JP3743954B2 - Processing apparatus, processing method, substrate cleaning apparatus, substrate cleaning method, developing apparatus, and developing method - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention relates to a processing apparatus and a processing method for performing a physical process on a surface (processed surface) of a substrate to be processed which is generally flexible, and in particular, a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate to be processed using a scrubbing brush. About.
[0002]
[Prior art]
In the manufacture of a liquid crystal display (LCD) or a semiconductor device, each microfabrication is performed on the premise that the surface of a substrate to be processed (LCD substrate, semiconductor wafer, etc.) is in a cleaned state. For this reason, the surface of the substrate is cleaned prior to each processing or between each processing. For example, in the photolithography process, the surface of the substrate is scrubbed or brushed by a brushing cleaning device called a scrubber prior to resist application. Is done.
[0003]
Usually, in this type of brushing cleaning apparatus, scrubbing is performed by moving (scanning) a scrubbing brush in a predetermined direction or path while rubbing against the substrate surface. Part of the foreign matter (dust, debris, contaminants, etc.) scraped from the substrate surface by the scrubbing brush remains on the substrate. For this reason, a rotatable spin chuck is used as a holding means for holding the substrate in the apparatus. After the scrubbing cleaning, the spin chuck is driven to rotate, and the substrate is spin-rotated to the substrate surface from the cleaning liquid jet nozzle. Spray a cleaning solution (blow cleaning) to wash away foreign substances from the substrate. After the blow cleaning, the substrate is spin-rotated at a high speed by a spin chuck, and the cleaning liquid remaining on the substrate is shaken off by a centrifugal force to dry the substrate surface.
[0004]
Conventionally, in the development processing of the LCD, a paddle system in which the LCD substrate is placed in a horizontal state and a developer is deposited thereon is often used.
[0005]
[Problems to be solved by the invention]
Conventionally, in a brushing cleaning apparatus for an LCD substrate, a chuck plate of a spin chuck for mounting and holding the substrate is formed in a rectangular shape that is slightly larger than the substrate, and is set up at four corners of such a rectangular chuck plate. The substrate is held on the chuck plate by sandwiching the corners of the substrate from both sides (both sides) by a pair of protruding holding pins. Negative pressure suction type circular chuck plates are rarely used. The reason is that the negative pressure suction type circular chuck plate that holds and holds the entire surface of the LCD substrate has a size having a diameter equal to or larger than the diagonal distance of the substrate, and the manufacturing cost is remarkably increased. On the other hand, in the negative pressure suction type circular chuck plate that holds and holds only a part of the LCD substrate, for example, the center part, the scrubbing brush cannot be pressed against the part of the substrate protruding from the chuck plate, Therefore, there is an inconvenience that scrubbing cleaning cannot be performed.
[0006]
However, even in the mechanical chuck plate as described above, the movement or scanning of the scrubbing brush may be hindered by the holding pins protruding from the substrate surface in the vicinity of the corner of the substrate. There was a problem that the scrubbing brush could not be performed completely, and that the scrubbing brush could not be rapidly and safely entered from the standby position onto the substrate when performing scrubbing cleaning.
[0007]
Further, in the conventional LCD development processing, as the substrate becomes larger, it takes time to wash away the developer in the rinsing step after development, and thus efficiency is required.
[0008]
The present invention has been made in view of the above-described problems of the prior art, and can perform a predetermined physical process applied to the surface (surface to be processed) of a substrate to be processed in a multifaceted or more efficient manner. An object of the present invention is to provide a processing apparatus and a processing method.
[0009]
Another object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of performing a scrubbing cleaning process for cleaning a substrate surface by rubbing a scrubbing brush against a substrate to be processed at a low cost. It is in.
[0010]
Another object of the present invention is to provide a substrate cleaning apparatus that improves cleaning processing efficiency and processing quality in a combined cleaning process that performs a two-stage cleaning process including a scrubbing cleaning process and a blow cleaning process that sprays a cleaning liquid to clean the substrate surface. Another object of the present invention is to provide a substrate cleaning method.
[0011]
Another object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can quickly and safely access a scrubbing brush onto a substrate during a scrubbing cleaning process to increase cleaning processing efficiency. is there.
[0012]
Another object of the present invention is to provide a substrate cleaning apparatus that improves cleaning processing efficiency and processing quality in a composite cleaning process that performs a two-stage cleaning process including a scrubbing cleaning process and a blow cleaning process that sprays a cleaning liquid to clean the substrate surface. It is another object of the present invention to provide a substrate cleaning method.
[0013]
Another object of the present invention is to provide a developing device and a developing method which can efficiently perform a rinsing process after development in a paddle type development process.
[0014]
[Means for Solving the Problems]
  In order to achieve the above object, a first processing apparatus of the present invention includes a holding unit that holds a predetermined portion of a substrate to be processed and holds the substrate with an adsorption force, and an outer side of the holding unit of the substrate. Support means for supporting the protruding portion from below, and the substrate held by the holding means and supported by the support meansA first processing means for performing a first treatment on the surface of the substrate; and a surface of the substrate which is held by the holding means and is bent downward by gravity without being supported by the supporting means. 2nd processing means which performs processing of 2,Elevating means for moving the supporting means up and down relative to the holding means.
  Further, the second processing apparatus of the present invention supports from below the holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force, and the portion of the substrate that protrudes outside the holding means. And a supporting means for performing a predetermined operation with respect to the substrate held by the holding means and supported by the supporting means, or the substrate held by the holding means and not supported by the supporting means. Processing means for performing processing; elevating means for moving the supporting means relative to the holding means; and the substrate in which the protruding portion is bent downward by gravity without being supported by the supporting means. On the other hand, transfer means for allowing the processing means to enter the substrate from a predetermined standby position through the protruding portion.Have
[0015]
  Further, the processing method of the present invention includes a first step of placing a substrate to be processed at a first position, and a second step of performing a first process on the surface of the substrate supported at the first position. A third step of displacing at least a part of the substrate from the first position to the second position, and a fourth step of applying a second treatment to the surface of the substrate at the second position; TheAnd supporting the substrate substantially horizontally at the first position, and tilting at least a portion of the substrate obliquely downward from the horizontal at the second position..
[0016]
  In the present invention, the raising and lowering means changes the height position of the supporting means with respect to the holding means, so that the protruding portion is supported by the supporting means on the substrate held by the holding means, and the protruding portion is the supporting means. It is possible to select a second state in which the aircraft is floated unsupported by (and protrudes into the air) and is bent downward due to gravity. A first process (second step) in which the horizontal posture of the substrate is desirable may be applied to the substrate in the first state, and a second process in which the flexure posture of the substrate is desirable for the substrate in the second state. (Fourth step) may be performed. Further, under the second state, the processing means can be quickly and safely entered from the end of the protruding portion of the substrate onto the substrate by the transfer means. Then, after the entry of the processing means is completed, the processing means can be operated immediately by switching from the second state to the first state.
