CN220371680U - Wafer transfer box base cleaning device - Google Patents

Abstract

The utility model relates to the technical field of semiconductors, and provides a wafer conveying box base cleaning device, which comprises: cleaning a base station, cleaning components and rails; the cleaning base station is provided with a cleaning chamber and a transfer port, and the cleaning chamber is communicated with the outside through the transfer port; the transfer port comprises an inlet and an outlet which are arranged on the cleaning base station, the inlet and the outlet are arranged opposite to each other along the horizontal direction, the cleaning base station is hoisted on the track, and the track passes through the cleaning chamber; the cleaning component is arranged at the bottom of the cleaning chamber and is used for cleaning the base of the wafer conveying box entering the cleaning chamber. So configured, through the above-mentioned wafer transfer box base cleaning device, do benefit to the cleaning process integration on the transfer path of wafer transfer box, realize the cleanness of its base in wafer transfer box transportation process, do benefit to the cleanliness factor of guaranteeing the wafer transfer box base in the use.

Description

Wafer transfer box base cleaning device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a wafer conveying box base cleaning device.

Background

The processing and manufacturing processes of semiconductors are complicated, and various semiconductor devices such as a deposition station, an exposure station, a development station, an etching station, a planarization station, a plating station, a wafer/die transfer station, etc. are involved in each process.

When wafers are transferred between different processes, the wafer transfer box is required to be used for carrying the wafers, so that the base of the wafer transfer box is frequently contacted with the carrying tables of the loading and unloading structures of different machines. In the frequent contact process, the wafer cassette base is easily caused to adhere with contaminants, so that the cleanliness is lowered. This phenomenon tends to increase the possibility of contamination of the wafer on the one hand, and also tends to cause cross-contamination between the various tools on the other hand.

In order to ensure the cleanliness of the wafer transfer box base, in the existing semiconductor processing and manufacturing process, the wafer transfer box base is usually cleaned manually and periodically, the cleaning period of the method is generally longer, the cleaning efficiency is lower, and the cleanliness of the base of the wafer transfer box in the using process is difficult to ensure.

Therefore, in order to solve the above-mentioned technical problems, the present utility model provides a cleaning device for a wafer cassette base, which is beneficial to quickly cleaning the wafer cassette base so as to ensure the cleanliness of the wafer cassette base.

Disclosure of Invention

The utility model provides a cleaning device for a wafer conveying box base, which comprises a cleaning base station, a cleaning assembly and a track, wherein the cleaning base station is hoisted on the track and is arranged on a transfer path of the wafer conveying box, so that the wafer conveying box enters the cleaning base station to be cleaned by the cleaning assembly in the transfer process, the cleaning efficiency is improved, the cleaning period is shortened, and the cleanliness of the base of the wafer conveying box in the use process is ensured.

In the present utility model, a wafer cassette base cleaning apparatus includes: cleaning a base station, cleaning components and rails;

the cleaning base station is provided with a cleaning chamber and a transfer port, and the cleaning chamber is communicated with the outside through the transfer port;

the transfer port comprises an inlet and an outlet which are arranged on the cleaning base station, the inlet and the outlet are arranged opposite to each other along the horizontal direction, the cleaning base station is hoisted on the track, and the track passes through the cleaning chamber through the inlet and the outlet;

the cleaning component is arranged at the bottom of the cleaning chamber and is used for cleaning the base of the wafer conveying box entering the cleaning chamber.

Optionally, the cleaning assembly includes a support base, and the support base has an air outlet thereon, and the air outlet is vertically upward arranged to blow air to the base of the wafer transfer box.

Optionally, the cleaning assembly further comprises a cleaning brush, and the cleaning brush is arranged in the cleaning chamber in a lifting manner.

Optionally, the cleaning assembly further includes a lifting platform, the lifting platform is disposed on the supporting seat, the cleaning brush is disposed on the lifting platform and can lift along with the lifting platform, and the air outlet is disposed around the lifting platform.

Optionally, a brush of the cleaning brush is disposed upward, and the cleaning brush is rotated to clean a base of the wafer transfer box.

Optionally, the cleaning brush is a roller structure, a brush is adhered to the outer surface of the roller, and the brush rotates along with the roller to clean the base of the wafer conveying box.

Optionally, the cleaning device for the wafer transfer box base further comprises a dust collecting device, a suction port is arranged on the cleaning base station, the suction port is externally connected with a suction pump, the dust collecting device is arranged at the suction port and is used for capturing particulate matters in the air passing through the suction port.

