JPH09129580A - Cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent wafers from being naturally dried up. SOLUTION: A cleaning chamber 12 of a chamber 11 is equipped with an alkali cleaning tank 20, a first water cleaning tank 30, an acid cleaning tank 40, a second water cleaning tank 50, and a cleaning transfer device 14, a drying chamber 13 of the chamber 11 is equipped with a vapor drying device 60 and a drying transfer device 15, and the cleaning chamber 12 is filled with an atmosphere 16 of high humidity. An underwater transfer device 70 is provided between the cleaning chamber 12 and the drying chamber 13 so as to introduce the cleaned wafers 1 direct into the vapor bath 61 of the vapor drying device 60. When the wafer 1 is aerially transferred by the cleaning transfer device 14 in the cleaning chamber 12, the wafers 1 are exposed to an atmosphere of high humidity, so that the wafers 1 are prevented from being naturally dried up. The cleaned wafers 1 are transferred to the vapor drying device as carried underwater, so that the cleaned wafers 1 are protected against natural drying in transit. In result, the wafer 1 can be protected from stains to be caused by natural drying.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to cleaning techniques, and in particular to
The present invention relates to a technique for collectively cleaning a plurality of objects to be cleaned, for example, a technique effectively used for a technique for cleaning a semiconductor wafer (hereinafter referred to as a wafer) in manufacturing a semiconductor device.

[0002]

2. Description of the Related Art As an apparatus for cleaning a wafer in the manufacture of semiconductor devices, a cleaning tank for cleaning with an alkaline cleaning solution (hereinafter referred to as an alkaline cleaning tank), a cleaning tank for cleaning with an acid cleaning solution (hereinafter referred to as an acid cleaning) Tank) and a cleaning tank for washing with water (hereinafter referred to as “water cleaning tank”) are provided side by side in the chamber, and a plurality of wafers are transferred by a transfer device while being held by a holding jig and sequentially transferred to each cleaning tank. There is a cleaning / drying apparatus that is configured to be dipped and the wafer after cleaning is subsequently dried.

Incidentally, as an example in which the cleaning / drying apparatus is described, "Electronic Materials November 1994 Separate Volume", P103 to P10, published by Industrial Research Institute Co., Ltd. November 25, 1994.
There are nine.

[0004]

In the conventional cleaning / drying apparatus, for example, when a wafer is transferred from the alkaline cleaning tank or the acid cleaning tank in the front stage to the water cleaning tank in the rear stage in the air in the chamber by the transfer device. It has been clarified by the present inventor that there is a problem that so-called stain easily occurs due to natural drying.

An object of the present invention is to provide a cleaning device capable of preventing natural drying after cleaning each cleaning tank.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0007]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, in a cleaning apparatus in which a plurality of cleaning tanks are arranged side by side in a chamber, and an object to be cleaned is transferred by a transfer apparatus and successively immersed in each cleaning tank, the inside of the chamber is maintained at high humidity. It is characterized by being

[0009]

According to the above-mentioned means, when the object to be cleaned in each cleaning tank is transported in the air by the transfer device in the air, the object to be cleaned is exposed to the humid atmosphere in the chamber and is naturally dried. Will be prevented.
Therefore, the stain generated by natural drying is prevented in advance.

Further, in the case where an underwater transfer tank is laid downstream of the final cleaning tank of the chamber, and a drying device for drying an object to be cleaned pulled up from the underwater transfer tank is provided on the outlet side of the underwater transfer tank. In addition, since the object to be cleaned after cleaning is transported underwater and transferred to the drying device, the phenomenon of natural drying during the transfer is prevented.

[0011]

1 is a front sectional view showing a cleaning / drying apparatus according to an embodiment of the present invention.

In the present embodiment, the cleaning apparatus according to the present invention is configured as a cleaning / drying apparatus for cleaning and drying the wafer before the oxidation treatment. In this cleaning / drying apparatus, a plurality of wafers 1 as objects to be cleaned are held by a holding jig 2 and are collectively cleaned. The holding jig 2 is made of a fluororesin having good chemical resistance, and has a rectangular box shape in plan view. A plurality of holding grooves (not shown) are formed on the pair of side wall surfaces on the long side of the holding jig 2 and are arcuately arranged at substantially equal intervals in the axial direction. Each holding groove is configured to hold one wafer 1 by inserting the wafer 1 as an object to be held from the upper opening of the holding jig 2.