[0017]
  In order to achieve the above object, the present inventionFirstThe substrate cleaning apparatus includes a holding unit that holds a predetermined portion of the substrate to be processed and holds the substrate with an adsorption force, and a supporting unit that supports a portion of the substrate that protrudes outside the holding unit from below. First cleaning means including a scrubbing brush that is held by the holding means and rubs and cleans the surface of the substrate supported by the support means;A cleaning liquid is supplied onto the substrate that is held by the holding unit and is not supported by the support unit, and the portion protruding outside the holding unit is bent downward due to gravity. A second cleaning means for cleaning off foreign matter scraped off by scrubbing cleaning of the cleaning means; and a lifting means for moving the support means up and down relative to the holding means.
  The second substrate cleaning apparatus of the present invention supports a holding unit that holds a predetermined portion of a substrate to be processed and holds the substrate with an adsorption force, and a portion of the substrate that protrudes outside the holding unit from below. And a first cleaning means including a scrubbing brush which is held by the holding means and rubs and cleans the surface of the substrate supported by the supporting means, and the supporting means with respect to the holding means Lifting and lowering means for moving the scrubbing brush relatively upward and downward with respect to the substrate where the protruding portion is bent downward by gravity without being supported by the supporting means. And a brush transfer means for entering the substrate from the standby position.
[0018]
  Of the present inventionFirstThe substrate cleaning method includes a first step of placing a substrate to be processed at a first position, a second step of rubbing and cleaning the surface of the substrate supported at the first position, and at least of the substrate A third step of displacing a part from the first position to the second position; and a fourth step of cleaning the surface of the substrate by spraying a cleaning liquid at the second position.And at the first position, the substrate is supported substantially horizontally, and at the second position, at least a part of the substrate is inclined obliquely downward from the horizontal.
  In the second substrate cleaning method of the present invention, a part of the substrate to be processed is placed on a predetermined substrate holding surface, and a portion of the substrate that protrudes from the substrate holding surface is bent downward by gravity. A first step, a second step in which the scrubbing brush enters the substrate from a predetermined standby position through the protruding portion of the substrate bent downward, and the scrubbing brush has entered the substrate. A third step of lifting and supporting the protruding portion of the substrate from below, and a fourth step of cleaning the surface of the substrate while rubbing the scrubbing brush against the surface of the substrate on which the protruding portion is supported And have.
[0019]
  Substrate cleaning apparatus of the present inventionIn the first state, the protruding means changes the position of the supporting means relative to the holding means, so that the protruding portion is supported substantially horizontally by the supporting means on the substrate held by the holding means, and the protruding portion is supported by the supporting means. It is possible to select a second state in which the air is floated without being supported (extruded into the air) and bent downward due to gravity. The substrate in the first state is scrubbed and cleaned by the first cleaning means. In this case, the portion that protrudes outside the substrate holding means (the protruding portion) is supported from below by the supporting means even if the scrubbing brush is pressed from above, so the portion that rests on the substrate holding means (non-extruding portion) Part) can be subjected to the same stable scrubbing cleaning. After the scrubbing cleaning, the cleaning liquid is supplied onto the substrate by the second cleaning means with respect to the substrate in the second state, so that the foreign matter on the substrate scraped off by the scrubbing cleaning is effectively washed off. . Prior to the start of scrubbing cleaning, the scrubbing brush can be quickly and safely entered from the end of the protruding portion of the substrate onto the substrate by the brush transfer means under the second state. Then, after completion of the scrubbing brush, the scrubbing cleaning can be started immediately by switching from the second state to the first state.
[0020]
  Further, the third substrate cleaning apparatus of the present invention has a holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force, and a portion of the substrate that protrudes outside the holding means from below. A first cleaning means including a support means for supporting, a scrubbing brush that is held by the holding means and rubs and cleans the surface of the substrate supported by the support means; Elevating means for moving the supporting means up and down relatively, and the supporting means divides a portion of the substrate that protrudes outside the holding means into a plurality of areas and supports each area independently. Including multiple supports for.
[0021]
  In the above configuration, during the scrubbing cleaning process, by selectively lowering the divided support part on the side through which the scrubbing brush has passed, the protruding part of the substrate immediately after cleaning, that is, the part that protrudes outside the substrate holding means is removed. It can be lowered toward the end by the deflection of gravity, and the cleaning liquid and the foreign matter can be easily flowed down.
[0022]
In the substrate cleaning apparatus of the present invention, preferably, the substrate cleaning apparatus may include a second cleaning unit that sprays a cleaning solution onto the surface of the substrate held by the holding unit to clean the substrate surface, and further includes the holding unit. It may be configured to have a rotational drive means that is mechanically connected to the means and rotates the substrate together with the holding means during the cleaning process by the second cleaning means.
[0023]
In this configuration, when the second cleaning means operates, the support member supporting the protruding portion of the substrate may be released by the lifting / lowering means, and the protruding portion may be bent downward by gravity. As a result, the cleaning liquid used for cleaning the substrate surface can easily flow down from the substrate, and the cleaning effect can be enhanced.
[0024]
  In order to achieve the above object, a first developing apparatus of the present invention includes a holding unit that holds a predetermined portion of a substrate to be processed and holds the substrate with an adsorption force, and an outer side of the holding unit of the substrate. A support means for supporting the protruding portion from below, and held by the holding means and supported by the support meansAlmost horizontalA developer supply means for supplying a developer onto the substrate and depositing the developer; and being held by the holding means and supported by the support means.The portion of the holding means that protrudes outside is bent downward due to gravity on the substrate.A rinsing liquid supply means for supplying a rinsing liquid to wash away the developer from the substrate, and an elevating means for moving the support means up and down relative to the holding means.The
  The second developing device of the present invention supports a holding unit that holds a predetermined portion of the substrate to be processed and holds the substrate with an adsorption force, and a portion of the substrate that protrudes outside the holding unit from below. Supporting means, a developer supplying means for supplying the developer onto the substrate held by the holding means and supported by the supporting means, and a developer supplying means for piling up, and held by the holding means, and the supporting means A rinsing liquid supply means for supplying a rinsing liquid onto the substrate that is not supported by the substrate and washing away the developer from the substrate; an elevating means for moving the supporting means relative to the holding means; and the supporting means Transfer means for allowing the developer supply means to enter the substrate from a predetermined standby position through the protrusion with respect to the substrate in which the protrusion protrudes downward due to gravity without receiving the support ofHave
[0025]
The developing method of the present invention includes a first step of supporting a substrate to be processed in a substantially horizontal posture and supplying a developer on the substrate to pour the liquid, and after the first step, one of the substrates to be processed. A second step of supporting only the portion on a predetermined substrate holding surface and bending the protruding portion downward by gravity, and spraying a rinse liquid on the surface of the substrate where the protruding portion is bent downward And a third step of washing away the developer from the substrate.
[0026]
  Of the present inventionIn the first developing device, during the developing process, the support means supports the portion protruding from the substrate holding means (the protruding portion) to keep the substrate in a substantially horizontal position, and the developer supply means develops in a paddle system. Pour the liquid. In the rinsing process immediately after the development process, the lifting means lowers the support means, so that the support means does not support the portion of the substrate that protrudes outside the holding means, so that the protruding portion of the substrate is caused by gravity. The developer is bent downward and the developer on the substrate is smoothly washed away by the rinse liquid supplied from the rinse liquid supply means.