Optionally, the dust collection device is provided in plurality, and each dust collection device is arranged at four corners of the bottom of the cleaning chamber.

Optionally, the wafer cassette base cleaning device further comprises a transfer door, and the inlet and the outlet are both provided with transfer doors.

Optionally, a sensor is installed on the transfer door, and the wafer transfer box is detected by the sensor and is controlled to be opened or closed.

In summary, the wafer cassette base cleaning apparatus of the present utility model includes: cleaning a base station, cleaning components and rails; the cleaning base station is provided with a cleaning chamber and a transfer port, and the cleaning chamber is communicated with the outside through the transfer port; the transfer port comprises an inlet and an outlet which are arranged on the cleaning base station, the inlet and the outlet are arranged opposite to each other along the horizontal direction, the cleaning base station is hoisted on the track, and the track passes through the cleaning chamber through the inlet and the outlet; the cleaning component is arranged at the bottom of the cleaning chamber and is used for cleaning the base of the wafer conveying box entering the cleaning chamber.

By the arrangement, the cleaning process is integrated on the transfer path of the wafer transfer box by the wafer transfer box base cleaning device, and the position of the wafer transfer box base cleaning device in the wafer processing process can be flexibly arranged based on the cleaning requirement. The cleaning of the base of the wafer conveying box is realized in the transferring process of the wafer conveying box, so that the cleaning process can be effectively fused into the processing process of the wafer. Thus, no other process downtime is caused to wait during cleaning. The cleaning device is also beneficial to shortening the cleaning period and improving the cleaning frequency, and does not cause great interference to the whole processing technology of the wafer in the cleaning process. Meanwhile, the cleanliness of the base of the wafer conveying box in the use process is guaranteed, the risk of pollution of the bearing table of the machine table due to low cleanliness of the base of the wafer conveying box is avoided, the cleanliness of a dust-free workshop can be effectively improved, and the possibility of pollution of wafers is reduced; meanwhile, cross contamination among the machine stations is avoided.

Drawings

FIG. 1 is a schematic view of a cleaning apparatus for a wafer cassette base according to a first embodiment of the present utility model;

fig. 2 is a schematic view of a cleaning brush according to a first embodiment of the present utility model.

Wherein, the reference numerals are as follows:

10-cleaning a base station; 11-a clean room; 12-a transfer port; 121-inlet; 122-outlet;

20-cleaning assembly; 21-a cleaning brush; 22-lifting platform; 23-a supporting seat;

30-a transfer gate; 31-entry door; 32-exit gate;

40-track;

50-dust collection device;

60-suction pump.

Detailed Description

The cleaning device for the pedestal of the wafer cassette according to the present utility model will be described in further detail with reference to the accompanying drawings and the embodiments. The advantages and features of the present utility model will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model.

As used in this disclosure, the singular forms "a," "an," and "the" include plural referents, the term "or" are generally used in the sense of comprising "and/or" and the term "several" are generally used in the sense of comprising "at least one," the term "at least two" are generally used in the sense of comprising "two or more," and the term "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance or number of features indicated. Thus, a feature defining "a first", "a second", "a third" may include one or at least two such features, either explicitly or implicitly. Furthermore, as used in this disclosure, "mounted," "connected," and "disposed" with respect to another element should be construed broadly to mean generally only that there is a connection, coupling, mating or transmitting relationship between the two elements, and that there may be a direct connection, coupling, mating or transmitting relationship between the two elements or indirectly through intervening elements, and that no spatial relationship between the two elements is to be understood or implied, i.e., that an element may be in any orientation, such as internal, external, above, below, or to one side, of the other element unless the context clearly dictates otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. Furthermore, directional terms, such as above, below, upper, lower, upward, downward, left, right, etc., are used with respect to the exemplary embodiments as they are shown in the drawings, upward or upward toward the top of the corresponding drawing, downward or downward toward the bottom of the corresponding drawing.

The present embodiment provides a cleaning device for a wafer cassette base, referring to fig. 1, the cleaning device for a wafer cassette base includes: cleaning base station 10, cleaning assembly 20, transfer door 30, and track 40;

the cleaning base station 10 is provided with a cleaning chamber 11 and a transfer port 12,

the cleaning base station 10 is provided with a cleaning chamber 11 to provide space for cleaning the wafer cassette, as shown in fig. 1, and the cleaning base station 10 is a rectangular box structure in this embodiment.