In the present embodiment, the cleaning / drying apparatus 10 is provided with a chamber 11 which forms an airtight space, and inside the chamber 11, a cleaning chamber 12 and a drying chamber 13 are formed. Each of the cleaning tanks described below is provided side by side on the floor surface of the cleaning chamber 12, and the drying chamber 13 is provided with a vapor drying device described below. Further, in the upper space of the cleaning chamber 12, a cleaning transfer device 14 for transferring the wafer 1 while being held by the holding jig 2 is laid all over, and the cleaning transfer device 14 is provided upstream of the cleaning chamber 12. Wafer 1 as an object to be connected from an installed loading device (not shown)
The group of wafers is received in a state of being housed in the holding jig 2, and the group of wafers 1 together with the holding jig 2 is sequentially dipped in each cleaning tank. Similarly, a drying carrier device 15 is laid in the upper space of the drying chamber 13, and the drying carrier device 15 receives the group of wafers 1 together with the holding jig 2 and is installed on the downstream side of the drying chamber 13. It is configured to be delivered to an unloading device (not shown).

The inside of the cleaning chamber 12 of the chamber 11 is formed in a humid atmosphere 16 having extremely high humidity. The high-humidity atmosphere 16 is formed by blowing moist air whose relative humidity is adjusted to 100% into the cleaning chamber 12 through a duct (not shown) from an air conditioner (not shown).

On the floor surface of the cleaning chamber 12 of the chamber 11, an alkaline cleaning tank 20 is arranged on the most upstream side. The alkaline cleaning tank 20 includes a processing tank 21 configured as an inner and outer double tank including an inner tank 22 and an outer tank 23, and the inner tank 22 and the outer tank 23 are formed in a concentric and substantially square tubular shape. ing. The treatment tank 21 stores an alkaline cleaning liquid 24 prepared from a mixed liquid of ammonia (NH ₄ OH), hydrogen peroxide (H ₂ O ₂ ) and water (H ₂ O). The cleaning liquid 24 circulates in the inner tank 22 and the outer tank 23. That is, a pump 25 having a filter 26 is connected to the bottom of the outer tank 23 and the inner tank 22.
In the above, the alkaline cleaning liquid 24 always overflows and circulates to the outer tank 23 side. Although not shown, the alkaline cleaning tank 20 is provided with a supply system for appropriately replenishing the alkaline cleaning liquid 24 and a discharge system for appropriately discharging the alkaline cleaning liquid 24.

A first water washing tank 30 is provided at a position downstream of the alkaline washing tank 20 on the floor surface of the washing chamber 12 of the chamber 11.
Is arranged. The first washing tank 30 is an inner tank 32 and an outer tank 3
3 and the processing tank 31 configured as an inner and outer double tank, and the inner tank 32 and the outer tank 33 are formed in a concentric and substantially square tubular shape. Pure water 3 as a cleaning liquid in the processing tank 31
4 is stored, and the pure water 34 circulates in the outer tank 33 and the inner tank 32. That is, the outer tank 3
A pump 35 having a filter 36 is connected to the bottom portion of 3, and the pure water 34 in the inner tank 32 always overflows and circulates to the outer tank 33 side. Although not shown, the first washing tank 30 is provided with a supply system for appropriately replenishing the pure water 34 and a discharge system for appropriately discharging the pure water 34.

An acid type cleaning tank 40 is arranged at a position downstream of the first water cleaning tank 30 on the floor surface of the cleaning chamber 12 of the chamber 11. The acid-based cleaning tank 40 includes a processing tank 41 configured as an inner and outer double tank including an inner tank 42 and an outer tank 43,
The inner tank 42 and the outer tank 43 are formed in a concentric, substantially square tubular shape. Hydrofluoric acid (HF) and water (H ₂ O) are used in the processing tank 41.
An acid-based cleaning liquid 44 prepared from a mixed liquid of the above is stored, and the acid-based cleaning liquid 44 is used as the outer tank 43 and the inner tank 42.
It is designed to circulate. That is, a pump 45 having a filter 46 is connected to the bottom of the outer tank 43, and the acid-based cleaning liquid 44 in the inner tank 42 always overflows and circulates to the outer tank 43 side. Although not shown, the acid-based water washing tank 40 has an acid-based cleaning liquid 44.
Supply system for appropriately replenishing the acid, and the acid-based cleaning liquid 44
A discharge system is installed to discharge as appropriate.