  In the second developing device of the present invention, before or after the start of the developing process, the lifting means lowers the support means relative to the holding means, so that the protruding portion of the substrate is released from the support by the support member. Is done. As a result, the portion of the substrate that protrudes outside the holding means (the protruding portion) becomes lower toward the end due to the deflection of gravity. By causing the nozzle) to enter the substrate, the developer supply means can be moved horizontally to enter the substrate quickly and safely. Then, after the entry of the developer supply means is completed, the elevating means raises the supporting means relative to the holding means (preferably the substrate mounting surface of the holding means and the supporting surface of the supporting means are substantially the same. The support member supports the protruding portion of the substrate from below, so that the developer supply means can be operated immediately.
[0027]
In the developing device of the present invention, preferably, the substrate is mechanically connected to the holding unit, and the substrate is put together with the holding unit while the rinse liquid supplying unit is supplying the rinse liquid onto the substrate. It may be configured to have a rotation driving means for rotating. In this substrate rotation movement, the developer or the rinse liquid can be more efficiently dropped to the outside of the substrate by rotating at a relatively low rotation speed while bending the protruding portion of the substrate downward.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
[0029]
FIG. 1 shows a coating and developing treatment system as a configuration example to which the apparatus or method of the present invention can be applied. This coating / development processing system is installed in a clean room and uses, for example, an LCD substrate as a substrate to be processed, and performs cleaning, resist coating, pre-baking, development, and post-baking in the photolithography process in the LCD manufacturing process. is there. The exposure process is performed by an external exposure apparatus (not shown) installed adjacent to this system.
[0030]
This coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.
[0031]
A cassette station (C / S) 10 installed at one end of the system has a cassette stage 16 on which a predetermined number, for example, four cassettes C for storing a plurality of substrates G can be placed, and a cassette C on the stage 12. And a transport mechanism 20 for taking in and out the substrate G. The transport mechanism 20 has a means for holding the substrate G, for example, a transport arm, can be operated with four axes of X, Y, Z, and θ, and is transported on the process station (P / S) 12 side described later. And the substrate G can be transferred.
[0032]
The process station (P / S) 12 includes, in order from the cassette station (C / S) 10 side, a cleaning process unit 22, a coating process unit 24, and a development process unit 26, a substrate relay unit 23, a chemical solution supply unit 25, and It is provided in a horizontal row via (spaced) the space 27.
[0033]
The cleaning process unit 22 includes two scrubber cleaning units (SCR) 28, an upper and lower ultraviolet irradiation / cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34. Contains.
[0034]
The coating process unit 24 includes a resist coating unit (CT) 40, a vacuum drying unit (VD) 42, an edge remover unit (ER) 44, an upper and lower two-stage adhesion / cooling unit (AD / COL) 46, An upper and lower two-stage heating / cooling unit (HP / COL) 48 and a heating unit (HP) 50 are included.
[0035]
The development process unit 26 includes three development units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 54, and a heating unit (HP) 56.
[0036]
Conveying paths 36, 52, and 58 are provided in the longitudinal direction at the center of each of the process units 22, 24, and 26, and the main conveying devices 38, 54, and 60 move along the respective conveying paths, and each of the process units 22 The unit is accessed to carry in / out or carry the substrate G. In this system, in each of the process units 22, 24, and 26, a spinner system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 52, and 58, and a heat treatment system is disposed on the other side. Units (HP, COL, etc.) are arranged.
[0037]
The interface unit (I / F) 14 installed at the other end of the system is provided with an extension (substrate transfer unit) 57 and a buffer stage 56 on the side adjacent to the process station 12, and is transported to the side adjacent to the exposure apparatus. A mechanism 59 is provided.
[0038]
FIG. 2 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 10, the transport mechanism 20 takes out one substrate G from a predetermined cassette C on the stage 12 and transports it to the cleaning process unit 22 of the process station (P / S) 12. It is passed to the device 38 (step S1).
[0039]
In the cleaning process section 22, the substrate G is first sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the first ultraviolet irradiation unit (UV), and then subjected to the next cooling unit ( In COL), the temperature is cooled to a predetermined temperature (step S2). This UV cleaning mainly removes organic substances on the substrate surface.
[0040]
Next, the substrate G is subjected to a scrubbing cleaning process by one of the scrubber cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to dehydration treatment by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pretreatment in the cleaning process unit 22 is completed, and the substrate G is transferred to the coating process unit 24 by the main transfer device 38 via the substrate transfer unit 23.
[0041]
In the coating process unit 24, the substrate G is first sequentially carried into an adhesion / cooling unit (AD / COL) 46, and undergoes a hydrophobic treatment (HMDS) in the first adhesion unit (AD) (step S6). The cooling unit (COL) cools to a constant substrate temperature (step S7).
[0042]
Thereafter, the substrate G is coated with a resist solution by a resist coating unit (CT) 40, and then subjected to a drying process by a reduced pressure drying unit (VD) 42, and then an edge remover unit (ER) 44 of the periphery of the substrate. Excess (unnecessary) resist is removed (step S8).
[0043]
Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and the first heating unit (HP) performs baking after coating (pre-baking) (step S9), and then the cooling unit ( COL) to cool to a constant substrate temperature (step S10). In addition, the heating unit (HP) 50 can also be used for baking after this application | coating.
[0044]
After the coating process, the substrate G is transported to the interface unit (I / F) 14 by the main transport device 54 of the coating process unit 24 and the main transport device 60 of the development process unit 26, and is passed from there to the exposure apparatus. (Step S11). In the exposure apparatus, a predetermined circuit pattern is exposed on the resist on the substrate G. After the pattern exposure, the substrate G is returned from the exposure apparatus to the interface unit (I / F) 14. The transport mechanism 59 of the interface unit (I / F) 14 passes the substrate G received from the exposure apparatus to the development process unit 26 of the process station (P / S) 12 via the extension 57 (step S11).
[0045]
In the development process section 26, the substrate G is subjected to development processing in any one of the development units (DEV) 52 (step S12), and then sequentially carried into one of the heating / cooling units (HP / COL) 55, Post baking is performed in the first heating unit (HP) (step S13), and then the substrate is cooled to a constant substrate temperature in the cooling unit (COL) (step S14). A heating unit (HP) 53 can also be used for this post-baking.
[0046]
The substrate G that has undergone a series of processing in the development process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24, where the transfer mechanism 20 Is stored in one of the cassettes C (step S1).
[0047]
In this coating and developing processing system, the present invention can be applied to the scrubber cleaning unit (SCR) 28. An embodiment in which the present invention is applied to a scrubber cleaning unit (SCR) 28 will be described below with reference to FIGS.
[0048]
As shown in FIG. 3, the scrubber cleaning unit (SCR) 28 of this embodiment has a bottomed housing or casing 60, and a spinner type scrubber cleaning device 62 is provided at the center of the casing 60.
[0049]
The scrubber cleaning device 62 basically includes a cup 64 functioning as a processing container, a substrate support mechanism 66 provided inside the cup 64, and a cleaning mechanism 110 provided so as to be able to enter and exit the cup 64. Has been.
[0050]
The substrate support mechanism 66 includes a rotatable and liftable spin chuck 68 that holds the substrate G by vacuum suction, and a liftable substrate support portion 70 that supports the substrate G from below around the spin chuck 68. Contains.