In other alternative embodiments, the outer profile of the cleaning base station 10 may be cylindrical or otherwise configured, and the overall configuration of the cleaning base station 10 may be adapted based on actual use requirements.

The cleaning chamber 11 is communicated with the outside through the transfer port 12, and the transfer port 12 is used for allowing the wafer transfer box to enter and exit the cleaning chamber 11. The wafer cassette is transferred into the cleaning chamber 11 through the transfer port 12, and after the base of the wafer cassette is cleaned, the wafer cassette is transferred out of the cleaning chamber 11 through the transfer port 12.

Referring to fig. 1, in the present embodiment, the transfer port 12 includes two openings, which serve as ingress and egress functions, respectively. Specifically, the transfer port 12 includes an inlet 121 and an outlet 122 disposed on the cleaning base station 10. Wherein the inlet 121 and the outlet 122 are provided as rectangular openings adapted to the shape of the side walls of the cleaning station 10, the inlet 121 is used for transferring the cassette into the cleaning chamber 11, and the outlet 122 is used for transferring the cassette out of the cleaning chamber 11 after cleaning is completed. The inlet 121 and the outlet 122 are separately disposed, which is beneficial to efficient cleaning process of the wafer transfer cassettes, for example, when one wafer transfer cassette enters the cleaning chamber 11, another wafer transfer cassette to be cleaned can wait at the position of the inlet 121, and after the wafer transfer cassette in the cleaning chamber 11 is cleaned, the wafer transfer cassette is transferred out of the cleaning chamber 11 through the outlet 122 without interfering with the wafer transfer cassette waiting at the position of the inlet 121, which is beneficial to improving cleaning efficiency and guaranteeing smooth overall cleaning process.

In this embodiment, the inlet 121 and the outlet 122 are disposed opposite to each other in the horizontal direction. Therefore, the wafer cassette can keep a straight line running when entering and exiting the cleaning chamber 11, which is beneficial to the transfer of the wafer cassette on the one hand, and is convenient for keeping the direction of the wafer cassette entering and exiting the cleaning chamber consistent with the transfer direction of the wafer cassette on the other hand, so that the cleaning process is better integrated on the transfer path of the wafer cassette, for example, the inlet 121 and the outlet 122 are arranged on the transfer path of the wafer cassette, so that the wafer cassette is cleaned in the transfer process between the machine stations. Therefore, the wafer conveying box base cleaning device can be fused in the process of the wafer on the premise of not improving the whole conveying path of the wafer conveying box, and the production cost is reduced.

Referring to fig. 1, the inlet 121 and the outlet 122 are disposed in the left-right direction in fig. 1. The cleaning base station 10 is suspended on the rail 40, the rail 40 passes through the cleaning chamber 11 through the inlet 121 and the outlet 122, for example, the upper surface of the rail 40 may be supported on the top of the cleaning chamber 11 of the cleaning base station 10 and connected by means of bolts. The track 40 may take the form of an i-shaped, channel-shaped or other shaped track. The track 40 can utilize the existing track, the transfer trolley is arranged in the existing track, and can move along the track 40 for transferring the wafer transfer box, and the transfer trolley can transfer the wafer transfer box through the cleaning chamber 11 in the transfer process due to the fact that the track 40 passes through the cleaning chamber 11, so that the wafer transfer box is cleaned on the transfer path, and cleaning efficiency is improved. And the inlet 121 and the outlet 122 are horizontally and oppositely arranged, so that the wafer transfer box can be conveniently cleaned, for example, the cleaning assembly 20 is arranged in the cleaning chamber 11, when the wafer transfer box is horizontally transferred into the cleaning chamber 11 and passes over the cleaning assembly 20, the wafer transfer box is cleaned by the cleaning assembly 20, and the wafer transfer box is ensured not to interfere with the position where the cleaning assembly 20 is positioned in the horizontal transfer process, namely, the cleaning assembly 20 does not need to be specially moved to give way for the wafer transfer box when the wafer transfer box enters and exits the cleaning chamber 11.

In this embodiment, the cleaning assembly 20 is disposed at the bottom of the cleaning chamber 11, and is used for cleaning the base of the wafer cassette entering the cleaning chamber 11.

The cleaning assembly 20 may be used in a contact cleaning mode or a non-contact cleaning mode, including but not limited to brush cleaning, wiping, water rinsing, and the like. Non-contact cleaning includes, but is not limited to, purging, and the like.