A second water washing tank 50 is arranged at a position downstream of the acid type washing tank 40 on the floor surface of the washing chamber 12 of the chamber 11. The second water washing tank 50 includes a treatment tank 51 configured as an inner and outer double tank including an inner tank 52 and an outer tank 53,
The inner tank 52 and the outer tank 53 are formed in a concentric, substantially square tubular shape. Pure water 54 as a cleaning liquid is stored in the processing tank 51, and the pure water 54 is used as the outer tank 53 and the inner tank 52.
It is designed to circulate. That is, a pump 55 having a filter 56 is connected to the bottom of the outer tank 53, and the pure water 54 in the inner tank 52 always overflows and circulates to the outer tank 53 side. Although not shown, the second cleaning tank 50 is provided with a supply system for appropriately supplying pure water 54 and a discharge system for appropriately discharging the pure water 54. Usually, the second water washing tank 50 after the acid-based cleaning has a plurality of stages, but for convenience, only one stage is shown.

On the other hand, a vapor drying device 60 is provided in the drying chamber 13.
There are facilities. The vapor dryer 60 is the vapor bath 6
1, the vapor bath 61 is formed in a box shape having a substantially square plane. At the upper part of the vapor bath 61, an entrance / exit 62 for opening / closing the holding jig 2 is provided. A coil-shaped cooling pipe 63 for circulating cooling water is laid on the inner peripheral wall of the inlet / outlet port 62 of the vapor bath 61. Isopropyl alcohol (hereinafter referred to as IPA), which is an organic solvent, is provided outside the vapor bath 61.
An IPA storage tank 64 in which is stored is formed. A heating device 65 including an infrared heater or a heat block having a sheathed heater embedded in a block of iron or aluminum is installed below the IPA storage tank 64. The heating device 65 heats the IPA 66 by heating the IPA 66. The vapor 67 is generated by forcibly evaporating it. Furthermore, IPA storage tank 6
A blower 68 is installed on the side wall of No. 4 so as to blow out the vapor 67 generated in the IPA storage tank 64 into the vapor bath 61.

A cleaning chamber 12 and a drying chamber 13 inside the chamber 11.
A partition wall 17 is built between the two compartments so as to partition both chambers, and an underwater carrier device 70 for carrying underwater the group of cleaned wafers 1 to the drying chamber 13 is installed below the partition wall 17. The submersible carrier device 70 includes a submersible carrier tank 71,
The underwater transport tank 71 is laid so as to be continuous from the final stage of the cleaning chamber 12 to the final end of the drying chamber 13, and pure water 72 is stored in the underwater transport tank 71. That is,
The lower part of the partition wall 17 is submerged in the pure water 72 of the underwater carrier 71, and is in a state of forming a tunnel in water. Although not shown, the pure water 72 stored in the submersible tank 71 is circulated to maintain a clean state at all times.

A conveyor 73 is laid at the bottom of the submersible tank 71 so as to go under the tunnel of the partition wall 17, and the conveyor 73 carries the holding jig 2 holding a group of wafers 1 from the cleaning chamber 12 to the drying chamber 13. It is designed to be transported in pure water 72. The vapor dryer 60 is installed directly above the end of the conveyor 73 on the drying chamber 13 side.
The group of wafers 1 that have been transported underwater by the conveyor 73 together with the holding jig 2 are pulled up into the atmosphere of the vapor 67 in the vapor bath 61 of the vapor drying device 60 by the drying transport device 15.

Next, the operation will be described. A group of wafers 1 to be cleaned and dried held by the holding jig 2 (hereinafter, referred to as wafer 1 group including the holding jig 2) is delivered to the cleaning carrier device 14 by a loading device, and the cleaning carrier device is provided. 1
4 conveys it right above the alkaline cleaning tank 20.
The group of wafers 1 transferred directly above the alkaline cleaning tank 20 is lowered by the cleaning transfer device 14 and immersed in the alkaline cleaning liquid 24 together with the holding jig 2. Dust adhering to the surface of the dipped wafer 1 group is removed by the cleaning action of the alkaline cleaning liquid 24. At this time, since the clean alkaline cleaning liquid 24 is constantly circulated in the alkaline cleaning tank 20, dust is prevented from reattaching to the wafer 1 group. Then, after a predetermined cleaning time set in advance, the cleaned wafer 1 group is pulled up from the alkaline cleaning tank 20 to the upper space of the cleaning chamber 12 by the cleaning transfer device 14.

