CN215823718U

CN215823718U - Wafer scrubbing machine

Info

Publication number: CN215823718U
Application number: CN202121923034.XU
Authority: CN
Inventors: 孙华丽
Original assignee: Suzhou Taihuichuang Automation Technology Co ltd
Current assignee: Suzhou Taihuichuang Automation Technology Co ltd
Priority date: 2021-08-17
Filing date: 2021-08-17
Publication date: 2022-02-15
Anticipated expiration: 2031-08-17

Abstract

The utility model relates to a wafer scrubbing machine, which comprises a frame body and an alignment mechanism arranged on the frame body, wherein the alignment mechanism comprises: the sucker is arranged in the frame body and can rotate relative to the frame body; the aligning pieces are arranged on two sides of the sucking disc in pairs and can move relative to the sucking disc under the action of the power device so as to adjust the position of a target object on the sucking disc; the first sensor is arranged on one side of the sucker, the target object is provided with a mark point, and the first sensor is used for detecting the position of the mark point of the target object; the controller is in signal connection with the first sensor and is used for receiving the position of the target object marking point detected by the first sensor and controlling the sucker to rotate so that the target object marking point reaches the designated position, and therefore the next process can be conveniently carried out without independently adding a process, and time and labor are saved.

Description

Wafer scrubbing machine

Technical Field

The utility model relates to a wafer scrubbing machine, and belongs to the technical field of semiconductors.

Background

The semiconductor industry is the core of modern electronic industry, the basis of the semiconductor industry is silicon material industry, the original material of the wafer is silicon, the pollutants on the surface of the wafer can seriously affect the performance, reliability and yield of devices, with the rapid development of microelectronic technology and the improvement of requirements of people, the influence of the pollutants on the devices is more prominent, in the process manufacturing process of the wafer, the pollution of dust, metal, organic matters and inorganic matters can not be avoided, the pollution can easily cause surface defects and dirt in holes, emission points, black points, dark spots and the like are generated, the yield of the wafer is reduced, the quality of the wafer is unstable and fails, and therefore, the removal of the pollutants on the surface of the wafer in the manufacturing process of the wafer is very important.

Generally, wafers are divided into 6 inches and 8 inches, and the 6 inches of wafers have notches, in the conventional wafer cleaning equipment, a robot arm is usually matched with a cleaning mechanism and the like to clean the wafers and then convey the wafers to a blanking mechanism, but the positions of the notches on the cleaned wafers placed on the blanking mechanism are inconsistent due to the movement of the wafers in the whole cleaning process. In order not to affect the next process, at this time, one more process is often added to make the directions of the notches on the cleaned wafer consistent, which is time-consuming and labor-consuming.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer scrubbing machine which has high cleaning efficiency and can sequentially arrange cleaned wafers.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a wafer scrubbing unit, includes the support body, sets up counterpoint mechanism on the support body, wherein, counterpoint mechanism includes:

the sucker is arranged in the frame body and can rotate relative to the frame body;

the aligning pieces are arranged on two sides of the sucking disc in pairs and can move relative to the sucking disc under the action of a power device so as to adjust the position of a target object on the sucking disc;

the first sensor is arranged on one side of the sucker, the target object is provided with a mark point, and the first sensor is used for detecting the position of the mark point of the target object;

and the controller is in signal connection with the first sensor and is used for receiving the position of the target object marking point detected by the first sensor and controlling the sucker to rotate so that the target object marking point reaches a specified position.

Further, the aligning piece comprises a base and a clamping part formed by extending from the base to the sucker, the clamping part is provided with a clamping surface, and the clamping surface is in an arc shape.

Furthermore, the wafer scrubbing machine further comprises a cleaning mechanism arranged on the frame body, the cleaning mechanism comprises a cleaning tank and a clamping and lifting unit which is arranged in the cleaning tank and can lift relative to the cleaning tank, and the clamping and lifting unit is used for clamping and fixing the target object.

Furthermore, the clamping lifting unit comprises a lifting rod connected with the cleaning table and a clamping piece connected with the cleaning table, and a groove clamped with the target object is formed in the clamping piece.

Furthermore, the wafer scrubbing machine also comprises a cleaning unit arranged on one side of the cleaning tank, and the cleaning unit is used for cleaning the surface of the target object.

Furthermore, the wafer scrubbing machine also comprises a turnover mechanism which is arranged opposite to the cleaning mechanism and is used for clamping and overturning the target object.

