CN105097623A

CN105097623A - Wafer loading port structure

Info

Publication number: CN105097623A
Application number: CN201410190454.XA
Authority: CN
Inventors: 雷强; 金一诺; 王坚; 王晖
Original assignee: ACM (SHANGHAI) Inc
Current assignee: ACM (SHANGHAI) Inc; ACM Research Shanghai Inc
Priority date: 2014-05-07
Filing date: 2014-05-07
Publication date: 2015-11-25

Abstract

The invention reveals a wafer loading port structure, and the structure comprises at least two wafer loading ports which are arranged in a manner that the two wafer loading ports form an inclined angle. Moreover, the wafer loading ports are located in the same periphery. The periphery is a periphery that a mechanical arm, used for the loading and unloading of the wafer loading ports, passes across during extending around a rotating center. The top of each wafer loading port is inclined, wherein the height decreases gradually from the interior to the exterior. The tops of the wafer loading ports are integrally shaped like a cone. The wafer loading ports are arranged in an inclined manner, and are located at the working periphery of the mechanical arm, thereby saving a mechanical arm translating mechanism, simplifying the mechanism of the mechanical arm, and reducing the size of the structure. Meanwhile, the wafer loading ports arranged in an inclined manner also enable the width to be reduced, and improve the utilization rate of space.

Description

Wafer load port organization

Technical field

The present invention relates to semiconductor processing equipment, more particularly, relate to a kind of wafer load port organization.

Background technology

Along with in semiconductor technology, the requirement of wafer throughput and production efficiency is improved constantly, in semiconductor processing equipment, higher requirement be it is also proposed for the transporting velocity of wafer in different process cavity.Increasing semiconductor equipment have employed the configuration of multiple wafer load port, to improve the transporting velocity of wafer.

Fig. 1 discloses in prior art a kind of configuration mode of the semiconductor equipment adopting multiple wafer load port.The semiconductor equipment disclosed in Fig. 1 has two wafer load port ones 01, and these two wafer load port ones 01 are arranged in a straight line.A mechanical arm 102 is responsible for loading and unloading these two wafer load port ones 01.In the arrangement shown in Fig. 1, mechanical arm 102 must possess the function moved horizontally, and loads and unloads wafer load port one 01 to move to the position of aliging with corresponding wafer load port one 01.Rotate and flexible function because mechanical arm 102 all can be required to have usually, therefore, in the embodiment shown in fig. 1, mechanical arm 102 needs employing three to overlap driving mechanism: rotate, stretch and translation.Too much driving mechanism considerably increases the complexity of mechanical arm 102, makes the failure rate of mechanical arm 102, production cost and maintenance cost all increase.Meanwhile, more driving mechanism also makes mechanical arm 102 need to occupy larger volume.

Meanwhile, arrange that the space utilization rate of two wafer load port ones 01 is in a straight line also lower, width is excessive.

Summary of the invention

The present invention is intended to propose a kind of wafer load port organization, can simplify the structure of mechanical arm and reduce overall volume.

According to one embodiment of the invention, propose a kind of wafer load port organization, comprise at least two wafer load ports, these at least two wafer load ports are that angle is arranged, and these at least two wafer load ports are positioned at circumferentially same.

In one embodiment, circumference be mechanical arm that wafer load port is loaded and unloaded around center of rotation, the circumference streaked when mechanical arm is stretched.

In one embodiment, the top of each wafer load port is skewed, reduces gradually from inside to outside.

In one embodiment, the topside perspective of wafer load port is tapered.

In one embodiment, this wafer is reprinted port organization and is comprised two wafer load ports, and the angle between the working face of two wafer load ports is 120 degree.

In one embodiment, the angle of inclination at the top of wafer load port is 15 ~ 25 degree.

Wafer load port in wafer load port organization of the present invention, in being in tilted layout and being positioned on the working circumference of mechanical arm, therefore can save the translation mechanism of mechanical arm, thus simplifies the mechanism of mechanical arm and reduce its volume.Meanwhile, the wafer load port be in tilted layout also reduces width, improves space availability ratio.