The group of wafers 1 pulled out from the alkaline cleaning tank 20 is transferred to the first cleaning tank 3 by the cleaning transfer device 14.
After being conveyed right above 0, it is lowered and immersed in pure water 34 together with the holding jig 2. From the time when the wafer 1 is pulled up from the alkaline cleaning tank 20 to the time when it is immersed in the first water cleaning tank 30, the group of wafers 1 is transported in the cleaning chamber 12 of the chamber 11 in the air, but the relative humidity in the cleaning chamber 12 is Since the atmosphere 16 is maintained at 100% high humidity, the surface of the wafer 1 is not naturally dried. Therefore, the phenomenon that the surface of the wafer 1 is stained by natural drying is prevented.

The wafer 1 group immersed in pure water 34 is washed away of foreign substances (hereinafter referred to as foreign substances, etc.) such as alkaline cleaning liquid and etching residues adhering to the surface thereof. The foreign substances that have been washed away ride on the upward water flow, and the inner tank 32
Is transported to the upper part in pure water 34. Since the overflow flow of the pure water 34 is always formed in the upper part of the inner tank 32, the foreign matters and the like carried on the upper part of the water flow are discharged to the outer tank 33 immediately on the overflow flow. Become. Therefore, in the pure water 34 of the inner tank 32, there is almost no foreign matter or the like floating. The wafer 1 group thus cleaned is pulled up from the pure water 34 in the first water washing tank 30 by the cleaning transfer device 14. At this time, since no foreign matter or the like floats on the water surface of the pure water 34, the foreign matter or the like does not reattach to the surface of the wafer 1 during the pulling process.

The group of wafers 1 pulled up from the first water washing tank 30 is carried by the cleaning carrying device 14 right above the acid-based cleaning tank 40 and then lowered to be held in the acid-based cleaning solution 44 together with the holding jig 2. Be immersed in. From the time of withdrawing from the first water washing tank 30 to the time of immersion in the acid-based cleaning tank 40, the group of wafers 1 is brought into the air in the cleaning chamber 12 of the chamber 11, but the relative humidity in the cleaning chamber 12 is Since the atmosphere 16 is maintained at 100% high humidity, the surface of the wafer 1 is not naturally dried. Therefore, the phenomenon that the surface of the wafer 1 is stained by natural drying is prevented.

The immersed wafer 1 group is removed of metal, pits, and the like adhering to the surface by the cleaning action of the acid-based cleaning liquid 44. At this time, since a clean acid-based cleaning liquid 44 is constantly circulated in the acid-based cleaning tank 40, re-adhesion of dust, metal foreign matter, etc. to the wafer 1 group is prevented. Then, after a predetermined cleaning time set in advance, the cleaned wafer 1 group is lifted from the acid cleaning tank 40 to the upper space of the cleaning chamber 12 by the cleaning transfer device 14.

A group of wafers 1 pulled up from the acid-based cleaning tank 40 is transferred by the cleaning transfer device 14 right above the second water cleaning tank 50 and then lowered, and the holding jig 2 and the pure water 5 are added.
It is immersed in 4. From the time of withdrawing from the acid type cleaning tank 40 to the time of immersion in the second water washing tank 50, the wafer 1 group is in the state of being transported in the air in the cleaning chamber 12 of the chamber 11, but the relative humidity in the cleaning chamber 12 is 100% humid atmosphere 1
Since it is maintained at 6, the surface of the wafer 1 does not dry naturally. Therefore, the phenomenon that the surface of the wafer 1 is stained by natural drying is prevented.

The wafer 1 group immersed in pure water 54 is washed away of foreign substances (hereinafter referred to as foreign substances) such as acid-based cleaning liquid and etching residues attached to the surface thereof. At this time, as in the case of the first washing tank 30, the overflow flow is always formed, so that the foreign matters and the like carried on the water flow to the upper portion are immediately discharged to the outer tank 53 as they are on the overflow flow. become. Therefore, in the pure water 54 of the inner tank 52, there is almost no foreign matter or the like floating. The group of wafers 1 thus cleaned is pulled up from the pure water 54 in the first water washing tank 50 by the cleaning transfer device 14. At this time, since no foreign matter or the like floats on the water surface of the pure water 54, the foreign matter or the like does not reattach to the surface of the wafer 1 during the pulling.