[0051]
The spin chuck 68 has a substantially horizontal circular chuck plate 72 whose diameter is shorter than the short side of the substrate G. Only a certain portion of the substrate G near the center of the substrate corresponding to the shape and area of the chuck plate 72 is placed on the chuck plate 72, and the other portion, that is, the outer portion (protruding portion) Gd extends in the radial direction from the chuck plate 72. It protrudes outside.
[0052]
An upper end portion of a rotation support shaft 74 extending in the vertical direction is fixed to the center of the back surface of the chuck plate 72, and a lower end portion of the rotation support shaft 74 is a rotation drive unit provided in the drive unit 76, for example, It is operatively coupled to an electric motor (not shown). By rotating the electric motor, the chuck plate 72 and the substrate G attracted and fixed on the chuck plate 72 are integrally rotated at a set speed via the rotation support shaft 74.
[0053]
A first elevating drive unit (not shown) made of, for example, an air cylinder for moving the chuck plate 72 up and down is also provided in the drive unit 76. At the time of loading / unloading the substrate G, the first raising / lowering drive unit lifts the rotation support shaft 74 vertically upward by a predetermined stroke, so that the chuck plate 72 rises to a predetermined height position Hb as shown in FIG. The substrate G is transferred to and from the main transfer device 38 (FIG. 1). During regular cleaning or cleaning (FIG. 5), the first elevating drive unit lowers the rotation support shaft 74 to the origin position, so that the chuck plate 72 is set to the reference height position Ha.
[0054]
As shown in FIG. 4, concentric grooves 72a and radial grooves 72b intersect (connect) with each other on the upper surface (substrate mounting surface) of the chuck plate 72, and these grooves are formed at predetermined locations. For example, a negative pressure source such as a vacuum pump is communicated through an air passage formed through the chuck plate 72 and the rotation support shaft 74 at the center of the plate. When the substrate G is placed on the chuck plate 72, a negative pressure from a negative pressure source is applied to the grooves 72a and 72b, and a negative pressure suction force acts on the back surface of the substrate G from the grooves 72a and 72b. Thus, the substrate G is fixedly held.
[0055]
The substrate support part 70 has a rigid horizontal support plate 78 having substantially the same shape and the same size as the substrate G. A portion of the horizontal support plate 78 corresponding to the chuck plate 72 is opened in a slightly larger circle so that the chuck plate 72 can relatively enter and leave the circular opening 78a.
[0056]
On the upper surface of the horizontal support plate 78, a large number of support pins 80 having a constant height are erected or protruded in a grid-like arrangement pattern, for example. The material of the support pin 80 can be arbitrarily selected, but since at least the pin top is a part that contacts the back surface of the substrate G, a member that does not damage the substrate, such as resin or rubber, is preferable.
[0057]
On the lower surface of the horizontal support plate 78, the upper ends of a plurality of L-shaped vertical support members 82 coupled to or coupled to the drive shaft of a second elevating drive unit (not shown) made of, for example, an air cylinder in the drive unit 76. The parts are fixed at a predetermined interval so as to uniformly distribute and receive the gravity or pressure from the horizontal support plate 78 side. The second lifting / lowering driving unit has a horizontal support plate 78 through a vertical support member 82, and the top surface (substrate support surface) of the support pins 80 is flush with the upper surface (substrate mounting surface) of the chuck plate 72. When the first height position H1 (= Ha) for supporting the substrate and the portion (excess portion) Gd of the substrate G protruding outside the chuck plate 72 are bent downward by gravity, any of the support pins 80 The top surface is also moved up and down between the second height position H2 for retraction (non-support) so as not to touch it.
[0058]
As described above, in this embodiment, since the horizontal support plate 78 and the support pins 80 of the substrate support unit 70 support the portion (excess portion) Gd of the substrate G that protrudes from the chuck plate 72 from below, the chuck plate 72 is rotated by spin rotation. The diameter can be made as small as possible without causing trouble, and the spin chuck 66 can be reduced in size and cost.
[0059]
  The cup 64 surrounds the periphery of the chuck plate 72 and the substrate G and can be moved up and down.wallPart 84 and its upper sidewallLower side facing the portion 84 with a gap in the radial directionwallPart 86 and the lower sidewallA bottom plate portion 88 that is formed integrally with the portion 86 and forms the bottom of the casing 60 is provided.
[0060]
  The upper side of the cup 64 is outside or inside the cup 64 (inside the drive unit 76).wallA well-known cup support / lifting mechanism (not shown) that supports the portion 84 and can be driven up and down to an arbitrary height within a set lifting range is provided. As shown in FIG. 3, when transferring the substrate G, the transfer arm (not shown) of the main transfer device 38 is passed inside the cup.wallThe part 84 is lowered to the lowest setting position. However, during processing, as shown in FIG.wallThe portion 84 is raised (positioned) to a height suitable for receiving droplets and airflow from the chuck plate 68 side.
[0061]
  Upper side of cup 64wallThe portion 84 has a tapered portion 84a extending obliquely upward toward the radially inner side. This upper sidewallThe taper portion 84a of the portion 84 is close to the side surface of the substrate G at the cup height position (FIG. 5) during the cleaning process, and functions to receive and drop the droplets scattered from the substrate G around the four sides. .
[0062]
  Cup lower sidewallA waste liquid recovery chamber 90 is formed inside the portion 86 along the circumferential direction. The bottom surface of the waste liquid collection chamber 90 has a height difference in the circumferential direction, and a drain port 92 is provided at the lowest part. The drainage port 92 communicates with a waste liquid tank (not shown) through a drainage pipe 94.
[0063]
The space above the waste liquid recovery chamber 90 serves not only as a drainage flow path but also as an exhaust flow path, and an exhaust port 96 is provided in a portion of the cup bottom plate portion 88 inside the waste liquid recovery chamber 90. The exhaust port 96 communicates with an external exhaust system such as an exhaust duct via an exhaust pipe 98. Under the chuck plate 72, an umbrella-shaped partition plate 100 constituting a drainage and exhaust passage is provided. The partition plate 100 is formed with holes 100a for allowing the vertical support members 82 to pass up and down.
[0064]
An exhaust or drain port 102 is provided at one or a plurality of locations on the bottom surface of the casing 60. Each exhaust or drain port 102 communicates with an external exhaust or drainage system (not shown) via an exhaust or waste pipe 104.
[0065]
The cleaning mechanism 110 in the scrubber cleaning device 62 includes, for example, a brush scrubber mechanism 112 and a jet scrubber mechanism 114 as shown in FIG. Although both mechanisms 112 and 114 are shown at the same time in FIG. 5 for convenience of explanation, normally, brushing cleaning by the brush scrubber mechanism 112 is performed first, and then blow cleaning by the jet scrubber mechanism 114 is performed. While one mechanism is operating, the other mechanism is waiting at a predetermined standby position (not shown) provided at the corner of the casing 60 outside the cup 64.
[0066]
The brush scrubber mechanism 112 in this embodiment is of a type that scans the substrate G while rotating the roll brush 116 having a cylindrical brush surface and rubbing it against the substrate surface. Both ends of the shaft 116a of the roll brush 116 are supported by a pair of up and down support arms 120 extending vertically downward from the brush scrubber main body 118, and transmission means (pulley and transmission) provided inside the support arm 120. It is operatively connected to a rotary drive unit built in the scrubber body 118, for example, an electric motor (not shown) via a belt or the like. The brush scrubber main body 118 can be moved along a guide 122 in a predetermined direction, for example, a long side direction of the substrate G, by a predetermined feeding mechanism (not shown). Further, the brush scrubber main body 118 itself or the support arm 120 can be moved up and down by a predetermined lifting mechanism (not shown).