Further, the turnover mechanism comprises a holding arm connected with a driving device, and a groove used for holding the target is formed in the holding arm.

Furthermore, the wafer scrubbing machine further comprises a feeding mechanism arranged on the opposite side of the alignment mechanism and a discharging mechanism arranged on one side of the feeding mechanism, wherein the feeding mechanism is used for providing the target object for the cleaning mechanism, and the discharging mechanism is used for placing the target object after cleaning.

Further, the feeding mechanism comprises a platform for placing a plurality of the targets and a second sensor for determining the positions of the targets.

Furthermore, the wafer scrubbing machine further comprises a conveying mechanism, the alignment mechanism, the cleaning mechanism, the feeding mechanism and/or the discharging mechanism and the turnover mechanism are arranged in an enclosing mode to form an accommodating area, and the conveying mechanism is arranged in the accommodating area.

The utility model has the beneficial effects that: through be provided with in wafer scrubbing unit for support body pivoted sucking disc and setting up the counterpoint piece in the sucking disc both sides and set up the first sensor in sucking disc one side for the mark point of the target object after the completion of washing can both reach the assigned position, thereby the going on of next flow of being convenient for need not to increase one process alone, labour saving and time saving.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a wafer scrubber according to the present invention;

FIG. 2 is a cross-sectional view of the wafer scrubber of FIG. 1;

fig. 3 is an enlarged view of a portion of the wafer scrubber shown in fig. 1.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.

Referring to fig. 1, a wafer scrubber 100 according to a preferred embodiment of the present invention is used to remove contamination on a wafer surface, contamination on a wafer surface caused by an environment during a manufacturing process, or particles adhered to a wafer surface during a manufacturing process.

Referring to fig. 1 and 2, the wafer scrubbing apparatus 100 includes a frame 1, a cleaning mechanism 2 disposed on the frame 1, an alignment mechanism 3 disposed at one side of the cleaning mechanism 2, a turnover mechanism 4 disposed opposite to the cleaning mechanism 2, a feeding mechanism 5 and a discharging mechanism 6 disposed opposite to the alignment mechanism 3, and a conveying mechanism 7. The cleaning mechanism 2, the alignment mechanism 3, the feeding mechanism 5 and/or the blanking mechanism 6 and the turnover mechanism 4 are surrounded to form a containing area 8, and the conveying mechanism 7 is arranged in the containing area 8, so that the wafer scrubbing machine 100 is more compact in overall structure and smaller in occupied space. In this embodiment, the target is a wafer, and each wafer has a mark point, so that the mark points of the cleaned wafer are located at the same position, which is convenient for the operation of the next process. When the wafer scrubbing machine 100 works, a plurality of wafers are placed in the feeding mechanism 5, the conveying mechanism 7 conveys the wafers on the feeding mechanism 5 to the aligning mechanism 3 for aligning, the aligned wafers are conveyed to the cleaning mechanism 2 through the conveying mechanism 7 for cleaning, and after cleaning is finished, the conveying mechanism 7 conveys the wafers to the blanking mechanism 6. It should be noted that, in the present embodiment, the transmission mechanism 7 is a robot arm, and the structure of the robot arm is the prior art, which is not described herein again.

The loading mechanism 5 includes a cassette (not shown) for placing wafers and a stage (not shown) for placing the cassette. Wherein, wafer box and platform set up to be connected through buckle structure can dismantle to the change of the whole box wafer of convenience improves work efficiency.

The loading mechanism 5 further includes a second sensor (not shown) disposed in the wafer cassette, which in this embodiment is a position sensor to determine the position of the wafer. Specifically, when the transfer mechanism 7 needs to transfer the wafers in the wafer cassette to the alignment mechanism 3 for alignment, the second sensor scans a plurality of wafers in the wafer cassette, and determines the wafers required to be cleaned according to the user requirements, and the transfer mechanism 7 transfers the wafers required to be cleaned and determined by the second sensor to the alignment mechanism 3, so as to align the mark points of the plurality of wafers on the platform.