The cleaning mode of the cleaning assembly 20 may be selected based on the adaptability of the actual cleaning requirement, for example, when the adhesion of the attachments on the base of the wafer cassette is strong, the contact cleaning mode may be adopted, or the contact and non-contact cleaning modes may be combined, and when the adhesion of the attachments on the base of the wafer cassette is weak, the non-contact cleaning mode may be adopted.

By the wafer conveying box base cleaning device, the cleaning process is integrated on the transfer path of the wafer conveying box, the positions of the wafer conveying box base cleaning device in the wafer processing process can be flexibly arranged based on the cleaning requirements, the base of the wafer conveying box is cleaned in the wafer conveying box transfer process, the cleaning process is effectively fused into the processing process of the wafer, and therefore other process shutdown waiting cannot be caused in the cleaning process. The cleaning device is also beneficial to shortening the cleaning period, improving the cleaning frequency and improving the cleaning efficiency, and does not cause great interference to the whole processing technology of the wafer in the cleaning process. Meanwhile, the cleanliness of the base of the wafer conveying box in the using process is guaranteed, the risk that the carrying table of the machine is polluted due to low cleanliness of the base of the wafer conveying box is avoided, the cleanliness of a dust-free workshop can be effectively improved, the possibility that the wafer is polluted is reduced, and meanwhile cross pollution among all the machines is avoided.

Further, the transfer door 30 is disposed at the transfer port 12 and is used for opening the transfer port 12 or closing the transfer port 12.

With continued reference to fig. 1, the transfer door 30 includes an inlet door 31 and an outlet door 32, where the inlet door 31 is installed at the position of the inlet 121 to open and close the inlet 121, and the outlet door 32 is installed at the position of the outlet 122 to open and close the outlet 122, where the inlet door 31 and the outlet door 32 are two-way doors, and the inlet door 31 and the outlet door 32 may adopt a sliding door or a door opening structure.

In the process of cleaning the wafer cassette, the inlet door 31 is opened first, the wafer cassette enters the cleaning chamber 11, then the inlet door 31 is closed, the wafer cassette is cleaned, the outlet door 32 is opened after the cleaning is completed, the wafer cassette exits the cleaning chamber 11, and the outlet door 32 is closed.

Wherein the opening and closing process of the inlet door 31 and the outlet door 32 can be driven by a driving device to open or close, the opening or closing time can be set at a fixed time, and the opening and closing time is matched with the transferring flow and cleaning time of the wafer transfer box.

In other alternative embodiments, the entrance door 31 and the exit door 32 may be opened or closed by a sensor control, for example, an entrance sensor may be provided at the position of the entrance door, which may be an infrared sensor, a radar wave sensor, or an image recognition sensor, i.e., an entrance sensor for detecting whether or not there is a pod in the detection area thereof. When the door sensor detects the pod, a door open signal is sent to a controller, which may be, for example, a central processing unit (Central Processing Unit, CPU), other general purpose processor, digital signal processor (Digital Signal Processor, DSP), application specific integrated circuit (Application Specific Integrated Circuit, ASIC), off-the-shelf programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. The controller sends a door opening signal to the driving device of the inlet door 31, the driving device acts to open the inlet door 31, the wafer transfer box enters the cleaning chamber 11, when the door opening sensor detects that the wafer transfer box does not exist in the detection area, the wafer transfer box completely enters the cleaning chamber 11, the door opening sensor sends a signal to the controller, and the controller sends a door closing signal to the inlet door 31. Alternatively, a correlation photoelectric sensor may be disposed at the position of the inlet 121, where the correlation photoelectric sensor cooperates with the entrance sensor, and the correlation photoelectric sensor is used to detect whether a wafer cassette passes through the inlet 121, if the inlet 121 is detected to have a wafer cassette passing through, the correlation photoelectric sensor sends a signal to the controller, and the controller sends a door closing signal to the driving device of the entrance door 31, where the driving devices of the entrance door 31 and the exit door 32 may be motors, that is, the controller sends a closing signal to the corresponding motors to control the opening and closing of the entrance door 31 and the exit door 32.

Similarly, the exit door 32 may also detect pods via an exit sensor. Or the outlet door 32 is opened by setting the opening time, which is fixed from the closing time of the inlet door 31, the outlet door 32 is automatically opened after the inlet door 31 is closed by the fixed time, and the base of the wafer transfer cassette is automatically transferred out of the cleaning chamber 11 through the opened outlet door 32 after cleaning for the set time.