[0067]
In this brush scrubber mechanism 112, a cleaning spray pipe 124 in which a large number of downward-facing cleaning nozzles or discharge ports are arranged in the axial direction of the roll brush 116 is positioned almost directly above the roll brush 116. It is installed almost horizontally in a supported state or structure. The cleaning spray pipe 124 communicates with a cleaning liquid supply section or a relay section (not shown) in the scrubber body 118 via a cleaning liquid supply pipe 126 extending in the vertical direction.
[0068]
The jet scrubber mechanism 114 has one or a plurality of cleaning nozzles 128 that discharge a high-pressure cleaning liquid JW from directly above toward the surface of the substrate G, and the cleaning nozzle 128 physically and functionally via a cleaning liquid supply pipe 129 and the like. A jet scrubber main body 130 that supports the scrubber and a cleaning nozzle feed mechanism (not shown) that feeds the jet scrubber main body 130 along a guide 132 in a certain direction.
[0069]
Next, the operation of the scrubber cleaning unit (SCR) 28 in this embodiment will be described.
[0070]
  When the main transport device 38 of the cleaning process unit 22 transports the substrate G to the unit (SCR) 28, the first elevating drive unit in the drive unit 76 synchronizes with this timing as shown in FIG. The 68 chuck plates 72 are raised to the set height position Hb. At this height position Hb, the substrate G is mounted on the upper surface (substrate mounting surface) of the chuck plate 72 by the transfer arm of the main transfer device 38. The upper side of the cup 64wallThe portion 84 is lowered to the lowest position shown in FIG. 3, and the transfer arm of the main transfer device 38 can enter the inside of the cup 64.
[0071]
When the substrate G is placed on the chuck plate 72, the negative pressure suction mechanism of the spin chuck 68 is activated to fix and hold the substrate G. Here, a portion (protruding portion) Gd that protrudes from the chuck plate 72 of the substrate G bends (tilts) downward due to gravity. When the transport arm of the main transport device 38 is retracted out of the cup 64, the first lifting / lowering driving unit lowers the chuck plate 72 to the reference height position Ha. The substrate G is also lowered integrally with the chuck plate 72. At this time, since the horizontal support plate 78 of the substrate support portion 70 is lowered to the second height position H2 for retraction (non-support), the substrate G is held horizontally on the chuck plate 72, but the protruding portion Gd assumes a posture bent downward due to gravity.
[0072]
After carrying in the substrate G as described above, the brush scrubber mechanism 112 moves the roll brush 116 from the home position outside the cup 64 to a predetermined cleaning start point PS in the cup 64. In the brush moving step before the start of cleaning, when the scrubber main body 118 enters the cup 64 along the guide 122 from a predetermined direction, the scrubber main body 118 itself or the support arm 120 moves at a predetermined distance at a predetermined intermediate position. The lower surface of the roll brush 116 is lowered to a predetermined height position Hr that is slightly higher than the height position Ha of the chuck plate 72 (approximately the thickness of the substrate). Next, the brush scrubber main body 118 moves horizontally along the guide 122 while the roll brush 116 is held at the height position Hr, so that the roll brush 116 is exposed to the protruding portion Gd of the substrate G as shown in FIG. It enters on the longitudinal end (one side) which is the lowest position, and stops at this position (cleaning start point) PS. At this time, the horizontal support plate 78 of the substrate support portion 70 is still lowered (retracted) to the second height position H2, and the protruding portion Gd of the substrate G is bent downward due to gravity. Can enter or access the substrate quickly and safely from the side (horizontal direction) without hitting the edge of the substrate G.
[0073]
  When the entry of the roll brush 116 to the cleaning start point PS on the substrate G is completed as described above, the second lifting drive unit in the drive unit 76 supports the horizontal support plate 78 via the vertical support member 82 for supporting the substrate. To the first height position H1. As shown in FIG. 7, as the horizontal support plate 78 rises, the support pins 80 on the horizontal support plate 78 abut the protruding portion Gd of the substrate G from the back side of the substrate and lift it horizontally. At this time, the end of the protruding portion Gd may be pressed against the roll brush 116 with a predetermined pressure. In this way, the substrate G is held or supported on the substrate placement surface of the chuck plate 72 and the substrate support surface of the support pins 80 set at the same height position Ha (H1), and the entire substrate becomes horizontal. . By this time, the upper side of the cupwallThe portion 84 may be raised to the height position of FIG.
[0074]
Next, in the brush scrubber mechanism 112, the scrubbing cleaning operation by the roll brush 116 is started from the cleaning start point PS (FIGS. 5 and 8). In this scrubbing cleaning, the roll brush 116 is rotated and brought into contact with the substrate G placed in a horizontal posture and fixed state on the chuck plate 72 and the support pins 80 while being brought into contact with the substrate G at a constant pressure. Is moved or scanned in the longitudinal direction from one end (cleaning start point PS) to the other end to scrape off foreign matter on the substrate surface.
[0075]
In the scrubbing cleaning, as shown in FIG. 8, the nozzle surface 124 is positioned above the roll brush 116 and moves together with the roll brush 116. Cleaning liquid CW is sprayed. Thus, since the substrate surface immediately before scrubbing is wetted by the cleaning liquid CW from the cleaning spray tube 124 (pre-wetting), wear of both the roll brush 116 and the substrate G is reduced during scrubbing, and each damage is reduced. can do. Further, since the cleaning liquid penetrates in advance to the foreign matter to be removed from the substrate surface in advance, the contamination of the substrate G is easily removed. The rotation direction of the roll brush 116 is set to a direction (direction of arrow B in FIG. 8) in which the foreign matter scraped off from the substrate surface is sent in a direction opposite to the traveling direction A of the roll brush 116. Is normal.
[0076]
  In the scrubbing cleaning as described above, the cleaning liquid is scattered from the substrate G around the four sides. In particular, a large amount of cleaning liquid scatters or drops from the rear end of the substrate G when viewed from the roll brush 116, and some of the foreign matter scatters or drops out of the substrate G when mixed with the scattered or dropped cleaning liquid. Scattered or dropped cleaning liquid and / or foreign matter is on the upper side of the cup 64wallAfter hitting the inner wall of the portion 84 or directly falling, it is collected in the waste liquid collecting chamber 90 at the bottom of the cup and discharged out of the cup 64 through the drain port 92.
[0077]
When the scrubbing cleaning process is completed, the brush scrubber mechanism 112 moves the set of the brush scrubber main body 118 or the roll brush 116 from the substrate G to the home position outside the cup 64. After the roll brush 116 has been removed, in the substrate support unit 70, the second elevating drive unit in the drive unit 76 retracts (unsupports) the horizontal support plate 78 from the first height position H1 for supporting the substrate so far. To the second height position H2. As a result, the protruding portion Gd of the substrate G is in a floating state, and is bent downward by gravity.