The group of wafers 1 pulled up from the second water washing tank 50 is carried by the cleaning carrying device 14 right above the entrance of the underwater carrying tank 71, and then lowered, and the holding jig 2 together with the underwater carrying tank 71. It is immersed in pure water 72 of. From the time when the wafer 1 is pulled up from the second water washing tank 50 to the time when it is immersed in the underwater transfer tank 71, the wafer 1 group is in the state of being transferred in the air inside the cleaning chamber 12 of the chamber 11, but the relative humidity inside the cleaning chamber 12 is 100. % Of the high humidity atmosphere 16, the surface of the wafer 1 does not naturally dry. Therefore, the phenomenon that stains and the like are generated on the surface of the wafer 1 due to natural drying is also prevented here.

The group of wafers 1 immersed in the pure water 72 in the underwater carrier 71 is carried to the drying chamber 13 side with the holding jig 2 placed on the conveyor 73. At this time, since the group of wafers 1 is transported in the pure water 72, the surface of the wafer 1 is not dried. Therefore, the phenomenon that stains and the like are generated on the surface of the wafer 1 due to natural drying is also prevented here.

The wafer 1 group transferred to the drying chamber 13 side is suspended from the submersible transfer tank 71 to the vapor 67 in the vapor bath 61 of the vapor dryer 60 by suspending the holding jig 2 by the drying transfer device 15. It is pulled up directly into the atmosphere. In this way, the group of wafers 1 is directly pulled up from the pure water 72 in the underwater carrier 71 into the atmosphere of the vapor 67, so that the surface of the wafer 1 is placed in the atmosphere of the vapor 67 in a wet state. The phenomenon that a stain or the like occurs on the surface of the wafer 1 due to drying is also prevented here.

Incidentally, although the vapor 67 supplied to the vapor bath 61 rises, it is cold-trapped by the cooling pipe 63, so that the inside of the vapor bath 61 is completely maintained in the atmosphere of the vapor 67. . Since the wafer 1 group exposed to the vapor 67 is at a temperature lower than the ambient temperature of the vapor 67, the vapor 67 is condensed on the surface of the wafer 1 and adheres as IPA 66. The IPA 66 that has condensed and adhered gradually replaces the moisture 69 that wets the surface of the wafer 1,
The replacement is completed when the surface temperature of the wafer 1 becomes equal to the temperature of the vapor 67.

On the other hand, the water 69 replaced with the IPA 66 flows down the surface of the wafer 1 together with the foreign matters remaining on the surface of the wafer 1, and a tray (not shown) arranged immediately below the group of wafers 1 is provided.
The water is dripped on each of the above and collected by a tray, and is discharged to the outside through a drain pipe (not shown). In this way, the moisture 69 is prevented from being mixed into the pure water 72 stored in the bottom portion of the underwater transport tank 71, so that the mixed moisture 69 is prevented from being re-evaporated into water vapor. Therefore, it is possible to prevent reattachment of the moisture 69 to the wafer 1.

When the replacement is completed, the group of wafers 1 is pulled up from the vapor bath 61 into the drying chamber 13 by the drying transfer device 15. Wafer 1 group is vapor bath 6
When the wafer 1 is pulled up from 1, the group of wafers 1 is heated by the ambient temperature of the vapor 67 and is heated, so that the IPA 66 adhering to these surfaces in the form of drops is vaporized while depriving the temperature. When the IPA 66 is completely vaporized, the wafer 1 group is in a dried state. By the way, the vaporized IPA is prevented from being sucked by a ventilator (not shown) and diffused to another place.

By repeating the above operation in each of the cleaning tank, the underwater transfer tank, and the vapor drying device, the group of wafers 1 supplied to the chamber 11 is sequentially cleaned and dried. Then, the cleaning work and the drying work of each stage are simultaneously advanced and processed in parallel.

According to the above embodiment, the following effects can be obtained. By transferring the wafers supplied to the cleaning chamber of the chamber in the air while maintaining a high humidity atmosphere, it is possible to prevent the wafers from naturally drying in the cleaning chamber during the transfer, thus preventing the occurrence of so-called stains. can do.