The entrance sensor and the exit sensor and the correlation photoelectric sensor may be disposed on the door frame of each doorway, and the opening and closing of the entrance door 31 and the exit door 32 may also be performed in other conventional manners, which will not be described herein.

Further, the cleaning assembly 20 includes a cleaning brush 21, a lifting table 22, and a supporting base 23.

The supporting seat 23 is provided with an air outlet, and the air outlet is vertically upwards arranged and used for blowing air to the base of the wafer conveying box. The supporting seat 23 is disposed at the bottom of the cleaning chamber 11, the lifting table 22 is disposed above the supporting seat 23, and the cleaning brush 21 is disposed on the lifting table 22 and can lift along with the lifting table 22. The supporting seat 23 is provided with a plurality of air outlets, and each air outlet is arranged around the lifting platform.

With continued reference to fig. 1, the cleaning brush 21 has a brush structure, and the brush may be made of polybutylene terephthalate filaments, nylon filaments, polypropylene filaments, etc., and is preferably made of a soft material, so as to be suitable for cleaning fine components. On the one hand, the cleaning brush 21 is soft, and the phenomenon of damage to the outer wall of the wafer conveying box can be improved when the base of the wafer conveying box is cleaned; meanwhile, the air outlet is formed in the cleaning assembly 20, so that excessive adhesion of attachments on the cleaning brush 21 is guaranteed, and the attachments on the cleaning brush 21 are easy to fall off in the movement process of the cleaning brush 21, so that the cleaning of the cleaning brush 21 is guaranteed.

With continued reference to fig. 1, the brush of the cleaning brush 21 is turned upwards, and the cleaning brush 21 is rotated to clean the base of the wafer cassette. The bottom of the cleaning brush 21 is in transmission fit with a rotor of the motor, the rotation axis of the cleaning brush 21 extends vertically, the cleaning brush 21 can be driven to rotate by the motor, and the motor is arranged on the lifting table 22 to drive the cleaning brush 21 to rotate a base of the cleaning wafer conveying box. Because the cleaning brush 21 is of a soft brush structure, the brush of the cleaning brush 21 can be slightly higher than the base in the transferring process of the wafer conveying box, when the wafer conveying box is transferred to the upper side of the cleaning brush 21, the base of the wafer conveying box is naturally contacted with the brush of the cleaning brush 21, and at the moment, the base of the wafer conveying box is thoroughly cleaned by driving the cleaning brush 21 to rotate.

In other alternative embodiments, the cleaning brush 21 may be linearly reciprocated by a linear motor to clean the base of the pod. The cleaning brush 21 may also be set in its movement pattern based on the actual cleaning requirements.

In other alternative embodiments, the cleaning brush 21 may be set to a stationary state, in which the brush of the cleaning brush 21 is higher than the base position of the wafer cassette during transfer, and the base of the wafer cassette naturally contacts the brush of the cleaning brush 21 when the wafer cassette is transferred past the cleaning brush 21. Along with the transfer of the wafer transfer box, the base of the wafer transfer box and the cleaning brush 21 move relatively, so that the cleaning purpose is naturally achieved.

With continued reference to fig. 1 and 2, the cleaning brush 21 has a flat brush structure, the brush position is upward, and the cleaning brush 21 is in an overall upright structure. The arrangement structure can reduce the occupied space of the cleaning brush 21 and improve the interference phenomenon of the cleaning brush 21 with other parts.

In other alternative embodiments, the cleaning brush 21 may be configured as a drum, and brushes are uniformly adhered to the outer surface of the drum, so that the central axis of the cleaning brush 21 may be configured as a horizontal structure, the motor drives the cleaning brush 21 to rotate around its central axis, and the brushes passing through the outer circumferential surface rotate with the drum to clean the base of the wafer transfer cassette.

In other alternative embodiments, the cleaning brush 21 may also take the form of other known brush arrangements.

In this embodiment, the lifting table 22 adopts a hydraulic lifting structure to drive the cleaning brush 21 to lift.

The lifting platform 22 may also take other lifting forms in the prior art, such as a scissor lift structure, a telescopic arm lift structure, a folding arm lift structure, etc.

The height of the cleaning brush 21 can be flexibly adjusted by the arrangement of the lifting table 22 to adapt to the carrying structures of wafer transfer boxes with different specifications or to adapt to the wafer transfer boxes with different specifications.