[0078]
Thereafter, blow cleaning by the jet scrubber mechanism 114 is performed. In this blow cleaning, as shown in FIG. 9, the cleaning liquid injection nozzle 128 reciprocates horizontally on the substrate G within a range of the substrate radius, for example, while spraying the ultrasonic vibration high pressure cleaning liquid JW toward the substrate G. Then, the foreign matter scraped off from the substrate surface by the previous scrubbing cleaning or the foreign matter that could not be removed by the scrubbing cleaning is washed away with the high pressure cleaning liquid JW.
[0079]
  At this time, the spin chuck 66 is also operated to rotate the substrate G together with the chuck plate 72 at a predetermined low speed, for example, 50 to 100 rpm. In this low-speed spin rotation, the protruding force Gd of the substrate G (particularly the end of the substrate) does not act on the substrate G so that the protruding portion Gd is bent downward by gravity. Maintain posture. As described above, the cleaning liquid JW flows down to the outside of the substrate G (in the direction of arrow E in FIG. 9) on the protruding portion Gd bent downward due to gravity (becomes lower toward the end). Is efficiently washed away. Even in the blow cleaning, the cleaning liquid and / or the foreign matter scattered or dropped out of the substrate G remains on the upper side of the cup 64.wallAfter hitting the inner wall of the portion 84 or directly falling, it is collected in the waste liquid collecting chamber 90 at the bottom of the cup and discharged out of the cup 64 through the drain port 92.
[0080]
When blow cleaning by the jet scrubber mechanism 114 as described above is completed, spin drying is then performed with the cleaning mechanism 110 retracted out of the cup 64. In this spin drying, the spin chuck 66 rotates the substrate G integrally with the chuck plate 72 at a remarkably higher rotation speed, for example, 500 to 2500 rpm for a certain time than when blow-cleaning. By this high speed rotation, the cleaning liquid adhering to the front surface or the back surface of the substrate G is spun off around by the centrifugal force, and the substrate G becomes dry in a short time.
[0081]
In this embodiment, after the scrubbing or brushing cleaning (FIGS. 6 to 8) as described above, the jet scrubber mechanism 114 maintains the height position H1 of the substrate support portion 70 as shown in FIG. The entire state of the substrate G is maintained in the state (the state shown in FIG. 8), and the cleaning liquid spray nozzle 128 is reciprocated on the substrate G in parallel with the substrate surface to perform the blow cleaning by spraying the high pressure cleaning liquid JW. It may be. Thus, when blow cleaning by the jet scrubber mechanism 114 is performed while the entire substrate G is supported horizontally, the cleaning liquid can be uniformly sprayed on the entire surface of the substrate G, and the cleaning ability can be improved.
[0082]
When the blow cleaning for the horizontally oriented substrate W is completed as described above, the cleaning mechanism 110 is retracted out of the cup 64 as shown in FIG. The substrate G is lowered from H1 to H2, the protruding portion Gd of the substrate G is floated in the air, the spin chuck 66 is driven, and the substrate G is rotated integrally with the chuck plate 72 at a high rotation speed, for example, 500 rpm to 250 rpm for a predetermined time. By this high speed rotation, the protruding portion Gd of the substrate G is lifted by the centrifugal force, the cleaning liquid adhering to the front surface or the back surface of the substrate is shaken off to the surroundings, and the substrate G becomes dry in a short time.
[0083]
Before performing spin drying by high-speed rotation as described above, the substrate G is spin-rotated for a suitable time at a low speed of, for example, about 50 to 100 rpm with the protruding portion Gd of the substrate G being bent downward by gravity. By doing so, the cleaning liquid on the substrate may be shaken out to some extent by using gravity and centrifugal force.
[0084]
When the spin drying is completed, as shown in FIG. 3, the rotation support shaft 74 is raised to lift the substrate G from the spin plate 68 to a predetermined height position, and the cup upper side wall portion 84 is lowered to the lowest setting position. . There, the transfer arm of the main transfer device 38 enters, receives the substrate G from the rotation support shaft 74, and carries it out of the unit (SCR) 28. The surface of the substrate G that has been carried out is subjected to the above-described stable and efficient scrubbing cleaning and blow cleaning, and since there is almost no foreign matter adhering thereto, it has a high cleanliness. Therefore, a process result with less contamination and particles can be obtained in the resist coating process and development process in the next process, and an LCD with a high yield can be obtained.
[0085]
In the scrubber cleaning mechanism 112 of the above-described embodiment, the roll brush 116 can be reciprocated on the substrate G to perform scrubbing cleaning for reciprocating scanning. In that case, the roll brush 116 may go out of the substrate G once past the substrate end portion of the cleaning start point PS or the opposite substrate end portion. Then, as shown in FIG. 12, after the roll brush 116 comes out of the substrate G, the horizontal support plate 78 of the substrate support portion 70 is lowered to the second height position H2, thereby causing the substrate protrusion portion Gd to move to gravity. The roll brush 116 may be re-entered onto the substrate G by horizontal movement in the same manner as described above. Next, as shown in FIG. 13, the horizontal support plate 78 of the substrate support unit 70 is raised to the first height position H1 to support the substrate protrusion Gd horizontally, and then the cleaning operation of the roll brush 116 is resumed. You may let me.
[0086]
12 and 13, when the roll brush 116 is moved backward, for example, the roll brush 116 is moved forward of the second cleaning spray pipe 134 provided in parallel with the first cleaning spray pipe 124. The cleaning liquid CW is sprayed on the substrate. In this way, by configuring each of the forward and backward movements of the roll brush 116 to spray the cleaning liquid onto the substrate in front of the roll brush 116 in the traveling direction, it is possible to efficiently realize the reciprocating scrubbing cleaning. it can.
[0087]
Next, an embodiment in which the present invention is applied to the developing unit (DEV) 52 in this coating and developing processing system will be described with reference to FIGS. In the figure, parts having substantially the same configuration or function as the respective parts (FIGS. 5 to 13) of the embodiment according to the scrubber cleaning unit described above are denoted by the same reference numerals.
[0088]
As shown in FIGS. 14 and 15, the developing unit (DEV) 52 in this embodiment includes a substrate support mechanism 66 (spin chuck 68 and substrate support portion 70) and a drive unit in a bottomed cylindrical cup CP. 76 is provided. Further, a developing solution nozzle 135 (FIG. 14) for supplying a developing solution and a rinsing nozzle 138 (FIG. 15) for supplying a rinsing solution to the substrate G supported by the substrate support mechanism 66 are provided. Yes.
[0089]
As shown in FIG. 14, the developer nozzle 135 is parallel to the surface of the substrate G by a nozzle drive or a scanning mechanism (not shown) while discharging the developer from the discharge hole 136 from above the substrate G toward the surface of the substrate G. It is configured to move horizontally in one direction, for example, the longitudinal direction of the substrate, and waits at a standby position outside the cup CP except when the developer is supplied. The developer nozzle 135 has a large number of discharge holes 136 that can supply the developer almost uniformly from one end to the other end of the substrate G in a horizontal direction perpendicular to the scanning direction (a direction perpendicular to the drawing sheet). A developer supply source (not shown) is connected to the developer nozzle 135 via a developer supply pipe (not shown).
[0090]
In FIG. 15, the rinse nozzle 138 is moved between a rinse liquid discharge position set above the center of the substrate G and a predetermined standby position provided outside the cup CP by a nozzle transfer mechanism (not shown). It can be done. A rinse liquid supply source (not shown) is connected to the rinse nozzle 138 via a rinse liquid supply pipe (not shown). A discharge port (not shown) is provided at the bottom of the cup CP to discharge the developer and rinse that have flowed down from the substrate G to the outside of the cup.