Accompanying drawing explanation

The above and other feature of the present invention, character and advantage are by more obvious by what become below in conjunction with the description of drawings and Examples, and Reference numeral identical in the accompanying drawings represents identical feature all the time, wherein:

Fig. 1 discloses the arrangement of a kind of wafer load port of the prior art, and two wafer load ports are arranged in a straight line.

Fig. 2 discloses the arrangement of the wafer load port according to one embodiment of the invention.

Fig. 3 discloses the stereogram of the wafer load port according to one embodiment of the invention.

Fig. 4 discloses the front view of the wafer load port according to one embodiment of the invention.

Embodiment

Shown in figure 2 ~ Fig. 4, disclose the wafer load port organization according to one embodiment of the invention.Wherein Fig. 2 discloses the arrangement of this wafer load port.As shown in Figure 2, this wafer load port organization comprises at least two wafer load ports 201, in the embodiment shown in Figure 2, for two wafer load ports 201.These two wafer load ports 201 are arranged in angle, angle between the working face of two wafer load ports is 120 degree, the plane of working face namely for being connected with other semiconductor processing equipment of so-called wafer load port, indicates with mark 202 in fig. 2.These two wafer load ports 201 are positioned at circumferentially same, this circumference be mechanical arm that wafer load port is loaded and unloaded around center of rotation, the circumference streaked when mechanical arm is stretched.In fig. 2, mechanical arm by marking 203 expressions, the circumference streaked when dotted line R represents that mechanical arm stretches.Two wafer load ports 201 are all positioned at when mechanical arm 203 stretches and streak circumferentially, therefore, when carrying out wafer conveying, mechanical arm 203 only needs that carrying out rotates and stretch can realize, and does not need to carry out translation, so mechanical arm 203 needs two overlap driving mechanism: rotate and stretch.Compare with the mechanical arm of prior art, save the driving mechanism of a set of translation, significantly can reduce complexity and the volume of mechanical arm, reduce its volume, manufacturing cost and maintenance cost.Although for two wafer load ports 201 in the embodiment shown in Fig. 2, but those skilled in the art can recognize, the wafer load port of greater number can be set as required, these ports also streak circumferentially by being disposed in when mechanical arm stretches, like this, mechanical arm 203 still only needs just can realize the handling for these ports by rotation and scaling operation.In addition, the wafer load port 201 angularly arranged can save the space on Width, and compared with the arrangement of the prior art shown in Fig. 1, the arrangement of the wafer load port shown in Fig. 2 has narrower width.

With reference to stereogram and front view that figure 3 and Fig. 4, Fig. 3 and Fig. 4 are this wafer load port respectively.As shown in the figure, the top 204 of each wafer load port, in skewed, reduces from inside to outside gradually.It is tapered that rear entirety is spliced at the top 204 of multiple wafer load port.In one embodiment, the angle of inclination at the top 204 of wafer load port is 15 ~ 25 degree.The top 204 of wafer load port is designed to skewed, and structure tapered after splicing, the top dust stratification of wafer load port can be avoided on the one hand, the entirety of wafer load port can be made more attractive in appearance on the other hand.

Above-described embodiment is available to be familiar with person in the art to realize or to use of the present invention; those skilled in the art can make various modifications or change to above-described embodiment and not depart from invention thought of the present invention; thus protection scope of the present invention not limit by above-described embodiment, and should be the maximum magnitude meeting the inventive features that claims are mentioned.

Claims

1. a wafer load port organization, is characterized in that, comprises at least two wafer load ports, and described at least two wafer load ports are that angle is arranged, and described at least two wafer load ports are positioned at circumferentially same.

2. wafer load port organization as claimed in claim 1, is characterized in that, described circumference be mechanical arm that wafer load port is loaded and unloaded around center of rotation, the circumference streaked when mechanical arm is stretched.

3. wafer load port organization as claimed in claim 1, it is characterized in that, the top of each wafer load port is skewed, reduces gradually from inside to outside.

4. wafer load port organization as claimed in claim 3, it is characterized in that, the topside perspective of described wafer load port is tapered.

5. wafer as claimed in claim 1 reprints port organization, and it is characterized in that, comprise two wafer load ports, the angle between the working face of two wafer load ports is 120 degree.

6. wafer load port organization as claimed in claim 5, it is characterized in that, the angle of inclination at the top of described wafer load port is 15 ~ 25 degree.