Referring to fig. 1, in this embodiment, the supporting seat 23 has a disc-shaped box-like structure. The support base 23 serves as a base of the entire cleaning assembly 20, and the elevating platform 22 is mounted on the support base 23. The lifting platform 22 is of a cylindrical structure, the lifting platform 22 and the supporting seat 23 are coaxially arranged, and the outer diameter of the lifting platform 22 is smaller than that of the supporting seat 23. The supporting seat 23 is internally provided with an air cavity, the supporting seat 23 can be externally connected with an air supply device to supply clean air into the cleaning chamber 11 through an air outlet, the upper surface of the supporting seat 23 is provided with a plurality of air outlets, and the air outlets are arranged around the lifting table 22, so that the air outlets are prevented from being blocked by the lifting table 22. In addition, the cleaning brush 21 is provided in a flat brush structure, and does not block the air outlet of the supporting seat 23 in a large range.

The action of the support seat 23 includes a purge and air flow circulation action;

in this embodiment, the air outlet of the supporting seat 23 is used for blowing air toward the base of the wafer transfer box, the air outlet of the supporting seat 23 sweeps the attachment on the base of the wafer transfer box, and the air outlet of the supporting seat 23 can sweep the attachment on the cleaning brush 21 while the cleaning brush 21 sweeps the base of the wafer transfer box, so as to ensure the cleaning of the cleaning assembly 20 and the base of the wafer transfer box. It is advantageous to ensure that the cleaning assembly 20 does not contaminate the cassette base.

On the basis, the cleaning device for the wafer transfer box base in this embodiment further includes a dust collecting device 50, a suction port is provided on the cleaning base station 10, the suction port is used for being externally connected with a suction pump 60, the suction pump 60 is used for sucking polluted air inside the cleaning chamber 11, the dust collecting device 50 is provided at the suction port, and the dust collecting device 50 is used for capturing particulate matters in the air passing through the suction port. By this structure, the air in the cleaning chamber 11 is sucked, and the circulation of the air flow in the cleaning chamber 11 can be ensured in combination with the ventilation of the support base 23, so as to ensure the cleaning of the air in the cleaning chamber 11, and further improve the cleaning effect of the wafer transfer box base.

The dust collecting device 50 includes a housing and a filter element built into the housing, the filter element being located in the housing 50 and located between an inlet and an outlet of the housing 50, wherein the filter element may be, but is not limited to, a cloth bag filter screen, glass fiber filter cotton, activated carbon filter cotton, synthetic fiber filter cotton, non-woven fabric filter cotton, or the like. The filter element can select the existing materials based on the filter parameters such as the size of the filter particles, gaps and the like and the adaptability of the actual filter requirement; to prevent the backflow of particulate matter collected in the dust collecting device 50, a one-way valve may be provided at the inlet of the housing 50 to ensure that the air flow is one-way from the inlet to the outlet side of the housing 50 to prevent particulate matter located in the housing 50 from flowing back into the clean room 11 through the inlet side. The dust collecting device 50 may be a conventional filter.

In this embodiment, the dust collecting device 50 is used in cooperation with the supporting seat 23, and when the cleaning gas is introduced into the cleaning chamber 11, the supporting seat 23 is provided with an external suction pump to suck the polluted air in the cleaning chamber 11 through the suction port, and the dust collecting device 50 is used for adsorbing and filtering particles, so that the air flow in the cleaning chamber 11 is circulated, and the cleaning of the interior of the cleaning chamber 11 is ensured.

As shown in fig. 1, in this embodiment, the cleaning chamber 11 is a rectangular parallelepiped, and the dust collecting devices 50 are respectively disposed at four corners of the bottom of the cleaning chamber 11. In cooperation with the dust collector, a suction port is arranged at each dust collector 50, and a suction pump is connected with four suction ports. For the purposes of illustration of cleaning, only one of the suction openings is shown in fig. 1 in connection with a suction pump 60. Therefore, when the suction pump 60 sucks, the air in the cleaning chamber 11 flows outwards through the four corners, so that the air introduced from the supporting seat 23 is blown to the brush or the wafer transfer box base, and then flows to the periphery in a diffusing manner, so that the particles carried in the air are also ensured to flow to the periphery in a diffusing manner so as to be far away from the wafer transfer box, and the particles in the air are not attached to the wafer transfer box again.