[0091]
In the development unit (DEV) 52 having such a configuration, development processing is performed by a paddle method. More specifically, as shown in FIG. 14, the entire surface of the substrate G is horizontally supported by the chuck plate 72 and the horizontal support plate 78 disposed at the same height position H1 as the chuck plate 72. The developer nozzle 135 is horizontally scanned from end to end of the substrate G while discharging the developer from the discharge hole 136 of the developer nozzle 135. As a result, the developer is uniformly deposited on the entire surface of the substrate G. Then, the developer is left on the substrate G and left for a predetermined time.
[0092]
When the above development processing is completed, as shown in FIG. 15, the horizontal support plate 78 is lowered from the same height position H1 as the chuck plate 72 to the height position H2 lower than the chuck plate 72 in the substrate support portion 70, and the substrate protrudes. The part Gd is bent downward by gravity. Then, after the developer nozzle 135 is retracted out of the cup CP, the rinse nozzle 138 is moved above the center of the substrate (rinse solution discharge position), and the rinse solution is directed from the rinse nozzle 138 toward the center of the substrate G. To discharge. At the same time, the spin chuck mechanism 66 is operated to spin the substrate G at a low speed of, for example, about 50 rpm to 100 rpm. Thus, the rinsing liquid supplied from the rinsing nozzle 138 to the center of the substrate G flows smoothly toward the end of the substrate G by gravity and centrifugal force, so that the developer is efficiently washed out from the substrate.
[0093]
As described above, according to this embodiment, in the developing process, the substrate G is horizontally supported by the substrate support unit 70, whereby the developer can be uniformly deposited on the entire surface of the substrate G. In the rinsing process, In the state where the protruding portion Gd of the substrate G is bent downward by gravity in the substrate support portion 70, preferably the spin solution is spun at low speed, and the rinse solution is smoothly flowed on the substrate G to wash off the developer efficiently. Is possible.
[0094]
The substrate support unit 70 of the above-described embodiment includes an integrated horizontal support plate 78. However, a split substrate support structure is also possible. For example, the horizontal support plate 72 is divided into left and right two (78L, 78R) in the longitudinal direction, and the second elevating drive unit in the drive unit 76 drives the divided support plates 78L, 78R up and down separately (independently). A configuration is also possible. In this configuration, for example, the figure16As shown in FIG. 3, the substrate support Gd immediately after cleaning is removed by gravity by selectively lowering the divided support plate (for example, 72R) on the side through which the roll brush 116 has passed to the second height position H2 during the scrubbing cleaning process. The cleaning liquid and the foreign matter can be easily flowed down by bending downward.
[0095]
In the above embodiment, the horizontal support plate 78 is moved up and down between the two height positions H1 and H2. However, the horizontal support plate 78 is moved up and down or aligned to an arbitrary height position within three or more, and within a predetermined range. Configuration is also possible. Further, by fixing the height position of the horizontal support plate 78 and changing the height position of the spin chuck 66 side, that is, the chuck plate 72, the relative height difference between the two (72, 78) can be set variably. It is also possible. The scrubbing brush is not limited to a roll brush, but may be another type of brush, such as a disk brush having a rotation axis perpendicular to the substrate surface.
[0096]
The substrate cleaning method or apparatus of the present invention is not limited to the coating and developing treatment, and can be applied to any application that performs scrubbing cleaning. The substrate to be processed in the present invention is not limited to an LCD substrate, but may be a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like.
[0097]
【The invention's effect】
As described above, according to the processing apparatus or the processing method of the present invention, the predetermined physical processing applied to the surface (surface to be processed) of the substrate to be processed can be performed in a multifaceted or more efficient manner.
[0098]
Further, according to the substrate cleaning apparatus or the substrate cleaning method of the present invention, the scrubbing cleaning process can be performed safely and reliably at a low cost, and the scrubbing brush can be accessed quickly and safely. Furthermore, it is possible to improve the cleaning processing efficiency and processing quality in the combined cleaning processing in which the two-step cleaning process of the scrubbing cleaning process and the blow cleaning process is performed.
[0099]
Further, according to the developing device or the developing method of the present invention, it is possible to efficiently perform the rinsing process after the development in the paddle type development process.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a coating and developing treatment system to which a substrate cleaning method or apparatus of the present invention can be applied.
FIG. 2 is a flowchart showing a processing procedure in the coating and developing treatment system according to the embodiment.
FIG. 3 is a schematic cross-sectional view showing a configuration (at the time of loading / unloading a substrate) in the scrubber cleaning unit of the embodiment.
FIG. 4 is a plan view showing a configuration of upper surfaces of a chuck plate and a substrate support in the scrubber cleaning unit of the embodiment.
FIG. 5 is a schematic cross-sectional view showing a configuration (in cleaning) in the scrubber cleaning unit of the embodiment.
FIG. 6 is a schematic side view showing an operation when a roll brush is allowed to enter a substrate to be processed in the embodiment.
FIG. 7 is a schematic side view showing the action of raising the substrate support portion to the substrate support height position immediately after the roll brush enters the substrate in the embodiment.
FIG. 8 is a schematic side view showing the positional relationship and operation of the main parts during scrubbing cleaning in the embodiment.
FIG. 9 is a schematic side view showing the positional relationship and operation of the main parts during blow cleaning in the embodiment.
FIG. 10 is a schematic side view showing a modified example of blow cleaning in the embodiment.
FIG. 11 is a schematic side view showing spin drying for blow cleaning according to a modification of the embodiment.
FIG. 12 is a schematic side view showing the positional relationship and operation of the main parts during scrubbing cleaning in a modification of the embodiment.
FIG. 13 is a schematic side view showing the positional relationship and operation of the main parts during scrubbing cleaning in a modification of the embodiment.
FIG. 14 is a schematic side view showing a configuration of a main part in a developing process in the developing unit of one embodiment.
FIG. 15 is a schematic side view illustrating a configuration of a main part in a rinsing process in the developing unit according to the embodiment.