The alignment mechanism 3 includes a suction cup 31 disposed on the frame body 1, alignment members 32 disposed on both sides of the suction cup 31 in pairs, a first sensor 33 disposed on one side of the suction cup 31 for detecting the position of a mark point on a wafer, and a controller (not shown) in signal connection with the first sensor 33. Wherein the suction cup 31 can rotate relative to the frame 1, and the aligning member 32 can move relative to the suction cup 31 under the action of the power device to adjust the position of the wafer on the suction cup 31. The conveying mechanism 7 places the wafer in the wafer box on the suction cup 31, the two aligning members 32 move close to the suction cup 31 under the action of the power device and clamp and align the wafer, so that the center of the wafer coincides with the center of the suction cup 31, and then after the controller receives the position of the mark point of the wafer detected by the first sensor 33, the controller controls the suction cup 31 to rotate so that the mark point of the wafer reaches the designated position. In addition, in this embodiment, the first sensor 33 is a position sensor, and in other embodiments, the first sensor 33 may also be a photoelectric sensor, and may also detect whether the mark point of the wafer reaches the designated position.

Referring to fig. 2, specifically, the alignment member 32 includes a base 321 and a holding portion 322 extending from the base 321 toward the chuck 31, and the power device pushes the base 321 of the two alignment members 32 to move toward the wafer, so that the holding portion 322 holds the wafer. In this embodiment, the retaining portion 322 has a retaining surface 323, and the retaining surface 323 is arc-shaped, so as to set the purpose: since the wafer is circular, the clamping surface 323 is arc-shaped to match the edge of the circular wafer, so as to better clamp the wafer.

Referring to fig. 2 and 3, the cleaning mechanism 2 includes a cleaning tank 21 disposed in the frame body 1, a holding and lifting unit 22 disposed in the cleaning tank 21 and capable of lifting and lowering relative to the cleaning tank 21, and a cleaning unit 23 disposed at one side of the cleaning tank 21. The clamping and lifting unit 22 is used for clamping and fixing the wafer, and the cleaning unit 23 is used for cleaning the wafer fixed by the clamping and lifting unit 22 in the cleaning tank 21.

The cleaning tank 21 includes a cleaning table (not numbered) and an outer wall (not shown), and a water outlet (not shown) is formed at the bottom of the cleaning tank 21 so as to discharge the residual sewage after the cleaning unit 23 cleans the wafer through the water outlet and a drain pipe (not shown), thereby preventing the next wafer from being polluted in the cleaning process. The outer wall is arranged outside the cleaning table to prevent the cleaning liquid from splashing when the cleaning unit 23 cleans the wafer.

The clamping elevating unit 22 includes an elevating rod (not shown) connected to the wash stand and a clamping member 222 connected to the wash stand. Specifically, one end of the lifting rod is connected to the lower surface of the cleaning table, the other end of the lifting rod is connected to a first motor (not shown), and when the first motor is started, the first motor output shaft drives the lifting rod to move up and down in the height direction of the wafer brushing machine 100, so that the wafer cleaning is more convenient. After the wafer is cleaned by the cleaning unit 23, the first motor drives the cleaning table and the clamping member 222 to rotate at a high speed, so that the cleaned wafer can be dried quickly. In this embodiment, the cleaning platform is provided with 6 clamping members 222, and every 2 clamping members 222 are a group, and 3 groups of clamping members 222 are uniformly arranged along the cleaning platform. In other embodiments, the number of the clamping members 222 can be other, as long as the above-mentioned effects are achieved.

The cleaning unit 23 includes a cleaning member 231 for cleaning the surface of the wafer, and the cleaning member 231 includes a gas pipe (not numbered) and a liquid pipe (not numbered) for supplying a spray liquid, and a nozzle 2311 communicating with the gas pipe and the liquid pipe and disposed at one side of the cleaning tank 21, and when the wafer is placed on the cleaning table, the nozzle 2311 communicates with the gas pipe and the liquid pipe, so that the mixed cleaning liquid is sprayed from the nozzle 2311 to the surface of the wafer, thereby cleaning the surface of the wafer.

The turnover mechanism 4 includes two chucking arms 41 connected to a driving device (not numbered) and a transmission member (not numbered) connecting the driving device and the two chucking arms 41, and the driving device makes the two chucking arms 41 approach or separate from each other through the transmission member, so as to chuck or release the two chucking arms 41 with the wafer. More specifically, the transmission member includes a connecting shaft (not shown) and guide grooves (not shown) provided on both sides of the connecting shaft and connecting the two chucking arms 41. An external force is applied to the driving device, and the output shaft of the driving device pushes the connecting shaft to rotate, so that the two clamping arms 41 move relatively or back to back along the guide grooves, and clamping or releasing of the two clamping arms 41 and the wafer is realized, and the surface of the whole wafer is cleaned at one time.