By preventing the generation of stains, the cleaning accuracy can be increased, so that the occurrence rate of defects in the steps subsequent to the exposure step can be reduced, and the yield of semiconductor devices can be increased to improve the productivity. Can be increased.

By carrying the wafer after washing with water into the drying chamber and directly pulling it up to the vapor bath, it is possible to prevent the wafer after washing from naturally drying while being transported to the vapor bath. Occurrence can be prevented.

By preventing the generation of stains, the accuracy of drying can be improved, so that the rate of occurrence of defects in the steps subsequent to the exposure step can be reduced, and the yield of semiconductor devices can be increased to improve the productivity. Can be increased.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, the cleaning tank in the cleaning chamber is not limited to the order of the alkaline cleaning tank, the first water cleaning tank, the acid cleaning tank and the second water cleaning tank, and any of them may be omitted.
Either may be configured in multiple stages. Further, it is desirable that the specific structure of each cleaning tank is appropriately configured in accordance with the cleaning conditions and the like.

The drying device is not limited to the vapor drying device, and other drying devices such as a hot water pull-up drying device and an orbital or rotation type batch drying device may be used.

Furthermore, the cleaning device may be separated from the drying device.

In the above description, the case where the invention made by the present inventor is mainly applied to the wafer cleaning and drying technology which is the field of application which is the background of the invention has been described, but the invention is not limited thereto, and a photomask or an optical device is used. It can be applied to general cleaning and drying technology for lenses, liquid crystal displays and the like. In particular, the present invention can be used to wash and dry an object to be washed that is difficult to dry naturally, and can obtain excellent effects.

[0045]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By carrying the object to be cleaned supplied to the chamber in the air while maintaining a high humidity atmosphere, it is possible to prevent the object to be cleaned from naturally drying in the chamber during the carrying, so-called stain. Can be prevented.

By transporting the article to be washed after washing with water to the dryer, it is possible to prevent the article to be washed after washing from being naturally dried while being conveyed to the dryer, so that the stain is not generated. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a front sectional view showing a cleaning / drying apparatus according to an embodiment of the present invention.

[Explanation of symbols]

1 ... Wafer (object to be cleaned), 2 ... Holding jig, 10 ... Cleaning / drying device (cleaning device), 11 ... Chamber, 12 ... Cleaning chamber,
13 ... Drying chamber, 14 ... Cleaning transfer device, 15 ... Drying transfer device, 16 ... Humid atmosphere, 17 ... Partition wall, 20 ... Alkaline cleaning tank, 21 ... Processing tank, 22 ... Inner tank, 23 ... Outer tank,
24 ... Alkaline cleaning solution, 25 ... Pump, 26 ... Filter, 30 ... First water washing tank, 31 ... Treatment tank, 32 ... Inner tank, 3
3 ... Outer tank, 34 ... Pure water, 35 ... Pump, 36 ... Filter, 40 ... Acid cleaning tank, 41 ... Treatment tank, 42 ... Inner tank, 4
3 ... Outer tank, 44 ... Acid cleaning solution, 45 ... Pump, 46 ... Filter, 50 ... Second washing tank, 51 ... Treatment tank, 52 ... Inner tank, 53 ... Outer tank, 54 ... Pure water, 55 ... Pump, 56 ... Filter, 60 ... Vapor dryer, 61 ... Vapor bath, 6
2 ... gateway, 63 ... cooling pipe, 64 ... IPA storage tank,
65 ... Heating device, 66 ... Isopropyl alcohol (organic solvent), 67 ... Vapor, 68 ... Blower, 69 ... Moisture, 7
0 ... Submersible carrier, 71 ... Submersible tank, 72 ... Pure water, 7
3 ... conveyor.

Claims (3)

[Claims] 1. A cleaning device in which a plurality of cleaning tanks are arranged side by side in a chamber, and an object to be cleaned is transferred by a transfer device and sequentially immersed in each cleaning tank, wherein the inside of the chamber is maintained at high humidity. A cleaning device characterized in that 2. An underwater transfer tank is laid downstream of the final cleaning tank of the chamber, and a drying device for drying an object to be cleaned pulled up from the underwater transfer tank is provided on the outlet side of the underwater transfer tank. The cleaning device according to claim 1, wherein: 3. The cleaning device according to claim 2, wherein the drying device is a vapor drying device.