performed for a predetermined time. During this chemical treatment, the opening of the treatment tank 2A is closed by the lid 3. After a while, the supply of N ₂ from the injection nozzles 9 _{1 to} 9 _N is stopped. In this treatment tank 2A, for example, high-temperature (about 120 ° C.) sulfuric acid added with hydrogen peroxide is stored.

Next, N ₂ is supplied from each of the injection nozzles 9 _{1 to} 9 _N immediately before the chemical liquid processing is completed. When the chemical liquid processing is completed, the lid 3 is opened, and the wafer chuck 11 is inserted into the chemical liquid processing tank 2A again. The processed wafer W is gripped and pulled upward. At this time, since the chuck cover 8 is mounted on the upper side, the pulled wafer W is accommodated in the chuck cover 8.
At this time, since the high-temperature chemical is attached to the wafer W and the wafer chuck 11 pulled up from the chemical treatment tank 2A, they are instantly evaporated and scattered as vapor. However, since the wafer chuck 11 and the wafer W are accommodated in the chuck cover 8, the scattered steam stays in the chuck cover 8 and is prevented from scattering outside the chuck cover 8.

On the other hand, constantly blown clean air downflow from the clean air flow generating means 5, also, since at this time is blown in the same down-flow of N ₂ gas from the injection nozzle 9 ₁ to 9 _N in the chuck cover 8 Further, since the inside of the housing cover 4 is always sucked by the exhaust means connected to the exhaust facility provided below the processing tank 2A, the scattered chemical vapor is efficiently discharged out of the substrate processing apparatus 1. Note that shown by dotted arrows in FIG. 2 shows the flow of air and N ₂ gas and chemical vapor. As can be seen in the illustrated fluid flow, the generated chemical vapor is discharged out of the apparatus together with N ₂ gas and clean air, so that the chemical vapor is diffused and adheres to the transfer device, other wafers and other members. This prevents contamination and corrosion. In addition, there is an effect of cooling the substrate, and the thermal shock can be alleviated when it is put in a washing tank.

FIG. 1 is a schematic front view schematically showing a partial configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a longitudinal sectional view showing an outline of one processing tank and a storage chamber in which the processing tank is stored in the substrate processing apparatus of FIG. 3 is a cross-sectional view taken along line XX in FIG. FIG. 4 is a perspective view of the scattering prevention cover as viewed obliquely from the rear. FIG. 5 is a perspective view showing the vicinity of a chemical treatment tank in a conventional cleaning apparatus. 6 is a longitudinal sectional view of the cleaning apparatus of FIG.

Explanation of symbols

1 Substrate processing equipment 2A, 2C Processing tank (chemical)
2B, 2D treatment tank (water washing)
2E Treatment tank (dry)
3 Lid 4 Transfer chamber (storage case)
5 Clean Air Flow Generation Means 6 Transport / Elevating Device 7 Chuck Cover Transport Device 8 Chuck Cover (Splash Prevention Cover)
9 feed pipe ₉ 1 to 9 _N injection nozzles 10 wafer lifting apparatus 11 wafer chuck (grasping mechanism)
11 _A , 11 _B Chuck arm A, B Placement part S Space W Wafer (Substrate to be processed)

Claims (9)

A processing tank composed of a bottomed container having an open top, a gripping mechanism for gripping the substrate to be processed, and immersion of the substrate to be processed in the processing liquid stored in the processing tank by connecting the gripping mechanism and In a substrate processing apparatus comprising: a lifting device that pulls up from within the processing tank; and a transport device that is connected to the lifting device and transports the substrate to be processed to the processing tank.
A substrate processing apparatus, comprising: a scattering prevention cover connected to the transfer device capable of covering an opening of the processing tank when vapor is generated and raised from the processing tank in a larger amount than normal.   The lid of the processing tank is provided with a lid that opens and closes the opening, and the scattering prevention cover covers an upper portion of the opening when the lid is opened. 2. The substrate processing apparatus according to 1.   The anti-scattering cover comprises a cover body whose outer periphery is surrounded by a side plate and whose upper part is closed and whose lower part is opened, so that the gripping mechanism can be taken in and out through an open port below the anti-scattering cover. None, when pulling up the substrate to be processed from the processing tank by the lifting device, the holding mechanism for holding the substrate to be processed and the substrate to be processed are accommodated in the scattering prevention cover. The substrate processing apparatus according to claim 1 or 2.   The substrate processing apparatus according to claim 3, wherein the scattering prevention cover is provided with an injection nozzle for injecting an inert gas on an inner surface of the ceiling.   5. The substrate processing apparatus according to claim 3, wherein an opening of the anti-scattering cover extends to a position close to an opening of a sink that accommodates the processing tank.   The substrate processing apparatus according to claim 1, wherein the scattering prevention cover is connected to the transfer device that moves in a horizontal direction by a pair of support members different from the lifting device.   The gripping mechanism housed inside the scattering prevention cover and the lifting device outside the scattering prevention cover are connected by a support arm, and the support arm is connected to the scattering prevention cover by the lifting device. The substrate processing apparatus according to claim 6, wherein a slit is formed in one side plate of the scattering prevention cover so as not to hinder the lifting / lowering operation of the substrate.   The substrate processing apparatus according to claim 1, wherein the scattering prevention cover is formed of a transparent member through which the inside can be seen.   The substrate according to any one of claims 1 to 8, wherein the processing tank, a gripping mechanism, a transfer device, an elevating device, and an anti-scattering cover are accommodated in a storage chamber provided with a clean air flow generation unit. Processing equipment.

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