Of course, the number of dust collectors 50 may be adapted based on the construction of the clean room 11 and the requirements of use.

In summary, the wafer cassette base cleaning apparatus of the present utility model includes: cleaning base station 10, cleaning assembly 20, and track 40; the cleaning base station 10 is provided with a cleaning chamber 11 and a transfer port 12, and the cleaning chamber 11 is communicated with the outside through the transfer port 12; the transfer port 12 comprises an inlet 121 and an outlet 122 which are arranged on the cleaning base station, the inlet 121 and the outlet 122 are arranged opposite to each other along the horizontal direction, the cleaning base station 10 is hoisted on the track 40, and the track 40 passes through the cleaning chamber 11 through the inlet 121 and the outlet 122; the cleaning assembly 20 is disposed at the bottom of the cleaning chamber 11, and is used for cleaning the base of the wafer cassette entering the cleaning chamber 11.

By the arrangement, the cleaning process is integrated on the transfer path of the wafer transfer box by the wafer transfer box base cleaning device, and the position of the wafer transfer box base cleaning device in the wafer processing process can be flexibly arranged based on the cleaning requirement. The cleaning of the base of the wafer conveying box is realized in the transferring process of the wafer conveying box, so that the cleaning process can be effectively fused into the processing process of the wafer. Thus, no other process downtime is caused to wait during cleaning. The cleaning device is also beneficial to shortening the cleaning period, improving the cleaning frequency and improving the cleaning efficiency, and does not cause great interference to the whole processing technology of the wafer in the cleaning process. Meanwhile, the cleanliness of the base of the wafer conveying box in the use process is guaranteed, the risk of pollution of the bearing table of the machine table due to low cleanliness of the base of the wafer conveying box is avoided, the cleanliness of a dust-free workshop can be effectively improved, and the possibility of pollution of wafers is reduced; meanwhile, cross contamination among the machine stations is avoided.

The above description is only illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model, and any changes and modifications made by those skilled in the art based on the above disclosure are intended to fall within the scope of the appended claims.

Claims (10)

1. A wafer cassette base cleaning apparatus comprising: cleaning a base station, cleaning components and rails;

the cleaning base station is provided with a cleaning chamber and a transfer port, and the cleaning chamber is communicated with the outside through the transfer port;

the transfer port comprises an inlet and an outlet which are arranged on the cleaning base station, the inlet and the outlet are arranged opposite to each other along the horizontal direction, the cleaning base station is hoisted on the track, and the track passes through the cleaning chamber through the inlet and the outlet;

the cleaning component is arranged at the bottom of the cleaning chamber and is used for cleaning the base of the wafer conveying box entering the cleaning chamber.

2. The pod base cleaning apparatus of claim 1, wherein the cleaning assembly comprises a support base having an air outlet disposed thereon, the air outlet being disposed vertically upward for blowing air toward the base of the pod.

3. The pod base cleaning apparatus of claim 2, wherein the cleaning assembly further comprises a cleaning brush disposed in the cleaning chamber in a liftable manner.

4. The wafer cassette base cleaning apparatus of claim 3, wherein the cleaning assembly further comprises a lift table disposed on the support base, the cleaning brush is disposed on the lift table and is liftable with the lift table, and the air outlet is disposed around the lift table.

5. The wafer cassette base cleaning apparatus of claim 4, wherein the brush of the cleaning brush is disposed upward, and the cleaning brush is rotated to clean the base of the wafer cassette.

6. The wafer cassette base cleaning apparatus of claim 4, wherein the cleaning brush is a roller structure, a brush is adhered to an outer surface of the roller, and the brush rotates with the roller to clean the wafer cassette base.

7. The wafer cassette base cleaning apparatus as set forth in any one of claims 1-6, further comprising a dust collection device, wherein a suction port is provided in the cleaning base station, the suction port being externally connected to a suction pump, the dust collection device being provided in the suction port, the dust collection device being for capturing particulate matter in air passing through the suction port.

8. The pod base cleaning apparatus of claim 7, wherein the dust collection apparatus is provided in plurality, each of the dust collection apparatuses being provided at four corners of the bottom of the cleaning chamber.

9. The pod base cleaning apparatus of any of claims 1-6, further comprising a transfer door, wherein both the inlet and the outlet are mounted with transfer doors.

10. The pod base cleaning apparatus of claim 9, wherein a sensor is mounted on the transfer door, the pod being detected by the sensor and the opening or closing of the transfer door being controlled.