FIG. 16 is a schematic side view showing a split-type substrate support structure according to a modification of the embodiment;
[Explanation of symbols]
28 Scrubber cleaning unit (SCR)
60 casing
62 Scrubber cleaning equipment
64 cups (processing containers)
66 Spin chuck mechanism
70 Substrate support
72 chuck plate
74 Rotation drive shaft
76 Drive unit
78 Horizontal support plate
80 Support pin
82 Vertical support member
112 Brush scrubber cleaning device
114 Jet scrubber cleaning device
116 Roll brush
118 Brush scrubber body
122 Guide
124,134 Cleaning spray tube
128 Cleaning liquid injection nozzle
130 Jet Scrubber Body
135 Developer nozzle
138 rinse nozzle

Claims (22)

Holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force;
Support means for supporting a portion of the substrate that protrudes outside the holding means from below;
A first processing means for performing a first treatment on the surface of the substrate held by the holding means and supported by the support means ;
Second processing means for performing a second processing on the surface of the substrate held by the holding means and having the protruding portion bent downward due to gravity without being supported by the supporting means;
And a lifting / lowering means for moving the support means relative to the holding means. Holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force;
Support means for supporting a portion of the substrate that protrudes outside the holding means from below;
A processing unit that performs a predetermined process on the substrate held by the holding unit and supported by the supporting unit, or the substrate held by the holding unit and not supported by the supporting unit;
Elevating means for moving the supporting means up and down relative to the holding means;
Transfer that causes the processing means to enter the substrate from a predetermined standby position through the protrusion with respect to the substrate in which the protrusion protrudes downward due to gravity without being supported by the support means. Means and
A processing apparatus. 2. The support means includes a plurality of support portions for dividing a portion of the substrate that protrudes outward from the first holding means into a plurality of regions and independently supporting the respective regions. Item 3. The processing apparatus according to Item 2. Holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force;
Support means for supporting a portion of the substrate that protrudes outside the holding means from below;
First cleaning means including a scrubbing brush that is held by the holding means and rubs and cleans the surface of the substrate supported by the support means;
A cleaning liquid is supplied onto the substrate that is held by the holding unit and is not supported by the support unit, and the portion protruding outside the holding unit is bent downward due to gravity. A second cleaning means for washing away foreign matter scraped off by scrubbing cleaning of the cleaning means;
Elevating means for moving the supporting means up and down relative to the holding means;
A substrate cleaning apparatus. Holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force;
Support means for supporting a portion of the substrate that protrudes outside the holding means from below;
First cleaning means including a scrubbing brush that is held by the holding means and rubs and cleans the surface of the substrate supported by the support means;
Elevating means for moving the supporting means up and down relative to the holding means;
A brush for causing the scrubbing brush to enter the substrate from a predetermined standby position through the protruding portion with respect to the substrate in which the protruding portion is bent downward due to gravity without being supported by the supporting means. Transport means and
A substrate cleaning apparatus. Holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force;
Support means for supporting a portion of the substrate that protrudes outside the holding means from below;
First cleaning means including a scrubbing brush that is held by the holding means and rubs and cleans the surface of the substrate supported by the support means;
Elevating means for moving the supporting means up and down relative to the holding means;
And the support means includes a plurality of support portions for dividing the portion of the substrate that protrudes outside the holding means into a plurality of areas and independently supporting each area. The substrate cleaning apparatus according to claim 5, further comprising a second cleaning unit that sprays a cleaning liquid on the surface of the substrate held by the holding unit . 8. The rotary drive unit that is mechanically connected to the holding unit and rotates the substrate together with the holding unit during the cleaning process by the second cleaning unit. The substrate cleaning apparatus as described. The elevating means has a first height position at which the support surface of the support means is substantially the same height as the mounting surface of the holding means, and low enough that the support surface of the support means does not touch the protruding portion of the substrate. The substrate cleaning apparatus according to any one of claims 4 to 8, further comprising means for moving the support means up and down between the second position. The first cleaning means includes a means for reciprocating the scrubbing brush on the substrate and scrubbing and cleaning the surface of the substrate by forward and backward movements, and each forward and backward movement. The substrate cleaning apparatus according to any one of claims 4 to 9, further comprising: a cleaning liquid supply unit on the substrate in front of the scrubbing brush in the traveling direction. Holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force;
Support means for supporting a portion of the substrate that protrudes outside the holding means from below;
A developer supply means for supplying a developer onto the substantially horizontal substrate held by the holding means and supported by the support means;
A rinsing liquid is supplied onto the substrate which is held by the holding means and is not supported by the support means, and the portion protruding outside the holding means is bent downward due to gravity, and the developer is supplied from the substrate. Rinsing solution supply means for washing away;
Elevating means for moving the supporting means up and down relative to the holding means;
A developing device. Holding means for holding a predetermined portion of the substrate to be processed and holding the substrate with an adsorption force;
Support means for supporting a portion of the substrate that protrudes outside the holding means from below;
A developer supply means for supplying and depositing a developer onto the substrate held by the holding means and supported by the support means;
A rinsing liquid supply means for supplying a rinsing liquid onto the substrate held by the holding means and not supported by the supporting means to wash away the developer from the substrate;
Elevating means for moving the supporting means up and down relative to the holding means;
With respect to the substrate in which the protruding portion is bent downward due to gravity without being supported by the supporting means, the developer supply means enters the substrate from a predetermined standby position through the protruding portion. Transporting means and
A developing device. 12. A rotation drive unit that is mechanically connected to the holding unit and that rotates the substrate together with the holding unit while the rinse liquid supply unit supplies the rinse liquid onto the substrate. Alternatively, the developing device according to claim 12. The elevating means has a first height position at which the support surface of the support means is substantially the same height as the mounting surface of the holding means, and low enough that the support surface of the support means does not touch the protruding portion of the substrate. The developing device according to claim 11, comprising means for moving the support means up and down between the second position. A first step of disposing a substrate to be processed at a first position;
A second step of applying a first treatment to the surface of the substrate supported at the first position;
A third step of displacing at least a portion of the substrate from the first position to a second position;
A fourth step of applying a second treatment to the surface of the substrate at the second position;
Has, in the first position to support the substrate substantially horizontally, the process how inclined from the horizontal obliquely downward at least part of said substrate in said second position. A first step of placing the substrate to be processed in a first position;
A second step of rubbing and cleaning the surface of the substrate supported at the first position;
A third step of displacing at least a portion of the substrate from the first position to the second position;
A fourth step of cleaning the surface of the substrate by spraying a cleaning liquid at the second position;
The substrate cleaning method includes: supporting the substrate substantially horizontally at the first position; and tilting at least a portion of the substrate obliquely downward from the horizontal at the second position. The substrate cleaning method according to claim 16, wherein the substrate is spin-rotated at the second position. A first step of placing a part of the substrate to be processed on a predetermined substrate holding surface and bending a portion of the substrate that protrudes from the substrate holding surface downward by gravity;
A second step of allowing the scrubbing brush to enter the substrate from a predetermined standby position through the protruding portion of the substrate bent downward;
After the scrubbing brush enters the substrate, a third step of lifting and supporting the protruding portion of the substrate from below;
A fourth step of cleaning the substrate surface while rubbing the scrubbing brush against the surface of the substrate on which the protruding portion is supported;
A substrate cleaning method comprising: A fifth step of releasing support of the protruding portion of the substrate and bending the protruding portion downward by gravity;
A sixth step of cleaning the substrate surface by spraying a cleaning liquid from a cleaning liquid spray nozzle onto the surface of the substrate where the protruding portion is bent downward;
The substrate cleaning method according to claim 18, comprising: 19. The substrate cleaning method according to claim 18, further comprising a seventh step of cleaning the surface of the substrate by spraying a cleaning liquid from a cleaning liquid spray nozzle onto the surface of the substrate on which the protruding portion is supported after the fourth step. A first step of supporting a substrate to be processed in a substantially horizontal posture and supplying a developer onto the substrate to pour liquid;
After the first step, a second step of supporting only a part of the substrate to be processed on a predetermined substrate holding surface and bending a portion protruding outside by gravity.
A third step in which a rinsing liquid is sprayed on the surface of the substrate where the protruding portion is bent downward to wash away the developer from the substrate;
A developing method comprising: The developing method according to claim 21, further comprising a fourth step of spinning the substrate in the third step.

Images