Referring to fig. 1 and 3, in order to ensure that the chucking arms 41 can chuck the wafer more stably, grooves 411 for chucking the edge of the wafer are formed in the two chucking arms 41. An external force is applied to the driving device, and the output shaft of the driving device pushes the connecting shaft to rotate, so that the two clamping arms 41 move relatively or oppositely along the guide grooves, thereby clamping or releasing the two clamping arms 41 and the wafer. When the two chucking arms 41 are chucking with the wafer, a part of the edge of the wafer is accommodated in the recess 411; when the two chucking arms 41 are released from the wafer, the two chucking arms 41 move away from the wafer.

In order to turn over the two chucking arms 41, the turning mechanism 4 further includes a connecting member 42 connecting the two chucking arms 41 and an output shaft of the driving device, and the driving device is activated to turn over the two chucking arms 41 through the connecting member 42 to clean the surface of the wafer.

In summary, the following steps: when the wafer scrubbing machine 100 is used, a wafer box with a plurality of wafers is installed in the feeding mechanism, and the second sensor determines the positions of the wafers to be cleaned in the wafer box. The conveying mechanism 7 conveys the wafer to be cleaned determined by the second sensor to the suction cup 31 of the aligning mechanism 3. The two aligning members 32 are moved toward the chuck 31 by the driving means so that the wafer overlaps the center of the chuck 31. Next, the first sensor 33 detects the position of the mark point of the wafer, and the controller receives the detection signal of the first sensor 33 and controls the chuck 31 to rotate, so that the mark point of the wafer reaches a designated position. Next, the transfer mechanism 7 places the aligned wafer in the cleaning tank 21, the cleaning unit 23 cleans the wafer, and if the other surface of the wafer needs to be cleaned, the lift lever drives the cleaning table and the clamp 222 to move up, and the transfer mechanism 7 transfers the wafer on the cleaning table to the turnover mechanism 4. When the turnover mechanism 4 drives the wafer to move to the same horizontal plane as the turnover mechanism 4, the two holding arms 41 of the turnover mechanism 4 hold the wafer. The driving device drives the two holding arms 41 to turn over, and the wafer is conveyed into the cleaning tank 21 again to clean the uncleaned surface. After the cleaning is finished, the lifting rod drives the cleaning table and the clamping piece 222 to rotate at a high speed, so that the liquid on the surface of the cleaned wafer is quickly dried, and the cleaned wafer is conveyed to the blanking mechanism 6 by the conveying mechanism 7, so that the cleaning of the whole surface of the wafer is finished.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a wafer scrubbing unit which characterized in that, includes the support body, sets up counterpoint mechanism on the support body, wherein, counterpoint mechanism includes:

2. The wafer scrubber of claim 1, wherein the alignment member includes a base and a catch extending from the base toward the chuck, the catch having a catch surface that is arcuate.

3. The wafer scrubber as recited in claim 1, further comprising a cleaning mechanism disposed on the frame, the cleaning mechanism including a cleaning tank, and a clamp lift unit disposed in the cleaning tank and capable of being lifted relative to the cleaning tank, the clamp lift unit configured to clamp and fix the object.

4. The wafer scrubber as recited in claim 3, wherein the clamp lift unit includes a lift rod connected to the cleaning table of the cleaning tank and a clamp connected to the cleaning table, the clamp having a groove for engaging with the target.

5. The wafer scrubber of claim 3, further comprising a cleaning unit disposed at a side of the cleaning tank, the cleaning unit configured to clean the surface of the target.

6. The wafer scrubber of claim 3, further comprising a flipping mechanism disposed opposite the cleaning mechanism, the flipping mechanism configured to hold and flip the object.

7. The wafer scrubber as recited in claim 6, wherein the flipping mechanism includes a chucking arm coupled to the drive mechanism, the chucking arm having a recess formed therein for chucking the object.

8. The wafer scrubber as recited in claim 4, further comprising a loading mechanism disposed on an opposite side of the alignment mechanism and a unloading mechanism disposed on a side of the loading mechanism, the loading mechanism configured to provide the target for the cleaning mechanism, the unloading mechanism configured to receive the target after cleaning.

9. The wafer scrubber of claim 8, wherein the feed mechanism includes a platform for placing the targets and a second sensor for determining the position of the targets.

10. The wafer scrubber of claim 9, further comprising a transfer mechanism, wherein the alignment mechanism, the cleaning mechanism, the loading mechanism and/or the unloading mechanism, and the flipping mechanism are enclosed to form a receiving area, and the transfer mechanism is disposed in the receiving area.